A frequency converter

Abstract

The utility model provides a kind of frequency converter, including power panel assembly, inner shell, radiator and outer shell, power panel assembly includes power supply circuit board and control circuit board, control circuit board is welded with power supply circuit board and is vertically arranged, outer shell is covered from above in the periphery of power panel assembly and inner shell.The utility model power supply circuit board is vertically installed in inner shell side face, no longer be limited to the horizontal size of circuit board, product can be designed into narrow body, and the width of frequency converter is reduced.Frequency converter installation can make full use of the height space of control cabinet, reduce width occupation, when multiple frequency converters are installed in the control cabinet of limited space, width space crowded problem can be avoided.The rectifier bridge, IGBT device, control circuit board are all welded on power supply circuit board in advance, form integrated power panel assembly, do not need welding on site when assembling, just need to lock power panel assembly, radiator and inner shell by screw, outer shell cover can complete assembly, improve assembly efficiency.

Description

Technical Field

[0001] This utility model relates to the field of frequency converter technology, specifically a frequency converter. Background Technology

[0002] Variable frequency drives (VFDs) are widely used in the industrial field. They are power electronic devices that achieve motor speed control by changing the motor's operating voltage and frequency.

[0003] Current inverter installations typically involve a multi-step, horizontally stacked mounting process. First, the heatsink is mounted horizontally onto the lower housing of the product. Then, the rectifier bridge and the IGBTs (Insulated Gate Bipolar Transistors) of the inverter circuit are screwed onto the heatsink. The power circuit board is then mounted horizontally onto the rectifier bridge and IGBTs and soldered together. The control circuit board is electrically connected to the power circuit board. Finally, the upper housing is installed, and the control panel is mounted. This horizontally stacked mounting method is cumbersome, inefficient, and relatively costly. Furthermore, the current horizontal mounting method limits the inverter's width due to the circuit board design. A large inverter width restricts its application scenarios and hinders cost reduction. For example, when multiple inverters are installed in a control cabinet with limited internal space, the existing inverters occupy the cabinet's width but cannot utilize its height. Utility Model Content

[0004] In order to overcome the shortcomings of the prior art, the purpose of this utility model is to provide a frequency converter.

[0005] To achieve the above objectives, the technical solution adopted by this utility model to solve its technical problem is: a frequency converter, comprising: A power board assembly includes a power circuit board and a control circuit board. The power circuit board is soldered with a rectifier bridge, multiple IGBT devices, and multiple bus filter capacitors. The IGBT device includes a heat dissipation surface, a top surface opposite to the heat dissipation surface, and pins soldered to the power circuit board. The top surface of the IGBT device is attached to the power circuit board. The control circuit board is soldered to the power circuit board and is arranged perpendicularly. The inner housing has a heat dissipation duct with an air inlet and an air outlet, and a cooling fan is installed at the air inlet. The power circuit board is vertically mounted on one side of the inner housing, and the control circuit board is horizontally located on the upper part of the inner housing. The heat dissipation duct wall of the inner housing has a first slot, multiple second slots, and multiple capacitor mounting holes. The rectifier bridge passes through the first slot, the IGBT device passes through the second slot, and the bus filter capacitor passes through the capacitor mounting holes and enters the heat dissipation duct. The heat sink is installed inside the heat dissipation duct. The heat sink is locked and fixed to the power board assembly by screws. The heat dissipation surface of the IGBT device is in contact with the heat sink, and the rectifier bridge is in contact with the heat sink. An outer casing with an opening at the bottom, the outer casing covering the power board assembly and the inner casing from above.

[0006] This utility model features a power circuit board that is vertically mounted on the side of the inner housing, eliminating the limitations imposed by the horizontal dimensions of the circuit board. This allows for a narrower design, reducing the width of the frequency converter. The frequency converter installation fully utilizes the height space of the control cabinet, minimizing width occupation. When multiple frequency converters are installed in a control cabinet with limited space, it avoids the problem of cramped width. The rectifier bridge, IGBT devices, and control circuit board are all pre-soldered onto the power circuit board, forming an integrated power board assembly. Assembly requires no on-site soldering; simply tightening the power board assembly, heat sink, and inner housing with screws, and then covering it with the outer housing, completes the assembly, improving assembly efficiency.

[0007] Furthermore, the heat sink includes a first heat dissipation wall and a second heat dissipation wall. The first heat dissipation wall is vertical and is used to dissipate heat from the IGBT device. The second heat dissipation wall is horizontal and is used to dissipate heat from the rectifier bridge.

[0008] By adopting the above-mentioned preferred solution, the double-wall structure is specifically adapted to the installation positions of IGBT devices and rectifier bridges, achieving precise heat dissipation and improving the overall heat dissipation targeting and efficiency.

[0009] Furthermore, the back of the first heat dissipation wall is provided with a plurality of first fins, and the back of the second heat dissipation wall is provided with a plurality of second fins, wherein the width of the first fins is greater than the width of the second fins.

[0010] By adopting the above-mentioned preferred scheme, the first fin is wider to match the high heat dissipation requirements of the IGBT, and the second fin is adapted to the heat dissipation requirements of the rectifier bridge. Through differentiated fin design, the heat dissipation effect is guaranteed while ensuring a compact structure.

[0011] Furthermore, a heat-conducting component is provided between the first heat dissipation wall and the inner shell, and the heat dissipation surface of the IGBT device is in contact with the heat-conducting component.

[0012] By adopting the above-mentioned preferred solution, the heat-conducting component can reduce the heat dissipation gap between the heat dissipation surface of the IGBT device and the first heat dissipation wall, improve the heat conduction efficiency, avoid device failure caused by local overheating, and at the same time seal the gap between the inner shell mounting slot and the heat sink, preventing external dust and moisture from entering the device, reducing the risk of corrosion of circuit board components in humid and dusty environments, and improving environmental adaptability.

[0013] Furthermore, a thermally conductive adhesive layer is applied between the second heat dissipation wall and the rectifier bridge.

[0014] By adopting the above-mentioned preferred solution, the thermally conductive adhesive layer can fill the tiny gap between the second heat dissipation wall and the rectifier bridge, enhance the heat conduction effect, ensure that the heat generated by the rectifier bridge during operation is transferred to the heat sink in a timely manner, ensure the stable operation of the rectifier bridge, and extend its service life.

[0015] Furthermore, an annular groove is provided on the end face of the inner housing where the capacitor mounting hole contacts the power circuit board, and a sealing strip is provided in the annular groove.

[0016] By adopting the above-mentioned preferred solution, the sealing strip can seal the gap between the inner shell and the power circuit board, further preventing external dust and moisture from entering the equipment, and significantly improving the reliability of equipment operation.

[0017] Furthermore, the inner housing is provided with a horizontally extending fixing post, and the power circuit board is fixed to the fixing post by screws.

[0018] By adopting the above-mentioned preferred solution, space can be effectively made for electronic components on the power circuit board, making the installation of the power circuit board more convenient.

[0019] Furthermore, the top of the inner housing is provided with a slot with an opening horizontally facing the power circuit board, and the opening of the slot is also provided with a V-shaped guide rib that gradually widens outward.

[0020] Using the above-mentioned preferred solution, the V-shaped guide rib can assist in the precise positioning and installation of the control circuit board, reduce assembly difficulty, and improve assembly efficiency. At the same time, the slot can provide support for one side of the control circuit board, enhancing the overall structural stability.

[0021] Furthermore, an isolation rib extending horizontally toward the power circuit board is provided on the outer side of the second slot of the inner housing. The power circuit board is provided with a socket that mates with the isolation rib, and the socket is located between adjacent pins of the IGBT device.

[0022] By adopting the above-mentioned preferred solution, the isolation ribs can increase the creepage distance between adjacent pins of the IGBT device, avoid leakage and short circuit problems caused by insufficient pin spacing, and significantly improve the reliability of equipment operation.

[0023] Furthermore, a fan cover is provided on the outside of the cooling fan.

[0024] Using the preferred solution described above, the fan cover serves to fix the fan and provide protection. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a structural schematic diagram of one embodiment of the frequency converter of this utility model.

[0027] Figure 2 This is an exploded structural diagram of one embodiment of the frequency converter of this utility model.

[0028] Figure 3 This is a cross-sectional view of one embodiment of the frequency converter of this utility model.

[0029] Figure 4 This is one of the structural diagrams of one embodiment of the inner shell.

[0030] Figure 5 This is a second structural diagram of one embodiment of the inner shell.

[0031] Figure 6 This is a structural diagram of one implementation of a radiator.

[0032] Figure 7 This is a structural diagram of one embodiment of the power board assembly.

[0033] Figure 8 yes Figure 7 Enlarged view of a portion of point A in the middle.

[0034] The numbers and letters in the diagram represent the names of the corresponding components: 10-Power board assembly; 11-Power circuit board; 111-Rectifier bridge; 112-IGBT device; 113-Bus filter capacitor; 114-Jack; 12-Control circuit board; 20-Inner shell; 21-Heat dissipation duct; 22-Air inlet; 23-Air outlet; 24-Cooling fan; 25-First slot; 26-Second slot; 27-Capacitor mounting hole; 28-Ring groove; 29-Fixing post; 31-Slot; 32-V-shaped guide rib; 33-Isolation rib; 40 - Radiator; 41 - First heat dissipation wall; 42 - Second heat dissipation wall; 43 - First fin; 44 - Second fin; 45 - Heat-conducting component; 50 - Outer casing; 51 - Fan cover. Detailed Implementation

[0035] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0036] like Figure 1-8 As shown, one embodiment of this utility model is: a frequency converter, comprising: The power board assembly 10 includes a power circuit board 11 and a control circuit board 12. The power circuit board 11 is soldered with a rectifier bridge 111, multiple IGBT devices 112 and multiple bus filter capacitors 113. The IGBT device 112 includes a heat dissipation surface, a top surface opposite to the heat dissipation surface and pins soldered to the power circuit board. The top surface of the IGBT device 112 is attached to the power circuit board 11. The control circuit board 12 is soldered to the power circuit board 11 and is arranged perpendicularly. The inner housing 20 has a heat dissipation duct 21, which has an air inlet 22 and an air outlet 23. A cooling fan 24 is installed at the air inlet 22. The power circuit board 11 is vertically installed on one side of the inner housing 20, and the control circuit board 12 is horizontally located on the upper part of the inner housing 20. The heat dissipation duct wall of the inner housing 20 is provided with a first slot 25, multiple second slots 26 and multiple capacitor mounting holes 27. The rectifier bridge 111 passes through the first slot 25, the IGBT device 112 passes through the second slot 26, and the bus filter capacitor 113 passes through the capacitor mounting hole 27 and enters the heat dissipation duct 21. Heat sink 40 is installed in heat dissipation duct 21. Heat sink 40 is locked and fixed to power board assembly 10 and inner shell 20 by screws. Heat dissipation surface of IGBT device 112 is in contact with heat sink 40. Rectifier bridge 111 is in contact with heat sink 40. The outer casing 50 has an opening at the bottom and covers the power board assembly 10 and the inner casing 20 from above.

[0037] The advantages of adopting the above technical solution are: the power circuit board is vertically mounted on the side of the inner casing, no longer limited by the horizontal dimensions of the circuit board, allowing the product to be designed with a narrow body and reducing the width of the frequency converter. Frequency converter installation can fully utilize the height space of the control cabinet, reducing width occupation. When multiple frequency converters are installed in a control cabinet with limited space, it avoids the problem of space congestion. The rectifier bridge, IGBT devices, and control circuit board are all pre-soldered onto the power circuit board, forming an integrated power board assembly. No on-site soldering is required during assembly; assembly is completed simply by locking the power board assembly, heat sink, and inner casing with screws and then covering it with the outer casing, improving assembly efficiency.

[0038] In this invention, the specific structures of the power circuit board and control circuit board in the power board assembly are not described in detail, as they can be obtained from existing technologies. In existing technologies, the power circuit board and control circuit board are typically connected by electronic connecting wires, while in this application, they are directly soldered and arranged vertically for ease of assembly. The rectifier bridge in the power circuit board rectifies the input AC power into DC power, and then the capacitor bank's filter circuit converts the pulsating DC power into stable DC power. Finally, an inverter circuit composed of IGBT devices converts the DC power back into AC power to drive the motor.

[0039] like Figure 3 , 6 As shown, in some other embodiments of this utility model, the heat sink 40 includes a first heat dissipation wall 41 and a second heat dissipation wall 42. The first heat dissipation wall 41 is vertical and is used to dissipate heat from the IGBT device 112. The second heat dissipation wall 42 is horizontal and is used to dissipate heat from the rectifier bridge 111. The beneficial effect of adopting the above technical solution is that the dual-wall structure is specifically adapted to the installation positions of the IGBT device and the rectifier bridge, achieving precise heat dissipation and improving the overall heat dissipation targeting and efficiency.

[0040] like Figure 3 , 6 As shown, in some other embodiments of this utility model, the back of the first heat dissipation wall 41 is provided with a plurality of first fins 43, and the back of the second heat dissipation wall 42 is provided with a plurality of second fins 44, wherein the width of the first fins 43 is greater than the width of the second fins 44. The beneficial effects of adopting the above technical solution are: the wider first fins match the high heat dissipation requirements of the IGBT, the second fins are adapted to the heat dissipation requirements of the rectifier bridge, and the structure is ensured while maintaining heat dissipation effect through differentiated fin design.

[0041] like Figure 2 , 3 As shown, in some other embodiments of this utility model, a heat-conducting element 45 is provided between the first heat dissipation wall 41 and the inner shell 20, and the heat dissipation surface of the IGBT device 112 is in contact with the heat-conducting element 45. The beneficial effects of adopting the above technical solution are: the heat-conducting element can reduce the heat dissipation gap between the heat dissipation surface of the IGBT device and the first heat dissipation wall, improve the heat conduction efficiency, avoid device failure caused by local overheating, and at the same time, it can seal the gap between the mounting slot of the inner shell and the heat sink, prevent external dust and moisture from entering the device, reduce the risk of corrosion of circuit board components in humid and dusty environments, and improve environmental adaptability.

[0042] In some other embodiments of this utility model, a thermally conductive adhesive layer is applied between the second heat dissipation wall 42 and the rectifier bridge 111. The beneficial effects of adopting the above technical solution are: the thermally conductive adhesive layer can fill the tiny gap between the second heat dissipation wall and the rectifier bridge, enhance the heat conduction effect, ensure that the heat generated by the rectifier bridge during operation is transferred to the heat sink in a timely manner, ensure the stable operation of the rectifier bridge, and extend its service life.

[0043] like Figure 4 As shown, in some other embodiments of this utility model, an annular groove 28 is provided on the end face of the inner housing 20 where the capacitor mounting hole 27 contacts the power circuit board 11, and a sealing strip is provided in the annular groove 28. The beneficial effect of adopting the above technical solution is that the sealing strip can seal the gap between the inner housing and the power circuit board, further preventing external dust and moisture from entering the equipment, and significantly improving the reliability of equipment operation.

[0044] like Figure 4 As shown, in some other embodiments of this utility model, the inner housing 20 is provided with a horizontally extending fixing post 29, and the power circuit board 11 is fixed to the fixing post 29 by screws. The beneficial effect of adopting the above technical solution is that it can effectively make way for electronic components on the power circuit board, facilitating the installation of the power circuit board.

[0045] like Figure 4 As shown, in some other embodiments of this utility model, the top of the inner housing 20 is provided with a slot 31 with an opening horizontally facing the power circuit board. The opening of the slot 31 is also provided with a V-shaped guide rib 32 that gradually widens outward. The beneficial effects of adopting the above technical solution are: the V-shaped guide rib can assist in the precise positioning and installation of the control circuit board, reduce the assembly difficulty, and improve the assembly efficiency. At the same time, the slot can provide support for one side of the control circuit board, enhancing the overall structural stability.

[0046] like Figure 4 , 8 As shown, in some other embodiments of this utility model, an isolation rib 33 extending horizontally towards the power circuit board is provided on the outer side of the second slot 26 of the inner housing 20. The power circuit board 11 is provided with a socket 114 that cooperates with the isolation rib, and the socket 114 is located between adjacent pins of the IGBT device 112. The beneficial effect of adopting the above technical solution is that the isolation rib can increase the creepage distance between adjacent pins of the IGBT device, avoid leakage and short circuit problems caused by insufficient pin spacing, and significantly improve the reliability of equipment operation.

[0047] like Figure 1 , 2 As shown, in some other embodiments of this utility model, a fan cover 51 is provided on the outside of the cooling fan 24. The beneficial effect of adopting the above technical solution is that the fan cover serves to fix the fan and provide protection.

[0048] The above embodiments are only for illustrating the technical concept and features of this utility model. Their purpose is to enable those skilled in the art to understand the content of this utility model and implement it. They should not be used to limit the protection scope of this utility model. All equivalent changes or modifications made in accordance with the spirit and essence of this utility model should be covered within the protection scope of this utility model.

Claims

1. A frequency converter, characterized in that, include: A power board assembly includes a power circuit board and a control circuit board. The power circuit board is soldered with a rectifier bridge, multiple IGBT devices, and multiple bus filter capacitors. The IGBT device includes a heat dissipation surface, a top surface opposite to the heat dissipation surface, and pins soldered to the power circuit board. The top surface of the IGBT device is attached to the power circuit board. The control circuit board is soldered to the power circuit board and is arranged perpendicularly. The inner housing has a heat dissipation duct with an air inlet and an air outlet, and a cooling fan is installed at the air inlet. The power circuit board is vertically mounted on one side of the inner housing, and the control circuit board is horizontally located on the upper part of the inner housing. The heat dissipation duct wall of the inner housing has a first slot, multiple second slots, and multiple capacitor mounting holes. The rectifier bridge passes through the first slot, the IGBT device passes through the second slot, and the bus filter capacitor passes through the capacitor mounting holes and enters the heat dissipation duct. The heat sink is installed inside the heat dissipation duct. The heat sink is locked and fixed to the power board assembly by screws. The heat dissipation surface of the IGBT device is in contact with the heat sink, and the rectifier bridge is in contact with the heat sink. An outer casing with an opening at the bottom, the outer casing covering the power board assembly and the inner casing from above.

2. The frequency converter according to claim 1, characterized in that, The heat sink includes a first heat sink wall and a second heat sink wall. The first heat sink wall is vertical and is used to dissipate heat from the IGBT device. The second heat sink wall is horizontal and is used to dissipate heat from the rectifier bridge.

3. The frequency converter according to claim 2, characterized in that, The back of the first heat dissipation wall is provided with a plurality of first fins, and the back of the second heat dissipation wall is provided with a plurality of second fins, wherein the width of the first fins is greater than the width of the second fins.

4. The frequency converter according to claim 2, characterized in that, A heat-conducting component is provided between the first heat dissipation wall and the inner shell, and the heat dissipation surface of the IGBT device is in contact with the heat-conducting component.

5. The frequency converter according to claim 2, characterized in that, A thermally conductive adhesive layer is applied between the second heat dissipation wall and the rectifier bridge.

6. The frequency converter according to claim 1, characterized in that, The inner housing has an annular groove on the end face that contacts the capacitor mounting hole and the power circuit board, and a sealing strip is provided in the annular groove.

7. The frequency converter according to claim 1, characterized in that, The inner housing is provided with a horizontally extending fixing post, and the power circuit board is fixed to the fixing post by screws.

8. The frequency converter according to claim 7, characterized in that, The top of the inner housing is provided with a slot with an opening horizontally facing the power circuit board, and the opening of the slot is also provided with a V-shaped guide rib that gradually widens outward.

9. The frequency converter according to claim 1, characterized in that, An isolation rib extending horizontally toward the power circuit board is provided on the outer side of the second slot of the inner housing. The power circuit board is provided with a socket that mates with the isolation rib. The socket is located between adjacent pins of the IGBT device.

10. The frequency converter according to claim 1, characterized in that, A fan cover is provided on the outside of the cooling fan.

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