Wafer carrier ring replacement device

Abstract

The utility model relates to the technical field of wafer, disclose a kind of wafer bearing ring replacement device, wafer includes protective film and is arranged on the bearing ring and chip of protective film, wafer bearing ring replacement device includes workbench, positioning template and is used to compress wafer on the ring of workbench, ring is compressed on the protective film between chip and bearing ring, workbench is vacuum adsorption platform, vacuum adsorption platform is equipped with positioning line, the edge of vacuum adsorption platform is equipped with angle recess, positioning template is equipped with the positioning opening of cooperation with wafer shape, positioning template is placed on vacuum adsorption platform, the positioning opening of positioning template is towards angle recess, the edge of positioning opening is opposite positioning line;The utility model is convenient and fast wafer replaces new bearing ring, guarantee the flatness of protective film, ensure that the quality of chip before and after replacing bearing ring does not change.

Description

Technical Field

[0001] This utility model relates to the field of wafer technology, and in particular to a wafer carrier ring replacement device. Background Technology

[0002] Existing high-precision chip mounters for embedded chip manufacturing have limited wafer thickness support. Some wafers exceed the machine's maximum thickness limit; direct loading of these wafers can cause jamming and halt production. Therefore, it's necessary to replace the carrier ring with one compatible with the machine's thickness support. Current carrier ring replacement procedures typically involve placing the wafer with the carrier ring to be replaced on a table, pressing down on the gap between the carrier ring and the chip using a pressing tool, peeling the carrier ring off the protective film, and then attaching the new carrier ring to its original position within the protective film. Because wafers are prone to slipping on a table, this requires one person to hold the pressing tool while another slowly peels the ring off, making the operation complex and inconvenient. Furthermore, operator movement during the pressing process can wrinkle the protective film, resulting in unevenness. In severe cases, this can cause chip detachment, affecting the placement machine's ability to identify the chip's position on the wafer. When the new carrier ring is attached to the protective film, the attachment position relies entirely on manual judgment, which cannot perfectly match the original position. This can lead to positional misalignment of the carrier ring, and severe misalignment can cause the placement machine to misidentify the position or fail to identify it at all. Moreover, after the old carrier ring is peeled off, the protective film at the carrier ring's position lacks shaping force and is prone to deformation. When the old and new carrier rings are attached, wrinkles are easily formed, resulting in a wrinkled and uneven protective film after replacement. In severe cases, this can cause chip detachment, affecting the placement machine's ability to identify the chip's position on the wafer. Utility Model Content

[0003] The purpose of this invention is to provide a wafer carrier ring replacement device that facilitates and facilitates the replacement of wafers with new carrier rings, ensures the flatness of the protective film, and guarantees that the quality of the chip remains unchanged before and after the carrier ring replacement.

[0004] To achieve the above objectives, this utility model provides a wafer carrier ring replacement device. The wafer includes a protective film, a carrier ring disposed on the protective film, and a chip. The wafer carrier ring replacement device includes a worktable, a positioning template, and a pressure ring for pressing the wafer onto the worktable. The pressure ring is pressed onto the protective film between the chip and the carrier ring. The worktable is a vacuum adsorption platform with positioning lines and corner grooves at its edges. The positioning template has positioning openings that match the shape of the wafer. The positioning template is placed on the vacuum adsorption platform with the positioning openings facing the corner grooves and the edges of the positioning openings aligned with the positioning lines.

[0005] As a preferred embodiment of this utility model, the worktable is provided with multiple sets of positioning lines, and each set of positioning lines is matched with a wafer of a certain specification.

[0006] As a preferred embodiment of this utility model, each set of positioning lines includes two positioning lines corresponding to the two side edges of the bearing ring respectively.

[0007] As a preferred embodiment of this utility model, when the wafer is placed in the positioning opening of the positioning template, the end of the wafer protrudes out of the positioning opening.

[0008] As a preferred embodiment of this utility model, the pressure ring is a plastic pressure ring.

[0009] As a preferred embodiment of this utility model, the positioning template is a steel template.

[0010] As a preferred embodiment of this utility model, the top surface of the workbench is a plastic tabletop.

[0011] As a preferred embodiment of this utility model, the positioning line is a positioning groove line.

[0012] Compared with the prior art, the wafer carrier ring replacement device of this utility model has the following advantages:

[0013] When replacing the carrier ring, place the positioning template on the vacuum adsorption platform, ensuring the positioning opening of the template aligns with the positioning lines on the platform. Then, accurately and flatten the wafer to be replaced within the positioning opening of the template, with the edge of the wafer aligned with the corner groove. Turn on the vacuum adsorption platform to hold the wafer and positioning template in place, pressing the pressure ring onto the protective film between the chip and the carrier ring. This ensures that when peeling off the old carrier ring, the peeling force will not affect the chip inside the pressure ring, and the protective film will not be lifted off the vacuum adsorption platform. Separate the carrier ring from the corner groove, gradually peeling the entire carrier ring completely off the protective film. After peeling, smooth the protective film to ensure it is flat. Finally, place the new carrier ring along the positioning groove. The positioning opening of the template is attached back to the protective film. This utility model uses a vacuum adsorption platform to adsorb the protective film, ensuring that the protective film is flat and adhered to the platform surface, avoiding wrinkles caused by uneven placement or during replacement. This does not affect the identification of the chip mounter after replacing the carrier ring. Moreover, the pressure ring assists in pressing the wafer in conjunction with the vacuum adsorption platform, allowing a single person to complete the entire replacement process independently, effectively reducing labor and operational complexity. An angular groove is set on the vacuum adsorption platform to facilitate the separation of the carrier ring and the protective film, reducing the difficulty of peeling off the protective film and avoiding damage to the protective film during angular peeling. Furthermore, the positioning opening on the positioning template ensures that the new carrier ring is accurately positioned on the protective film. Attached Figure Description

[0014] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings of the embodiments will be briefly described below.

[0015] Figure 1 A schematic diagram of a wafer carrier ring replacement device provided by this utility model;

[0016] Figure 2 A schematic diagram of the structure of the workbench provided by this utility model;

[0017] Figure 3 A schematic diagram of the positioning template provided by this utility model;

[0018] In the figure, there is a workbench 1; a positioning line 11; a corner groove 12; a positioning template 2; a positioning opening 21; a pressure ring 3; a bearing ring 41; a chip 42; and a protective film 43. Detailed Implementation

[0019] The specific embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this utility model, but are not intended to limit its scope.

[0020] In the description of this utility model, it should be understood that the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0021] like Figures 1 to 3 As shown, a preferred embodiment of the present invention provides a wafer carrier ring replacement device. The wafer includes a protective film 43, a carrier ring 41 disposed on the protective film 43, and a chip 42. The wafer carrier ring replacement device includes a worktable 1, a positioning template 2, and a pressure ring 3 for pressing the wafer onto the worktable 1. The pressure ring 3 is pressed onto the protective film 43 between the chip 42 and the carrier ring 41. The worktable 1 is a vacuum adsorption platform. The vacuum adsorption platform is provided with a positioning line 11. A corner groove 12 is provided at the edge of the vacuum adsorption platform. The positioning template 2 is provided with a positioning opening 21 that matches the shape of the wafer. The positioning template 2 is placed on the vacuum adsorption platform. The positioning opening 21 of the positioning template 2 faces the corner groove 12, and the edge of the positioning opening 21 is directly opposite the positioning line 11.

[0022] In this invention, when replacing the carrier ring 41, the positioning template 2 is placed on the vacuum adsorption platform, with the positioning opening 21 of the positioning template 2 corresponding to the positioning line 11 on the vacuum adsorption platform. The wafer to be replaced (carrying the carrier ring 41) is then placed flat and accurately within the positioning opening 21 of the positioning template 2, with the edge of the wafer aligned with the corner groove 12. The vacuum adsorption platform is then activated to adsorb and fix the wafer and positioning template 2. The pressure ring 3 is pressed onto the protective film 43 between the chip 42 and the carrier ring 41. This ensures that when peeling off the old carrier ring 41, the peeling force will not affect the chip 42 inside the pressure ring 3, and the protective film 43 will not be lifted off the vacuum adsorption platform. The carrier ring 41 and the protective film 43 are separated from the corner groove 12, and then the entire carrier ring 41 is gradually peeled completely off the protective film 43. After peeling, the protective film 43 is tidied up to ensure it is flat. Finally, the new carrier ring 41 is reattached to the protective film 43 along the positioning opening 21 of the positioning template 2. This invention achieves this through a vacuum adsorption platform. The vacuum adsorption platform can adsorb the protective film 43, ensuring that the protective film 43 is flat and adhered to the surface of the vacuum adsorption platform. This avoids wrinkling of the protective film 43 due to uneven placement or during replacement. After the old carrier ring 41 is peeled off, the protective film 43 at the point where the carrier ring 41 was attached is adsorbed by the vacuum adsorption platform without wrinkling. This avoids the chip 42 falling off or shifting due to wrinkling at the edge of the protective film 43 when the new carrier ring 41 is attached. It will not affect the identification of the pick-and-place machine after replacing the carrier ring 41. Moreover, with the help of the pressure ring 3 to press the wafer in conjunction with the vacuum adsorption platform, a single person can complete the entire replacement process independently, effectively reducing manpower and operational complexity. An angled groove 12 is set on the vacuum adsorption platform to facilitate the separation of the carrier ring 41 and the protective film 43. This reduces the difficulty of peeling off the protective film 43 and avoids damage to the protective film 43 during the angled peeling process. In addition, the positioning opening 21 on the positioning template 2 ensures that the new carrier ring 41 is accurately attached to the protective film 43.

[0023] For example, the workbench 1 is provided with multiple sets of positioning lines 11, each set of positioning lines 11 matching a wafer of a certain specification. Since wafers have a variety of different specifications, such as 6-inch wafers, 8-inch wafers, 10-inch wafers, etc., it can be understood that the pressure ring 3 and the positioning template 2 in this embodiment also have a variety of specifications matching wafers of different specifications. The positioning lines 11, pressure ring 3 and positioning template 2 of the corresponding size are selected according to the wafer of the bearing ring 41 to be replaced, and the wafer bearing ring replacement device has wide applicability.

[0024] Specifically, each set of positioning lines 11 includes two positioning lines 11 corresponding to the two sides of the bearing ring 41, which can reduce the difficulty of manufacturing the positioning lines 11 of the vacuum adsorption platform and ensure the accurate placement of the positioning template 2.

[0025] In this embodiment, when the wafer is placed in the positioning opening 21 of the positioning template 2, the end of the wafer protrudes out of the positioning opening 21, which facilitates the separation of the carrier ring 41 and the protective film 43 in the wafer.

[0026] For example, the pressure ring 3 is a plastic pressure ring 3, which is less likely to damage the protective film 43 and effectively protects the protective film 43.

[0027] In this embodiment, the positioning template 2 is a steel template, which results in low wear during long-term use. The positioning opening 21 on the positioning template 2 can accurately match the bearing ring 41, ensuring the accurate placement of the new bearing ring 41. For example, the positioning line 11 is a positioning groove line, which facilitates accurate observation of the position of the positioning line 11 on the workbench 1, avoids wear on the positioning line 11, and ensures the flatness of the workbench 1 surface.

[0028] Furthermore, the top surface of the worktable 1 is a plastic surface, which reduces the wear of the protective film 43 on the worktable 1 and effectively protects the wafer.

[0029] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0030] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and substitutions can be made without departing from the technical principles of the present utility model, and these improvements and substitutions should also be considered within the protection scope of the present utility model.

Claims

1. A wafer carrier ring replacement device, wherein the wafer includes a protective film and a carrier ring and a chip disposed on the protective film, characterized in that, The wafer carrier ring replacement device includes a worktable, a positioning template, and a pressure ring for pressing the wafer onto the worktable. The pressure ring is pressed onto the protective film between the chip and the carrier ring. The worktable is a vacuum adsorption platform with positioning lines and corner grooves at its edges. The positioning template has positioning openings that match the shape of the wafer. The positioning template is placed on the vacuum adsorption platform with the positioning openings facing the corner grooves and the edges of the positioning openings facing the positioning lines.

2. The wafer carrier ring replacement device as described in claim 1, characterized in that, The workbench is provided with multiple sets of positioning lines, each set of positioning lines matching a wafer of a certain specification.

3. The wafer carrier ring replacement device as described in claim 2, characterized in that, Each set of positioning lines includes two positioning lines that correspond to the two side edges of the bearing ring, respectively.

4. The wafer carrier ring replacement device as described in claim 1, characterized in that, When the wafer is positioned in the positioning opening of the positioning template, the end of the wafer protrudes outside the positioning opening.

5. The wafer carrier ring replacement device as described in claim 1, characterized in that, The pressure ring is a plastic pressure ring.

6. The wafer carrier ring replacement device as described in claim 1, characterized in that, The positioning template is a steel template.

7. The wafer carrier ring replacement device as described in claim 1, characterized in that, The top surface of the workbench is a plastic tabletop.

8. The wafer carrier ring replacement device as described in claim 1, characterized in that, The positioning line is a positioning groove line.

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