RGBW four-color LED filament and LED lamp

Abstract

The utility model provides a kind of RGBW four-color LED filament and LED lamp, the RGBW four-color LED filament includes ceramic substrate, drive IC chip, electrode pin, three flip LED chips and CSP white light chip, the drive IC chip, three the flip LED chip and the CSP white light chip are all set on the ceramic substrate, three the flip LED chip is respectively used to emit red light, blue light and green light, the CSP white light chip is used to emit white light, the electrode pin is located at the end of the ceramic substrate, and each the flip LED chip and the CSP white light chip are connected with the electrode pin, each the flip LED chip and the CSP white light chip are connected with the drive IC chip, by the present application, the white light color temperature stability is deployed, and it is also favorable to reduce the complexity of control power supply, to reduce cost in turn.

Description

Technical Field

[0001] This utility model relates to the field of lighting technology, and in particular to an RGBW four-color LED filament and an LED lamp. Background Technology

[0002] As LED technology matures, traditional LED bulbs emit only a single color temperature and cannot adjust their light output according to user and environmental needs, which limits their use in lighting.

[0003] Currently, the dimming products on the market are mainly based on RGB three-color light sources. The mixing ratio of RGB three-color light sources is used to achieve a fourth white light color through LED dimming and color adjustment drivers. These products have complex power supply control and very high cost, and the resulting white light color temperature is unstable. Utility Model Content

[0004] Therefore, the purpose of this utility model is to provide an RGBW four-color LED filament and LED lamp to overcome the shortcomings of the prior art.

[0005] To achieve the above objectives, this utility model provides an RGBW four-color LED filament, comprising a ceramic substrate, a driver IC chip, electrode pins, three flip-chip LEDs, and a CSP white light chip. The driver IC chip, the three flip-chip LEDs, and the CSP white light chip are all disposed on the ceramic substrate. The three flip-chip LEDs are used to emit red, blue, and green light, respectively, and the CSP white light chip is used to emit white light. The electrode pins are disposed at the ends of the ceramic substrate, and each flip-chip LED and CSP white light chip is connected to the electrode pins. Each flip-chip LED and CSP white light chip is also connected to the driver IC chip.

[0006] The beneficial effects of this invention are as follows: by setting three flip-chip LEDs and a CSP white light chip on a ceramic substrate, by setting the driver IC chip on the ceramic substrate, by connecting each flip-chip LED and CSP white light chip to electrode pins respectively, and by connecting each flip-chip LED and CSP white light chip to the driver IC chip respectively, multiple colors of light can be produced using the three flip-chip LEDs and CSP white light chip. Furthermore, the white light color temperature produced by the CSP white light chip in conjunction with the three flip-chip LEDs is stable. At the same time, by embedding the driver IC chip in the filament, the complexity of the control power supply is reduced, thereby reducing costs.

[0007] Preferably, the ceramic substrate is provided with a silver layer circuit, and each of the flip-chip LED chip and CSP white light chip is connected to the electrode pin through the silver layer circuit.

[0008] Preferably, there are two electrode pins, which are located at opposite ends of the ceramic substrate, and the two ends of the silver layer circuit are respectively connected to the two electrode pins.

[0009] Preferably, a transparent adhesive layer is disposed on the ceramic substrate, the transparent adhesive layer covering the three flip-chip LEDs and the CSP white light chip.

[0010] Preferably, the three flip-chip LEDs and the CSP white light chip are arranged at equal intervals on the ceramic substrate.

[0011] Preferably, adjacent flip-chip LEDs are connected in parallel, and the flip-chip LEDs and the CSP white light chip are connected in parallel.

[0012] To achieve the above objectives, this utility model also provides an LED lamp, including the RGBW four-color LED filament described above.

[0013] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0014] Figure 1 A schematic diagram of the structure of an RGBW four-color LED filament provided in the first embodiment of the utility model;

[0015] Figure 2 A schematic diagram of the structure of the ceramic substrate and silver layer circuit provided in the first embodiment of the utility model.

[0016] Explanation of key component symbols:

[0017] 10. Ceramic substrate; 11. Silver layer circuit; 12. Electrode pins; 20. Driver IC chip; 40. Flip LED chip; 50. CSP white light chip.

[0018] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this utility model. Detailed Implementation

[0019] To facilitate understanding of this utility model, a more complete description will be given below with reference to the accompanying drawings. Several embodiments of this utility model are shown in the drawings. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this utility model will be more thorough and complete.

[0020] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0022] Please see Figures 1 to 2 The RGBW four-color LED filament in the first embodiment of this utility model includes a ceramic substrate 10, a driver IC chip 20, electrode pins 12, three flip-chip LEDs 40 and a CSP white light chip 50.

[0023] The driver IC chip 20, three flip-chip LEDs 40, and CSP white light chip 50 are all disposed on the ceramic substrate 10. The three flip-chip LEDs 40 and CSP white light chip 50 are arranged at equal intervals on the ceramic substrate 10. The driver IC chip 20 is located on one side of the flip-chip LEDs 40. The three flip-chip LEDs 40, CSP white light chip 50, and driver IC chip 20 are all connected to the ceramic substrate 10 through silver layer lines 11. Specifically, four silver layer lines 11 are brushed on the ceramic substrate 10, and the three flip-chip LEDs 40 and CSP white light chip 50 are disposed on the four partial silver layer lines 11. The silver layer lines 11 without LED chips are used as idle silver layer lines, and the driver IC chip 20 is disposed on the idle silver layer lines. It can be understood that the three flip-chip LEDs 40 and CSP white light chip 50 are all electrically connected to the driver IC chip 20 through the silver layer lines 11.

[0024] It should be noted that there are two electrode pins 12. The two electrode pins 12 are respectively located at opposite ends of the ceramic substrate 10. The two ends of each silver layer line 11 are electrically connected to the two electrode pins 12. It can be understood that each of the two electrode pins 30 is connected to an electrode pin 12. By designing the silver layer line 11, the connection between the flip-chip LED chip 40 and the CSP white light chip 50 and the electrode pins 12 is strengthened.

[0025] In this embodiment, a transparent adhesive layer is disposed on the ceramic substrate 10, which covers three flip-chip LED chips 40 and CSP white light chip 50.

[0026] In this embodiment, adjacent flip-chip LEDs 40 are connected in parallel, and flip-chip LEDs 40 and CSP white light chips 50 are also connected in parallel to ensure that they do not interfere with each other and improve the practicality of the filament.

[0027] In practical implementation, by setting three flip-chip LEDs 40 and CSP white light chips 50 on the ceramic substrate 10, by setting the driver IC chip 20 on the ceramic substrate 10, by connecting each flip-chip LED and CSP white light chip 50 to the electrode pins 30 respectively, and by connecting each flip-chip LED 40 and CSP white light chip 50 to the driver IC chip 20 respectively, multiple colors of light can be produced by using the three flip-chip LEDs 40 and CSP white light chips 50. The white light color temperature produced by the CSP white light chip 50 in conjunction with the three flip-chip LEDs 40 is stable. At the same time, by embedding the driver IC chip 20 in the filament, it is also beneficial to reduce the complexity of the control power supply, thereby reducing costs.

[0028] It should be noted that the above implementation process is only to illustrate the feasibility of this application, but it does not mean that the RGBW four-color LED filament of this application has only the above-mentioned unique implementation process. On the contrary, as long as the RGBW four-color LED filament of this application can be implemented, it can be included in the feasible implementation scheme of this application.

[0029] The LED lamp in the second embodiment of this utility model includes the RGBW four-color LED filament in the first embodiment.

[0030] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0031] The above-described embodiments are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the appended claims.

Claims

1. An RGBW four-color LED filament, characterized in that, The device includes a ceramic substrate, a driver IC chip, electrode pins, three flip-chip LEDs, and a CSP white light chip. The driver IC chip, the three flip-chip LEDs, and the CSP white light chip are all disposed on the ceramic substrate. The three flip-chip LEDs are used to emit red light, blue light, and green light, respectively, and the CSP white light chip is used to emit white light. The electrode pins are located at the ends of the ceramic substrate, and each flip-chip LED and CSP white light chip is connected to the electrode pins. Each flip-chip LED and CSP white light chip is also connected to the driver IC chip. The ceramic substrate has a silver layer circuit. Each of the flip-chip LED chip and CSP white light chip is connected to the electrode pin through the silver layer circuit. The three flip-chip LED chips and the CSP white light chip are arranged on a portion of the silver layer circuit. The portion of the silver layer circuit without LED chips is used as an idle silver layer circuit. The driver IC chip is arranged on the idle silver layer circuit.

2. The RGBW four-color LED filament according to claim 1, characterized in that, The number of electrode pins is two, and the two electrode pins are located at opposite ends of the ceramic substrate. The two ends of the silver layer circuit are respectively connected to the two electrode pins.

3. The RGBW four-color LED filament according to claim 1, characterized in that, A transparent adhesive layer is disposed on the ceramic substrate, and the transparent adhesive layer covers the three flip-chip LEDs and the CSP white light chip.

4. The RGBW four-color LED filament according to claim 1, characterized in that, The three flip-chip LEDs and the CSP white light chip are arranged at equal intervals on the ceramic substrate.

5. The RGBW four-color LED filament according to claim 1, characterized in that, The adjacent flip-chip LEDs are connected in parallel, and the flip-chip LEDs and the CSP white light chip are connected in parallel.

6. An LED light, characterized in that, Includes the RGBW four-color LED filament as described in any one of claims 1-5.

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