Wafer surface defect detection apparatus

Abstract

The utility model relates to wafer detection technical field, specifically wafer surface defect detection equipment, including wafer detector, two limit plates are fixed on wafer detector symmetry, the top of limit plate is slidably installed with pushing mechanism, and pushing mechanism includes the clamping plate and the sliding slot, and the top of limit plate is fixedly connected with clamping plate, and the sliding slot is located in clamping plate, and the sliding slot part is slidably installed with the slide rod, and the one end of slide rod is bonded with the gasket away from clamping plate, and the side wall close to the sliding slot of slide rod is fixedly connected with the pull block, the slide rod is slid in the sliding slot part of clamping plate, and the wafer can be pushed along the fixed path and moves to the slide rod end, and the gasket of slide rod end contacts wafer edge, avoids the hard contact of rigid slide rod and wafer, prevents scratching wafer, and further can take the wafer after detection quickly while wafer is pushed out detection area conveniently.

Description

Technical Field

[0001] This utility model relates to testing equipment, specifically a wafer surface defect testing equipment, and belongs to the field of wafer testing technology. Background Technology

[0002] A wafer is a silicon wafer used to fabricate silicon semiconductor circuits and is the basic material for manufacturing semiconductor chips. It is formed from large single crystals of high-purity polycrystalline silicon through a series of complex processes including crystal growth, grinding, polishing, and slicing. It is named for its circular, thin wafer shape. Semiconductor wafer inspection equipment possesses comprehensive and high-precision defect detection capabilities. It can accurately identify micron- and nanometer-level defects on the surface and inside the wafer, preventing defective products from flowing into the next process and directly determining the precision and yield of chip manufacturing.

[0003] However, existing wafer inspection instruments require operators to directly reach into the equipment to pull out wafers. When pulling out wafers manually, it is difficult to ensure that the force is even. If the force is biased to one side, the edge of the wafer is prone to rigid collision with the inner side of the limiting plate when it slides, resulting in edge chipping. This is especially true for thin wafers or wafers with surface coatings, where chipping will directly damage the integrity of the wafer structure. Utility Model Content

[0004] The purpose of this invention is to provide a wafer surface defect detection device to solve the above problems. The slide bar slides in the groove provided in the plate. The end of the slide bar can push the wafer to move along a fixed path. The pads attached to the end of the slide bar contact the edge of the wafer to avoid hard contact between the rigid slide bar and the wafer, thus preventing scratches on the wafer. In this way, the wafer can be pushed out of the detection area and the detected wafer can be picked up quickly.

[0005] This utility model achieves the above-mentioned objective through the following technical solution: a wafer surface defect detection device, including a wafer inspection instrument, on which two limiting plates are symmetrically fixed. A pushing mechanism is slidably installed on the top of the limiting plates. The pushing mechanism includes a clamping plate and a sliding groove. The top of the limiting plates is fixedly connected to the clamping plate. The clamping plate is provided with a sliding groove. A sliding rod is slidably installed in the sliding groove. A gasket is adhered to the end of the sliding rod away from the clamping plate. A pull block is fixedly connected to the side wall of the sliding rod near the sliding groove.

[0006] Preferably, the slide rod and the card plate are slidably connected, and the width of the slide rod near the card plate is equal to the width of the slide groove.

[0007] Preferably, the slide bar is L-shaped and the pull block is ring-shaped.

[0008] Preferably, a positioning mechanism is slidably mounted on the wafer inspection instrument. The positioning mechanism includes a bracket and hydraulic rods. The bracket is fixedly connected to the wafer inspection instrument. Two hydraulic rods are fixed inside the bracket. A fixing block is fixedly connected to the telescopic end of the hydraulic rod. A connecting rod is fixedly mounted on the fixing block. A clamping plate is fixedly connected to the end of the connecting rod.

[0009] Preferably, the support is located at the end of the wafer inspection instrument away from the slide bar, and the two hydraulic rods are symmetrically arranged inside the support.

[0010] Preferably, the clamping plate is located at the end of the connecting rod away from the hydraulic rod, and the clamping plate is slidably connected to the limiting plate.

[0011] Preferably, the length of the limiting plate is greater than the length of the clamping plate, and the central part of the clamping plate is arranged with an arc surface structure.

[0012] Preferably, an ion eliminator is fixedly installed on the side of the wafer inspection instrument away from the support, and a display screen and a high-definition camera are fixedly installed on the part of the wafer inspection instrument near the top of the ion eliminator.

[0013] The beneficial effects of this utility model are as follows: The symmetrically arranged limiting plate and clamping plate allow the slide rod to slide within the groove provided in the clamping plate. The end of the slide rod can push the wafer along a fixed path, pushing the wafer out of the inspection area, thus facilitating quick retrieval of the inspected wafer. A gasket is adhered to the end of the slide rod; the gasket is made of flexible material and directly contacts the edge of the wafer, avoiding hard contact between the rigid slide rod and the wafer, preventing scratches and ensuring the integrity of the wafer's appearance. The bending design of the L-shaped slide rod avoids other components of the inspection instrument, eliminating the need for additional operating space. Simultaneously, the L-shaped structure makes the pushing direction of the slide rod more aligned with the wafer's center of gravity, preventing wafer tilting and improving the stability of wafer pushing. The annular pull block facilitates gripping or hooking by the operator, saving effort when manually adjusting the slide rod. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0015] Figure 2 for Figure 1 The diagram shown is an enlarged view of the structure of part A.

[0016] Figure 3 This is a schematic diagram of the connection structure between the slide rod and the pull block of this utility model;

[0017] Figure 4 for Figure 3 The diagram shown is an enlarged view of the structure of section B.

[0018] Figure 5This is a schematic diagram of the connection structure between the limiting plate and the clamping plate of this utility model.

[0019] In the diagram: 1. Wafer inspection instrument; 2. High-definition camera; 3. Display screen; 4. Ion antistatic bar; 5. Pushing mechanism; 501. Clamping plate; 502. Slide groove; 503. Slide rod; 504. Pulling block; 505. Gasket; 6. Limiting plate; 7. Positioning mechanism; 701. Bracket; 702. Hydraulic rod; 703. Fixing block; 704. Connecting rod; 705. Clamping plate. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] Please see Figures 1-5 As shown, the wafer surface defect inspection equipment includes a wafer inspection instrument 1. Two limiting plates 6 are symmetrically fixed on the wafer inspection instrument 1. A pushing mechanism 5 is slidably installed on the top of the limiting plates 6. The pushing mechanism 5 includes a clamping plate 501 and a sliding groove 502. The clamping plate 501 is fixedly connected to the top of the limiting plates 6. The sliding groove 502 is provided inside the clamping plate 501. A sliding rod 503 is slidably installed in the sliding groove 502. The sliding rod 503 has an L-shaped structure. A gasket 505 is attached to the end of the sliding rod 503 facing away from the clamping plate 501. The sliding rod 503 is close to the sliding groove 502. A pull block 504 is fixedly connected to the side wall. By holding the ring-shaped pull block 504, the L-shaped slide rod 503 is pushed along the slide groove 502, so that the gasket 505 attached to the end of the slide rod 503 can gently contact the edge of the wafer. By continuously pushing the slide rod 503, the wafer is pushed out of the detection area along the fixed path guided by the limiting plate 6 until the wafer is completely removed from the detection area, which is convenient for manual or robotic arm to pick up the material. The slide rod 503 is slidably connected to the clamping plate 501, and the width of the end of the slide rod 503 near the clamping plate 501 is equal to the width of the slide groove 502.

[0022] As a technical optimization of this utility model, a positioning mechanism 7 is slidably mounted on the wafer inspection instrument 1. The positioning mechanism 7 includes a bracket 701 and hydraulic rods 702. The bracket 701 is fixedly connected to the wafer inspection instrument 1 and is located at the end of the wafer inspection instrument 1 away from the sliding rod 503. Two hydraulic rods 702 are fixedly fixed inside the bracket 701 and are symmetrically arranged inside the bracket 701. A fixing block 703 is fixedly connected to the telescopic end of the hydraulic rod 702. A connecting rod 704 is fixedly mounted on the fixing block 703. A clamping plate 705 is fixedly connected to the end of the connecting rod 704. The center part of the clamping plate 705 is arranged with an arc surface structure and is located at the end of the connecting rod 704 away from the hydraulic rods 702. The clamping plate 705 is slidably connected to the limiting plate 6. The length of the limiting plate 6 is greater than the length of the clamping plate 705. When the control switch of the hydraulic rod 702 installed in the bracket 701 is turned on, the telescopic end of the hydraulic rod 702 is connected to the connecting rod 704 through the fixing block 703. The clamping plate 705 is fixedly connected to the connecting rod 704. When the hydraulic rod 702 is started, its telescopic end drives the fixing block 703 to move the connecting rod 704, which in turn causes the connecting rod 704 to move the clamping plate 705 closer to the wafer. When the clamping plate 705, which has an arc surface structure, contacts the edge of the wafer, the hydraulic rod 702 automatically decelerates. By using the arc surface structure to fit the curvature of the wafer, surface contact clamping is achieved, and finally the wafer can be fixed in the center of the detection area.

[0023] As a technical optimization of this utility model, an ion eliminator 4 is fixedly installed on the side of the wafer inspection instrument 1 away from the support 701. A display screen 3 and a high-definition camera 2 are fixedly installed on the wafer inspection instrument 1 near the top of the ion eliminator 4. When the switch of the ion eliminator 4 installed on the device is turned on, the ion eliminator 4 blows ion wind on the surface of the wafer to neutralize the static electricity generated by the wafer during handling and to prevent the wafer from adsorbing dust particles. Then, the high-definition camera 2 performs a full-area scan on the surface of the wafer. The scanning path is set in a spiral pattern to ensure that the image can be transmitted to the display screen 3 in real time. The operator can then observe the defects on the surface of the wafer through the display screen 3, or automatically identify the defects by combining the built-in algorithm of the device, and record the defect type, location and size in detail.

[0024] In use, the operator first places the wafer to be inspected stably in the inspection area of ​​the wafer inspection instrument 1, ensuring the edge of the wafer is inside the limiting plate 6. Then, the operator activates the control switch of the hydraulic rod 702 installed in the bracket 701. The telescopic end of the hydraulic rod 702 is connected to a connecting rod 704 via a fixing block 703. A clamping plate 705 is fixedly connected to the connecting rod 704. When the hydraulic rod 702 is activated, its telescopic end drives the fixing block 703 to move the connecting rod 704, which in turn moves the clamping plate 705 closer to the wafer. When the clamping plate 705, with its arc-shaped structure, contacts the edge of the wafer, the hydraulic rod 702 automatically decelerates. Utilizing the arc-shaped structure to conform to the curvature of the wafer, surface contact clamping is achieved, ultimately fixing the wafer in the center of the inspection area. After the wafer is positioned, the operator turns on the switch of the ion eliminator 4 installed on the equipment. The ion eliminator 4 blows ion wind onto the surface of the wafer to facilitate neutralization. The static electricity generated during wafer handling prevents the wafer from attracting dust particles. Then, a high-definition camera 2 scans the entire wafer surface in a spiral pattern to ensure real-time image transmission to the display screen 3. The operator then observes wafer surface defects on the display screen 3, or uses the equipment's built-in algorithm to automatically identify defects and record their type, location, and size in detail. After inspection, the hydraulic rod 702 extends and retracts in the opposite direction, resetting its position. Its extension end drives the clamping plate 705 to slide along the inner wall of the limiting plate 6 to both sides, releasing the wafer. Finally, the operator holds the annular pull block 504 and pushes the L-shaped slide rod 503 along the slide groove 502, allowing the gasket 505 attached to the end of the slide rod 503 to gently contact the edge of the wafer. Continuing to push the slide rod 503, the wafer is pushed out of the inspection area along the fixed path guided by the limiting plate 6 until it is completely removed from the inspection area, facilitating manual or robotic arm removal.

[0025] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0026] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A wafer surface defect inspection device, comprising a wafer inspection instrument (1), characterized in that: Two limiting plates (6) are symmetrically fixed on the wafer inspection instrument (1). A pushing mechanism (5) is slidably installed on the top of the limiting plate (6). The pushing mechanism (5) includes a clamping plate (501) and a slide groove (502). The clamping plate (501) is fixedly connected to the top of the limiting plate (6). The slide groove (502) is provided in the clamping plate (501). A slide rod (503) is slidably installed in the slide groove (502). A gasket (505) is glued to the end of the slide rod (503) away from the clamping plate (501). A pull block (504) is fixedly connected to the side wall of the slide rod (503) near the slide groove (502).

2. The wafer surface defect detection equipment according to claim 1, characterized in that: The slide rod (503) is slidably connected to the card plate (501), and the width of the end of the slide rod (503) near the card plate (501) is equal to the width of the slide groove (502).

3. The wafer surface defect detection equipment according to claim 1, characterized in that: The slide bar (503) is arranged in an L-shape, and the pull block (504) is arranged in a ring shape.

4. The wafer surface defect detection equipment according to claim 1, characterized in that: A positioning mechanism (7) is slidably mounted on the wafer inspection instrument (1). The positioning mechanism (7) includes a bracket (701) and a hydraulic rod (702). The bracket (701) is fixedly connected to the wafer inspection instrument (1). Two hydraulic rods (702) are fixed inside the bracket (701). A fixing block (703) is fixedly connected to the telescopic end of the hydraulic rod (702). A connecting rod (704) is fixedly mounted on the fixing block (703). A clamping plate (705) is fixedly connected to the end of the connecting rod (704).

5. The wafer surface defect detection equipment according to claim 4, characterized in that: The bracket (701) is located at one end of the wafer inspection instrument (1) away from the slide bar (503), and the two hydraulic rods (702) are symmetrically arranged inside the bracket (701).

6. The wafer surface defect detection equipment according to claim 4, characterized in that: The clamping plate (705) is located at the end of the connecting rod (704) away from the hydraulic rod (702), and the clamping plate (705) is slidably connected to the limiting plate (6).

7. The wafer surface defect detection equipment according to claim 4, characterized in that: The length of the limiting plate (6) is greater than the length of the clamping plate (705), and the center part of the clamping plate (705) is set with an arc surface structure.

8. The wafer surface defect detection equipment according to claim 4, characterized in that: An ion eliminator (4) is fixedly installed on the side of the wafer inspection instrument (1) away from the support (701). A display screen (3) and a high-definition camera (2) are fixedly installed on the part of the wafer inspection instrument (1) near the top of the ion eliminator (4).

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