A practical PCB and BGA chip welding ball mounting device

Abstract

The utility model relates to practical PCB and BGA chip welding ball mounting device, including the main bakelite insulating panel of tray structure, the first bolt fixed hole is formed to the main bakelite insulating panel, set up the left bakelite panel and right bakelite panel on the main bakelite insulating panel, the second bolt fixed hole is formed to the left bakelite panel and right bakelite panel with the first bolt fixed hole position correspondence, the third bolt fixed hole and the fourth bolt fixed hole are still formed to the main bakelite insulating panel, the main bakelite insulating panel still is equipped with the upper bakelite insulating panel, the fifth bolt fixed hole is formed to the upper bakelite insulating panel with the third bolt fixed hole position correspondence when installing, and the sixth bolt fixed hole is formed with the fourth bolt fixed hole position correspondence, the chip fixed panel is placed fixedly to the main bakelite insulating panel top, is installed with the welding steel net of the upper bakelite insulating panel and the main bakelite insulating panel clamping fixed to the chip fixed panel.

Description

Technical Field

[0001] This utility model relates to the field of chip soldering, and in particular to a practical PCB and BGA chip soldering and ball-planting device. Background Technology

[0002] With the rapid development of science and technology, artificial intelligence (AI) technology has advanced by leaps and bounds, enabling intelligentization, automation, and informatization. AI products have garnered significant attention, such as smart speakers, smart security cameras, smart door locks and access control systems, and smart robot vacuum cleaners. These smart products have broadened the horizons of people's lives, helping them work, study, and entertain themselves more efficiently, enriching their lives. The core component of all AI products is the PCBA (Printed Circuit Board Assembly); the functions of smart products are inseparable from the PCBA. The PCBA is the most important component of the product, consisting of a PCB and the soldering and processing of various components.

[0003] A PCB (Printed Circuit Board) consists of an insulating base plate, connecting wires, and pads for assembling and soldering electronic components. It enables electrical connections between various components in the circuit and serves the dual function of a conductive path and an insulating base plate. A BGA-SOC (Browser Grid Assembly-Screen Optimizer) is a highly integrated semiconductor chip and one of the important components in a PCBA (Printed Circuit Board Assembly).

[0004] Technology solution companies will design functional products reasonably according to market project needs; in the early stage of the project, a small number of PCBA prototypes need to be produced and processed for product software and hardware development and debugging, to realize project function verification, and to facilitate the rapid mass production of products.

[0005] PCBA prototype production and processing typically uses two methods: manual soldering and SMT fully automated soldering.

[0006] Manual soldering is performed by soldering workers who use electric arc soldering machines to melt solder bars, first applying solder to the component pads on the PCB, and then soldering each component onto the PCB surface.

[0007] Fully automatic soldering: Liquid solder paste is heated and melted using fully automatic soldering machines (solder paste printers, high-speed pick-and-place machines, reflow soldering machines). The melted solder paste uses the surface tension of the liquid to automatically adjust the position of the components and return them to the correct pads.

[0008] Traditional manual soldering is inefficient, requiring one solder joint per material to be soldered; while traditional fully automated soldering has high costs for prototype surface mount soldering, and SMT factories usually need to pay for the start-up and production line fees. Utility Model Content

[0009] This utility model provides a practical PCB and BGA chip soldering and ball-mounting device, including a main bakelite insulating panel with a tray structure, on which a first bolt fixing hole is formed; a left bakelite panel and a right bakelite panel are disposed on the main bakelite insulating panel, on which a second bolt fixing hole is formed corresponding to the position of the first bolt fixing hole; a third bolt fixing hole and a fourth bolt fixing hole are also formed on the main bakelite insulating panel; an upper bakelite insulating panel is also provided on the main bakelite insulating panel, on which a fifth bolt fixing hole corresponding to the position of the third bolt fixing hole and a sixth bolt fixing hole corresponding to the position of the fourth bolt fixing hole are formed; a chip fixing panel is placed and fixed on the main bakelite insulating panel, and a welding steel mesh is installed above the chip fixing panel and clamped and fixed with the upper bakelite insulating panel and the main bakelite insulating panel.

[0010] Preferably, the first bolt fixing hole and the third bolt fixing hole are oblong holes.

[0011] Preferably, stepped grooves are formed around the left bakelite panel and the right bakelite panel in the circumferential direction.

[0012] Preferably, the stepped groove is provided with an asbestos strip that fits against the side wall of the stepped groove.

[0013] Preferably, the asbestos strip has a plurality of anti-slip grooves recessed into the thickness of the asbestos strip.

[0014] Preferably, the first bolt fixing hole is provided with a first rubber protrusion that protrudes towards the center of the first bolt fixing hole and is disposed along the inner circumferential surface of the first bolt fixing hole.

[0015] Preferably, the third bolt fixing hole is provided with a second rubber tab that protrudes along the inner circumference of the third bolt fixing hole and faces the center of the third bolt fixing hole.

[0016] Preferably, the side of the upper bakelite insulating panel facing the main bakelite insulating panel is provided with an asbestos pad.

[0017] Preferably, rubber feet are provided at the four bottom corners of the main bakelite insulating panel.

[0018] Preferably, the bottom of the rubber foot pad has a suction cup-like structure.

[0019] This utility model provides a practical PCB and BGA chip soldering and ball-mounting device, which can reduce the damage to components and copper foil pads caused by manual soldering, thus reducing product malfunctions. It is more efficient than manual soldering; the solder joints produced by this device are round, bright, and regularly shaped, resulting in a more aesthetically pleasing appearance than those produced by manual soldering. It is suitable for R&D prototype production soldering, and allows for bulk engineering samples of materials and components. It requires minimal operator skill and is easy to operate; it eliminates the need for SMT placement equipment, saving on soldering costs; it supports BGA-SOC chip repair and ball-mounting; and it is suitable for R&D repair and small-batch ball-mounting. Its ingenious design, simple structure, ease of operation, and low cost make it ideal for both. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in this utility model or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below.

[0021] Figure 1 This is a schematic diagram showing the disassembled structure of the chip welding and ball-planting device provided in an embodiment of the present invention. Figure 2 A schematic diagram of the combined structure of the chip welding and ball-planting device provided in this embodiment of the utility model; Figure 3 This is a schematic diagram of the structure of the asbestos strip provided in an embodiment of the present utility model; Figure 4 This is a cross-sectional view of the suction cup-shaped rubber foot pad provided in an embodiment of the present invention.

[0022] Reference numerals: 1. Main bakelite insulating panel; 2. First bolt fixing hole; 3. Left bakelite panel; 4. Right bakelite panel; 5. Second bolt fixing hole; 6. Third bolt fixing hole; 7. Fourth bolt fixing hole; 8. Upper bakelite insulating panel; 9. Fifth bolt fixing hole; 10. Sixth bolt fixing hole; 11. Chip fixing panel; 12. Welded steel mesh; 13. Stepped groove; 14. Asbestos strip; 15. Rubber foot pad. Detailed Implementation

[0023] To enable those skilled in the art to better understand the technical solutions in the embodiments of this utility model, and to make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the technical solutions in this utility model will be further described in detail below with reference to the accompanying drawings.

[0024] The following is a description using specific embodiments: like Figure 1 , Figure 2As shown, this utility model embodiment provides a practical PCB and BGA chip soldering and ball-mounting device, including a main bakelite insulating panel 1 with a tray structure, on which a first bolt fixing hole 2 is formed; a left bakelite panel 3 and a right bakelite panel 4 are disposed on the main bakelite insulating panel 1, on which a second bolt fixing hole 5 is formed corresponding to the position of the first bolt fixing hole 2; a third bolt fixing hole 6 and a fourth bolt fixing hole 7 are also formed on the main bakelite insulating panel 1; an upper bakelite insulating panel 8 is also provided on the main bakelite insulating panel 1, on which a fifth bolt fixing hole 9 corresponding to the position of the third bolt fixing hole 6 and a sixth bolt fixing hole 10 corresponding to the position of the fourth bolt fixing hole 7 are formed; a chip fixing panel 11 is placed and fixed on the main bakelite insulating panel 1, and a welding steel mesh 12 is installed above the chip fixing panel 11 and clamped and fixed with the upper bakelite insulating panel 8 and the main bakelite insulating panel 1.

[0025] The main bakelite insulating panel 1 serves as the main frame, supporting electronic components and welding steel mesh 12. The left bakelite panel 3 and the right bakelite panel 4 are placed on the main bakelite insulating panel 1, which can clamp the chip fixing panel 11, which holds electronic components, between the left bakelite panel 3 and the right bakelite panel 4, thus fixing the chip fixing panel 11.

[0026] In actual operation, either the left bakelite panel 3 or the right bakelite panel 4 is adjusted and fixed, and then tightened and locked to the main bakelite insulation panel 1 with bolts. One side of the chip fixing panel 11 is then pressed against the fixed left bakelite panel 3 or the right bakelite panel 4. Then, the unfixed right bakelite panel 4 or the left bakelite panel 3 is moved so that it presses against the other side of the chip fixing panel 11, clamping the chip fixing panel 11. The right bakelite panel 4 or the left bakelite panel 3 is then fixed with bolts, thus completing the fixing of the chip fixing panel 11.

[0027] The chip fixing panel 11 has a chip fixing slot for placing the chip. The chip to be soldered and ball-mounted is placed in the chip fixing slot. The welding steel mesh 12 is placed on the chip fixing panel 11. The bakelite insulation panel 8, the welding steel mesh 12 and the main bakelite insulation panel 1 are then joined together. The welding steel mesh 12 is then locked and fixed by passing the bolts through the fifth bolt fixing hole 9, the fixing hole on the welding steel mesh 12 and the third bolt fixing hole 6 on the main bakelite insulation panel 1 in sequence. This completes the alignment of the welding steel mesh 12 with the chip solder feet on the chip fixing plate.

[0028] Meanwhile, the fifth bolt fixing hole 9 can also be an oblong hole, similar to the third bolt fixing hole 6. After the bolt passes through the fifth bolt fixing hole 9 and the third bolt fixing hole 6, its position can be adjusted along the length of the oblong hole, thereby adjusting the corresponding position of the welding stencil 12 and the chip solder pads. Once aligned, the bolt is immediately tightened to prevent the chip solder pads from shifting relative to the welding stencil 12, thus avoiding welding errors.

[0029] The chip welding ball placement device provided by this technical solution can play a good auxiliary positioning role and will not shift during the welding process, thus preventing chip welding errors and scrap.

[0030] In one embodiment of this utility model, the first bolt fixing hole 2 and the third bolt fixing hole 6 are oblong holes.

[0031] The first bolt fixing hole 2 serves to position the left bakelite panel 3 and the right bakelite panel 4. The elongated hole structure allows the left bakelite panel 3 and the right bakelite panel 4 to move within the range of the elongated hole, thereby adjusting the position of the left bakelite panel 3 and the right bakelite panel 4. This is used in conjunction with the chip fixing panel 11 to facilitate the replacement of chip fixing panels 11 of different specifications and sizes, as well as to adjust the fixing position of the welding steel mesh 12.

[0032] In one embodiment of this utility model, stepped grooves 13 are respectively formed around the left bakelite panel 3 and the right bakelite panel 4 in the circumferential direction.

[0033] A stepped groove 13 is formed around the left bakelite panel 3 and the right bakelite panel 4. The function of the stepped groove 13 is to support the chip fixing panel 11 at the bottom. When the chip fixing panel 11 is fixed, the left and right sides are at the same height, which makes it less likely for there to be a height difference. This results in a higher welding yield and a more stable welding result. It also keeps the chip fixing panel 11 in a horizontal state and prevents the chip fixing panel 11 from being uneven due to visual errors.

[0034] like Figure 3 As shown in one embodiment of the present invention, an asbestos strip 14 is provided in the stepped groove 13 and is attached to the side wall of the stepped groove 13.

[0035] Asbestos strips 14 are attached to the inner sidewall of the stepped groove 13. This serves both as a buffer when clamping the chip fixing panel 11 and as a means to withstand damage caused by the high temperature during soldering. The presence of the asbestos strips 14 allows the chip fixing panel 11 to slightly sink into the asbestos strips 14 on both sides when clamped, preventing the chip fixing panel 11 from falling off midway and improving the clamping effect, thereby ensuring the soldering effect.

[0036] In one embodiment of this utility model, a plurality of anti-slip grooves are formed on the asbestos strip 14, which are recessed into the thickness of the asbestos strip 14.

[0037] Anti-slip grooves are provided on the asbestos strip 14 so that the chip fixing panel 11 cannot be easily pulled out or knocked out after it is clamped, increasing the friction without increasing the clamping force, ensuring that the chip fixing panel 11 is more stable during welding and will not be clamped and deformed.

[0038] In one embodiment of this utility model, a first rubber tab is provided in the first bolt fixing hole 2, which is arranged along the inner circumferential surface of the first bolt fixing hole 2 and protrudes toward the center of the first bolt fixing hole 2.

[0039] One side of the first rubber tab is fixedly connected to the inner wall of the first bolt fixing hole 2, and the other side protrudes towards the center of the hole. The first bolt fixing hole 2 is an oblong hole with first rubber tabs protruding towards the center on both sides. When the bolt moves left or right within the first bolt fixing hole 2, friction is generated due to the contact between the first rubber tab and the bolt, increasing the resistance to bolt movement and preventing excessive displacement of the bolt due to uneven force. This allows for precise adjustment of the bolt's displacement speed within the first bolt fixing hole 2, and after it has moved into position, the high resistance prevents it from easily shifting again, ensuring that the welded steel mesh 12 does not easily deviate after aligning with the chip solder pads.

[0040] In one embodiment of this utility model, a second rubber tab is provided in the third bolt fixing hole 6, which is arranged along the inner circumferential surface of the third bolt fixing hole 6 and protrudes toward the center of the third bolt fixing hole 6.

[0041] The function of the second rubber tab installed in the third bolt fixing hole 6 is the same as that of the first rubber tab, and will not be repeated here.

[0042] In one embodiment of this utility model, an asbestos pad is provided on the side of the upper bakelite insulating panel 8 facing the main bakelite insulating panel 1.

[0043] An asbestos pad is placed at the bottom of the bakelite insulation panel 8. Its function is to buffer the welded steel mesh 12 when the bakelite insulation panel 8 presses down to fix it, so that the welded steel mesh 12 will not be damaged by the force. In addition, during high-temperature welding, the asbestos pad can protect the bakelite insulation panel from being damaged due to excessive temperature.

[0044] In one embodiment of this utility model, rubber feet 15 are provided at the four bottom corners of the main bakelite insulating panel 1.

[0045] Rubber pads are installed at the four corners of the bottom of the main bakelite insulation panel 1. These pads can lift the main bakelite insulation panel 1 and prevent the bottom of the table from being burned during welding operations, thus protecting the table.

[0046] like Figure 4 As shown in one embodiment of the present invention, the bottom of the rubber foot pad 15 forms a suction cup-like structure.

[0047] The rubber pad is designed as a suction cup structure, which can be adsorbed onto the surface of the workbench, thereby ensuring that the main bakelite insulation panel 1 will not shift during operation and making the welding process stable.

[0048] This utility model provides a practical PCB and BGA chip soldering and ball-mounting device, which can reduce the damage to components and copper foil pads caused by manual soldering, thus reducing product malfunctions. It is more efficient than manual soldering; the solder joints produced by this device are round, bright, and regularly shaped, resulting in a more aesthetically pleasing appearance than those produced by manual soldering. It is suitable for R&D prototype production soldering, and allows for bulk engineering samples of materials and components. It requires minimal operator skill and is easy to operate; it eliminates the need for SMT placement equipment, saving on soldering costs; it supports BGA-SOC chip repair and ball-mounting; and it is suitable for R&D repair and small-batch ball-mounting. Its ingenious design, simple structure, ease of operation, and low cost make it ideal for both.

[0049] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A practical PCB and BGA chip soldering and ball-mounting device, characterized in that, The main bakelite insulating panel (1) includes a tray structure, on which a first bolt fixing hole (2) is formed; a left bakelite panel (3) and a right bakelite panel (4) are disposed on the main bakelite insulating panel (1), on which a second bolt fixing hole (5) is formed corresponding to the position of the first bolt fixing hole (2); a third bolt fixing hole (6) and a fourth bolt fixing hole (7) are also formed on the main bakelite insulating panel (1). 1) An upper bakelite insulating panel (8) is also provided, on which a fifth bolt fixing hole (9) corresponding to the position of the third bolt fixing hole (6) and a sixth bolt fixing hole (10) corresponding to the position of the fourth bolt fixing hole (7) are formed; a chip fixing panel (11) is placed and fixed on the main bakelite insulating panel (1), and a welded steel mesh (12) is installed above the chip fixing panel (11) and clamped and fixed to the upper bakelite insulating panel (8) and the main bakelite insulating panel (1).

2. The practical PCB and BGA chip soldering and ball-mounting device as described in claim 1, characterized in that, The first bolt fixing hole (2) and the third bolt fixing hole (6) are oblong holes.

3. The practical PCB and BGA chip soldering and ball-mounting device as described in claim 2, characterized in that, The left bakelite panel (3) and the right bakelite panel (4) are respectively surrounded by stepped grooves (13) in the circumferential direction.

4. The practical PCB and BGA chip soldering and ball-mounting device as described in claim 3, characterized in that, The stepped groove (13) is provided with an asbestos strip (14) that fits against the side wall of the stepped groove (13).

5. The practical PCB and BGA chip soldering and ball-mounting device as described in claim 4, characterized in that, Multiple anti-slip grooves are formed on the asbestos strip (14) that are recessed into the thickness of the asbestos strip (14).

6. The practical PCB and BGA chip soldering and ball-mounting device as described in claim 5, characterized in that, The first bolt fixing hole (2) is provided with a first rubber protrusion that protrudes toward the center of the first bolt fixing hole (2) along the inner circumferential surface of the first bolt fixing hole (2).

7. The practical PCB and BGA chip soldering and ball-planting device as described in claim 6, characterized in that, The third bolt fixing hole (6) is provided with a second rubber protrusion that protrudes toward the center of the third bolt fixing hole (6) along the inner circumferential surface of the third bolt fixing hole (6).

8. The practical PCB and BGA chip soldering and ball-planting device as described in claim 7, characterized in that, The upper bakelite insulating panel (8) has an asbestos pad on the side facing the main bakelite insulating panel (1).

9. The practical PCB and BGA chip soldering and ball-planting device as described in claim 8, characterized in that, Rubber pads (15) are provided at the four bottom corners of the main bakelite insulating panel (1).

10. The practical PCB and BGA chip soldering and ball-mounting device as described in claim 9, characterized in that, The bottom of the rubber foot pad (15) forms a suction cup-like structure.

Images