A semiconductor wafer heat isolation tester
Patent Information
- Application Number
- CN202521995930.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-17
- Publication Date
- 2026-09-04
- Estimated Expiration
- 2035-09-17
AI Technical Summary
[0005]本实用新型的目的在于提供一种半导体晶圆隔热测试器,以解决上述背景技术中提出“容器通常是固定的,无法被取下”的问题
[0013] This utility model's clamping assembly triggers the clamping action based on the weight of the container itself, eliminating the need for an additional drive motor or other power source, thus simplifying the equipment structure and reducing energy consumption. The limiting groove precisely restricts the sliding direction of the clamping block, preventing misalignment and ensuring the stability of the container's clamping. The elastic element enables the clamping assembly to automatically reset, facilitating quick container handling and improving operational efficiency.
Smart Images

Figure CN224719970U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of semiconductor wafer testing technology, and specifically relates to a semiconductor wafer thermal insulation tester. Background Technology
[0002] Semiconductor wafers are the core basic material for manufacturing integrated circuits. They are essentially thin semiconductor material sheets that have been precisely processed and have specific electrical properties. Mainstream wafers use high-purity single-crystal silicon as raw material, but there are also compound semiconductor wafers such as gallium arsenide and silicon carbide, which are used in special applications such as high-frequency communication and power electronics.
[0003] In existing semiconductor wafer thermal insulation testing equipment, the container used to hold the semiconductor wafer is usually fixed and cannot be removed during use, which causes inconvenience to the staff during subsequent testing operations.
[0004] Therefore, this utility model provides a semiconductor wafer thermal insulation tester. Utility Model Content
[0005] The purpose of this invention is to provide a semiconductor wafer thermal insulation tester to solve the problem mentioned in the background art that "the container is usually fixed and cannot be removed".
[0006] To achieve the above objectives, this utility model provides the following technical solution: a semiconductor wafer thermal insulation tester, comprising a support base, a support rod fixedly connected to the top of the support base, a support platform fixedly connected to the front end of the support rod, a container placed on the upper part of the support platform, a heater installed on the upper part of the container via a movable component, a clamping component for the container being provided inside the support platform, the clamping component including symmetrically distributed limiting grooves inside the support platform, clamping blocks slidably connected inside the limiting grooves on both sides, a transmission strip fixedly connected to the bottom of the clamping block, a trapezoidal block one fixedly connected to the other end of the transmission strip, a trapezoidal block two slidably connected to the side of the trapezoidal block one, an elastic element fixedly connected to the bottom of the trapezoidal block two, a lifting column fixedly connected to the top of the trapezoidal block two, the lifting column penetrating the top of the support platform, and a placement base fixedly connected to the top of the lifting column, the container being located on top of the placement base.
[0007] In a preferred embodiment, the clamping assembly further includes an arc-shaped groove formed on the side of the clamping block, the inner wall of the arc-shaped groove having an auxiliary cavity, and a roller being rotatably connected inside the auxiliary cavity.
[0008] In a preferred embodiment, the roller makes rolling contact with the side of the container, and the heater is located directly above the container.
[0009] In a preferred embodiment, the moving component includes a lifting slide groove formed at the front end of the support rod, a lead screw is rotatably connected inside the lifting slide groove, and a lifting slider is slidably connected inside the lifting slide groove.
[0010] In a preferred embodiment, the lifting slider has a threaded hole inside and is fixedly connected to the heater. The lifting slider is threadedly connected to the lead screw through the threaded hole. A stepper motor is fixedly installed on the top of the support rod, and the drive end of the stepper motor is driven by the lead screw.
[0011] In a preferred embodiment, a placement platform is fixedly connected to the top of the support base and to the front of the support rod, a display screen is hinged to the left side of the support rod, and a control button is fixedly installed at the front end of the support base.
[0012] Compared with the prior art, the beneficial effects of this utility model are:
[0013] This utility model's clamping assembly triggers the clamping action based on the weight of the container itself, eliminating the need for an additional drive motor or other power source, thus simplifying the equipment structure and reducing energy consumption. The limiting groove precisely restricts the sliding direction of the clamping block, preventing misalignment and ensuring the stability of the container's clamping. The elastic element enables the clamping assembly to automatically reset, facilitating quick container handling and improving operational efficiency.
[0014] This invention utilizes a mechanized adjustment method with moving components, which is more convenient and efficient than manual adjustment, reducing manual intervention by operators and minimizing operational errors. It also enables automated adjustment of the heater height according to testing requirements, thereby enhancing the intelligence level of the equipment. Attached Figure Description
[0015] Figure 1 This is a schematic diagram of the overall three-dimensional structure of this utility model;
[0016] Figure 2 This is a three-dimensional cross-sectional structural diagram of the support platform component of this utility model;
[0017] Figure 3 This is a three-dimensional structural diagram of the heater and other components of this utility model.
[0018] In the diagram: 1. Support base; 2. Support rod; 3. Support platform; 4. Container; 5. Heater; 6. Moving component; 7. Placement platform; 8. Display screen; 9. Control button; 301. Limiting groove; 302. Clamping block; 303. Transmission bar; 304. Trapezoidal block one; 305. Trapezoidal block two; 306. Elastic element; 307. Lifting column; 308. Placement base; 309. Arc groove; 310. Auxiliary cavity; 311. Roller; 601. Lifting groove; 602. Lead screw; 603. Lifting slider; 604. Threaded hole; 605. Stepper motor. Detailed Implementation
[0019] The present invention will be further described below with reference to the embodiments.
[0020] The following embodiments are used to illustrate the present invention, but should not be used to limit the scope of protection of the present invention. The conditions in the embodiments can be further adjusted according to specific conditions, and simple improvements to the method of the present invention under the premise of the concept of the present invention are all within the scope of protection claimed by the present invention.
[0021] Please see Figure 1-3This utility model provides a semiconductor wafer heat insulation tester, including a support base 1, a support rod 2 fixedly connected to the top of the support base 1, a support platform 3 fixedly connected to the front end of the support rod 2, a container 4 placed on the upper part of the support platform 3 for storing semiconductor wafers, a heater 5 installed on the upper part of the container 4 via a moving component 6, and a clamping component for holding the container 4 provided inside the support platform 3. The clamping component includes symmetrically distributed limiting grooves 301 inside the support platform 3, clamping blocks 302 slidably connected inside the limiting grooves 301 on both sides, a transmission bar 303 fixedly connected to the bottom of the clamping block 302, the transmission bar 303 being "L"-shaped, a trapezoidal block 304 fixedly connected to the other end of the transmission bar 303, a trapezoidal block 305 slidably connected to the side of the trapezoidal block 304, and the trapezoidal block 304 and the trapezoidal block 305 being in contact. One side of the contact surface is inclined. The bottom of the trapezoidal block 305 is fixedly connected to an elastic element 306. The weight of the container 4 is greater than the elastic force of the elastic element 306. The top of the trapezoidal block 305 is fixedly connected to a lifting column 307, which penetrates the top of the support platform 3. The top of the lifting column 307 is fixedly connected to a placement base 308, and the container 4 is located on the top of the placement base 308. The clamping assembly of this utility model triggers the clamping action by the weight of the container 4 itself, without the need for additional drive motors or other power sources, simplifying the equipment structure and reducing energy consumption. The limiting groove 301 can accurately limit the sliding direction of the clamping block 302, preventing the clamping block 302 from shifting and causing clamping misalignment, ensuring the clamping stability of the container 4. The setting of the elastic element 306 realizes the automatic reset function of the clamping assembly, which makes it convenient for operators to quickly pick up and put down the container 4, improving operating efficiency.
[0022] The clamping assembly also includes an arc-shaped groove 309 formed on the side of the clamping block 302. An auxiliary cavity 310 is formed on the inner wall of the arc-shaped groove 309. A roller 311 is rotatably connected inside the auxiliary cavity 310. The roller 311 is used to reduce friction with the container 4 and protect the container 4. The roller 311 makes rolling contact with the side of the container 4, and the heater 5 is located directly above the container 4. The setting of the roller 311 in this invention can significantly reduce the frictional resistance between the clamping block 302 and the container 4, and avoid the clamping block 302 scraping against the side of the container when picking up and putting down the container 4, which would cause scratches or damage to the surface of the container, thereby protecting the semiconductor wafer inside the container 4 from indirect damage. The arc-shaped design of the arc-shaped groove 309 can increase the contact area between the clamping block 302 and the container 4. Combined with the rolling contact of the roller 311, it can not only ensure the stability of clamping, but also further optimize the friction protection effect.
[0023] Specifically, such as Figure 1 and Figure 3As shown, the moving component 6 includes a lifting slide 601 located at the front end of the support rod 2. The lifting slide 601 guides and limits the lifting slider 603, preventing it from shifting left or right during movement and avoiding uneven heating due to positional deviation of the heater 5, thus ensuring the test results. A lead screw 602 is rotatably connected inside the lifting slide 601, and the lifting slider 603 is slidably connected inside the lifting slide 601. A threaded hole 604 is provided inside the lifting slider 603, and the lifting slider 603 is fixedly connected to the heater 5. The lifting slider 603 is threadedly connected to the lead screw 602 through the threaded hole 604. A stepper motor 605 is fixedly installed on the top of the support rod 2. The stepper motor 605 has the characteristics of high precision and controllable speed, which can accurately control the rotation angle of the lead screw 602, and then precisely adjust the moving distance of the lifting slider 603 through threaded transmission, so as to achieve precise control of the height of the heater 5, ensure the accuracy of the heating distance in the heat insulation test, and improve the reliability of the test data. The transmission end of the stepper motor 605 is driven by the lead screw 602.
[0024] This invention utilizes the mechanized adjustment method of the moving component 6, which is more convenient and efficient than manual adjustment, reduces manual intervention by operators, lowers operational errors, and enables automated adjustment of the heater 5 height according to testing requirements, thereby enhancing the intelligence level of the equipment.
[0025] Specifically, such as Figure 1 As shown, a placement platform 7 is fixedly connected to the top of the support base 1 and the front of the support rod 2. The placement platform 7 is used to place the heated container 4 to prevent the high-temperature container 4 from damaging external equipment. A display screen 8 is hinged to the left side of the support rod 2, and a control button 9 is fixedly installed at the front end of the support base 1.
[0026] Working principle and usage process of this utility model:
[0027] The operator first puts the semiconductor wafer to be tested into the container 4, and then places the container 4 on the placement base 308 on top of the support platform 3;
[0028] Then, the weight of the container 4 causes the placement base 308 to move down, which drives the lifting column 307 and trapezoidal block 2 305 to move down synchronously and compress the elastic element 306. Trapezoidal block 2 305 pushes trapezoidal block 1 304 to move through the inclined surface, which in turn allows the "L"-shaped transmission bar 303 to drive the clamping block 302 to slide in the limiting slide groove 301 until the arc groove 309 on the side of the clamping block 302 fits against the container 4, achieving stable clamping.
[0029] The operator then starts the equipment by pressing the control button 9 at the front of the support base 1. The stepper motor 605 at the top of the support rod 2 drives the lead screw 602 in the lifting slide 601 to rotate. The lifting slider 603 moves precisely under the guide limit of the lifting slide 601 through the threaded hole 604 and the threaded engagement of the lead screw 602, thereby driving the heater 5 fixed thereto to adjust to a suitable height for heat insulation testing.
[0030] During the test, the operator can observe the test data through the display screen 8 hinged to the left side of the support rod 2.
[0031] After the test, the stepper motor 605 is controlled by the control button 9 to reset the heater 5. The elastic element 306 rebounds and drives the trapezoidal block 2 305, trapezoidal block 1 304, transmission bar 303 and clamping block 302 to reset. The operator takes out the container 4 and places the high-temperature container 4 on the top of the support base 1 and on the placement platform 7 located in front of the support rod 2, thus completing the entire operation process.
[0032] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A semiconductor wafer thermal insulation tester, comprising a support base (1), characterized in that: A support rod (2) is fixedly connected to the top of the support base (1), and a support platform (3) is fixedly connected to the front end of the support rod (2). A container (4) is placed on the upper part of the support platform (3), and a heater (5) is installed on the upper part of the container (4) via a moving component (6). A clamping component for the container (4) is provided inside the support platform (3). The clamping component includes symmetrically distributed limiting grooves (301) inside the support platform (3). Clamping blocks (302) are slidably connected inside the limiting grooves (301) on both sides. A transmission bar (303) is fixedly connected to the bottom, and a trapezoidal block (304) is fixedly connected to the other end of the transmission bar (303). A trapezoidal block (305) is slidably connected to the side of the trapezoidal block (304). An elastic element (306) is fixedly connected to the bottom of the trapezoidal block (305). A lifting column (307) is fixedly connected to the top of the trapezoidal block (305). The lifting column (307) passes through the top of the support platform (3), and a placement base (308) is fixedly connected to the top of the lifting column (307). The container (4) is located on the top of the placement base (308).
2. The semiconductor wafer thermal insulation tester according to claim 1, characterized in that: The clamping assembly also includes an arc-shaped groove (309) formed on the side of the clamping block (302), and an auxiliary cavity (310) is formed on the inner wall of the arc-shaped groove (309), and a roller (311) is rotatably connected inside the auxiliary cavity (310).
3. A semiconductor wafer thermal insulation tester according to claim 2, characterized in that: The roller (311) makes rolling contact with the side of the container (4), and the heater (5) is located directly above the container (4).
4. A semiconductor wafer thermal insulation tester according to claim 1, characterized in that: The moving component (6) includes a lifting slide groove (601) opened at the front end of the support rod (2), a lead screw (602) is rotatably connected inside the lifting slide groove (601), and a lifting slider (603) is slidably connected inside the lifting slide groove (601).
5. A semiconductor wafer thermal insulation tester according to claim 4, characterized in that: The lifting slider (603) has a threaded hole (604) inside, and the lifting slider (603) is fixedly connected to the heater (5). The lifting slider (603) is threadedly connected to the lead screw (602) through the threaded hole (604). A stepper motor (605) is fixedly installed on the top of the support rod (2), and the transmission end of the stepper motor (605) is drivenly connected to the lead screw (602).
6. A semiconductor wafer thermal insulation tester according to claim 1, characterized in that: A placement platform (7) is fixedly connected to the top of the support base (1) and to the front of the support rod (2). A display screen (8) is hinged to the left side of the support rod (2). A control button (9) is fixedly installed at the front end of the support base (1).