Power bus for suppressing electromagnetic interference

Abstract

A power bus for suppressing electromagnetic interference includes a power bus body, an electromagnetic interference suppression composite layer, and a plurality of grounding members. The power bus body is electrically connected to at least one power supply and at least one power module. The electromagnetic interference suppression composite layer has a plurality of grounding channels and includes a substrate layer, two insulating layers, and a conductive layer. The substrate layer is fixed to the power bus body. The insulating layer is fixed to the substrate layer away from the power bus body. The conductive layer is disposed between the insulating layers. The grounding members are respectively disposed in the grounding channels and in contact with the conductive layer. The grounding members are electrically connected to at least one grounding terminal. When the power bus body conducts power, the conductive layer generates an induced current from interference noise, which is grounded through the grounding members, thereby suppressing electromagnetic interference.

Description

Technical Field

[0001] This utility model relates to a power bus, and more particularly to a power bus that suppresses electromagnetic interference. Background Technology

[0002] Electromagnetic interference (EMI) refers to the noise interference caused by electromagnetic energy to electronic devices, which can negatively affect the operation of these devices. Mild cases may result in signal distortion and reduced performance, while severe cases may cause system crashes or even permanent damage.

[0003] To ensure the stable operation of power modules in electronic devices to perform various functions, the power supply must provide a stable power through an efficient conduction path. In previous technologies, considering the advantages of high current carrying capacity, good heat dissipation, and high mechanical strength, most used a busbar as the medium for current conduction.

[0004] However, electromagnetic radiation is often generated during the conduction of power on a bus. This electromagnetic radiation can propagate through space and, if not properly suppressed, may cause electromagnetic interference to electronic devices. Utility Model Content

[0005] In view of the fact that in the prior art, the electromagnetic radiation generated during power conduction on the bus can cause electromagnetic interference to electronic devices, thereby affecting their normal operation, the main objective of this invention is to provide a power bus that suppresses electromagnetic interference. By inserting a grounding component through the grounding channel of the electromagnetic interference suppression composite layer and making contact with the conductive layer, the induced current generated in the conductive layer during power conduction on the power bus body is conducted to the ground terminal, thereby effectively suppressing the electromagnetic interference caused to the electronic device.

[0006] Accordingly, the necessary technical means adopted by this utility model to solve the problems of the prior art is to provide a power bus for suppressing electromagnetic interference, which is disposed in an electronic device and includes a power bus body, an electromagnetic interference suppression composite layer, and multiple grounding components. The power bus body is electrically connected to at least one power supply and at least one power module of the electronic device, thereby conducting the power generated by the power supply to the power module.

[0007] The electromagnetic interference suppression composite layer has multiple grounding channels and includes a substrate layer, two insulating layers, and a conductive layer. The grounding channels penetrate the substrate layer, the insulating layers, and the conductive layer. The substrate layer is fixed to the power bus body. The insulating layers are fixed to the side of the substrate layer away from the power bus body. The conductive layers are disposed between the insulating layers. Grounding elements are respectively inserted through the grounding channels, contacting the conductive layers and electrically connected to at least one grounding terminal.

[0008] When power is conducted through the power bus body, an induced current is generated in the conductive layer. The induced current is conducted to the ground terminal through the grounding component to ground the device, thereby suppressing electromagnetic interference to electronic devices.

[0009] Based on the aforementioned necessary technical means, the following auxiliary technical means can be derived. Preferably, a plurality of first through-holes are formed in the substrate layer, a plurality of second through-holes are formed in each of the insulating layers, and a plurality of third through-holes are formed in the conductive layer, wherein the first through-holes, second through-holes, and third through-holes are aligned with each other to form a grounding channel. More preferably, the diameter of the second through-holes in the insulating layer farther from the substrate layer is larger than the diameter of the third through-holes.

[0010] Based on the aforementioned necessary technical means, the following auxiliary technical means can be derived. Preferably, the power bus body includes two bus insulating layers and a routing layer. The bus insulating layers are covered and fixed by the substrate layer. The routing layer includes an insulating frame, at least one routing trace, at least one power supply contact, and at least one output contact. The insulating frame is disposed between the bus insulating layers. The routing trace is fitted and fixed to the insulating frame. The power supply contact extends from the routing trace and is electrically connected to the power supply. The output contact extends from the routing trace relative to the power supply contact and is electrically connected to the power module. The power generated by the power supply is sequentially conducted to the power module through the power supply contact, the routing trace, and the output contact.

[0011] Preferably, the power bus body has multiple extension channels. The extension channels avoid each other and pass through the bus insulation layer and the trace layer, and are respectively connected to the grounding channel for the grounding component to pass through.

[0012] Even better, each of the bus insulation layers has multiple fourth through holes, and the insulation frame has multiple fifth through holes, with the fourth and fifth through holes aligned with each other to form an extended channel.

[0013] Based on the aforementioned necessary technical means, the following auxiliary technical means can be derived. Preferably, the power bus body is a copper busbar; the substrate layer is an FR4 substrate layer; the insulating layer is two PET insulating layers; and the conductive layer is a copper foil conductive layer.

[0014] In summary, the power bus for suppressing electromagnetic interference provided by this utility model, by passing a grounding component through the grounding channel of the electromagnetic interference suppression composite layer and making contact with the conductive layer, can conduct the induced current generated by the conductive layer to the grounding terminal when the power bus body conducts power, thereby effectively suppressing the electromagnetic interference caused to the electronic device.

[0015] The specific embodiments adopted in this utility model will be further explained through the following embodiments and drawings. Attached Figure Description

[0016] Figure 1 A three-dimensional schematic diagram showing a preferred embodiment of the power bus for suppressing electromagnetic interference of the present invention;

[0017] Figure 2 This is a three-dimensional exploded view of a power bus for suppressing electromagnetic interference according to a preferred embodiment of the present invention.

[0018] Figure 3 This diagram shows an exploded perspective view of the power bus body of a preferred embodiment of the present invention.

[0019] Figure 4 show Figure 1 A three-dimensional sectional view of section AA along the middle; and

[0020] Figure 5 A perspective view showing a preferred embodiment of the present invention, illustrating a power bus for suppressing electromagnetic interference disposed in an electronic device and electrically connected to a power supply and a power module.

[0021] The attached diagram is described as follows:

[0022] 100: Power Bus

[0023] 200: Electronic devices

[0024] 201a, 201b, 201c: Power Modules

[0025] 202: Grounded metal casing

[0026] 300: Power supply

[0027] 1: Power bus body

[0028] 11a, 11b: Bus insulation layer

[0029] 12: Wiring Layer

[0030] 121: Insulating frame

[0031] 122: Wiring

[0032] 123: Power supply contact

[0033] 124: Output Contact

[0034] 2: Electromagnetic Interference Suppression Composite Layer

[0035] 21: Substrate layer

[0036] 22a, 22b: Insulation layer

[0037] 23: Conductive layer

[0038] 3: Screws

[0039] 31: Screw head

[0040] 32: Stud

[0041] 4a, 4b: Copper busbar terminals

[0042] GC: Grounding Channel

[0043] EC: Extended Channel

[0044] H1: First perforation

[0045] H2a, H2b: Second perforation

[0046] H3: Third perforation

[0047] H4a, H4b: Fourth perforation

[0048] H5: Fifth perforation Detailed Implementation

[0049] Since the power bus for suppressing electromagnetic interference provided by this utility model can be widely used in various electronic devices, it will not be described in detail here. Only one preferred embodiment is listed for specific explanation. This embodiment is only used to help explain the purpose and effect of the embodiment of this utility model in a convenient and clear way.

[0050] Please see Figures 1 to 4 , Figure 1 A three-dimensional schematic diagram showing a preferred embodiment of the power bus for suppressing electromagnetic interference of the present invention; Figure 2 This is a three-dimensional exploded view of a power bus for suppressing electromagnetic interference according to a preferred embodiment of the present invention. Figure 3 This invention displays an exploded perspective view of the power bus body according to a preferred embodiment of the present invention; and Figure 4 show Figure 1 A three-dimensional cross-sectional view of section AA along the middle.

[0051] like Figures 1 to 4 As shown, a power bus (hereinafter referred to as "power bus") 100 for suppressing electromagnetic interference includes a power bus body 1, an electromagnetic interference suppression composite layer 2, and multiple grounding components.

[0052] The power bus body 1 has multiple extension channels EC (only one is shown), and includes two bus insulation layers 11a and 11b and a wiring layer 12. The wiring layer 12 includes an insulating frame 121, multiple traces 122 (only one is shown), multiple power supply contacts 123 (only one is shown), and multiple output contacts 124 (only one is shown). In practice, the power supply of each phase line must be connected to the power supply contacts according to the three-phase four-wire mains power supply.

[0053] Structurally, the insulating frame 121 is positioned between the bus insulating layers 11a and 11b. The trace 122 is fitted and fixed to the insulating frame 121, avoiding overlap with the extension channel EC. The power supply contact 123 extends from the trace 122, and the output contact 124 extends from the trace 122 relative to the power supply contact 123. Regarding the fixing method, the bus insulating layers 11a and 11b can be glued to both sides of the insulating frame 121, but this is not a limitation. In terms of material selection, the power bus body 1 can be, for example, a copper busbar, but this is not a limitation. The advantage of using a copper busbar is its high current carrying capacity, excellent heat dissipation, and high mechanical strength. In practice, as long as power conduction is possible, the power bus can be made of any material.

[0054] The electromagnetic interference suppression composite layer 2 has multiple grounding channels GC (only one is shown) connected to the extension channel EC, and includes a substrate layer 21, two insulating layers 22a and 22b, and a conductive layer 23. Structurally, the substrate layer 21 covers and is fixed to the power bus body 1 (bus insulating layer 11a), the insulating layers 22a and 22b cover and are fixed to the side of the substrate layer 21 away from the power bus body 1, and the conductive layer 23 is disposed between the insulating layers 22a and 22b. In terms of fixing methods, the substrate layer 21, the insulating layers 22a and 22b, and the conductive layer 23 can be bonded together by adhesive, but this is not a limitation.

[0055] In terms of material selection, substrate layer 21 can be, for example, an FR4 substrate layer to provide overall structural strength; insulating layers 22a and 22b can be, for example, two PET insulating layers; and conductive layer 23 can be, for example, a copper foil conductive layer. It should be noted that the above material selection is not restrictive. In practice, as long as the functional requirements (high structural strength, high insulation or conductivity) are met, substrate layer 21, insulating layers 22a and 22b, or conductive layer 23 can be selected from any material.

[0056] After passing through the grounding channel GC and the extension channel EC respectively, the grounding element makes electrical contact with the conductive layer 23 and is electrically connected to at least one grounding terminal. In practice, the grounding element can be connected to the same grounding terminal or multiple different grounding terminals, depending on actual needs. In this embodiment, the grounding channel GC and the extension channel EC both pass through the power bus 100, allowing the grounding element to pass through either side of the power bus 100, but this is not a limitation. In other embodiments, the extension channel EC can be removed, and grounding can be achieved through the grounding element that passes only through the grounding channel GC.

[0057] To form a grounding channel GC, the substrate layer 21 has multiple first through holes H1 (only one is shown), the insulating layers 22a and 22b each have multiple second through holes H2a and H2b (only one is shown), and the conductive layer 23 has multiple third through holes H3 (only one is shown). The first through holes H1, second through holes H2a and H2b and the third through holes H3 are aligned with each other to form a grounding channel GC that penetrates the substrate layer 21, the insulating layers 22a and 22b and the conductive layer 23.

[0058] In order to form the extended channel EC, the bus insulation layers 11a and 11b each have multiple fourth through holes H4a and H4b (each marked as one), and the insulation frame 121 has multiple fifth through holes H5 (only one marked), and the fourth through holes H4a and H4b and the fifth through holes H5 are aligned with each other to form an extended channel EC that penetrates the bus insulation layers 11a and 11b and the insulation frame 121.

[0059] In this embodiment, the grounding element is a plurality of screws 3 (only one is shown), but it is not limited thereto. In other embodiments, it can be, for example, any conductive post (e.g., a metal post) that can be inserted into the grounding channel GC. Structurally, the screw 3 includes a screw head 31 and a stud 32 extending from the screw head 31.

[0060] In order to ensure that the screw 3 can fully contact the conductive layer 23 when it passes through the grounding channel GC, the diameter of the second through hole (i.e., the second through hole H2a) of the insulating layer (i.e., the insulating layer 22a) away from the substrate layer 21 is larger than the diameter of the third through hole H3, so that the side of the screw head 31 extending out of the stud 32 can fully contact the conductive layer 23.

[0061] In addition to the power bus body 1, the electromagnetic interference suppression composite layer 2, and the screws 3, the power bus 100 in this embodiment also includes two sets of copper bus terminals 4a and 4b (located adjacent to the power supply contact 123 and the output contact 124, respectively), but is not limited thereto. Functionally, the copper bus terminals can be used to extend the wiring.

[0062] Please see Figure 5 , Figure 5 A perspective view showing a preferred embodiment of the present invention, illustrating a power bus for suppressing electromagnetic interference disposed in an electronic device and electrically connected to a power supply and a power module.

[0063] like Figure 5As shown, a power bus 100 is disposed in an electronic device 200, and the power bus body 1 is electrically connected to a power supply 300 and multiple power modules 201a, 201b, and 201c of the electronic device 200 via power supply contacts 123 and output contacts 124, respectively, so as to conduct the power generated by the power supply to the power modules 201a, 201b, and 201c in sequence via power supply contacts 123, wiring 122, and output contacts 124. In practice, the number of power modules can be selected according to the actual load requirements, and a power supply may contain only one power module.

[0064] In this embodiment, the grounding terminal is a grounded metal housing 202 of the electronic device 200, but it is not limited thereto. In other embodiments, any grounding method can be used. The grounded metal housing 202 is used to secure the power bus 100 by passing screws 3 sequentially through the grounding channel GC and the extension channel EC.

[0065] When the power bus body 1 conducts power, the accompanying electromagnetic radiation will induce an induced current (not shown) in the conductive layer 23. The induced current can be conducted to the grounding terminal (i.e., the grounded metal casing 202) through the grounding component (i.e., screw 3) to ground, thereby suppressing electromagnetic interference to the electronic device 200.

[0066] EMI conducted emission testing (test conditions: 650 volts / 44 amps) verified that the electronic device 200, which conducts power via the power bus 100, exhibits a low noise level (especially at low frequencies) and good suppression performance. Furthermore, compared to using a single-point grounding, this design utilizes multi-point grounding (i.e., multiple grounding components) to effectively disperse noise interference and enhance resistance to electromagnetic interference.

[0067] In summary, the power bus 100 provided by this utility model, by passing a grounding component (screw 3) through the grounding channel GC and making contact with the conductive layer 23, can conduct the induced current generated by the conductive layer 23 to the grounding terminal (i.e., the grounded metal casing 202) when the power bus body 1 conducts power, thereby effectively suppressing electromagnetic interference to the electronic device 200.

[0068] The detailed description of the preferred embodiments above is intended to more clearly illustrate the features and spirit of this utility model, and is not intended to limit the scope of this utility model to the preferred embodiments disclosed above. Rather, the aim is to cover various modifications and equivalent arrangements within the scope of the patent claims to be made by this utility model.

Claims

1. A power bus for suppressing electromagnetic interference, configured in an electronic device, characterized in that, And includes: A power bus body is electrically connected to at least one power supply and at least one power module of the electronic device, thereby conducting the power generated by the power supply to the power module. An electromagnetic interference suppression composite layer is provided, with multiple grounding channels, and includes: A substrate layer is fixed to the power bus body; Two insulating layers cover and are fixed to the side of the substrate layer away from the power bus body; and A conductive layer is disposed between the two insulating layers; as well as Multiple grounding elements are respectively installed through the multiple grounding channels, contact each other with the conductive layer, and are electrically connected to at least one grounding terminal; The multiple grounding channels penetrate the substrate layer, the two insulating layers, and the conductive layer.

2. The power bus of claim 1, wherein, The substrate layer has multiple first through holes, the two insulating layers each have multiple second through holes, and the conductive layer has multiple third through holes. The multiple first through holes, the multiple second through holes, and the multiple third through holes are aligned with each other to form the multiple grounding channels.

3. The power bus of claim 2, wherein, The aperture of the plurality of second through holes in the insulating layer that is farther away from the substrate layer is larger than the aperture of the plurality of third through holes.

4. The power bus of claim 1, wherein, The power bus body includes: Two-wire insulating layers are provided for covering and fixing the substrate layer; and One routing layer, including: An insulating frame is disposed between the two bus insulation layers; At least one trace is fitted and fixed to the insulating frame; At least one power supply contact extends from the aforementioned trace and is electrically connected to the aforementioned power supply; and At least one output contact extends from the aforementioned trace relative to the aforementioned power supply contact and is electrically connected to the aforementioned power module.

5. The power bus for suppressing electromagnetic interference as described in claim 4, characterized in that, The power bus body has multiple extension channels. These multiple extension channels avoid each other with the aforementioned traces and pass through the two bus insulation layers and the trace layer. They are also connected to the multiple grounding channels for the multiple grounding components to pass through.

6. The power bus of claim 5, wherein the conductive layer is formed of a conductive material selected from the group consisting of copper, aluminum, and silver. The two bus insulation layers each have multiple fourth through holes, and the insulation frame has multiple fifth through holes. The multiple fourth through holes and the multiple fifth through holes are aligned with each other to form the multiple extended channels.

7. The power bus of claim 1, wherein the power bus is configured to suppress electromagnetic interference. The power bus itself is a copper busbar power bus.

8. The power bus of claim 1, wherein the power bus is configured to suppress electromagnetic interference. The substrate layer is an FR4 substrate layer.

9. The power bus of claim 1, wherein, The two insulating layers are two PET insulating layers.

10. The power bus of claim 1, wherein, The conductive layer is a copper foil conductive layer.

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