Electronic device module and mobile terminal

Abstract

The application relates to the field of wireless communication technology and discloses an electronic device module and a mobile terminal. The electronic device module of the application is applied to the mobile terminal and comprises a first heating device and a driving device. The first heating device is integrated with a first cooling medium flow channel. The driving device is used for driving the cooling medium to circulate and flow in the first cooling medium flow channel. The electronic device module of the application can precisely actively radiate the first heating device in a modular manner, effectively improves the heat dissipation capacity of the mobile terminal, does not additionally occupy the internal space of the mobile terminal, is beneficial to the demand of product miniaturization, does not need to open a large number of flow channels in the middle frame and other structures of the mobile terminal, and does not affect the overall structural strength of the mobile terminal.

Description

Technical Field

[0001] This application relates to the field of wireless communication technology, and in particular to an electronic device module and a mobile terminal. Background Technology

[0002] Mobile terminals (such as mobile phones and tablets) are common electronic devices in daily life. During use, the heat-generating components inside the mobile terminal will dissipate heat, causing the mobile terminal to overheat, which will affect the user experience. Therefore, researching thermal design that maintains high heat dissipation performance has become an important topic in the field of mobile terminals.

[0003] Existing heat dissipation methods include graphite heat dissipation films, graphene, heat pipes (HP), and vapor chambers (VC).

[0004] However, with the continuous improvement of mobile terminal specifications and the increase in user demands, such as when users use high-power applications such as artificial intelligence (AI), games, video calls, and satellite communications, the heat generated by mobile terminals also increases. Therefore, the above-mentioned heat dissipation methods can no longer balance the heat generated by the heat-generating components inside the mobile terminal. Summary of the Invention

[0005] This application provides an electronic device module and a mobile terminal. The electronic device module of this application can actively dissipate heat from heat-generating components through a modular heat dissipation method, improving the overall heat dissipation capacity of the mobile terminal and enabling temperature regulation of the mobile terminal to prevent overheating during use and thus affecting the user experience. The embodiments of this application are described below from multiple aspects, and the implementation methods and beneficial effects described below can be used for mutual reference.

[0006] The first aspect of this application provides an electronic device module for use in a mobile terminal. The specific electronic device module includes: a first heating device, the first heating device integrating a first cooling medium channel; and a driving device for driving the cooling medium to circulate within the first cooling medium channel.

[0007] By adopting the above technical solution, the embodiments of this application integrate a first cooling medium channel on the first heating device. The cooling medium is driven by a driving device to circulate within the first cooling medium channel to remove the heat generated by the first heating device. Furthermore, the first heating device has its own cooling medium channel, thus forming a liquid cooling module. This modular approach allows for precise and active heat dissipation of the first heating device, effectively improving the heat dissipation capability of the mobile terminal.

[0008] Furthermore, in this embodiment, the first cooling medium channel is integrated into the first heating device. On the one hand, it does not occupy additional internal space of the mobile terminal, which is beneficial to the miniaturization of the product. On the other hand, it does not require opening a large number of channels in the mid-frame and other structures, and will not affect the overall structural strength of the mobile terminal.

[0009] In one possible implementation of the first aspect described above, the electronic device module further includes a second heating device, which integrates a second cooling medium channel. The second cooling medium channel is connected to the first cooling medium channel, and the driving device is used to drive the cooling medium to circulate within the first cooling medium channel and the second cooling medium channel.

[0010] By adopting the above technical solution, this embodiment integrates a second cooling medium channel on the second heating device. A driving device drives the cooling medium to circulate within the second cooling medium channel, thereby removing the heat generated by the second heating device. Furthermore, the second heating device has its own cooling medium channel, thus forming a liquid cooling module. This modular approach precisely and actively dissipates heat from the second heating device, further improving the heat dissipation capability of the mobile terminal.

[0011] Furthermore, in this embodiment, the second cooling medium channel is connected to the first cooling medium channel, so that the cooling medium can circulate within the first and second cooling medium channels, thereby achieving precise active heat dissipation for the first and second heating devices and improving the heat dissipation capability of the mobile terminal.

[0012] In one possible implementation of the first aspect described above, the electronic device module further includes: a liquid storage chamber; the liquid storage chamber is connected to a first cooling medium channel or a second cooling medium channel; and a driving device is used to drive the cooling medium to circulate within the liquid storage chamber and the first cooling medium channel or the second cooling medium channel.

[0013] By adopting the above technical solution, a liquid storage chamber is set in the electronic device module, and the liquid storage chamber is connected to either a first cooling medium channel or a second cooling medium channel to provide cooling medium to either channel. A driving device drives the cooling medium to circulate in the first cooling medium channel, thereby precisely and actively dissipating heat from the first heat-generating device; or a driving device drives the cooling medium to circulate in the second cooling medium channel, thereby precisely and actively dissipating heat from the second heat-generating device, effectively improving the heat dissipation capability of the mobile terminal.

[0014] In one possible implementation of the first aspect described above, the electronic device module further includes a liquid storage chamber located between the first cooling medium channel and the second cooling medium channel, and connected to the first cooling medium channel and the second cooling medium channel. The driving device is used to drive the cooling medium to circulate within the liquid storage chamber and the first cooling medium channel or the liquid storage chamber and the second cooling medium channel.

[0015] By employing the above technical solution, the liquid storage chamber is located between the first cooling medium flow channel and the second cooling medium flow channel. Therefore, when the temperature of the first heating device is too high, the cooling medium flows directly from the liquid storage chamber to the first cooling medium flow channel, precisely achieving active heat dissipation for the first heating device. When the temperature of the second heating device is too high, the cooling medium flows directly from the liquid storage chamber to the second cooling medium flow channel, precisely achieving active heat dissipation for the second heating device, effectively improving the heat dissipation efficiency of the electronic device module.

[0016] In one possible implementation of the first aspect above, the liquid storage chamber includes an outlet and an inlet, and the first cooling medium flow channel includes a first cooling medium inlet and a first cooling medium outlet, wherein the first cooling medium inlet is connected to the outlet and the first cooling medium outlet is connected to the inlet.

[0017] The second cooling medium flow channel includes a second cooling medium inlet and a second cooling medium outlet. The second cooling medium inlet is connected to the liquid outlet, and the second cooling medium outlet is connected to the liquid inlet.

[0018] In one possible implementation of the first aspect described above, the first cooling medium channel and the second cooling medium channel are located on the same side of the liquid storage chamber.

[0019] A second aspect of this application provides a mobile terminal, which includes any of the electronic device modules in possible implementations of the first aspect described above.

[0020] By adopting the above technical solution, any of the above electronic device modules can be set in the mobile terminal. The heat-generating device of the mobile terminal has its own cooling medium channel to form a liquid cooling module. The modular heat dissipation method can accurately and actively dissipate heat from the heat-generating device in the mobile terminal. At the same time, since the cooling medium channel is integrated on the heat-generating device, it will not occupy additional internal space of the mobile terminal, which is conducive to the miniaturization of mobile terminal products. On the other hand, since it is not necessary to open a large number of channels in the mid-frame and other structures, it will not affect the overall structural strength of the mobile terminal.

[0021] In one possible implementation of the second aspect described above, the first heating device includes a battery, with a package disposed on the outside of the battery. The package integrates a first cooling medium channel, and the package has a first cooling medium inlet and a first cooling medium outlet communicating with the first cooling medium channel. The mobile terminal also includes a first temperature sensor capable of detecting the temperature of the battery.

[0022] Using the above technical solution, the battery temperature is detected by a first temperature sensor. When the battery temperature reaches or exceeds a preset value, the driving device drives the cooling medium to circulate within the first cooling medium channel, thereby precisely achieving active heat dissipation for the battery. Furthermore, the first cooling medium channel is integrated into the outer packaging of the battery; that is, the first cooling medium channel is created within the existing packaging of the battery itself. This effectively utilizes the existing packaging without occupying additional internal space in the mobile terminal. Simultaneously, the packaging is closest to the battery, and integrating the first cooling medium channel within the packaging effectively improves the battery's heat dissipation capacity.

[0023] In one possible implementation of the second aspect above, the second heat-generating device of the electronic device module includes a PCB board, the PCB board having a support plate, the support plate integrating a second cooling medium flow channel, the second cooling medium flow channel including a second cooling medium inlet and a second cooling medium outlet; the mobile terminal also includes a second temperature sensor, the second temperature sensor being capable of detecting the temperature of the PCB board.

[0024] By employing the above technical solution, the temperature of the PCB board is detected by a second temperature sensor. When the temperature of the PCB board reaches or exceeds a preset temperature value, the driving device drives the cooling medium to circulate within the second cooling medium channel, thereby precisely achieving active heat dissipation for the PCB board. Furthermore, the second cooling medium channel is integrated into the raised platform, that is, a second cooling medium channel is opened within the existing raised platform of the PCB board itself. This effectively utilizes the existing raised platform of the mobile terminal without occupying additional internal space of the mobile terminal. Moreover, the raised platform inside the mobile terminal is usually in close contact with the PCB board to facilitate support and fixation of the PCB board. Therefore, integrating the second cooling medium channel within the raised platform can effectively improve the heat dissipation capacity of the PCB board.

[0025] In one possible implementation of the second aspect above, the mobile terminal further includes a mid-frame, the mid-frame having a baffle rib, the baffle rib integrating a liquid storage cavity for an electronic device module, the liquid storage cavity being connected to a first cooling medium channel or a second cooling medium channel.

[0026] By adopting the above technical solution, a liquid storage cavity is integrated into the baffle rib of the mid-frame. That is, the liquid storage cavity is created within the existing baffle rib of the mid-frame, making reasonable use of the existing baffle structure without occupying additional internal space of the mobile terminal. Furthermore, since the baffle rib is usually located in the middle area of ​​the mid-frame, and the battery and PCB board are usually located on opposite sides of the baffle rib, integrating the liquid storage cavity within the baffle rib places it between the first and second cooling medium channels. Therefore, when heat dissipation is needed for the battery, the cooling medium can flow directly from the liquid storage cavity into the first cooling medium channel; when heat dissipation is needed for the PCB board, the cooling medium can flow directly from the liquid storage cavity into the second cooling medium channel. This increases the speed at which the cooling medium enters the first or second cooling medium channel from the liquid storage cavity, further improving the overall heat dissipation capacity of the mobile terminal. Attached Figure Description

[0027] Figure 1 This is a stereoscopic view of a mobile phone provided by some implementation methods;

[0028] Figure 2 This is an exploded view of a mobile phone provided by some implementation methods;

[0029] Figure 3 This is a perspective view of a folding machine provided in another embodiment;

[0030] Figure 4 This application provides a stereoscopic view of the internal structure of a mobile phone. Figure 1 ;

[0031] Figure 5 This is an architecture diagram of the electronic device module provided in the embodiments of this application;

[0032] Figure 6 This is a schematic diagram of the circulation of cooling medium in a mobile phone within a liquid storage chamber and a first cooling medium flow channel, provided in an embodiment of this application.

[0033] Figure 7 This is a schematic diagram of the circulation of cooling medium in a mobile phone within a liquid storage chamber and a second cooling medium flow channel, according to an embodiment of this application.

[0034] Figure 8 This is a schematic diagram of the circulation of cooling medium in a mobile phone within a liquid storage chamber, a first cooling medium flow channel, and a second cooling medium flow channel, according to an embodiment of this application.

[0035] Figure 9 This is a cross-sectional view of a mobile phone provided in an embodiment of this application;

[0036] Figure 9a yes Figure 9 A magnified view of a section at point A in the middle;

[0037] Figure 9b yes Figure 9 A magnified view of a section at point B in the middle;

[0038] Figure 10 This is a perspective view of a first heating device for a mobile phone provided in an embodiment of this application;

[0039] Figure 11 This is a cross-sectional view of a first heating device for a mobile phone provided in an embodiment of this application;

[0040] Figure 12 yes Figure 11 A magnified view of a section at point C;

[0041] Figure 13 yes Figure 11 A magnified view of a section at point D;

[0042] Figure 14 This is a schematic diagram of the third main segment of a first heating element in a mobile phone according to an embodiment of this application;

[0043] Figure 15 This is a schematic diagram of another third main segment of a first heating device for a mobile phone provided in an embodiment of this application;

[0044] Figure 16 This application provides a stereoscopic view of the internal structure of a mobile phone. Figure 2 ;

[0045] Figure 17 yes Figure 16 A magnified view of a section at point E in the middle;

[0046] Figure 18 yes Figure 16 A magnified view of a section at point F in the middle;

[0047] Figure 19 This is a top view of a mounting plate for a second heating element of a mobile phone, as provided in an embodiment of this application.

[0048] Figure 20 This is a cross-sectional view of a support plate for a second heating device of a mobile phone provided in an embodiment of this application;

[0049] Figure 21 This is a schematic diagram of the cooling medium flowing in a first cooling medium channel in a modified embodiment of a mobile phone provided in this application.

[0050] Figure 22 This is a schematic diagram of the flow of cooling medium in a modified embodiment of a mobile phone provided in this application, showing the flow of cooling medium in the liquid storage chamber and the first cooling medium flow channel;

[0051] Figure 23This is a schematic diagram of the cooling medium flowing in the second cooling medium channel in another modified embodiment of a mobile phone provided in this application.

[0052] Figure 24 This is a schematic diagram showing the flow of cooling medium in a liquid storage cavity and a second cooling medium flow channel in another modified embodiment of a mobile phone provided in this application.

[0053] Explanation of icon numbers:

[0054] 10: Mobile phone; 11: Display screen; 12: Mid-frame; 13: PCB board; 14: Large heat dissipation components;

[0055] 20: Folding mechanism; 21: Rotating mechanism; 22: First middle frame; 23: Second middle frame; 24: Flexible screen; 25: First flexible screen; 26: Second flexible screen;

[0056] 100: Mobile phone;

[0057] 200: Mid-frame; 210: Rib;

[0058] 300: Electronic component module;

[0059] 310: First heating element; 311: Battery; 3111: Electrode; 312: Packaging; 3121: First sidewall; 3122: Second sidewall; 3123: Backplate; 3124: Accommodation space; 3125: First extension; 3126: Second extension; 313: First cooling medium channel; 3131: First transition section; 3132: First main flow section; 3133: Second transition section; 3134: Second main flow section; 3135: Third main flow section; 314: First cooling medium inlet; 315: First cooling medium outlet; 316: First channel connection; 317: Second channel connection; 318: First valve; 319: Second valve;

[0060] 320: Second heating element; 321: PCB board; 322: Elevating board; 3221: Outer frame; 3222: First partition; 3223: Second partition; 3224: Third partition; 3225: First cutout area; 3226: Second cutout area; 3227: Third cutout area; 3228: Fourth cutout area; 323: Second cooling medium flow channel; 324: Second cooling medium inlet; 325: Second cooling medium outlet; 326: Third flow channel connection; 327: Fourth flow channel connection; 328: Third valve; 329: Fourth valve;

[0061] 330: Liquid storage chamber; 331: First liquid outlet; 332: First liquid inlet; 333: Second liquid outlet; 334: Second liquid inlet;

[0062] 340: Drive unit;

[0063] 350: First temperature sensor;

[0064] 360: Second temperature sensor;

[0065] 400: First installation area;

[0066] 500: Second installation area. Detailed Implementation

[0067] This application provides an electronic device module for mobile terminals. This module employs a modular heat dissipation method to precisely and actively dissipate heat from internal heat-generating components, effectively improving the overall heat dissipation capacity of the mobile terminal. Specifically, the mobile terminal includes, but is not limited to, mobile phones, tablet computers, e-book readers, laptop computers, personal digital assistants (PDAs), personal computers (PCs), notebook computers, in-vehicle devices, wearable devices (such as watches), and set-top boxes—electronic devices requiring heat dissipation.

[0068] For ease of explanation, the following description uses a mobile phone as an example of a mobile terminal. The mobile phone of the present application embodiment is described below with specific embodiments.

[0069] Figure 1 A perspective view of a mobile phone according to an embodiment of this application is shown. Figure 2 An exploded view of the internal structure of a mobile phone according to an embodiment of this application is shown.

[0070] For ease of subsequent description, before describing the specific structure of the mobile phone, this application embodiment first exemplarily defines the X, Y, and Z directions. For example... Figure 1 As shown, the X direction is the length direction of the phone 10 when it is placed normally, which can also be understood as the length direction of the electronic module, and also as the direction perpendicular to the user's grip direction when using the phone 10. The Y direction is the width direction of the phone 10 when it is placed normally, which can also be understood as the width direction of the electronic module, and also as the user's grip direction when using the phone 10. The Z direction is the thickness direction of the phone 10 when it is placed normally, which can also be understood as the thickness direction of the electronic module 40.

[0071] In this embodiment, the X, Y, and Z directions intersect each other. The following explanation will use the example of the X, Y, and Z directions being mutually perpendicular to each other. It should be noted that the perpendicularity in this embodiment is not absolute; approximate perpendicularity due to manufacturing and assembly errors (e.g., an angle of 89.9° between two structural features) is also within the scope of perpendicularity in this embodiment. The limitations on perpendicularity will not be repeated later.

[0072] Combination Figure 1 and Figure 2 As can be seen, the mobile phone 10 includes a display screen 11, a mid-frame 12, a PCB (Printed Circuit Board) 40, and a battery (not shown). The battery and PCB 40 are fixed within the mid-frame 12. The battery and PCB 40 are the main heat-generating components within the mobile phone 10. During use, the battery and PCB 40 dissipate heat, causing the phone to overheat and affecting the user experience. Therefore, heat dissipation is necessary for the battery and PCB 40. Typically, the mobile phone 10 includes a large heat dissipation device 14.

[0073] Specifically, the large-area heat dissipation device 14 is, for example, a vapor chamber (VC), a graphite sheet, or a heat dissipation device composed of a vapor chamber and a graphite sheet. The large-area heat dissipation device 14 is attached to the bottom of the display screen 11 and assembled with the display screen 11 into the mid-frame 30. The large-area heat dissipation device 14 is located between the display screen 11 and the heat-generating components (battery, PCB board 40), and the large-area heat dissipation device 14 covers the battery and PCB board 40, thereby achieving heat dissipation for the battery and PCB board 40, and thus achieving heat dissipation and heat dissipation for the entire mobile phone 10.

[0074] Understandable, Figure 1 and Figure 2 The mobile phone 10 shown is a candybar phone. In addition, the mobile phone in this embodiment of the application can also be a folding phone, a rollable screen phone, etc.

[0075] refer to Figure 3 , Figure 3 A perspective view of a folding machine 20 according to an embodiment of this application is shown.

[0076] like Figure 3As shown, the folding machine 20 includes a rotating mechanism 21, a first middle frame 22 (also referred to as a first body), a second middle frame 23 (also referred to as a second body), and a flexible screen 24. Along the Y-direction, i.e., along the width direction of the folding machine 20, the first middle frame 22 and the second middle frame 23 are respectively disposed on opposite sides of the rotating mechanism 21. The first middle frame 22 and the second middle frame 23 are respectively connected to the rotating mechanism 21 and can rotate relative to each other. Exemplarily, the first middle frame 22 and the second middle frame 23 constitute the supporting skeleton of the folding machine 20, and electronic components, such as batteries and PCB boards (not shown in the figure), are disposed inside the first middle frame 22 and the second middle frame 23.

[0077] The flexible screen 24 is fixed to the first middle frame 22, the second middle frame 23, and the rotating mechanism 21. The flexible screen 24 includes a first flexible screen 25 and a second flexible screen 26 connected together. Specifically, the first flexible screen 25 is disposed between the rotating mechanism 21 and the first middle frame 22, and the second flexible screen 26 is disposed between the second middle frame 23. The flexible screen 24 can be an organic light-emitting diode (OLED) screen, a micro organic light-emitting diode (micro organic light-emitting diode) screen, a quantum dot light-emitting diode (QLED) screen, a liquid crystal display (LCD), etc.

[0078] For example, the rotating mechanism 21 and the first middle frame 22 are covered by the first flexible screen 25, and the second middle frame 23 is covered by the second flexible screen 26. The first middle frame 22 rotates relative to the rotating mechanism 21 and can drive the first flexible screen 25 to move; the second middle frame 23 rotates relative to the rotating mechanism 21 and can drive the second flexible screen 26 to move, so that the flexible screen 24 is in a bent state or an unfolded state, thereby allowing the folding machine 20 to switch between the folded state and the unfolded state.

[0079] For example, the battery and PCB board mentioned above are heat-generating devices inside the folding machine 20. For instance, when the battery is located inside the first middle frame 22, the large heat dissipation device 14 mentioned above can be installed inside the first middle frame 22. When the PCB board is located inside the second middle frame 23, the large heat dissipation device 14 mentioned above can be installed inside the second middle frame 23 to achieve uniform heat dissipation and heat dissipation for the entire folding machine 20.

[0080] With the development of technology, the various functions of mobile phones have been significantly expanded and improved, and heat dissipation design has gradually become a bottleneck for the performance of mobile phones.

[0081] For example, due to the development of artificial intelligence (AI), some mobile phones (such as the mobile phone 10 or foldable phone 20 provided in the embodiments of this application) have introduced large-scale AI models to generate various image and photography optimization processing, voice assistant execution or conversion, user interface interaction experience and other functions. During the operation of these functions, a lot of computing resources are required, which will generate a lot of heat.

[0082] For example, with the widespread adoption of satellite communication technology, some mobile phones (such as the mobile phone 10 or foldable phone 20 provided in this application embodiment) can directly send and receive signals via satellite networks without relying on terrestrial cellular networks. This allows them to maintain communication capabilities even during periods without network coverage (e.g., natural disasters, emergencies) and in areas (e.g., remote areas, deep mountains, jungles, oceans). Compared to traditional terrestrial cellular network communication, satellite communication requires coverage over longer distances and stronger signal penetration capabilities. Therefore, when using satellite communication on a mobile phone, power consumption increases, generating more heat.

[0083] However, the aforementioned large-area heat dissipation device 14 is insufficient to balance the heat generated by the battery and PCB board inside the phone. Furthermore, the large-area heat dissipation device 14 primarily provides heat dissipation passively, resulting in low efficiency. To improve heat dissipation efficiency, in some possible implementations, a fan can be installed inside the phone to actively dissipate heat from the heat-generating components. This dissipation through heat convection improves the phone's active heat dissipation efficiency. However, the principle of active heat dissipation via a fan involves introducing cold air into the phone, which can negatively impact its waterproof performance.

[0084] To address the aforementioned technical problems, this application provides an electronic component module for mobile phones. By integrating cooling medium channels into the existing structure of the heat-generating device, the cooling medium circulates within these channels, thereby precisely and actively dissipating heat from the heat-generating device. This does not require additional space within the phone's interior, nor does it necessitate creating numerous additional channels in the phone's frame, thus not affecting the phone's structural strength. It is understood that the electronic component module provided in this application can be applied to the aforementioned mobile phone 10 (candybar phone) or the aforementioned foldable phone 20. For ease of description, the following explanation uses the application of the electronic component module to a candybar phone as an example.

[0085] refer to Figure 4 and Figure 5 , Figure 4 The internal structure of the mobile phone 100 according to an embodiment of this application is shown. Figure 5 An architectural diagram of an electronic device module 300 according to an embodiment of this application is shown.

[0086] like Figure 4 and Figure 5 As shown, the mobile phone 100 provided in this embodiment includes a mid-frame 200, and the mid-frame 200 further includes a baffle 210, which extends along the width direction Y. The baffle 210 integrates a liquid storage cavity 330. Figure 6 As shown in the diagram, a liquid storage cavity 330 is formed within the existing structure of the middle frame 200 (i.e., the baffle 210), and the liquid storage cavity 330 is used to store the cooling medium. The baffle 210 divides the middle frame 200 into a first mounting area 400 and a second mounting area 500 along the length direction X, and the first mounting area 400 and the second mounting area 500 are located on opposite sides of the baffle 210 along the length direction X.

[0087] The first mounting area 400 is equipped with a battery 311, and a packaging component 312 is provided on the outside of the battery 311. The battery 311 and the packaging component 312 constitute the first heat-generating device 310 of the mobile phone 100. The first mounting area 400 is also equipped with a first temperature sensor 350, which can monitor the temperature of the battery 311 in real time.

[0088] The second mounting area 500 is provided with a PCB board 321. Along the thickness direction Z, a support plate 322 is provided at the bottom of the PCB board 321. The PCB board 321 and the support plate 322 constitute the second heat-generating device 320 of the mobile phone 100. The support plate 322 is used to support and fix the PCB board 321. The second mounting area 500 is also provided with a second temperature sensor 360, which can monitor the temperature of the PCB board 321 in real time.

[0089] The aforementioned electronic device module 300 includes a first heating device 310, a second heating device 320, and a liquid storage chamber 330.

[0090] refer to Figure 6 , Figure 6 A simplified diagram showing the connection between the raised platform 322, the retaining rib 210, and the package 312 is shown.

[0091] For example, refer to Figure 6 and combined Figure 4 The packaging component 312 integrates a first cooling medium flow channel 313, that is, the first cooling medium flow channel 313 is formed within the existing structure of the battery 311 (i.e., the packaging component 312). The support plate 322 integrates a second cooling medium flow channel 323, that is, the second cooling medium flow channel 323 is formed within the existing structure of the PCB board 321 (i.e., the support plate 322). The liquid storage chamber 330, the first cooling medium flow channel 313, and the second cooling medium flow channel 323 are interconnected, so that the cooling medium can circulate between the first cooling medium flow channel 313, the liquid storage chamber 330, and the second cooling medium flow channel 323 to dissipate heat from the battery 311 and the PCB board 321.

[0092] For example, the raised platform 322 is equipped with a driving device 340, which is electrically connected to the PCB board 321 so that the PCB board 321 supplies power to the driving device 340. A pre-set program within the mobile phone 100 can control the driving device 340 to drive the cooling medium to circulate between the first cooling medium channel 313, the liquid storage chamber 330, and the second cooling medium channel 323, thereby achieving active heat dissipation for the battery 311 and the PCB board 321. Furthermore, the pre-set program within the mobile phone 100 can also adjust the power of the driving device 340, thereby allowing the driving device 340 to adjust the flow rate of the cooling medium. When the heat generated by the battery 311 and the PCB board 321 is too high, increasing the flow rate of the cooling medium by the driving device 340 can effectively improve heat dissipation efficiency. When the heat generated by the battery 311 and the PCB board 321 is low, reducing the flow rate of the cooling medium by the driving device 340 can effectively save energy.

[0093] The driving device 340 can be a piezoelectric ceramic, a water pump, or other device capable of driving the flow of cooling medium. The specific number of driving devices 340 is not specifically limited in this embodiment; for example, there can be two, three, or four or more. The specific location of the driving devices 340 is also not specifically limited in this embodiment. For example, the driving devices 340 can be disposed on the baffle 210 or the packaging 312. Alternatively, driving devices 340 can be simultaneously disposed on any two or three of the packaging 312, the elevating plate 322, and the baffle 210.

[0094] refer to Figure 5 and combined Figure 4 The first temperature sensor 350 and the second temperature sensor 360 are respectively connected to the drive device 340. When the first temperature sensor 350 detects that the temperature of the battery 311 is higher than the set temperature value, the first temperature sensor 350 transmits an electrical signal to the drive device 340 so that the drive device 340 drives the cooling medium to dissipate heat from the battery 311. When the second temperature sensor 360 detects that the temperature of the PCB board 321 is higher than the set temperature value, the second temperature sensor 360 transmits an electrical signal to the drive device 340 so that the drive device 340 drives the cooling medium to dissipate heat from the PCB board 321.

[0095] The following is combined Figures 6 to 8 This section details the heat dissipation process of the electronic component module 300. Among other things, Figure 7 A schematic diagram showing the circulation of the cooling medium in the liquid storage chamber 330 and the second cooling medium flow channel 323 is shown. Figure 8 A schematic diagram is shown showing the circulation of the cooling medium in the liquid storage chamber 330, the first cooling medium flow channel 313, and the second cooling medium flow channel 323.

[0096] refer to Figure 6 and combined Figure 4 and Figure 5 When the first temperature sensor 350 detects that the temperature of the battery 311 reaches or exceeds the set temperature value, the drive device 340 drives the cooling medium to flow from the liquid storage chamber 330 into the first cooling medium flow channel 313. After flowing through the entire first cooling medium flow channel 313, the cooling medium flows back to the liquid storage chamber 330 to complete a heat dissipation cycle. During this process, the cooling medium can carry away the heat dissipated by the battery 311, thereby accurately and in real time actively dissipating heat from the battery 311.

[0097] refer to Figure 7 and combined Figure 4 and Figure 5 When the second temperature sensor 360 detects that the temperature of the PCB board 321 reaches or exceeds the set temperature value, the driving device 340 drives the cooling medium from the liquid storage chamber 330 into the second cooling medium flow channel 323. After flowing through the entire second cooling medium flow channel 323, the cooling medium flows back to the liquid storage chamber 330 to complete a heat dissipation cycle. During this process, the cooling medium can remove the heat dissipated by the PCB board 321, thereby accurately and in real time actively dissipating heat from the PCB board 321.

[0098] refer to Figure 8 and combined Figure 4 and Figure 5 When the first temperature sensor 350 detects that the temperature of the battery 311 reaches or exceeds the set temperature value, and the second temperature sensor 360 detects that the temperature of the PCB board 321 reaches or exceeds the set temperature value, the driving device 340 drives the cooling medium from the liquid storage chamber 330 into the first cooling medium flow channel 313. The cooling medium flows through the entire first cooling medium flow channel 313, then flows back to the liquid storage chamber 330, and then flows from the liquid storage chamber 330 into the second cooling medium flow channel 323. The cooling medium flows through the entire second cooling medium flow channel 323 and then flows back to the liquid storage chamber 330 to complete a heat dissipation cycle. In this process, the cooling medium can remove the heat dissipated by the battery 311 and the PCB board 321, realizing active heat dissipation for the entire mobile phone 100.

[0099] It should be noted that the temperature setting value in this embodiment is 40°C, but it is not limited to this. In other possible implementations, the temperature setting value can also be 41°C, 42°C or 43°C, etc., which can be adaptively adjusted according to the actual heat dissipation needs of the mobile phone 100.

[0100] For example, Figure 6 , Figure 7 and Figure 8The flow direction of the cooling medium is counterclockwise in all cases, but this application embodiment does not impose any special restrictions on this. The flow direction of the cooling medium can be adjusted by the driving device 340. For example, the driving device 340 can drive the cooling medium to flow in a clockwise direction.

[0101] In summary, the electronic device module 300 provided in this application integrates a first cooling medium channel 313 within the packaging 312 of the battery 311, a second cooling medium channel 323 within the support plate 322 below the PCB board 321, and a liquid storage cavity 330 within the baffle 210 of the middle frame 200. The liquid storage cavity 330 is interconnected with the first cooling medium channel 313 and the second cooling medium channel 323. Thus, the driving device 340 enables the cooling medium to actively dissipate heat from the two different heat-generating modules, the battery 311 and the PCB board 321. At the same time, by adjusting the flow rate of the cooling medium through the driving device 340, the heat dissipation efficiency can be effectively improved. Furthermore, the packaging component 312, the support plate 322, and the baffle 210 are all existing structures of the phone 100 itself. Therefore, integrating the first cooling medium channel 313 into the packaging component 312, the second cooling medium channel 323 into the support plate 322, and the liquid storage chamber 330 into the baffle 210 will not occupy additional internal space of the phone 100, which is beneficial to the miniaturization requirements of the product. In addition, it is not necessary to open a large number of channels in the mid-frame 200, which can ensure the overall structural strength and manufacturability of the mid-frame 200. Since the cooling medium is located entirely inside the phone 100 and does not need to be exchanged with the outside, the mid-frame 200 does not need to have openings, and will not affect the waterproof performance of the phone 100.

[0102] It is understood that in the embodiments of this application, the first cooling medium flow channel 313 and the second cooling medium flow channel 323 are located on opposite sides of the liquid storage cavity 330 along the length direction X. However, the embodiments of this application do not impose special restrictions on the specific locations of the first cooling medium flow channel 313, the second cooling medium flow channel 323, and the liquid storage cavity 330. In other possible implementations, the first cooling medium flow channel 313 and the second cooling medium flow channel 323 are located on the same side of the liquid storage cavity 330 along the length direction X.

[0103] The following will combine Figures 9 to 9b A detailed description of the specific structure of the liquid storage chamber 330 is provided. Figure 9 A cross-sectional view is shown showing the package 312, the support plate 322, and the retaining rib 210 connected together. Figure 9a It shows Figure 9 A magnified view of a portion of point A in the middle. Figure 9b It shows Figure 9 A magnified view of a section at point B.

[0104] refer to Figure 9a and Figure 9b The liquid storage chamber 330 is provided with two liquid inlets (specifically, a first liquid inlet 332 and a second liquid inlet 334) and two liquid outlets (specifically, a first liquid outlet 331 and a second liquid outlet 333). Specifically, the liquid storage chamber 330 has a first liquid outlet 331 and a first liquid inlet 332 along the length direction X near the battery 311, and the first liquid outlet 331 and the first liquid inlet 332 are spaced apart along the width direction Y. The liquid storage chamber 330 is connected to the first cooling medium flow channel 313 through the first liquid outlet 331 and the first liquid inlet 332. The cooling medium flows from the liquid storage chamber 330 into the first cooling medium flow channel 313 through the first liquid outlet 331 and flows back into the liquid storage chamber 330 through the first liquid inlet 332. Accordingly, the liquid storage chamber 330 is provided with a second liquid outlet 333 and a second liquid inlet 334 on the side near the support plate 322 along the length direction X. Along the width direction Y, the second liquid outlet 333 and the second liquid inlet 334 are spaced apart. The liquid storage chamber 330 is connected to the second cooling medium flow channel 323 through the second liquid outlet 333 and the second liquid inlet 334. The cooling medium flows from the liquid storage chamber 330 into the second cooling medium flow channel 323 through the second liquid outlet 333 and flows back into the liquid storage chamber 330 through the second liquid inlet 334.

[0105] The following will combine Figures 10 to 15 The specific structures of battery 311, packaging component 312, and first cooling medium flow channel 313 are described in detail. Figure 10 A perspective view of battery 311 and package 312 is shown. Figure 11 A cross-sectional view of battery 311 and package 312 is shown. Figure 12 It shows Figure 11 Enlarged view at point C in the middle. Figure 13 It shows Figure 11 Enlarged view at point D in the middle. Figure 14 A schematic diagram showing the first cooling medium flow channel 313 located on the package 312 is shown. Figure 15 A schematic diagram is shown in another embodiment, in which the first cooling medium channel 313 is located on the package 312.

[0106] refer to Figure 10The battery 311 is a generally rectangular block structure. The packaging 312 includes a first sidewall 3121, a second sidewall 3122, and a backplate 3123. The first sidewall 3121 and the second sidewall 3122 are positioned opposite each other along the width direction Y. Also along the width direction Y, one side of the backplate 3123 is connected to the first sidewall 3121, and the other side is connected to the second sidewall 3122. Thus, the first sidewall 3121, the second sidewall 3122, and the backplate 3123 together form a receiving space 3124, within which the battery 311 is received, for example, by snap-fit. The first sidewall 3121, the second sidewall 3122, and the backplate 3123 each cover one side of the battery 311 (i.e., one side of the rectangular structure). A first cooling medium channel 313 is integrated within each of the first sidewall 3121, the second sidewall 3122, and the backplate 3123. Figure 12 (See) part of it, to dissipate heat from the surface of the battery 311 that comes into contact with the package 312.

[0107] It should be noted that the specific location of the first cooling medium flow channel 313 is not specifically limited in this embodiment. In other possible implementations, only a portion of the first cooling medium flow channel 313 may be integrated into one or both of the first sidewall 3121, the second sidewall 3122, or the backplate 3123, which can be adjusted according to the heat dissipation requirements of the battery 311 during use. For example, when the heat dissipation requirements of the battery 311 are small, the first cooling medium flow channel 313 may be integrated into only one of the first sidewall 3121, the second sidewall 3122, or the backplate 3123. As another example, when the heat dissipation requirements of the battery 311 are large, the first cooling medium flow channel 313 may be integrated into both the first sidewall 3121 and the second sidewall 3122, that is, both the first sidewall 3121 and the second sidewall 3122 may integrate a portion of the first cooling medium flow channel 313.

[0108] For example, refer to Figure 10 and combined Figure 9 Along the length direction X, the end of the first sidewall 3121 near the retaining rib 210 includes a first extension 3125. The first extension 3125 extends along the width direction Y toward the second sidewall 3122, and the first extension 3125 is a generally rectangular block structure. (Reference) Figure 12 and combined Figure 9a Along the length direction X, the first extension 3125 is provided with a first cooling medium inlet 314 on the side facing the baffle 210. The first cooling medium inlet 314 is connected to the first liquid outlet 331 of the liquid storage chamber 330 so that the cooling medium can flow from the liquid storage chamber 330 into the first cooling medium flow channel 313 through the first cooling medium inlet 314.

[0109] For example, continue to refer to Figure 12 and combined Figure 9aThe portion of the first cooling medium flow channel 313 located within the first sidewall 3121 includes a first transition section 3131 and a first main flow section 3132. The first transition section 3131 extends along the width direction Y, and the first main flow section 3132 extends along the length direction X. One end of the first transition section 3131 communicates with the first cooling medium inlet 314, and the other end communicates with the first main flow section 3132, allowing the cooling medium to flow from the first cooling medium inlet 314 into the first main flow section 3132 through the first transition section 3131.

[0110] For example, refer to Figure 10 and combined Figure 9 Along the length direction X, the end of the second sidewall 3122 near the retaining rib 210 includes a second extension 3126. The second extension 3126 extends toward the first sidewall 3121 along the width direction Y, and the second extension 3126 is a generally rectangular block structure. (Reference) Figure 13 and combined Figure 9b Along the length direction X, the second extension 3126 is provided with a first cooling medium outlet 315 on the side facing the baffle 210. The first cooling medium outlet 315 is connected to the first liquid inlet 332 of the liquid storage chamber 330 so that the cooling medium can flow back from the first cooling medium flow channel 313 to the liquid storage chamber 330 through the first cooling medium outlet 315, thereby completing the cooling cycle of the cooling medium in the first cooling medium flow channel 313.

[0111] For example, continue to refer to Figure 13 and combined Figure 9b The portion of the first cooling medium flow channel 313 located within the second sidewall 3122 includes a second transition section 3133 and a second main flow section 3134. The second transition section 3133 extends along the width direction Y, and the second main flow section 3134 extends along the length direction X. One end of the second transition section 3133 communicates with the first cooling medium outlet 315, and the other end communicates with the second main flow section 3134, allowing the cooling medium to flow from the second main flow section 3134 to the first cooling medium outlet 315 through the second transition section 3133.

[0112] refer to Figure 10 Along the width direction Y, the first extension 3125 and the second extension 3126 are spaced apart to avoid the electrode 3111 of the battery 311, so that the battery 311 can be electrically connected to other electronic components (such as PCB board 321).

[0113] For example, refer to Figure 14 and combined Figure 5 as well as Figures 9 to 13The portion of the first cooling medium flow channel 313 located within the back plate 3123 includes a third main flow section 3135. The third main flow section 3135 extends along the width direction Y, with one end connected to the first main flow section 3132 and the other end connected to the second main flow section 3134. Thus, when the first temperature sensor 350 detects that the temperature of the battery 311 exceeds a set value, the drive device 340 drives the cooling medium from the liquid storage chamber 330 into the first cooling medium flow channel 313 through the first cooling medium inlet 314, and sequentially flows through the first transition section 3131, the first main flow section 3132, the third main flow section 3135, the second main flow section 3134, and the second transition section 3133 of the first cooling medium flow channel 313, finally returning to the liquid storage chamber 330 through the first cooling medium outlet 315, thereby completing one cooling cycle. In other words, the cooling medium flows from the liquid storage chamber 330 through the first sidewall 3121, the back plate 3123, and the second sidewall 3122 in sequence, and carries away the heat dissipated by the part of the battery 311 covered by the first sidewall 3121, the back plate 3123, and the second sidewall 3122.

[0114] In this embodiment, the first mainstream segment 3132, the second mainstream segment 3134, and the third mainstream segment 3135 are all straight flow channels. However, this embodiment does not specifically limit the extension direction of the first mainstream segment 3132, the second mainstream segment 3134, and the third mainstream segment 3135. For example, the third mainstream segment 3135 is used as an example for illustration. Figure 15 ,exist Figure 15 In the illustrated embodiment, there are ten third main flow segments 3135, which are spaced apart along the width direction Y. Each third main flow segment 3135 extends along the length direction X. Any two adjacent third main flow segments 3135 are connected by a connecting segment 3136, thereby increasing the area occupied by the third main flow segments 3135 in the back plate 3123, thus increasing the area through which the cooling medium flows through the battery 311 and improving the heat dissipation effect of the battery 311. The number of third main flow segments 3135 is not specifically limited in this embodiment. For example, in some possible implementations, the number of third main flow segments 3135 can be eight, nine, eleven, twelve, etc., and can be adaptively adjusted according to the area of ​​the back plate 3123 and the actual needs such as the heat generation of the battery 311.

[0115] It should be noted that, in other possible embodiments, where the internal space of the first sidewall 3121 allows, the portion of the first cooling medium flow channel 313 located within the first sidewall 3121 can also be configured as multiple first main flow segments 3132 spaced apart along the thickness direction Z. That is, the portion of the first cooling medium flow channel 313 located within the first sidewall 3121 is not a straight flow channel. Correspondingly, where the internal space of the second sidewall 3122 allows, the portion of the first cooling medium flow channel 313 located within the second sidewall 3122 can also be configured as multiple second main flow segments 3134 spaced apart along the thickness direction Z. That is, the portion of the first cooling medium flow channel 313 located within the second sidewall 3122 is not a straight flow channel.

[0116] refer to Figure 16 , Figure 17 and Figure 18 ,in, Figure 16 A perspective view showing the packaging 312, the support plate 322, and the retaining rib 210 connected together inside the mobile phone 100 is shown. Figure 17 It shows Figure 16 Enlarged view at point E in the middle. Figure 18 It shows Figure 16 Enlarged view of point F in the middle.

[0117] For example, refer to Figure 17 and Figure 18 and combined Figure 6 Along the length direction X, the baffle 210 has a first flow channel connection portion 316 and a second flow channel connection portion 317 on the side facing the battery 311. Along the width direction Y, the first flow channel connection portion 316 and the second flow channel connection portion 317 are spaced apart. The first liquid outlet 331 and the first cooling medium inlet 314 are connected through the first flow channel connection portion 316, allowing the cooling medium to flow from the liquid storage chamber 330 into the first cooling medium flow channel 313 through the first liquid outlet 331, the first flow channel connection portion 316, and the first cooling medium inlet 314. The first liquid inlet 332 and the first cooling medium outlet 315 are connected through the second flow channel connection portion 317, allowing the cooling medium to flow back from the first cooling medium flow channel 313 into the liquid storage chamber 330 through the first cooling medium outlet 315, the second flow channel connection portion 317, and the first liquid inlet 332.

[0118] For example, the first flow channel connection portion 316 and the second flow channel connection portion 317 are connected to the package 312 by a plug-in connection. The plug-in connection of the first flow channel connection portion 316 and the second flow channel connection portion 317 facilitates installation and promotes component reuse. For example, when the mobile phone 100 needs to be repaired and the battery 311 is replaced, the new battery 311 can be directly installed into the mobile phone 100, and the first flow channel connection portion 316 of the baffle 210 can be inserted into the first cooling medium inlet 314 of the package 312 of the new battery 311, and the second flow channel connection portion 317 can be inserted into the first cooling medium outlet 315.

[0119] The embodiments of this application do not impose specific limitations on the connection method between the first flow channel connecting part 316 and the second flow channel connecting part 317 and the packaging 312. For example, in other possible implementations, the first flow channel connecting part 316 and the second flow channel connecting part 317 can also be connected to the packaging 312 by means of screwing, welding or other methods.

[0120] refer to Figure 17 and Figure 18 and combined Figure 7 In this embodiment, a first valve 318 is provided in the first flow channel connection portion 316, and a second valve 319 is provided in the second flow channel connection portion 317. The first valve 318 and the second valve 319 open or close simultaneously. For example, refer to... Figure 7 When the temperature of battery 311 is lower than a set value, the first valve 318 and the second valve 319 remain closed simultaneously to isolate the first cooling medium flow channel 313 from the liquid storage chamber 330. For example, refer to... Figure 6 When the temperature of the battery 311 reaches or exceeds the set value, the first valve 318 and the second valve 319 open simultaneously to connect the first cooling medium flow channel 313 with the liquid storage chamber 330. Thus, the cooling medium can circulate within the liquid storage chamber 330 and the first cooling medium flow channel 313 to dissipate heat from the battery 311.

[0121] It is understood that the specific locations of the first valve 318 and the second valve 319 are not specifically limited in this embodiment. For example, in other possible implementations, the first valve 318 may also be located in the first transition section 3131, and the second valve 319 may also be located in the second transition section 3133, as long as the cooling medium is prevented from circulating between the first cooling medium flow channel 313 and the liquid storage chamber 330 when the first valve 318 and the second valve 319 are closed. In other possible implementations, the first flow channel connection portion 316 and the second flow channel connection portion 317 are located in the packaging component 312, or one of the first flow channel connection portion 316 and the second flow channel connection portion 317 is located in the baffle 210, and the other is located in the packaging component 312.

[0122] The following will combine Figures 19 to 20 The specific structure of the raised plate 322 and the second cooling medium flow channel 323 is described in detail. Figure 19 A top view of the raised platform 322 is shown. Figure 20 A cross-sectional view of the raised platform 322 is shown.

[0123] refer to Figure 4 Along the thickness direction Z, the support plate 322 is fixed to the middle frame 200 by fasteners such as bolts. The support plate 322 supports the PCB board 321 and is in contact with the PCB board 321. The PCB board 321 is fixed to the support plate 322 by fasteners such as bolts. Since the PCB board 321 and the support plate 322 are in contact, the cooling medium flows through the second cooling medium channel 323 within the support plate 322. Figure 4 (Not shown) Internal circulation allows for effective heat dissipation from the PCB board 321. For example, refer to... Figure 19 and combined Figure 4 The shape of the raised platform 322 is adapted to the PCB board 321 so that the PCB board 321 can be stably fixed on the raised platform 322. The raised platform 322 is a roughly rectangular frame.

[0124] Specifically, refer to Figure 19 The raised platform 322 includes an outer frame 3221, a first partition 3222, a second partition 3223, and a third partition 3224. The outer frame 3221 is approximately rectangular. The first partition 3222, second partition 3223, and third partition 3224 are located inside the outer frame 3221, dividing the inner side of the outer frame 3221 into four open areas. These open areas allow the raised platform 322 to secure the PCB board 321 while avoiding obstructions to electronic components (not shown) on the PCB board 321, effectively improving the utilization of the internal space of the mobile phone 100. Furthermore, the open areas reduce the weight of the raised platform 322, thereby reducing the weight of the mobile phone 100, which is beneficial for the miniaturization and weight reduction requirements of the mobile phone 100.

[0125] For example, refer to Figure 20 and combined Figure 4The second cooling medium channel 323 is integrated within the outer frame 3221, extending along the rectangular side of the outer frame 3221 and penetrating the entire outer frame 3221. In other words, in this embodiment, the second cooling medium channel 323 forms a rectangular structure. It is understood that this embodiment does not impose specific limitations on the position and extension direction of the second cooling medium channel 323. For example, in some possible implementations, a portion of the second cooling medium channel 323 is integrated within the outer frame 3221, the first partition 3222, the second partition 3223, and the third partition 3224, to allow the cooling medium to flow through more areas of the PCB board 321, thereby improving the heat dissipation effect on the PCB board 321. In some other possible implementations, a portion of the second cooling medium flow channel 323 may be integrated into only one, two, or three of the outer frame 3221, the first partition 3222, the second partition 3223, and the third partition 3224, which can be adaptively adjusted according to the actual heat generation of the PCB board 321 and the actual shape of the raised board 322.

[0126] In this embodiment, the outer frame 3221 is integrally formed with the first partition 3222, the second partition 3223 and the third partition 3224, but it is not limited to this. In other possible embodiments, the outer frame 3221 and the first partition 3222, the second partition 3223 and the third partition 3224 may also be four different parts fixed together by welding, bonding, screwing or other means to form the raised plate 322.

[0127] Specifically, with Figure 19 Taking the shown perspective as an example, the first dividing part 3222 is L-shaped and located at the lower left corner of the outer frame 3221. The first dividing part 3222 and the outer frame 3221 form a first hollow area 3225. The second dividing part 3223 is L-shaped and located at the lower right corner of the outer frame 3221. The second dividing part 3223 and the outer frame 3221 form a second hollow area 3226. The third dividing part 3224 is L-shaped and located at the upper right corner of the outer frame 3221. The second dividing part 3223 and the outer frame 3221 form a third hollow area 3227. Exemplarily, the first dividing part 3222, the second dividing part 3223, the third dividing part 3224, and the outer frame 3221 form a fourth hollow area 3228. In other words, apart from the first hollow area 3225, the second hollow area 3226 and the third hollow area 3227, the remaining part inside the outer frame 3221 is the fourth hollow area 3228.

[0128] It should be noted that the number of the aforementioned cutout areas is not specifically limited in this embodiment and can be adaptively adjusted according to the specific structure of the PCB board 321. For example, in other possible embodiments, the number of cutout areas may be five, six, or seven, or more.

[0129] refer to Figure 20 and combined Figure 16 Along the length direction X, the bottom of the raised platform 322 (i.e., the side of the raised platform 322 near the retaining rib 210) is provided with a second cooling medium inlet 324 and a second cooling medium outlet 325. Along the width direction Y, the second cooling medium inlet 324 and the second cooling medium outlet 325 are spaced apart. (Reference) Figure 20 and combined Figure 9a The second cooling medium inlet 324 is connected to the second outlet 333 of the liquid storage chamber 330, so that the cooling medium can flow from the liquid storage chamber 330 into the second cooling medium flow channel 323 through the second cooling medium inlet 324. The second cooling medium outlet 325 is connected to the second inlet 334 of the liquid storage chamber 330, so that the cooling medium can flow back to the liquid storage chamber 330 through the second cooling medium outlet 325, thereby completing the cooling cycle of the cooling medium in the second cooling medium flow channel 323.

[0130] For example, continue to refer to Figure 20 and combined Figure 9a Along the length direction X, the raised plate 322 has a third flow channel connection portion 326 and a fourth flow channel connection portion 327 on the side facing the baffle 210. Along the width direction Y, the third flow channel connection portion 326 and the fourth flow channel connection portion 327 are spaced apart. The second liquid outlet 333 and the second cooling medium inlet 324 are connected through the third flow channel connection portion 326, and the fourth flow channel connection portion 327 is connected to the second cooling medium outlet 325, allowing the cooling medium to flow from the storage chamber 330 into the second cooling medium flow channel 323 through the second liquid outlet 333, the third flow channel connection portion 326, and the second cooling medium inlet 324. The second cooling medium outlet 325 and the second liquid inlet 334 are connected through the fourth flow channel connection portion 327, allowing the cooling medium to flow back from the second cooling medium flow channel 323 into the storage chamber 330 through the second cooling medium outlet 325, the fourth flow channel connection portion 327, and the second liquid inlet 334, thus completing the cooling circulation of the cooling medium within the second cooling medium flow channel 323.

[0131] For example, the third flow channel connection 326 is plugged into the second outlet 333 so that the second cooling medium inlet 324 communicates with the second outlet 333, and the fourth flow channel connection 327 is plugged into the second inlet 334 so that the second cooling medium outlet 325 communicates with the second inlet 334. This plug-in type of third flow channel connection 326 and fourth flow channel connection 327 facilitates installation and promotes component reuse. For example, when the mobile phone 100 needs repair and the mounting plate 322 needs replacement, the new mounting plate 322 can be directly installed onto the mobile phone 100, and the third flow channel connection 326 of the new mounting plate 322 can be inserted into the second outlet 333, and the fourth flow channel connection 327 can be inserted into the second inlet 334.

[0132] The present application does not impose specific limitations on the connection method between the third flow channel connecting part 326 and the fourth flow channel connecting part 327 and the baffle 210. For example, in other possible implementations, the third flow channel connecting part 326 and the fourth flow channel connecting part 327 can also be connected to the baffle 210 by means of screwing, welding or other methods.

[0133] refer to Figure 20 and combined Figure 7 In this embodiment, a third valve 328 is provided in the third flow channel connection portion 326, and a fourth valve 329 is provided in the fourth flow channel connection portion 327. The third valve 328 and the fourth valve 329 open or close simultaneously. For example, refer to... Figure 6 and combined Figure 5 When the temperature of the PCB board 321 is lower than the set value, the third valve 328 and the fourth valve 329 remain closed simultaneously to isolate the second cooling medium flow channel 323 from the liquid storage chamber 330. For example, refer to... Figure 7 and Figure 8 and combined Figure 5 When the temperature of the PCB board 321 reaches or exceeds the set value, the third valve 328 and the fourth valve 329 open simultaneously to connect the second cooling medium flow channel 323 with the liquid storage chamber 330. As a result, the cooling medium can circulate in the liquid storage chamber 330 and the second cooling medium flow channel 323 to dissipate heat from the PCB board 321.

[0134] It is understood that the specific locations of the third valve 328 and the fourth valve 329 are not specifically limited in this application embodiment. For example, in other possible implementations, the third valve 328 may also be located at the second cooling medium inlet 324, and the fourth valve 329 may also be located at the second cooling medium outlet 325, as long as the cooling medium is prevented from circulating between the second cooling medium flow channel 323 and the liquid storage chamber 330 when the third valve 328 and the fourth valve 329 are closed.

[0135] In other possible implementations, the third flow channel connection portion 326 and the fourth flow channel connection portion 327 are provided on the baffle 210, or one of the third flow channel connection portion 326 and the fourth flow channel connection portion 327 is provided on the baffle 210 and the other is provided on the raised plate 322.

[0136] It should be noted that this application embodiment does not impose a specific limitation on the number of heat-generating devices included in the electronic device module 300, for example, Figure 21 A schematic diagram is shown showing the electronic device module 300 including only the first heat-generating device 310. (Reference) Figure 21 and combined Figure 5 The drive unit 340 is located inside the first cooling medium flow channel 313. When the first temperature sensor 350 detects that the temperature of the battery 311 reaches or exceeds the set temperature value, the drive unit 340 drives the cooling medium to circulate within the first cooling medium flow channel 313 to achieve active heat dissipation for the battery 311.

[0137] In another possible implementation, for example, Figure 22 A schematic diagram is shown showing the electronic device module 300 including only the first heating element 310 and the liquid reservoir 330. (Reference) Figure 22 and combined Figure 5 The driving device 340 is located inside the liquid storage chamber 330. When the first temperature sensor 350 detects that the temperature of the battery 311 reaches or exceeds the set temperature value, the first valve 318 and the second valve 319 open. The driving device 340 drives the cooling medium from the liquid storage chamber 330 through the first outlet 331, the first flow channel connection 316, and the first cooling medium inlet 314 into the first cooling medium flow channel 313, and in a counterclockwise direction ( Figure 22 (From the perspective shown) the cooling medium flows through the entire first cooling medium channel 313, and finally flows back to the liquid storage chamber 330 through the first cooling medium outlet 315, the second channel connection 317, and the first liquid inlet 332 in sequence to complete a cooling cycle. During this process, the cooling medium can carry away the heat dissipated by the battery 311, realizing active heat dissipation of the battery 311. Exemplarily, the drive device 340 can also be disposed within the first cooling medium channel 313.

[0138] For example, Figure 23 A schematic diagram is shown showing the electronic device module 300 including only the second heat-generating device 320. (Reference) Figure 23 and combined Figure 5The electronic device module 300 includes only the second heat-generating device 320. The driving device 340 is located in the second cooling medium flow channel 323. When the second temperature sensor 360 detects that the temperature of the PCB board 321 reaches or exceeds the set temperature value, the driving device 340 drives the cooling medium to circulate in the second cooling medium flow channel 323 to achieve heat dissipation and heat equalization of the PCB board 321.

[0139] In another possible implementation, for example, Figure 24 A schematic diagram is shown showing the electronic device module 300 including only the second heating element 320 and the liquid storage chamber 330. (Reference) Figure 24 and combined Figure 5 The drive unit 340 is located inside the liquid storage chamber 330. When the second temperature sensor 360 detects that the temperature of the PCB board 321 reaches or exceeds the set temperature value, the third valve 328 and the fourth valve 329 open. The drive unit 340 drives the cooling medium from the liquid storage chamber 330 through the second outlet 333, the second flow channel connection 326, and the second cooling medium inlet 324 into the second cooling medium flow channel 323, and in a counterclockwise direction ( Figure 18 (From the perspective shown) the medium flows through the entire second cooling medium channel 323, and finally flows back to the liquid storage chamber 330 through the second cooling medium outlet 325, the third channel connection 327, and the second inlet 334 in sequence, to complete a cooling cycle. During this process, the cooling medium can carry away the heat dissipated by the PCB board 321, realizing active heat dissipation of the PCB board 321. Exemplarily, the drive device 340 can also be disposed within the second cooling medium channel 323.

[0140] It is understood that the electronic device module 300 is described in this application embodiment using the battery 311 and PCB board 321 as examples of heat-generating devices. However, this application is not limited to this. Any electronic device that generates heat during the use of the mobile phone 100 can be cooled and evenly distributed through the electronic device module 300 of this application embodiment. For example, when the mobile phone 100 uses functions such as taking photos and recording videos for a long time, the camera will also generate heat, causing the mobile phone 100 to become hot. To address this, a third cooling medium channel (not shown in the figure) can be integrated into the frame or other components that are fixed to or adjacent to the camera. That is, a third cooling medium channel is opened in the existing structure inside the mobile phone 100 and connected to the liquid storage cavity 330. This allows the cooling medium to carry away the heat generated by the camera when flowing through the third cooling medium channel, thereby accurately achieving active heat dissipation for the camera.

[0141] It is understandable that the aforementioned electronic device module 300 and Figure 2 The large heat dissipation devices 14 shown do not conflict and can be set simultaneously to further improve the heat dissipation effect of the mobile phone 100.

[0142] In summary, the electronic device module provided in this application utilizes the existing internal structure of the mobile phone, integrating cooling medium channels within the heat-generating components to form a liquid cooling module. A driving device drives the cooling medium to circulate within these channels, precisely and actively dissipating heat from the heating components through a modular heat dissipation method. Furthermore, since the cooling medium channels are integrated into the existing structure of the mobile phone, they do not occupy additional internal space, which is beneficial for miniaturization. Additionally, it eliminates the need for numerous channels within the mid-frame, ensuring the overall structural strength and manufacturability of the mid-frame. Because the cooling medium is entirely located inside the mobile phone and does not need to be exchanged with the outside environment, it does not affect the phone's waterproof performance.

Claims

1. An electronic device module, used in a mobile terminal, characterized in that, include: A first heating element, the first heating element integrating a first cooling medium flow channel, wherein the first heating element includes a package, and the first cooling medium flow channel is formed inside the package; A driving device is used to drive the cooling medium to circulate within the first cooling medium channel.

2. The electronic device module according to claim 1, characterized in that, The electronic device module also includes: The second heating element integrates a second cooling medium channel, which is connected to the first cooling medium channel. The driving device is used to drive the cooling medium to circulate within the first cooling medium channel and the second cooling medium channel.

3. The electronic device module according to claim 1 or 2, characterized in that, Also includes: Liquid reservoir; The liquid storage chamber is connected to the first cooling medium channel or the second cooling medium channel; The driving device is used to drive the cooling medium to circulate within the liquid storage chamber and the first or second cooling medium flow channel.

4. The electronic device module according to claim 2, characterized in that, It also includes a liquid storage chamber, which is located between the first cooling medium flow channel and the second cooling medium flow channel and is connected to the first cooling medium flow channel and the second cooling medium flow channel. The driving device is used to drive the cooling medium to circulate in the liquid storage chamber and the first cooling medium flow channel or the liquid storage chamber and the second cooling medium flow channel.

5. The electronic device module according to claim 4, characterized in that, The liquid storage chamber includes an outlet and an inlet, and the first cooling medium flow channel includes a first cooling medium inlet and a first cooling medium outlet. The first cooling medium inlet is connected to the outlet, and the first cooling medium outlet is connected to the inlet. The second cooling medium flow channel includes a second cooling medium inlet and a second cooling medium outlet. The second cooling medium inlet is connected to the liquid outlet, and the second cooling medium outlet is connected to the liquid inlet.

6. The electronic device module according to claim 3, characterized in that, The first cooling medium channel and the second cooling medium channel are located on the same side of the liquid storage chamber.

7. A mobile terminal, characterized in that, include: The electronic device module as described in any one of claims 1-6.

8. The mobile terminal according to claim 7, characterized in that, include: The first heating device includes a battery, and a packaging component is provided on the outside of the battery. The packaging component integrates the first cooling medium flow channel, and the packaging component is provided with a first cooling medium inlet and a first cooling medium outlet that are connected to the first cooling medium flow channel. A first temperature sensor is used to detect the temperature of the battery.

9. The mobile terminal according to claim 7, characterized in that, The second heat-generating device of the electronic device module includes a PCB board, the PCB board is provided with a support plate, the support plate integrates a second cooling medium flow channel, the second cooling medium flow channel includes a second cooling medium inlet and a second cooling medium outlet; The second temperature sensor is capable of detecting the temperature of the PCB board.

10. The mobile terminal according to claim 7, characterized in that, The mobile terminal also includes a mid-frame, which has baffles. The baffles integrate a liquid storage cavity for the electronic device module, and the liquid storage cavity is connected to the first cooling medium channel or the second cooling medium channel.

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