High-voltage variable-frequency water-cooled radiator

Abstract

The utility model relates to high pressure variable frequency radiator technical field, specifically is a kind of high pressure variable frequency water-cooling radiator, including base, the base top surface is equipped with the tray for containing by bolt assembly, and tray bottom end surface integrally constructs the vertical pipe for guiding flow, and the vertical pipe is equipped with the hose for guiding flow at the end away from tray;In the process of using high pressure variable frequency water-cooling radiator, water source that can be collected on the surface of base when water cooling by tray, and water source can be discharged to the specified position outside by vertical pipe and hose, to reduce the influence caused by the random flow of water source, so that water-cooling radiator can more stably cool high pressure frequency converter.

Description

Technical Field

[0001] This utility model relates to the field of high-voltage variable frequency radiator technology, specifically to a high-voltage variable frequency water-cooled radiator. Background Technology

[0002] A frequency converter is a power control device that uses the switching action of power semiconductor devices to convert industrial frequency power into electrical energy of another frequency. With the rapid development of modern power electronics and microelectronics technologies, high-voltage, high-power variable frequency speed control devices have become increasingly mature. The high-voltage problem, which was previously difficult to solve, has been well solved in recent years through device series or unit series connection. Patent No. CN202320230778.6 discloses an auxiliary water-cooled radiator for a high-voltage frequency converter. Through the impeller set at the lower end of each rotor, the impeller can be driven to rotate when the water pump delivers water from the semiconductor cooling water tank to the interior of each second cavity, thereby driving multiple fan blades to rotate synchronously. In addition, the water flow into the interior of the first cavity can cool multiple heat-conducting plates, thereby achieving water-cooled heat dissipation and effectively ensuring the heat dissipation effect. However, in the process of using the high-voltage frequency converter water-cooled radiator, the cold water is transported through the conduit and flows back into the semiconductor cooling water tank after passing through the connecting plate. When the surface of the connecting plate comes into contact with the air due to its low temperature, some water will condense. The accumulation of water and its free flow can easily cause some problems. Therefore, we propose a high-voltage variable frequency water-cooled radiator. Utility Model Content

[0003] To address the problems in the existing technology, this utility model provides a high-voltage variable frequency water-cooled radiator.

[0004] The technical solution adopted by this utility model to solve its technical problem is a high-voltage variable frequency water-cooled radiator, including a base. The top surface of the base is bolted with a tray for holding, and the bottom surface of the tray is integrally constructed with a vertical pipe for guiding the flow. The end of the vertical pipe away from the tray is equipped with a flexible hose for guiding the flow. The inner side of the tray is equipped with vertical rods for support, and there are multiple sets of vertical rods. A plate seat located on the top of the tray is assembled between the multiple sets of vertical rods. A frame groove for guiding flow is opened on the top surface of the plate seat, and a flow groove connected to the frame groove is opened on the outer wall surface of the plate seat.

[0005] By adopting the above technical solution, during the use of the high-voltage variable frequency water-cooled radiator, the water that flows down the plate surface during water cooling can be collected by the tray, and the water can be discharged to a designated location outside through the vertical pipe and the hose, thereby reducing the impact caused by the random flow of water and enabling the water-cooled radiator to cool the high-voltage variable frequency more stably. During the use of the tray, most of the vertical bars on the tray surface can support the tray, while the grooves on the tray surface facilitate the diversion of water condensed on the surface. The water can also flow into the inside of the tray through the flow channel, making it easy to collect and discharge it to a designated location, thus further reducing the situation of water flowing randomly.

[0006] Specifically, the top surface of the plate base is provided with a groove, and a plate for sealing is assembled inside the groove by bolts. Both the top and bottom surfaces of the plate are provided with heat-conducting plates, and there are multiple sets of heat-conducting plates.

[0007] By adopting the above technical solution, the plate installed inside the groove on the plate base can easily support multiple sets of heat conduction plates, and the cooling capacity of the cooling water entering the plate base can be transferred out through the heat conduction plates, thereby facilitating heat dissipation and cooling. At the same time, the plate is easy to disassemble and install, and easy to clean and replace.

[0008] Specifically, the top surface of the base is equipped with a semiconductor cooling water tank body, and the outlet end of the semiconductor cooling water tank body is equipped with a circulation pump located on the surface of the base. The outlet end of the circulation pump is equipped with a return pipe, and the end of the return pipe away from the circulation pump is equipped with an impeller seat. There are multiple sets of impeller seats, and the end of the impeller seat away from the return pipe is connected to the inlet end of the semiconductor cooling water tank body through a conduit.

[0009] By adopting the above technical solution, the main body of the semiconductor cooling water tank can easily cool the internal water source, while the circulating pump can easily draw cold water and guide it through the return pipe for discharge. This allows the cold water to pass through the impeller seat and drive the impeller body inside the impeller seat to rotate. The impeller body can then drive the fan blades on the outer periphery of the impeller seat to rotate and easily blow the cold air to the designated location for cooling and heat dissipation. Subsequently, the cold water can enter the plate base and conduct the cold air through the heat conduction plate. Then, the cold water inside the plate base can flow back into the main body of the semiconductor cooling water tank to form a circulating cooling operation.

[0010] Specifically, a protective filter screen is fitted onto the outer peripheral surface of the impeller seat using screws.

[0011] By adopting the above technical solution, the filter screen can easily protect the fan blades on the outer periphery of the impeller seat, enabling them to operate more stably.

[0012] Specifically, the bottom surface of the plate has an integrally formed frame strip that fits into the groove, and the bottom surface of the plate has an adhesive pad that fits into the groove.

[0013] By adopting the above technical solution, the frame strip at the bottom of the panel fits into the groove on the inner wall of the groove, and with the addition of the rubber pad, the tightness of the connection between the panel and the groove is improved, thereby reducing the occurrence of leakage.

[0014] Compared with the prior art, the present invention has the following beneficial effects: 1. The technical solution of this application, through the design of tray, vertical pipe and hose, can collect water flowing from the surface of the plate during the use of high voltage frequency inverter water cooling radiator by using tray, and can discharge water to a designated external location through vertical pipe and hose, thereby reducing the impact caused by random water flow, so that the water cooling radiator can dissipate heat from the high voltage frequency inverter more stably.

[0015] 2. The technical solution of this application, through the design of vertical rods, plate base, frame groove and flow channel, allows the plate base to be supported by most of the vertical rods on the surface of the tray during use, while the frame groove on the surface of the plate base facilitates the diversion of water condensed on its surface, and the flow channel allows water to flow into the interior of the tray, thereby facilitating its collection and discharge to a designated location, and further reducing the situation of water flowing randomly. Attached Figure Description

[0016] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0017] Figure 1 This is an isometric view of the present invention; Figure 2 This is a schematic diagram of the tray structure of this utility model; Figure 3 This is a schematic diagram of the plate structure of this utility model; In the diagram: 1. Base; 2. Tray; 3. Vertical pipe; 4. Flexible hose; 5. Vertical rod; 6. Plate seat; 7. Groove; 8. Plate body; 9. Heat-conducting plate; 10. Frame groove; 11. Flow groove; 12. Semiconductor cooling water tank body; 13. Circulation pump; 14. Return pipe; 15. Impeller seat; 16. Filter screen cover; 17. Frame strip; 18. Rubber pad. Detailed Implementation

[0018] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0019] Please see Figure 1-3This utility model provides a technical solution: a high-voltage variable frequency water-cooled radiator, including a base 1, a tray 2 for holding is bolted to the top surface of the base 1, and a vertical pipe 3 for guiding flow is integrally formed on the bottom surface of the tray 2. A flexible hose 4 for guiding flow is installed at the end of the vertical pipe 3 away from the tray 2; vertical rods 5 for support are installed on the inner side of the tray 2, and there are multiple sets of vertical rods 5. A plate seat 6 located on the top of the tray 2 is installed between the multiple sets of vertical rods 5, and a frame groove 10 for guiding flow is opened on the top surface of the plate seat 6, and a flow groove 11 connected to the frame groove 10 is opened on the outer wall surface of the plate seat 6.

[0020] During use, the tray 2 can collect the water that flows onto the surface of the plate seat 6 during water cooling, and the water can be discharged to a designated location outside through the vertical pipe 3 and the flexible hose 4, thereby reducing the impact of water flowing randomly and enabling the water cooling radiator to cool the high-voltage frequency converter more stably. During the use of the tray 6, most of the vertical bars 5 on the surface of the tray 2 can support the tray 6, and the frame grooves 10 on the surface of the tray 6 can facilitate the drainage of water condensed on its surface, and the water can flow into the interior of the tray 2 through the flow channel 11, so as to facilitate the collection and discharge of water to a designated location, and further reduce the situation of water flowing randomly.

[0021] like Figure 1 and Figure 3 As shown, the top surface of the plate base 6 is provided with a groove 7, and a plate body 8 for sealing is assembled inside the groove 7 by bolts. Both the top and bottom surfaces of the plate body 8 are provided with heat-conducting plates 9, and there are multiple sets of heat-conducting plates 9.

[0022] In use, the plate body 8 installed inside the groove 7 on the surface of the plate base 6 can easily support multiple sets of heat conduction plates 9, and allow the cooling water entering the plate base 6 to be transferred out through the heat conduction plates 9, thereby facilitating heat dissipation and cooling. At the same time, the plate body 8 is easy to disassemble and clean and replace.

[0023] like Figure 1 As shown, a semiconductor cooling water tank body 12 is mounted on the top surface of the base 1, and a circulation pump 13 located on the surface of the base 1 is mounted on the water outlet end of the semiconductor cooling water tank body 12. A return pipe 14 is mounted on the water outlet end of the circulation pump 13, and an impeller seat 15 is mounted on the end of the return pipe 14 away from the circulation pump 13. There are multiple sets of impeller seats 15, and the end of the impeller seat 15 away from the return pipe 14 is connected to the water inlet end of the semiconductor cooling water tank body 12 through a conduit.

[0024] In use, the semiconductor cooling water tank body 12 facilitates the cooling of the internal water source, while the circulating pump 13 facilitates the extraction of cold water and its discharge through the return pipe 14. This allows the cold water to pass through the impeller seat 15 and drive the impeller body inside the impeller seat 15 to rotate. The impeller body then drives the fan blades on the outer periphery of the impeller seat 15 to rotate and blow the cold air to the designated location for cooling. Subsequently, the cold water enters the plate seat 6 and conducts the cold air through the heat conduction plate 9. The cold water inside the plate seat 6 then flows back into the semiconductor cooling water tank body 12, forming a circulating cooling operation.

[0025] like Figure 1 As shown, a filter screen 16 for protection is fitted onto the outer peripheral surface of the impeller seat 15 by screws.

[0026] When in use, the filter screen 16 can protect the fan blades on the outer periphery of the impeller seat 15, enabling it to operate more stably.

[0027] like Figure 3 As shown, the bottom surface of the plate 8 has an integrally formed frame strip 17 that fits into the groove 7, and the bottom surface of the plate 8 has an adhesive pad 18 that fits into the groove 7.

[0028] When in use, the frame strip 17 at the bottom of the plate 8 fits into the groove on the inner wall of the groove 7, and with the addition of the rubber pad 18, the tightness of the connection between the plate 8 and the groove 7 is improved, thereby reducing the occurrence of leakage.

[0029] The working principle and usage process of this utility model are as follows: In use, first, install the corresponding structural components in suitable positions. During the use of the high-voltage variable frequency water-cooled radiator, the tray 2 can collect the water flowing from the surface of the plate base 6 during water cooling, and the water can be discharged to a designated external location through the vertical pipe 3 and the flexible hose 4, thereby reducing the impact of random water flow and enabling the water-cooled radiator to more stably dissipate heat from the high-voltage variable frequency drive. Simultaneously, during the use of the plate base 6, the numerous vertical bars 5 on the surface of the tray 2 can support the plate base 6, while the frame grooves 10 on the surface of the plate base 6 facilitate the drainage of condensed water, and the flow channels 11 allow water to flow into the interior of the tray 2, thus facilitating further cooling. The water is collected and discharged to a designated location to further reduce the possibility of water flowing randomly. The controller can operate the main body 12 of the semiconductor cooling water tank to facilitate the cooling of the internal water source. The circulation pump 13 can draw cold water and guide it through the return pipe 14 for discharge. The cold water can pass through the impeller seat 15 and drive the impeller body inside the impeller seat 15 to rotate. The impeller body can drive the fan blades on the outer periphery of the impeller seat 15 to rotate and blow the cold air to the designated location for cooling. Then the cold water can enter the plate seat 6 and conduct the cold air through the heat conduction plate 9. The cold water inside the plate seat 6 can then flow back into the main body 12 of the semiconductor cooling water tank to form a circulating cooling operation.

[0030] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The descriptions of the above embodiments and specifications are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of protection claimed by this utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A high-voltage variable frequency water-cooled radiator, characterized in that, Includes a base (1), the top surface of which is bolted with a tray (2) for holding, and the bottom surface of the tray (2) is integrally constructed with a vertical pipe (3) for guiding flow, and the end of the vertical pipe (3) away from the tray (2) is fitted with a flexible hose (4) for guiding flow. The inner side of the tray (2) is equipped with vertical rods (5) for support, and there are multiple sets of vertical rods (5). A plate seat (6) located on the top of the tray (2) is assembled between the multiple sets of vertical rods (5). A frame groove (10) for guiding flow is opened on the top surface of the plate seat (6), and a flow groove (11) connected to the frame groove (10) is opened on the outer wall surface of the plate seat (6).

2. The high-voltage variable frequency water-cooled radiator according to claim 1, characterized in that, The top surface of the plate base (6) is provided with a groove (7), and a plate body (8) for sealing is assembled inside the groove (7) by bolts. The top and bottom surfaces of the plate body (8) are provided with heat-conducting plates (9), and there are multiple sets of heat-conducting plates (9).

3. The high-voltage variable frequency water-cooled radiator according to claim 1, characterized in that, The top surface of the base (1) is fitted with a semiconductor cooling water tank body (12), and the outlet end of the semiconductor cooling water tank body (12) is fitted with a circulation pump (13) located on the surface of the base (1). The outlet end of the circulation pump (13) is fitted with a return pipe (14), and the end of the return pipe (14) away from the circulation pump (13) is fitted with an impeller seat (15). There are multiple sets of impeller seats (15), and the end of the impeller seat (15) away from the return pipe (14) is connected to the inlet end of the semiconductor cooling water tank body (12) through a conduit.

4. A high-voltage variable frequency water-cooled radiator according to claim 3, characterized in that, The outer peripheral surface of the impeller seat (15) is fitted with a protective filter screen (16) by screws.

5. A high-voltage variable frequency water-cooled radiator according to claim 2, characterized in that, The bottom surface of the plate (8) is integrally constructed with a frame strip (17) that fits into the groove (7), and the bottom surface of the plate (8) is bonded with a rubber pad (18) that fits into the groove (7).

Images