Semiconductor package and semiconductor die
CN224698185UActive Publication Date: 2026-08-28TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information
- Application Number
- CN202521772850.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2024-08-21
- Filing Date
- 2025-08-20
- Publication Date
- 2026-08-28
- Estimated Expiration
- 2035-08-20
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Figure CN224698185U_ABST
Abstract
A semiconductor package and semiconductor die, the semiconductor package including at least a first die. The first die includes internal circuitry disposed on a substrate, electrostatic discharge (ESD) protection circuitry disposed on the substrate but laterally spaced from the internal circuitry and including a first charge dissipation element, and a first silicon controlled rectifier (SCR) laterally adjacent.
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