Vector frequency converter beneficial to moisture-proof and heat dissipation

Abstract

The utility model discloses a vector type frequency converter beneficial to moisture-proof and heat dissipation, including the first heat conduction spare of setting in the lower part of IGBT module, the second heat conduction spare of setting in the lower part of rectifier bridge module and the heat dissipation board of case outside, first heat conduction spare, second heat conduction spare and the heat dissipation board all are equipped with the passage for the circulation of coolant, and first heat conduction spare, second heat conduction spare and the heat dissipation board are connected through coolant circulation pipeline, and coolant circulation pipeline circulates and flows between first heat conduction spare, second heat conduction spare and the heat dissipation board, coolant transmits heat to the heat dissipation board outside, effectively avoids IGBT module and rectifier bridge module temperature excessively high, and the heat dissipation window of electric control open -close is arranged on the case, and the air humidity probe is arranged on the outside of case, and the air humidity probe is electrically connected with the heat dissipation window of electric control open -close through control circuit. Air humidity probe opens and closes the heat dissipation window of electric control open -close according to the air humidity of external environment, avoids the water vapor of outside to enter the inside of case and leads to frequency converter to be damped.

Description

Technical Field

[0001] This utility model belongs to the field of frequency converter technology, specifically a vector frequency converter that is beneficial for moisture prevention and heat dissipation. Background Technology

[0002] Vector inverters are devices used for speed regulation of motors. Their working principle involves rectification followed by inversion to obtain the desired frequency voltage. During operation, the internal IGBTs (Insulated Gate Bipolar Transistors) and rectifier bridges carry large currents, generating significant heat. If this heat cannot be dissipated promptly, it can trigger overheat protection mechanisms (alarms or shutdown), and in severe cases, even permanently damage the components.

[0003] Most frequency converters currently employ ventilation for heat dissipation. For example, Chinese utility model patent CN223124770U discloses a high-heat-dissipation vector frequency converter, including a vector frequency converter main unit. The vector frequency converter main unit is controlled by a control panel located at the top front. Multiple elastic slots are distributed at the front end of the fixed plate. When disassembling the cover plate, pressing down on the connecting rod causes two moving blocks to move downwards. When the moving blocks can no longer move downwards, the connecting rod pulls the cover plate downwards, separating it from the vector frequency converter main unit. This completes the disassembly of the cover plate. For reinstallation, pressing down on the connecting rod until it cannot move further, aligning the locking blocks with the L-shaped slots, and pushing the cover plate until it overlaps with the vector frequency converter main unit, releasing the connecting rod allows the stainless steel spring to release its elastic force. The sleeve post is then inserted into the insertion hole, completing the installation of the cover plate and the vector frequency converter main unit. This ensures the integrity of the locking mechanism and improves operational convenience and efficiency.

[0004] However, when the ambient humidity is high, moisture from the outside can enter the inverter during the ventilation and heat dissipation process, causing short circuits, arcing, component corrosion, and instantaneous burnout of power modules such as IGBTs.

[0005] Meanwhile, existing vector inverters typically install heat sinks on the rectifier bridge module and IGBT module, which generate a lot of heat. The heat sinks directly dissipate the heat generated by the rectifier bridge module and IGBT module into the chassis. Although this protects the rectifier bridge module and IGBT module to a certain extent, it will cause the ambient temperature inside the chassis to rise, affecting the overall heat dissipation effect of the inverter. Utility Model Content

[0006] This invention proposes a vector inverter that is beneficial for moisture protection and heat dissipation, aiming to solve the problem of unsatisfactory moisture protection and heat dissipation effects of existing vector inverters.

[0007] To achieve the above objectives, the present invention adopts the following technical solution: A vector inverter with moisture-proof and heat dissipation features includes a vector inverter body and a heat dissipation assembly. The vector inverter body includes a chassis and an IGBT module and a rectifier bridge module disposed within the chassis. The heat dissipation assembly includes a first heat-conducting element disposed below the IGBT module, a second heat-conducting element disposed below the rectifier bridge module, and a heat dissipation plate disposed outside the chassis. The first heat-conducting element, the second heat-conducting element, and the heat dissipation plate are all provided with channels for coolant circulation. The first heat-conducting element, the second heat-conducting element, and the heat dissipation plate are connected by a coolant circulation pipeline, and the coolant circulation pipeline circulates between the first heat-conducting element, the second heat-conducting element, and the heat dissipation plate. The chassis is equipped with an electrically controllable heat dissipation window, and an air humidity probe is installed on the outside of the chassis. The air humidity probe is electrically connected to the electrically controllable heat dissipation window through a control circuit.

[0008] Preferably, the heat dissipation assembly further includes a thermoelectric cooler, the hot end of which is fixed to the heat sink and in close contact with the heat sink, and the cold end of which is fitted with a heat-conducting plate that extends into the chassis.

[0009] Preferably, a temperature sensor is installed inside the chassis, and the temperature sensor is electrically connected to the semiconductor cooling chip through a control circuit.

[0010] Preferably, the electrically controllable heat dissipation window includes a first electrically controlled heat dissipation window located on the top of the chassis and a second electrically controlled heat dissipation window located on both sides of the chassis. An exhaust fan is provided at the lower part of the first electrically controlled heat dissipation window, and an air humidity probe is electrically connected to the first electrically controlled heat dissipation window, the second electrically controlled heat dissipation window, and the exhaust fan through a control circuit.

[0011] Preferably, the first heat-conducting component, the second heat-conducting component, and the heat sink are all provided with serpentine pipes inside. The outlets of the serpentine pipes of the first and second heat-conducting components are connected in parallel with the inlet of the serpentine pipe of the heat sink through a coolant circulation pipe. The outlet of the serpentine pipe of the heat sink is connected to the inlet of the serpentine pipe of the first and second heat-conducting components, respectively. A one-way valve is provided on both the outlet and the inlet of the serpentine pipe.

[0012] Preferably, a circulation pump is installed on the coolant circulation pipeline.

[0013] Preferably, the coolant is heat transfer oil.

[0014] Beneficial effects: Compared with the prior art, the present invention can achieve at least the following technical effects: 1. This utility model utilizes heat-conducting oil to transfer the heat generated by the IGBT module and rectifier bridge module to the external heat sink through the first and second heat-conducting components. This effectively prevents the IGBT module and rectifier bridge module from overheating, and also prevents the heat from the IGBT module and rectifier bridge module from dissipating into the chassis and causing the internal temperature of the chassis to become too high, thus improving heat dissipation efficiency.

[0015] 2. This utility model is equipped with an air humidity sensor. The air humidity probe controls the opening and closing of the electrically controlled heat dissipation window according to the air humidity of the external environment, which prevents external moisture from entering the chassis and causing the inverter to become damp.

[0016] 3. This utility model is equipped with a semiconductor cooling chip, which cools the internal environment of the chassis through the heat pump effect of the semiconductor cooling chip, preventing the internal temperature of the chassis from becoming too high when the heat dissipation window is closed, and further improving the heat dissipation effect. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0018] Figure 2 This is a schematic diagram showing the installation position of the first heat-conducting component of this utility model.

[0019] Figure 3 This is a schematic diagram of the internal structure of the first heat-conducting component of this utility model.

[0020] Figure 4 This is a schematic diagram showing the installation position of the second heat-conducting component of this utility model.

[0021] Figure 5 This is a schematic diagram of the internal structure of the second heat-conducting component of this utility model.

[0022] Figure 6 This is a schematic diagram of the coolant circulation pipeline of this utility model.

[0023] Figure 7 This is a schematic diagram of the heat sink structure of this utility model.

[0024] Figure 8 This is a side view of the present invention.

[0025] In the diagram: 1. Chassis; 2. Air humidity probe; 3. First motorized heat dissipation window; 4. Heat sink; 5. Second motorized heat dissipation window; 6. IGBT module; 7. First heat conduction component; 8. Rectifier bridge module; 9. Second heat conduction component; 10. Semiconductor cooling chip; 11. Cooling plate; 12. Exhaust fan; 13. Circulation pump; 14. Check valve; 15. Temperature sensor; 16. Serpentine piping. Detailed Implementation

[0026] The present invention will be further explained below with reference to specific implementation examples.

[0027] Please see Figure 1-8 This utility model proposes a vector inverter that is beneficial for moisture prevention and heat dissipation, including a vector inverter body and a heat dissipation assembly. The vector inverter body includes a chassis 1 and an IGBT module 6 and a rectifier bridge module 8 disposed inside the chassis 1. The heat dissipation assembly includes a first heat-conducting element 7 disposed below the IGBT module 6, a second heat-conducting element 9 disposed below the rectifier bridge module 8, and a heat dissipation plate 4 outside the chassis 1. The first heat-conducting element 7, the second heat-conducting element 9, and the heat dissipation plate 4 are all provided with channels for coolant circulation. The first heat-conducting element 7, the second heat-conducting element 9, and the heat dissipation plate 4 are connected by a coolant circulation pipeline, and the coolant circulation pipeline circulates between the first heat-conducting element 7, the second heat-conducting element 9, and the heat dissipation plate 4. The chassis 1 is equipped with an electrically controllable heat dissipation window, and an air humidity probe 2 is installed on the outside of the chassis 1. The air humidity probe 2 is electrically connected to the electrically controllable heat dissipation window through a control circuit.

[0028] like Figure 1-6 As shown, the first heat-conducting component 7 is in contact with the IGBT module, and the heat generated by the IGBT module is transferred to the first heat-conducting component 7. The second heat-conducting component 9 is in contact with the rectifier bridge module 8, and the heat generated by the rectifier bridge module is transferred to the second heat-conducting component 9. The coolant circulates between the first heat-conducting component 7, the second heat-conducting component 9 and the heat sink 4 through the coolant circulation pipe, transferring the heat to the heat sink 4 and dissipating it to the external environment. This effectively prevents the IGBT module and the rectifier bridge module from overheating, and also prevents the heat from the IGBT module and the rectifier bridge module from dissipating into the chassis 1 and causing the internal temperature of the chassis to become too high, thus improving the heat dissipation efficiency.

[0029] The air humidity probe 2 is used to detect the air humidity of the external environment. When the air humidity exceeds the threshold, the air humidity probe 2 controls the electrically controllable heat dissipation window to close through the control circuit, preventing external moisture from entering the chassis 1 and causing the inverter to become damp. Since the first heat conduction component 7 and the second heat conduction component 9 transfer heat to the outside of the chassis 1 through the coolant rather than dissipating it into the chassis 1, under normal circumstances, even if the heat dissipation window of the chassis 1 is closed, the temperature inside the chassis 1 will not become too high.

[0030] In this embodiment, the heat dissipation assembly further includes a thermoelectric cooler 10. The hot end of the thermoelectric cooler 10 is fixed on the heat sink 4 and in close contact with the heat sink 4. The cold end of the thermoelectric cooler 10 is equipped with a heat-conducting plate 11, which extends into the chassis 1.

[0031] like Figure 7 , Figure 8As shown, in order to prevent the temperature inside the chassis 1 from becoming too high due to the closure of the heat dissipation window under extreme conditions, a semiconductor cooling chip 10 is provided in this embodiment. After the semiconductor cooling chip 10 is powered on, its cold end absorbs the heat inside the chassis 1 through the heat conduction plate 11. Utilizing the heat pump effect of the semiconductor cooling chip 10, the heat is transferred to the heat sink 4 through its hot end.

[0032] In this embodiment, a temperature sensor 15 is provided inside the chassis 1, and the temperature sensor 15 is electrically connected to the semiconductor cooling chip 10 through a control circuit.

[0033] By controlling the thermoelectric cooler 10 with a temperature sensor 15, the thermoelectric cooler 10 only activates when the temperature inside the chassis 1 exceeds a threshold, which helps reduce the overall energy consumption of the device and extend the lifespan of the thermoelectric cooler 10. The control circuit for controlling the power on and off of actuators based on ambient temperature is a mature technology and will not be elaborated upon here.

[0034] In this embodiment, the electrically controllable heat dissipation window includes a first electrically controlled heat dissipation window 3 located on the top of the chassis 1 and a second electrically controlled heat dissipation window 5 located on both sides of the chassis 1. An exhaust fan 12 is provided at the lower part of the first electrically controlled heat dissipation window 3. The air humidity probe 2 is electrically connected to the first electrically controlled heat dissipation window 3, the second electrically controlled heat dissipation window 5 and the exhaust fan 12 through a control circuit.

[0035] When the external humidity of the chassis 1 is normal, the first electric ventilation window 3 and the second electric ventilation window 5 remain open. Air enters the chassis through the second electric ventilation windows 5 on both sides of the chassis 1, and is exhausted from the chassis 1 through the first electric ventilation window 3 on the top of the chassis 1 under the action of the exhaust fan 12. The first electric ventilation window 3 and the second electric ventilation window 5 adopt the existing technology of a flip-up blade structure, such as the electric ventilation window structure mentioned in utility model patent document CN222471233U.

[0036] When the air humidity probe 2 detects that the external ambient humidity exceeds the threshold, it controls the first electric heat dissipation window 3 and the second electric heat dissipation window 5 to close through the control circuit. Among them, the air humidity probe 2 is a resistive humidity sensor, such as the HS1101 humidity sensor. The analog output of the resistive humidity sensor is connected to a comparator, such as the LM393 dual voltage comparator IC. The comparator can control the first electric heat dissipation window 3, the second electric heat dissipation window 5 and the exhaust fan 12 through isolation circuits such as transistors and multiple relays.

[0037] In this embodiment, the first heat-conducting component 7, the second heat-conducting component 9, and the heat sink 4 are all provided with serpentine pipes 16 inside. The outlets of the serpentine pipes 16 of the first heat-conducting component 7 and the second heat-conducting component 9 are connected in parallel with the inlet of the serpentine pipes 16 of the heat sink 4 through a coolant circulation pipe. The outlet of the serpentine pipes 16 of the heat sink 4 is connected to the inlet of the serpentine pipes 16 of the first heat-conducting component 7 and the second heat-conducting component 9, respectively. A one-way valve 14 is provided on the outlet and inlet of each serpentine pipe 16.

[0038] By setting a serpentine conduit 16 inside the first heat-conducting element 7, the second heat-conducting element 9, and the heat sink 4, the contact area between the coolant and the first heat-conducting element 7, the second heat-conducting element 9, and the heat sink 4 can be increased, thereby improving the heat transfer efficiency. By setting a one-way valve 14, the flow direction of the coolant can be kept stable.

[0039] In this embodiment, a circulation pump 13 is further provided on the coolant circulation pipeline.

[0040] By setting up a circulation pump 13 to force the coolant to circulate, the heat exchange efficiency is further improved. In this embodiment, the coolant is a heat transfer oil, such as a silicone oil-based heat transfer oil with good thermal stability.

[0041] In the description of this utility model, the term "multiple" refers to two or more. Unless otherwise explicitly defined, the terms "upper," "lower," "left," "right," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. The terms "connection," "installation," "fixing," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.

[0042] In the description of this utility model, the terms "one embodiment," "some embodiments," "specific embodiment," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of this utility model. In this utility model, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0043] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A vector-type frequency converter that facilitates moisture protection and heat dissipation, characterized in that, The device includes a vector inverter body and a heat dissipation assembly. The vector inverter body includes a chassis (1) and an IGBT module (6) and a rectifier bridge module (8) disposed in the chassis (1). The heat dissipation assembly includes a first heat-conducting component (7) disposed at the lower part of the IGBT module (6), a second heat-conducting component (9) disposed at the lower part of the rectifier bridge module (8), and a heat dissipation plate (4) outside the chassis (1). The first heat-conducting component (7), the second heat-conducting component (9), and the heat dissipation plate (4) are all provided with channels for coolant circulation. The first heat-conducting component (7), the second heat-conducting component (9), and the heat dissipation plate (4) are connected by a coolant circulation pipeline. The coolant circulation pipeline circulates between the first heat-conducting component (7), the second heat-conducting component (9), and the heat dissipation plate (4). The chassis (1) is provided with an electrically controllable heat dissipation window, and an air humidity probe (2) is provided on the outside of the chassis (1). The air humidity probe (2) is electrically connected to the electrically controllable heat dissipation window through a control circuit.

2. A vector inverter with moisture-proof and heat dissipation-friendly design according to claim 1, characterized in that, The heat dissipation assembly also includes a semiconductor cooling chip (10), the hot end of which is fixed on the heat sink (4) and in close contact with the heat sink (4), and the cold end of which is equipped with a heat-conducting plate (11), which extends into the chassis (1).

3. A vector inverter with moisture-proof and heat dissipation-friendly design according to claim 2, characterized in that, A temperature sensor (15) is installed inside the chassis (1), and the temperature sensor (15) is electrically connected to the semiconductor cooling chip (10) through a control circuit.

4. A vector inverter with moisture-proof and heat dissipation-friendly design according to claim 1, characterized in that, The electrically controllable heat dissipation window includes a first electrically controlled heat dissipation window (3) located on the top of the chassis (1) and a second electrically controlled heat dissipation window (5) located on both sides of the chassis (1). An exhaust fan (12) is provided at the lower part of the first electrically controlled heat dissipation window (3). An air humidity probe (2) is electrically connected to the first electrically controlled heat dissipation window (3), the second electrically controlled heat dissipation window (5) and the exhaust fan (12) through a control circuit.

5. A vector inverter with moisture-proof and heat dissipation-friendly design according to claim 1, characterized in that, The first heat-conducting component (7), the second heat-conducting component (9) and the heat sink (4) are all provided with serpentine pipes (16). The outlets of the serpentine pipes (16) of the first heat-conducting component (7) and the second heat-conducting component (9) are connected in parallel with the inlet of the serpentine pipes (16) of the heat sink (4) through the coolant circulation pipe. The outlet of the serpentine pipes (16) of the heat sink (4) is connected to the inlet of the serpentine pipes (16) of the first heat-conducting component (7) and the second heat-conducting component (9) respectively. A one-way valve (14) is provided on both the outlet and the inlet of the serpentine pipes (16).

6. A vector inverter with moisture-proof and heat dissipation-friendly design according to claim 5, characterized in that, A circulation pump (13) is installed on the coolant circulation pipeline.

7. A vector inverter with moisture-proof and heat dissipation-friendly design according to claim 1, characterized in that, The coolant is heat transfer oil.

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