Temperature measuring device for a heating ring of a semiconductor device

Abstract

The utility model provides a kind of temperature measuring device of heating ring of semiconductor equipment, comprising: support seat;Carrier ring is set to the top of support seat;At least one heat insulation part is provided on the upper surface of carrier ring, and heat insulation part is evenly distributed on the upper surface of carrier ring along the circumference of carrier ring;Heat insulation part is used to place heating ring;At least one temperature measuring element is set to the lower surface of heating ring, for measuring the temperature distribution of heating ring;Temperature measuring element includes temperature measuring sensor, connecting wire and joint, and temperature measuring sensor is evenly distributed on the lower surface of heating ring along the circumference of heating ring;Joint fixing part is fixed to support seat, and joint fixing part includes joint mounting bracket, and joint mounting bracket is set below carrier ring and extends along the circumferential outer edge of carrier ring;Joint mounting bracket includes multiple fixing holes, for fixing joint.The temperature measuring device provided by the utility model can accurately simulate the on-machine effect of heating ring, and the heat conduction of heating ring is reduced by heat insulation part, improving temperature measuring precision.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor equipment technology, and in particular to the field of temperature measuring device for heating ring of semiconductor equipment. Background Technology

[0002] Semiconductor equipment is used to process integrated circuits and is widely used in the fabrication of chips, sensors, and other devices. Common semiconductor equipment includes etching equipment, thin film equipment, and photolithography equipment. Taking CVD thin film equipment as an example, it mainly grows film layers of target materials on wafers through certain semiconductor processes.

[0003] With the large-scale application of advanced packaging, the demand for ultra-thick SiO2 (e.g., over 30 micrometers thick) is increasing. To reduce the adhesion of particulate matter to the wafer surface during processing and prevent metal peeling from the sprayed panel in high-temperature environments, existing technologies typically use heating rings within the CVD chamber. For example, in processes with a processing temperature of 400 degrees Celsius (such as TEOS / BPTEOS / HDR processes), heating of the sprayed panel via heat conduction is commonly used. This effectively reduces particulate matter generated during the coating process and prevents metal peeling. Therefore, to stabilize process results and reduce unnecessary disassembly and reassembly of inlet pipes and helium testing, the uniformity of heating of this heating ring needs to be ensured. Thus, a fixture is needed to accurately simulate the on-machine conditions after the process has been completed, detecting the overall temperature and temperature difference of the heating ring to determine whether the process can proceed. However, existing temperature detection methods have large errors and cannot simulate the on-machine effect. Utility Model Content

[0004] The purpose of this invention is to provide a temperature measuring device for the heating ring of a semiconductor device, which can accurately simulate the effect of the heating ring on the machine and accurately detect the temperature of the heating ring.

[0005] To achieve the above objectives, this utility model is implemented through the following technical solution:

[0006] A temperature measuring device for a heating ring in a semiconductor device is provided, comprising:

[0007] Support base;

[0008] A support ring is disposed above the support base; at least one heat insulation portion is provided on the upper surface of the support ring, and the heat insulation portion is evenly distributed along the circumference of the support ring on the upper surface of the support ring; the heat insulation portion is used to place a heating ring.

[0009] At least one temperature measuring element is disposed on the lower surface of the heating ring and is used to measure the temperature distribution of the heating ring; wherein, the temperature measuring element includes a temperature sensor, a connecting wire and a connector, the two ends of the connecting wire are respectively connected to the temperature sensor and the connector, and the temperature sensor is evenly distributed along the circumference of the heating ring on the lower surface of the heating ring;

[0010] A connector fastener is fixed to the support base. The connector fastener includes a connector mounting bracket, which is disposed below the bearing ring and extends outward along the circumference of the bearing ring. The connector mounting bracket includes multiple fixing holes for fixing the connector.

[0011] Furthermore, the heat insulation part is made of PEEK material and is a cylindrical boss.

[0012] Furthermore, at least one positioning boss is provided on the upper surface of the bearing ring, which is used to position the outer peripheral edge of the heating ring.

[0013] Furthermore, the support base includes an upper ring, a lower ring, and a connecting part, wherein the upper ring and the lower ring are respectively disposed at both ends of the connecting part, and the connecting part is cylindrical.

[0014] Furthermore, the connector mounting bracket is a fan-shaped plate, and the fixing holes are square holes, which are evenly distributed on the fan-shaped plate;

[0015] The connector fastener also includes a fixing plate, which is used to fix the connector fastener to the support base. The fixing plate is a vertically extending plate, and its upper end is connected to the inner peripheral edge of the connector mounting bracket.

[0016] Furthermore, the fixing plate is disposed on the inner surface of the cylindrical part of the connecting part, and the joint mounting bracket is disposed between the upper ring and the bearing ring.

[0017] Furthermore, there are eight temperature measuring elements; the temperature sensor is TC.

[0018] Furthermore, it also includes a display device for displaying the measured temperature, and the connector is connected to the corresponding connector of the connection line of the display device.

[0019] Furthermore, through holes are provided on the fixing plate, and bolts are passed through the through holes to fix it to the support base.

[0020] Furthermore, there are two positioning bosses, located near the connector fixing component; and four heat insulation parts.

[0021] Compared with the prior art, the present invention has the following advantages:

[0022] 1. The temperature measuring device provided by this utility model can simulate the working conditions of the heating ring.

[0023] 2. At least one heat insulation part is provided on the support ring. The heat insulation part can isolate the heating ring and the support ring, so the heat of the heating ring will not be conducted to the heat insulation part. Therefore, the temperature distribution of the heating ring is more accurately measured. At the same time, the heat insulation part forms a gap between the support ring and the heating ring, which facilitates the placement of connecting wires and temperature sensors, and also reduces the influence of connecting wires on temperature measurement.

[0024] 3. The connector mounting bracket is used to fix the connector, which can make the connecting wires arranged tightly and regularly, reducing the impact of the connecting wires on temperature measurement. Attached Figure Description

[0025] To more clearly illustrate the technical solution of this utility model, the drawings used in the description will be briefly introduced below. Obviously, the drawings in the following description are one embodiment of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort:

[0026] Figure 1 A schematic diagram of the temperature measuring device provided by this utility model;

[0027] Figure 2 A schematic diagram of the structure of the heating ring provided by this utility model;

[0028] Figure 3 A schematic diagram of the structure of the connector fixing component provided by this utility model;

[0029] Figure 4 A side view of the support base provided by this utility model. Detailed Implementation

[0030] The following detailed description, in conjunction with the accompanying drawings and specific embodiments, further illustrates the proposed solution of this utility model. The advantages and features of this utility model will become clearer from the following description. It should be noted that the drawings are in a very simplified form and use non-precise proportions, intended only to facilitate and clearly illustrate the embodiments of this utility model. Please refer to the drawings to make the objectives, features, and advantages of this utility model more apparent and understandable. It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are only for illustrative purposes to aid those skilled in the art and are not intended to limit the implementation conditions of this utility model. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to the size, without affecting the effects and objectives achieved by this utility model, should still fall within the scope of the technical content disclosed in this utility model.

[0031] Figure 1A schematic diagram of the temperature measuring device is shown, such as... Figure 1 As shown, the temperature measuring device is used for the heating ring 400 of a semiconductor device, which may be, for example, a thin film device (such as a CVD device), an etching device, a heat treatment device, etc. This utility model provides a temperature measuring device for the heating ring of a semiconductor device, comprising: a support base 300, a bearing ring 100, at least one temperature measuring element (not shown in the figure), and a connector fixing element 200.

[0032] The support base 300 includes an upper ring 301, a lower ring 303, and a connecting part 302. The upper ring 301 and the lower ring 303 are respectively disposed at both ends of the connecting part 302, and the connecting part 302 is cylindrical.

[0033] A support ring 100 is disposed above the support base 300; at least one heat insulation part 101 is provided on the upper surface of the support ring 100, and the heat insulation part 101 is evenly distributed along the circumference of the support ring 100 on the upper surface of the support ring; the heat insulation part is used to place a heating ring.

[0034] The temperature sensing element is disposed on the lower surface of the heating ring and is used to measure the temperature distribution of the heating ring. The temperature sensing element includes a temperature sensor, a connecting wire, and a connector. The two ends of the connecting wire are respectively connected to the temperature sensor and the connector. The temperature sensor is evenly distributed along the circumference of the heating ring on the lower surface of the heating ring; for example, the temperature sensor is fixed to the lower surface of the heating ring with adhesive. The connecting wire is a conductor used for electrical connection.

[0035] See Figure 2 The connector fastener 200 is fixed to the support base 300. The connector fastener 200 includes a connector mounting bracket 201, which is located below the bearing ring and extends outward along the circumference of the bearing ring. The connector mounting bracket 201 includes multiple fixing holes 203 for fixing the connector. The connector mounting bracket 201 is a fan-shaped plate, and the fixing holes 203 are square holes, which are evenly distributed on the fan-shaped plate. The connector fastener 200 also includes a fixing plate 202, which is used to fix the connector fastener to the support base. The fixing plate is a vertically extending plate, and its upper end is connected to the inner circumferential edge of the connector mounting bracket 201. The fixing plate 202 is located on the cylindrical inner surface of the connecting part, and the connector mounting bracket is located between the upper ring and the bearing ring. The fixing plate 202 has through holes 204, through which bolts pass to fix it to the support base.

[0036] The heat insulation part is made of PEEK material, which has good heat insulation performance, and it is a cylindrical boss. The heat insulation part can isolate the heating ring and the support ring, so the heat of the heating ring will not be conducted to the heat insulation part, thus making the measurement of the temperature distribution of the heating ring more accurate. At the same time, the heat insulation part creates a gap between the support ring and the heating ring, which facilitates the placement of connecting wires and temperature sensors, and also reduces the influence of connecting wires on temperature measurement.

[0037] Optionally, at least one positioning boss 102 is provided on the upper surface of the bearing ring 100, the positioning boss being used to position the outer peripheral edge of the heating ring.

[0038] Optionally, there are eight temperature sensing elements; the temperature sensor is TC.

[0039] Furthermore, the temperature measuring device also includes a display device for displaying the measured temperature, and the connector is connected to the corresponding connector of the connection line of the display device.

[0040] Optionally, there are two positioning bosses, located near the connector fixing member; there are four heat insulation parts.

[0041] like Figure 2 The heating ring 400 contains a heating wire and a built-in temperature sensor (TC). The heating wire provides heat, and the built-in TC measures temperature. The heating ring has two leads: a first lead 401 connects to the built-in TC within the heating ring, supplying power to the TC and simultaneously reading its temperature; the second lead 402 connects to the heating wire, supplying power to the heating wire.

[0042] The temperature measurement method provided in this solution is as follows: The heating ring is placed on the heat insulation part 101 of the support ring 100, and the outer peripheral edge of the heating ring is aligned with the positioning boss 102 to achieve positioning. Then, power is supplied to the heating ring to simulate on-machine heating. The temperature distribution of the heating ring is measured by a temperature measuring element, and the temperature result obtained from the temperature sensor of the temperature measuring element is compared with the temperature result obtained from the built-in TC to obtain the temperature deviation.

[0043] The temperature measuring device provided by this utility model can simulate the operating conditions of a heating ring. At least one heat insulation part is provided on the support ring, which isolates the heating ring and the support ring, thus preventing heat from the heating ring from being conducted to the heat insulation part. Therefore, the temperature distribution of the heating ring is measured more accurately. Simultaneously, the heat insulation part creates a gap between the support ring and the heating ring, facilitating the placement of connecting wires and temperature sensors, while also reducing the influence of the connecting wires on temperature measurement. A connector mounting bracket is used to fix the connector, allowing the connecting wires to be arranged tightly and regularly, further reducing the influence of the connecting wires on temperature measurement.

[0044] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0045] Although the present invention has been described in detail through the above preferred embodiments, it should be understood that the above description should not be considered as a limitation of the present invention. Various modifications and substitutions to the present invention will be apparent to those skilled in the art after reading the above content. Therefore, the scope of protection of the present invention should be defined by the appended claims.

Claims

1. A temperature measuring device for a heating ring in a semiconductor device, characterized in that, include: Support base; A support ring is disposed above the support base; at least one heat insulation part is provided on the upper surface of the support ring, and the heat insulation part is evenly distributed on the upper surface of the support ring along the circumference of the support ring. The heat insulation section is used to house the heating ring; At least one temperature measuring element is disposed on the lower surface of the heating ring and is used to measure the temperature distribution of the heating ring; wherein, the temperature measuring element includes a temperature sensor, a connecting wire and a connector, the two ends of the connecting wire are respectively connected to the temperature sensor and the connector, and the temperature sensor is evenly distributed along the circumference of the heating ring on the lower surface of the heating ring; A connector fastener is fixed to the support base. The connector fastener includes a connector mounting bracket, which is disposed below the bearing ring and extends outward along the circumference of the bearing ring. The connector mounting bracket includes multiple fixing holes for fixing the connector.

2. The temperature measuring device for the heating ring of a semiconductor device as described in claim 1, characterized in that, The heat insulation part is made of PEEK material and is a cylindrical boss.

3. The temperature measuring device for the heating ring of a semiconductor device as described in claim 2, characterized in that, The upper surface of the bearing ring is also provided with at least one positioning boss, which is used to position the outer peripheral edge of the heating ring.

4. The temperature measuring device for the heating ring of a semiconductor device as described in claim 1, characterized in that, The support base includes an upper ring, a lower ring, and a connecting part. The upper ring and the lower ring are respectively disposed at both ends of the connecting part, and the connecting part is cylindrical.

5. The temperature measuring device for the heating ring of a semiconductor device as described in claim 4, characterized in that, The connector mounting bracket is a fan-shaped plate, and the fixing holes are square holes, which are evenly distributed on the fan-shaped plate. The connector fastener also includes a fixing plate, which is used to fix the connector fastener to the support base. The fixing plate is a vertically extending plate, and its upper end is connected to the inner peripheral edge of the connector mounting bracket.

6. The temperature measuring device for the heating ring of a semiconductor device as described in claim 5, characterized in that, The fixing plate is disposed on the inner surface of the cylindrical part of the connecting part, and the joint mounting bracket is disposed between the upper ring and the bearing ring.

7. The temperature measuring device for the heating ring of a semiconductor device as described in any one of claims 1-6, characterized in that, There are eight temperature measuring elements; the temperature sensor is TC.

8. The temperature measuring device for the heating ring of a semiconductor device as described in claim 1, characterized in that, It also includes a display device for displaying the measured temperature, and the connector is connected to the corresponding connector of the connection line of the display device.

9. The temperature measuring device for the heating ring of a semiconductor device as described in claim 5, characterized in that, The mounting plate has through holes, through which bolts are passed to secure it to the support base.

10. The temperature measuring device for the heating ring of a semiconductor device as described in claim 3, characterized in that, There are two positioning bosses, located near the connector fixing parts; there are four heat insulation parts.

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