Earphone circuit board welding jig

Abstract

The earphone circuit board welding jig comprises a base and a rotating seat. The rotating seat is provided with positioning members and a carrier plate table arranged at intervals. The positioning members are configured to position and place the earphone shell, and the carrier plate table is configured to position and place the circuit board and expose the welding points on the circuit board. The rotating seat is rotationally connected with the base to change the position of the welding points on the circuit board relative to the base. The earphone circuit board welding jig can change the position of the welding points on the circuit board relative to the operator by rotating the rotating seat relative to the base. The welding position and the welding angle can be adjusted every time before welding operation. The circuit board or the earphone shell does not need to be frequently disassembled and assembled. The operation is simple and convenient. The operator can operate the rotating seat with one hand without putting down the electric soldering iron, reducing the safety hazard of being scalded by the electric soldering iron and improving the work efficiency.

Description

Technical Field

[0001] This application relates to the field of headphone assembly technology, and in particular to a wire bonding fixture for headphone circuit boards. Background Technology

[0002] In the production and assembly of headphones, there are many scenarios requiring wire soldering, especially for over-ear headphones. Various wires on the headphone shell need to be soldered to corresponding circuit boards such as the mainboard, adapter board, and charging board. Due to the length limitations of the wires, currently, thin clamps are mainly used to hold the circuit board, making the circuit board slightly higher than the headphone shell, before soldering. Because the solder points are distributed in different locations on the circuit board, some concentrated on both sides, after soldering the points on one side, the operator often needs to put down the soldering iron, release the clamp, adjust the position of the headphone shell and the circuit board, and then re-clamp the circuit board to adjust the solder points on the other side to a suitable position and angle for convenient subsequent soldering operations. This entire adjustment process is cumbersome, difficult, and inefficient. Moreover, during the repeated clamping process, operators are prone to burns from the nearby soldering iron, posing a safety hazard. Utility Model Content

[0003] This application aims to address at least one of the technical problems existing in the prior art. To this end, based on the current issue that multiple adjustments to the headphone housing and circuit board position are required for wire bonding on circuit boards, this application proposes a wire bonding fixture for headphone circuit boards that is easy to operate, improves work efficiency, and reduces safety hazards.

[0004] The headphone circuit board wire bonding fixture according to an embodiment of this application includes a base and a rotating seat; The rotating base is provided with spaced positioning elements and a carrier platform. The positioning elements are configured to position and place the earphone housing, and the carrier platform is configured to position and place the circuit board and expose the solder points on the circuit board. The rotating seat is rotatably connected to the base to change the position of the solder points on the circuit board relative to the base.

[0005] The headphone circuit board soldering fixture according to the embodiments of this application has at least the following beneficial effects: the base serves as the fixed part of the headphone circuit board soldering fixture, and the rotating seat serves as the movable part of the headphone circuit board soldering fixture. The rotating seat is provided with spaced positioning members and a carrier platform. The operator can position the headphone shell on the positioning members and position the circuit board on the carrier platform, exposing the soldering points on the circuit board, thereby maintaining the relative spacing between the headphone shell and the circuit board. By manipulating the rotating seat to rotate it relative to the base, the operator can change the position of the soldering points on the circuit board relative to the operator. Before each soldering operation, the appropriate soldering position and a comfortable soldering angle can be adjusted. Only one clamping is required, eliminating the need for frequent disassembly and assembly of the circuit board or headphone shell. The operation is simple and convenient. The operator can operate the rotating seat with one hand without putting down the soldering iron, reducing the safety hazard of being burned by the soldering iron, and also improving work efficiency.

[0006] According to some embodiments of this application, a cover plate is also included. The headphone circuit board wire bonding fixture has a clamping state and a releasing state. When the headphone circuit board wire bonding fixture is in the clamping state, the cover plate clamps the circuit board with the carrier stage. When the headphone circuit board wire bonding fixture is in the releasing state, the cover plate releases the clamping of the circuit board.

[0007] According to some embodiments of this application, the cover plate is provided with an electrical connection part, which is used to connect to the ground wire. When the headphone circuit board soldering fixture is in the clamping state, the electrical connection part abuts against the grounding terminal on the circuit board.

[0008] According to some embodiments of this application, the electrical connection portion is a spring pin, the spring pin includes a needle tip, the needle tip is capable of extending and retracting relative to the cover plate along the contact direction between the electrical connection portion and the grounding end, so that the needle tip remains in contact with the grounding end when the headphone circuit board soldering fixture is in the clamping state.

[0009] According to some embodiments of this application, a locking element is also included, wherein the cover plate is pivotally connected to the carrier stage, the cover plate is rotatable relative to the carrier stage to press the circuit board onto the carrier stage or to release the circuit board, and the locking element is configured to lock the relative position between the cover plate and the carrier stage when the cover plate presses the circuit board onto the carrier stage.

[0010] According to some embodiments of this application, the cover plate is provided with a pressing part, the pressing part protruding from the side of the cover plate facing the carrier stage, and the pressing part is configured to press the circuit board onto the carrier stage when the headphone circuit board bonding jig is in the clamping state. The pressing portion separates the cover plate from the circuit board and forms a bonding space, and / or the pressing portion is made of a flexible material.

[0011] According to some embodiments of this application, a positioning pin is provided on the carrier plate, the positioning pin protrudes from the side of the carrier plate facing the circuit board, and the positioning pin can be fitted with a positioning hole on the circuit board so that the carrier plate can position and place the circuit board. And / or, the carrier platform is provided with a positioning groove, the positioning groove is for the circuit board to be placed in, and the groove wall of the positioning groove is used to position the circuit board circumferentially.

[0012] According to some embodiments of this application, the carrier platform is located above the positioning member, and the rotating seat is located below the positioning member. The rotating seat is used to support the earphone shell. The positioning member includes a retaining block, which protrudes from the rotating seat on the side facing the carrier platform and together with the rotating seat forms a contour groove. The contour groove has an upward-facing opening and is used to accommodate the earphone shell and position the periphery of the earphone shell. The contour groove has a notch in the horizontal direction for the earphone shell to be placed into the contour groove.

[0013] According to some embodiments of this application, it further includes a rotating shaft and a bearing, wherein the rotating seat and the base are optionally mounted with the rotating shaft and the other is mounted with the bearing, the axis of the rotating shaft extends in the vertical direction, and the rotating shaft is inserted into the bearing so that the rotating seat can rotate around the axis of the rotating shaft.

[0014] According to some embodiments of this application, the rotating seat is provided with a stop portion, and the base is provided with a limiting portion. When the rotating seat rotates around the axis of the rotating shaft, the limiting portion can stop the stop portion to limit the rotation angle range of the rotating seat.

[0015] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0016] The present application will be further described below with reference to the accompanying drawings and embodiments, wherein: Figure 1 This is a schematic diagram of the structure of the headphone circuit board wire bonding fixture according to an embodiment of this application; Figure 2 for Figure 1 Side view; Figure 3 for Figure 1 The diagram shows the structural arrangement of the headphone circuit board soldering fixture with the circuit board and headphone housing. Figure 4 for Figure 3Partial structural diagram; Figure 5 for Figure 4 A magnified view of a section at point A in the middle; Figure 6 This is a schematic diagram of the cover plate according to an embodiment of this application; Figure 7 This is a schematic diagram of the carrier stage according to an embodiment of this application; Figure 8 This is a schematic diagram of the structure of the base and the rotating seat in an embodiment of this application; Figure 9 This is an exploded view of the base and rotating seat from one perspective of an embodiment of this application; Figure 10 This is an exploded view of the base and rotating seat from another perspective, representing an embodiment of this application.

[0017] Reference numerals: base 100, limiting part 110; Rotary seat 200, stopped part 210, arc-shaped slide groove 220; Positioning component 300, enclosure block 310, contour groove 320, opening 321, notch 322; Carrier platform 400, positioning groove 410, positioning pin 420, clearance groove 430, clearance hole 440, threaded hole 450; Cover plate 500, electrical connection part 510, needle 511, needle tube 512, ground wire 520, pivot 530, holding part 540, through hole 550, operating handle 560; Circuit board 600, solder joint 610, grounding terminal 620, positioning hole 630; Earphone shell 700; 800mm shaft; Bearing 900. Detailed Implementation

[0018] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0019] In the description of this application, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0020] In the description of this application, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0021] In the description of this application, unless otherwise expressly defined, terms such as "setup," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this application in conjunction with the specific content of the technical solution.

[0022] In the description of this application, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0023] The embodiments of this application are described below with reference to the accompanying drawings: Reference Figures 1 to 5 According to the embodiments of this application, the headphone circuit board soldering fixture is suitable for mounting the headphone housing 700 and the circuit board 600, so as to solder various wires on the headphone housing 700 to the corresponding soldering points on the circuit board 600. The circuit board 600 can be the headphone's main board, adapter board, or charging board, for example. Figures 3 to 5 The circuit board 600 shown is specifically the headphone motherboard. The headphone circuit board soldering fixture includes a base 100, a rotating seat 200, a positioning component 300, and a carrier stage 400.

[0024] Reference Figure 1 and Figure 2 The positioning element 300 and the carrier plate stage 400 are disposed on the rotary seat 200 and arranged at intervals. The rotary seat 200 may include the positioning element 300 and the carrier plate stage 400, or the positioning element 300 and the carrier plate stage 400 may be located on the rotary seat 200. (Refer to...) Figure 3 and Figure 4 The positioning component 300 is configured to position and place the earphone housing 700, and the carrier platform 400 is configured to position and place the circuit board 600, and expose the solder points 610 on the circuit board 600, thereby achieving the positioning function of the earphone housing 700 and the circuit board 600.

[0025] The operator can place the earphone housing 700 on the positioning member 300 and the circuit board 600 on the carrier stage 400, thereby maintaining the relative spacing between the earphone housing 700 and the circuit board 600, preventing relative movement between the earphone housing 700 and the circuit board 600, and ensuring the accuracy of the soldering.

[0026] Understandably, after placing the circuit board 600 on the carrier stage 400, the solder points 610 on the circuit board 600 need to be exposed. Firstly, the carrier stage 400 must not contact the solder points 610. Secondly, the carrier stage 400 must provide sufficient space for the operator to solder near the solder points 610 without affecting the soldering operation or causing positional interference. The circuit board 600 has one or more solder points 610, and these solder points 610 are distributed in different locations on the circuit board 600, for example... Figure 4 The circuit board 600 shown has multiple solder points 610 arranged on both sides.

[0027] Among them, reference Figures 1 to 3 The rotating base 200 is rotatably connected to the base 100 to change the position of the solder points 610 on the circuit board 600 relative to the base 100. The base 100 serves as the fixed part of the headphone circuit board soldering fixture, and the rotating base 200 serves as the movable part of the headphone circuit board soldering fixture. When the rotating base 200 rotates relative to the base 100, the rotating base 200 also synchronously drives the positioning component 300, the headphone housing 700, the carrier platform 400, and the circuit board 600 to rotate, thereby changing the position of the solder points 610 on the circuit board 600 relative to the operator. Ultimately, this adjusts some of the solder points 610 to a suitable soldering position and a comfortable soldering angle. Then, the operator performs soldering operations on some of the solder points 610. After the soldering is completed, the rotating base 200 is rotated again to adjust another part of the solder points 610 to a suitable soldering position and a comfortable soldering angle. Then, the operator performs soldering operations on the other part of the solder points 610.

[0028] By manipulating the rotating base 200 to rotate relative to the base 100, the operator can change the position of the soldering point 610 on the circuit board 600 relative to the operator. Before each soldering operation, the operator can adjust to a suitable soldering position and a comfortable soldering angle. In other words, the headphone housing 700 and the circuit board 600 only need to be clamped once, without the need for frequent disassembly and assembly of the circuit board 600 or the headphone housing 700. The operation is simple, convenient, and highly efficient.

[0029] In addition, the operator can operate the rotary table 200 with one hand, while the other hand can always hold the soldering iron. There is no need to frequently put down the soldering iron, nor to repeatedly clamp the earphone shell 700 and the circuit board 600, which reduces the safety hazard of the operator being burned by the nearby soldering iron and further improves work efficiency.

[0030] Reference Figures 1 to 4 In some embodiments of this application, the embodiments of this application also include a cover plate 500, which can be movably connected to the carrier stage 400 or can be detachably connected to the carrier stage 400. The headphone circuit board wire bonding fixture has a clamping state and a releasing state.

[0031] When the headphone circuit board wire bonding fixture is in the clamping state, the cover plate 500 and the carrier stage 400 clamp the circuit board 600. The final mating state of the cover plate 500 and the carrier stage 400 achieves the purpose of clamping and fixing the circuit board 600, thereby maintaining the relative spacing between the headphone housing 700 and the circuit board 600, preventing relative movement between the headphone housing 700 and the circuit board 600, and ensuring the accuracy of wire bonding. When the headphone circuit board wire bonding fixture is in the released state, the cover plate 500 releases its clamping on the circuit board 600. Specifically, the cover plate 500 can be moved or rotated relative to the carrier stage 400, or the cover plate 500 can be removed from the carrier stage 400 to remove the circuit board 600.

[0032] During the wire bonding process on circuit board 600, in order to ensure the safety of operators and products, as well as to ensure the stability of the wire bonding process, circuit board 600 often needs to be connected to a ground wire. Connecting circuit board 600 to a ground wire can divert the current on circuit board 600 to the ground, preventing operators from being shocked and ensuring personal safety. When the components on circuit board 600 fail, connecting circuit board 600 to a ground wire can divert the current to the ground, thereby protecting circuit board 600 from damage.

[0033] Currently, after the existing clamp holds the circuit board 600, the operator needs to use a special grounding clamp to hold the grounding terminal 620 on the circuit board 600 to connect the circuit board 600 to the ground wire. This clamping method is difficult to operate and time-consuming.

[0034] In this regard, in some embodiments of this application, reference is made to Figure 4 and Figure 5 The cover plate 500 is provided with an electrical connection part 510, which is used to connect to the ground wire 520. The electrical connection part 510 corresponds to the grounding terminal 620 on the circuit board 600. When the headphone circuit board soldering fixture is in the clamping state, that is, when the cover plate 500 and the carrier stage 400 clamp and fix the circuit board 600, the electrical connection part 510 abuts against the grounding terminal 620 on the circuit board 600, thus achieving the purpose of connecting the circuit board 600 to the ground wire 520. The operation is very simple, and the electrical connection part 510 abuts against the grounding terminal 620 on the circuit board 600 at the same time as clamping and fixing the circuit board 600, without the need for additional operations, which is easy and saves time.

[0035] Reference Figure 5and Figure 6 In some embodiments, the electrical connection portion 510 is a spring needle, which includes a needle tip 511 and a needle tube 512. The needle tube 512 is fixedly mounted on the cover plate 500. The ground wire 520 is electrically connected to the needle tip 511. The needle tip 511 can extend and retract relative to the needle tube 512, so that the needle tip 511 can extend and retract relative to the cover plate 500 along the contact direction between the electrical connection portion 510 and the grounding end 620, so that the needle tip 511 abuts against the grounding end 620 when the headphone circuit board wire bonding fixture is in the clamping state. Even if there is a certain deviation between the position of the cover plate 500 and the circuit board 600 or the position of the circuit board 600 changes during the wire bonding process, the electrical connection portion 510 of this application embodiment can ensure that the needle tip 511 is stably abutted against the grounding end 620 through the elastic extension and retraction design.

[0036] Understandably, the axis of the spring pin extends along the cover plate 500 in the direction close to the grounding end 620, for example, Figures 4 to 6 The axis of the spring pin shown extends in the vertical direction. According to the actual needs of the circuit board 600, if the circuit board 600 has multiple grounding terminals 620, multiple spring pins are also set accordingly, with each spring pin corresponding to one of the multiple grounding terminals 620.

[0037] In some embodiments, refer to Figure 4 The cover plate 500 is pivotally connected to the carrier stage 400. Specifically, one end of the cover plate 500 is pivotally connected to the carrier stage 400 via a pivot 530. The cover plate 500 can be flipped relative to the carrier stage 400 to press the circuit board 600 onto the carrier stage 400 or to release the circuit board 600. It can be understood that the cover plate 500 can achieve the positioning of the circuit board 600 by its own weight.

[0038] This application embodiment also includes a locking member (not shown in the figure). The locking member is configured to lock the relative position between the cover plate 500 and the carrier stage 400 when the cover plate 500 presses the circuit board 600 onto the carrier stage 400. When the locking member is in the locked state, it can prevent the cover plate 500 from flipping relative to the carrier stage 400, ensuring that the circuit board 600 is stably clamped by the cover plate 500 and the circuit board 600. When the locking member is in the unlocked state, the cover plate 500 can flip relative to the carrier stage 400 to release the circuit board 600.

[0039] Reference Figure 4 , Figure 6 and Figure 7The locking element can be a fastening bolt. The cover plate 500 has a through hole 550 located offset from the pivot 530 and the circuit board 600. The carrier plate 400 has a corresponding threaded hole 450. The locking element passes through the through hole 550 and is threaded into the threaded hole 450 for fastening, thus achieving a locking effect between the cover plate 500 and the carrier plate 400. Alternatively, the locking element can employ a magnetic structure, with two mutually attractive magnets on the cover plate 500 and the carrier plate 400 respectively. The magnets are positioned offset from the pivot 530 and the circuit board 600, achieving rapid engagement and disengagement between the cover plate 500 and the carrier plate 400.

[0040] Reference Figure 4 and Figure 6 In some embodiments of this application, a pressing portion 540 is provided on the cover plate 500. The pressing portion 540 protrudes from the side of the cover plate 500 facing the carrier stage 400. The pressing portion 540 is configured to press the circuit board 600 onto the carrier stage 400 when the headphone circuit board wire bonding fixture is in the clamping state.

[0041] In some embodiments, reference is made to Figure 4 The holding part 540 separates the cover plate 500 from the circuit board 600 and forms a bonding space. At the same time, the holding part 540 also avoids the bonding point 610 on the circuit board 600. The bonding space can provide the operator with the necessary space to operate the bonding wire, which facilitates the bonding wire.

[0042] Alternatively, in another embodiment, the pressing part is made of a flexible material to achieve a cushioning effect. The pressing part 540 is used to prevent the cover plate 500 from making hard contact with the circuit board 600, thereby reducing damage to the circuit board 600.

[0043] Understandably, the pressing part 540 needs to have a certain degree of elasticity and rigidity, so as to not only buffer the circuit board 600, but also prevent the circuit board 600 from shifting after being pressed. The pressing part 540 can be made of urethane or rubber material. Among them, the pressing part 540 made of urethane material has the characteristics of high strength and small compression deformation.

[0044] Thanks to the fact that the electrical connection part 510 is a spring pin with an elastic telescopic design, even if the elastic deformation of the holding part 540 when pressing different circuit boards 600 is different, resulting in different positions of the cover plate 500 relative to the circuit board 600, the spring pin can still ensure that the pin tip 511 is stably abutted against the grounding terminal 620.

[0045] In addition, in some embodiments, the retaining portion 540 separates the cover plate 500 from the circuit board 600 and forms a bonding wire space, and the retaining portion is made of a flexible material.

[0046] Reference Figure 4and Figure 6 In some embodiments of this application, a control handle 560 is installed on the side of the cover plate 500 away from the carrier plate 400. The operator can hold the control handle 560 to actuate the cover plate 500, causing the cover plate 500 to flip relative to the carrier plate 400, so as to press the circuit board 600 onto the carrier plate 400 or release the circuit board 600. The operation is very convenient, and the operation can be performed with one hand, which is also labor-saving.

[0047] Reference Figure 4 , Figure 5 and Figure 7 In some embodiments, a positioning pin 420 is provided on the carrier stage 400. The positioning pin 420 protrudes from the side of the carrier stage 400 facing the circuit board 600. The positioning pin 420 can be fitted with the positioning hole 630 on the circuit board 600 so that the carrier stage 400 can position and place the circuit board 600. At least two positioning pins 420 are provided at intervals to restrict and constrain the circuit board 600 in the horizontal direction.

[0048] Alternatively, in another embodiment, the carrier stage 400 may also be provided with a positioning groove 410, into which the circuit board 600 is placed. The positioning groove 410 extends horizontally and can support the circuit board 600 upwards. The groove wall of the positioning groove 410 is used to position the circuit board 600 circumferentially.

[0049] Furthermore, the carrier platform 400 can also be equipped with both a positioning groove 410 and a positioning pin 420 to achieve a dual positioning effect. The positioning pin 420 can protrude from the bottom of the positioning groove 410, as shown in the reference diagram. Figure 7 Combined with the action of the cover plate 500 pressing the circuit board 600 downward onto the carrier stage 400, the circuit board 600 is restricted and constrained in the vertical direction, and the circuit board 600 is finally clamped and fixed.

[0050] In addition, to prevent damage to the components on the circuit board 600 during clamping and fixing, refer to Figure 7 The carrier platform 400 is also provided with a clearance groove 430, which can provide clearance space for most of the components on the lower side of the circuit board 600. A clearance hole 440 that runs vertically through the bottom of the clearance groove 430 can also be provided to provide clearance space for the components protruding on the lower side of the circuit board 600, thereby effectively protecting the components on the circuit board 600. In addition, the pressing part 540 also avoids the components on the upper side of the circuit board 600 when pressing the circuit board 600.

[0051] Reference Figures 1 to 4In some embodiments of this application, the carrier stage 400 is located above the positioning member 300, and the rotating seat 200 is located below the positioning member 300. The rotating seat 200 is used to support the earphone housing 700. The cover plate 500 can be flipped up and down relative to the carrier stage 400, so that the circuit board 600 is located above the earphone housing 700, or even directly above the position of the post-assembly circuit board 600 inside the earphone housing 700. This ensures that the multiple solder points 610 distributed on the upper side of the circuit board 600 are relatively close to the wires inside the earphone housing 700. Moreover, the wires can be routed from below the circuit board 600 around the outer edge of the circuit board 600, extend to the top of the circuit board 600, and then be soldered to the solder points 610.

[0052] Among them, reference Figures 1 to 3 The positioning component 300 includes a retaining block 310, which protrudes from the rotating base 200 on the side facing the carrier platform 400 and together with the rotating base 200 forms a contour groove 320. The contour groove 320 has an upward-facing opening 321. The contour groove 320 is used to accommodate the earphone housing 700 and to position the periphery of the earphone housing 700. This prevents the earphone housing 700 from moving relative to the circuit board 600 and also ensures that the earphone housing 700 rotates synchronously with the rotating base 200 when it rotates relative to the base 100. The opening 321 allows the wires of the earphone housing 700 to pass upward through the contour groove 320 and extend to the soldering point 610 without obstructing the wires.

[0053] In some embodiments, refer to Figure 1 and Figure 3 The enclosure block 310 is roughly "C" shaped. The contour groove 320 has a notch 322 in the horizontal direction. The notch 322 is used to allow the earphone shell 700 to be placed into the contour groove 320, providing an entrance. In this way, the earphone shell 700 does not need to be placed into the contour groove 320 from the open position 321. The distance between the carrier platform 400 and the enclosure block 310 can be set closer. To a certain extent, the distance between the circuit board 600 and the earphone shell 700 is designed to be closer, providing sufficient space for the operator to solder wires.

[0054] To enable the rotating seat 200 to rotate relative to the base 100, some embodiments of this application further include a rotating shaft 800 and a bearing 900. The rotating seat 200 and the base 100 are optionally fitted with the rotating shaft 800, and the other with the bearing 900. The axis of the rotating shaft 800 extends in the vertical direction, and the rotating shaft 800 is inserted into the bearing 900, so that the rotating seat 200 can rotate around the axis of the rotating shaft 800. For example... Figure 9 The rotating shaft 800 shown is fixedly mounted on the upper side of the base 100. Figure 10The outer ring of the bearing 900 shown is mounted on the rotating seat 200, and the rotating shaft 800 is fixedly inserted into the inner ring of the bearing 900. The rotating shaft 800 itself does not rotate, but relies on the outer ring of the bearing 900 to rotate relative to the inner ring of the bearing 900, so that the rotating seat 200 can rotate around the axis of the rotating shaft 800 with less resistance, and the operator can also operate the rotating seat 200 with less effort.

[0055] In some other embodiments, the rotating shaft 800 can be fixedly installed on the lower side of the rotating seat 200, the outer ring of the bearing 900 can be installed on the base 100, and the rotating shaft 800 can be fixedly inserted into the inner ring of the bearing 900, so that the rotating shaft 800 can rotate around its own axis.

[0056] Reference Figures 8 to 10 In some embodiments of this application, the rotating seat 200 is provided with a stopped part 210, and the base 100 is provided with a limiting part 110. When the rotating seat 200 rotates around the axis of the rotating shaft 800, the limiting part 110 can stop the stopped part 210 to limit the rotation angle range of the rotating seat 200. Two sets of stopped parts 210 can be provided, with both sets of stopped parts 210 equidistant from the rotating shaft 800. The central angle formed by the two sets of stopped parts 210 with the axis of the rotating shaft 800 as the center is equal to the rotation angle range of the rotating seat 200. The maximum rotation angle of the rotating seat 200 can be any angle between 150° and 210°. By reciprocating the rotation of the rotating seat 200, the operator can... Figure 4 The solder points 610 on both sides of the circuit board 600 shown are adjusted to a suitable solder position and a comfortable solder angle.

[0057] To reduce the overall height of the headphone circuit board soldering fixture in this embodiment, a compact assembly between the base 100 and the rotating seat 200 can be achieved by concealing the stop portion 210. (Refer to...) Figure 8 and Figure 10 The rotating seat 200 has an arc-shaped groove 220 between the two sets of stopped parts 210. The stopped parts 210 are installed at both ends of the arc-shaped groove 220. The arc-shaped groove 220 can accommodate the limiting part 110, and when the arc-shaped groove 220 rotates around the axis of the rotating shaft 800, the limiting part 110 will not obstruct the arc-shaped groove 220.

[0058] Specifically, the limiting part 110 can be a stop slider, which not only stops the stopped part 210, but also slides with the arc-shaped slide groove 220, so that the stop slider and the two side walls of the arc-shaped slide groove 220 are close to being in contact. When the rotating seat 200 rotates around the axis of the rotating shaft 800, it ensures the stable operation of the rotating seat 200 and prevents displacement. Moreover, when the rotating seat 200 stops rotating, the stop slider can also provide a certain static friction force to ensure that the rotating seat 200 and the base 100 have a relatively stable positional relationship, so that the rotating seat 200 does not rotate too easily when the operator is soldering wires.

[0059] The embodiments of this application have been described in detail above with reference to the accompanying drawings. However, this application is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of this application. Furthermore, unless otherwise specified, the embodiments and features described in the embodiments of this application can be combined with each other.

Claims

1. A wire bonding fixture for an earphone circuit board, characterized in that, include: Base; The rotating base is provided with spaced positioning elements and a carrier platform. The positioning elements are configured to position and place the earphone housing, and the carrier platform is configured to position and place the circuit board and expose the solder points on the circuit board. The rotating seat is rotatably connected to the base to change the position of the solder points on the circuit board relative to the base.

2. The headphone circuit board wire bonding fixture according to claim 1, characterized in that, It also includes a cover plate. The headphone circuit board wire bonding fixture has a clamping state and a releasing state. When the headphone circuit board wire bonding fixture is in the clamping state, the cover plate clamps the circuit board with the carrier stage. When the headphone circuit board wire bonding fixture is in the releasing state, the cover plate releases the clamping of the circuit board.

3. The headphone circuit board wire bonding fixture according to claim 2, characterized in that, The cover plate is provided with an electrical connection part, which is used to connect to the ground wire. When the headphone circuit board soldering fixture is in the clamping state, the electrical connection part abuts against the grounding terminal on the circuit board.

4. The headphone circuit board wire bonding fixture according to claim 3, characterized in that, The electrical connection part is a spring pin, which includes a needle tip. The needle tip is retractable relative to the cover plate along the contact direction between the electrical connection part and the grounding end, so that the needle tip remains in contact with the grounding end when the headphone circuit board wire bonding fixture is in the clamping state.

5. The headphone circuit board wire bonding fixture according to claim 2, characterized in that, It also includes a locking element, wherein the cover plate is pivotally connected to the carrier platform, the cover plate is rotatable relative to the carrier platform to press the circuit board onto the carrier platform or to release the circuit board, and the locking element is configured to lock the relative position between the cover plate and the carrier platform when the cover plate presses the circuit board onto the carrier platform.

6. The headphone circuit board wire bonding fixture according to claim 5, characterized in that, The cover plate is provided with a pressing part, which protrudes from the side of the cover plate facing the carrier plate. The pressing part is configured to press the circuit board onto the carrier plate when the headphone circuit board bonding jig is in the clamping state. The pressing portion separates the cover plate from the circuit board and forms a bonding space, and / or the pressing portion is made of a flexible material.

7. The headphone circuit board wire bonding fixture according to claim 1, characterized in that, The carrier platform is provided with a positioning pin, which protrudes from the side of the carrier platform facing the circuit board. The positioning pin can be fitted with the positioning hole on the circuit board so that the carrier platform can position and place the circuit board. And / or, the carrier platform is provided with a positioning groove, the positioning groove is for the circuit board to be placed in, and the groove wall of the positioning groove is used to position the circuit board circumferentially.

8. The headphone circuit board wire bonding fixture according to claim 1, characterized in that, The carrier platform is located above the positioning member, and the rotating seat is located below the positioning member. The rotating seat is used to support the earphone shell. The positioning member includes a retaining block, which protrudes from the rotating seat on the side facing the carrier platform and together with the rotating seat forms a contour groove. The contour groove has an upward-facing opening. The contour groove is used to accommodate the earphone shell and position the periphery of the earphone shell. The contour groove has a notch in the horizontal direction for the earphone shell to be placed into the contour groove.

9. The headphone circuit board wire bonding fixture according to claim 1, characterized in that, It also includes a rotating shaft and a bearing. The rotating seat and the base are selected to mount the rotating shaft on one and the bearing on the other. The axis of the rotating shaft extends in the vertical direction. The rotating shaft is inserted into the bearing so that the rotating seat can rotate around the axis of the rotating shaft.

10. The headphone circuit board wire bonding fixture according to claim 9, characterized in that, The rotating seat is provided with a stop portion, and the base is provided with a limiting portion. When the rotating seat rotates around the axis of the rotating shaft, the limiting portion can stop the stop portion to limit the rotation angle range of the rotating seat.

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