A high-precision positioning and adjusting device for special equipment of semiconductor devices

Abstract

The utility model discloses a kind of high-precision semiconductor device special equipment positioning adjusting device, it is related to semiconductor manufacturing and testing field, solve the problem of traditional device adsorption uneven, low positioning accuracy and angle adjustment deficiency.The device includes rack, positioning table, drive mechanism, sliding assembly and other units.Positioning table adopts honeycomb vacuum adsorption groove, adsorption through-hole diameter 0.2mm, cooperate diamond positioning column and silicon carbide wear-resistant ball head, realize submicron adsorption and positioning accuracy.Drive mechanism is composed of piezoelectric push rod, flexible hinge and grating displacement sensor, realize X, Y high-precision displacement control;Angle fine adjustment assembly is cooperated by eccentric adjusting cam, arc-shaped guide slide rail and silicon nitride ceramic steel ball, realize 0.001 ° level angle adjustment.Scheme integrates high-precision adsorption, displacement closed-loop control and angle fine adjustment, significantly improve the precision and reliability of semiconductor device processing and testing, prolong equipment service life.

Description

Technical Field

[0001] This utility model relates to the field of precision manufacturing equipment for semiconductor devices, and more specifically to a positioning and adjustment device for high-precision semiconductor device special equipment. Background Technology

[0002] Currently, positioning and adjustment devices are widely used in the semiconductor device manufacturing and testing field for precisely fixing and adjusting the position of semiconductor devices. However, existing technologies have many shortcomings. Most devices use an integral vacuum chuck with single-point evacuation, resulting in large and sparsely distributed adsorption pores, leading to uneven adsorption forces that cannot meet the stringent flatness requirements of high-end devices. Simultaneously, traditional positioning devices often employ a lead screw-stepper motor direct-drive slide structure, exhibiting significant backlash and frictional temperature rise issues, making it difficult to achieve sub-micron level positioning accuracy and repeatability. Furthermore, existing devices generally lack angle deviation compensation methods, failing to achieve high-precision angle fine-tuning, affecting the bonding accuracy and testing yield of semiconductor devices. While these devices can achieve basic positioning functions, their accuracy and stability are no longer sufficient to meet the ever-increasing process demands in high-end semiconductor manufacturing. The shortcomings of existing technologies are mainly reflected in poor adsorption stability, low positioning accuracy, insufficient angle adjustment accuracy, and poor overall stability. Utility Model Content

[0003] The purpose of this invention is to address the shortcomings of existing positioning and adjustment devices, such as poor adsorption stability, low positioning accuracy, insufficient angle adjustment precision, and poor overall stability. This invention achieves high-precision positioning and adjustment through the following innovative designs: A honeycomb vacuum adsorption tank combined with 0.2mm diameter micropores, diamond positioning columns, and silicon carbide wear-resistant ball heads solves the problems of uneven adsorption and low positioning accuracy, achieving sub-micron level adsorption and positioning; a drive mechanism composed of piezoelectric push rods, flexible hinges, and grating displacement sensors eliminates the backlash and frictional temperature rise of traditional lead screw structures, achieving high-precision displacement control; an eccentric adjustment cam, arc-shaped guide rail, and silicon nitride ceramic steel ball angle fine-tuning component fills the gap in angle deviation compensation in existing devices, achieving 0.001° level angle fine-tuning; furthermore, an annular air-bearing support ring and a composite shock-absorbing seat are introduced to improve overall stability. This invention significantly improves the accuracy and reliability of semiconductor device processing and testing, meeting the needs of high-end manufacturing.

[0004] To achieve the above-mentioned technical effects, the present invention adopts the following technical solution:

[0005] A high-precision semiconductor device positioning and adjustment device includes a frame, a positioning stage for placing semiconductor devices, and a drive mechanism for moving the positioning stage. The positioning stage is connected to the frame via a sliding assembly, and the drive mechanism is mounted on one side of the frame. The upper surface of the positioning stage is provided with a honeycomb-shaped vacuum adsorption groove, and the bottom of the groove has adsorption through holes with a diameter of 0.2 mm. The adsorption through holes connect to a gas collection chamber inside the stage, and the gas collection chamber is connected to a vacuum interface via a high-pressure resistant hose. Three diamond positioning posts are provided along the edge of the positioning stage, and silicon carbide wear-resistant ball heads are embedded at the top of the posts. The drive mechanism includes an X-axis adjustment assembly and a Y-axis adjustment assembly. The X-axis adjustment component and the Y-axis adjustment component are both composed of a piezoelectric push rod, a flexible hinge, and a grating displacement sensor. The output end of the piezoelectric push rod is connected to the positioning table through a universal joint, and the grating displacement sensor is set between the push rod and the hinge. The angle fine adjustment component is composed of two sets of symmetrical eccentric adjustment cams, an arc-shaped guide rail, and an elastic preload seat. The eccentric adjustment cam is driven by a precision fine adjustment handwheel, and the edge of the cam abuts against the tungsten steel wear-resistant block on the side of the positioning table. The arc-shaped guide rail is embedded with silicon nitride ceramic steel balls (96), and the ceramic steel balls cooperate with the arc-shaped groove at the bottom of the positioning table.

[0006] The flexible hinge is a straight-round hinge formed by wire cutting, with a hinge neck thickness of 0.4mm, a nickel-phosphorus alloy anti-corrosion coating on the surface, and a rotation angle error of ≤0.001°.

[0007] The sliding assembly includes a precision guide rail and a load-bearing slider. The precision guide rail is made of silicon nitride ceramic and the surface is ground to Ra0.01μm. The load-bearing slider is embedded with silicon nitride ceramic rollers with a diameter of 2mm and an adjacent spacing of 4mm.

[0008] The diamond positioning post is fixed to the positioning platform by an eccentric locking bolt. A laser calibration hole is provided on the side of the positioning post. The coaxiality between the axis of the calibration hole and the center of the silicon carbide wear-resistant ball head is ≤0.002mm.

[0009] The elastic preload seat is a disc spring assembly, with a memory alloy preload spring installed inside. The spring force is adjusted by adjusting the stud, with an adjustment range of 20-150N.

[0010] The bottom of the frame is equipped with four composite shock absorbers, which are composed of nitrile rubber pads and stainless steel coil springs. The nitrile rubber pads have a hardness of 70±5 Shore A, and the stainless steel coil springs have a stiffness coefficient of 50 N / mm.

[0011] The bottom of the positioning platform is provided with an annular air-bearing support ring, which is connected to a high-pressure air source through a copper air pipe. During operation, it forms an air film with a thickness of 3-5 μm. The edge of the air-bearing support ring is provided with a polytetrafluoroethylene anti-scratch ring.

[0012] The positive and beneficial technical effects of this utility model are as follows:

[0013] This invention solves the problem of uneven adsorption force caused by large and sparsely distributed adsorption pores in existing technologies by employing a honeycomb vacuum adsorption groove and micropore design, significantly improving adsorption stability and flatness. The drive mechanism, composed of a piezoelectric actuator, flexible hinge, and grating displacement sensor, eliminates the backlash and frictional temperature rise of traditional lead screw-stepper motor structures, achieving sub-micron level high-precision positioning and repeatability. The design of an eccentric adjusting cam and arc-shaped guide rail angle fine-tuning components fills the gap in angle deviation compensation in existing devices, achieving high-precision angle fine-tuning at the 0.001° level. Furthermore, the design of an annular air-bearing support ring and a composite shock-absorbing seat further enhances the overall stability of the device. These innovative designs enable this invention to meet the stringent requirements for positioning accuracy and stability in high-end semiconductor manufacturing, significantly improving the processing accuracy and testing yield of semiconductor devices. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort, wherein:

[0015] Figure 1 This is an overall structural diagram of a positioning and adjustment device for a high-precision semiconductor device.

[0016] Figure 2 This is a diagram of the adsorption structure of the positioning stage of a high-precision semiconductor device positioning and adjustment device.

[0017] Figure 3 This is a structural diagram of the drive mechanism of a positioning and adjustment device for a high-precision semiconductor device.

[0018] Figure 4 This is a structural diagram of an angle fine-tuning component of a positioning and adjustment device for high-precision semiconductor devices according to this utility model.

[0019] Figure 5 This is a structural diagram of an elastic preload seat for a positioning and adjustment device for high-precision semiconductor devices, according to this utility model.

[0020] Figure 6 This is a structural diagram of an annular air-floating support ring for a positioning and adjustment device for high-precision semiconductor devices, according to this utility model.

[0021] Figure 7This is a structural diagram of a sliding component of a positioning and adjustment device for a high-precision semiconductor device.

[0022] In the diagram: 1. Frame; 2. Positioning platform; 3. Drive mechanism; 4. Sliding assembly; 5. Vacuum adsorption tank; 6. Diamond positioning column; 7. X-axis adjustment assembly; 8. Y-axis adjustment assembly; 9. Angle fine-tuning assembly; 10. Composite shock absorber seat; 10. Nitrile rubber pad; 101. Helical spring; 102. Annular air flotation support ring; 11. Copper air pipe; 111. Scratch-resistant ring; 112. Precision guide rail; 41. Ceramic component; 411. Load-bearing slider; 42. Ceramic roller; 421. Adsorption through hole; 51. Air collection chamber; 52. High-pressure resistant hose; 53. Vacuum interface 54, wear-resistant ball head 61, eccentric locking bolt 62, laser calibration hole 63, piezoelectric push rod 71, flexible hinge 72, straight round hinge 721, alloy anti-corrosion layer 722, grating displacement sensor 73, universal joint 74, eccentric adjusting cam 91, arc-shaped guide slide rail 92, elastic preload seat 93, precision fine-tuning handwheel 94, tungsten steel wear-resistant block 95, ceramic steel ball 96, arc-shaped slide groove 97, disc spring assembly 931, preload spring 932, adjusting stud 933. Detailed Implementation

[0023] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.

[0024] like Figures 1-7As shown, the high-precision semiconductor device positioning and adjustment device of this utility model includes a frame 1, a positioning stage 2, and a drive mechanism 3. The positioning stage 2 is connected to the frame 1 via a sliding assembly 4, which includes a precision guide rail 41 and a load-bearing slider 42 to ensure smooth and precise movement of the positioning stage 2. The upper surface of the positioning stage 2 is provided with a honeycomb vacuum adsorption groove 5, and the bottom is distributed with adsorption through holes 51 with a diameter of 0.2 mm. These through holes are connected to the gas collection chamber 52 inside the stage and to the vacuum interface 54 through a high-pressure resistant hose 53 to achieve stable adsorption of semiconductor devices. The edge of the positioning stage 2 is equipped with three diamond positioning posts 6, and the top is embedded with a silicon carbide wear-resistant ball head 61 for precise positioning of semiconductor devices. The drive mechanism 3 is installed on one side of the frame 1 and includes an X-axis adjustment assembly 7, a Y-axis adjustment assembly 8, and an angle fine-tuning assembly 9. These assemblies are composed of a piezoelectric push rod 71, a flexible hinge 72, and a grating displacement sensor 73 to achieve precise control of the positioning stage 2. The angle fine-tuning component 9 consists of two sets of symmetrical eccentric adjusting cams 91, an arc-shaped guide rail 92, and an elastic preload seat 93. Driven by a precision fine-tuning handwheel 94, it achieves high-precision angle adjustment. Furthermore, the bottom of the frame 1 is equipped with four composite shock-absorbing seats 10, composed of nitrile rubber pads 101 and stainless steel coil springs 102, to reduce the impact of external vibrations on the device. The bottom of the positioning stage 2 also features an annular air-bearing support ring 11, connected to a high-pressure air source via a copper air pipe 111. During operation, this forms a 3-5 μm thick air film, further enhancing the stability and accuracy of the device. These designs collectively ensure the superior performance of this device in high-precision positioning and adjustment.

[0025] A high-precision semiconductor device positioning and adjustment device includes a frame 1, a positioning stage 2 for placing semiconductor devices, and a drive mechanism 3 for moving the positioning stage. The positioning stage 2 is connected to the frame 1 via a sliding assembly 4, and the drive mechanism 3 is mounted on one side of the frame 1. The upper surface of the positioning stage 2 is provided with a honeycomb-shaped vacuum adsorption groove 5, with adsorption through holes 51 of 0.2 mm diameter distributed at the bottom of the groove. The adsorption through holes 51 connect to a gas collection chamber 52 inside the stage, and the gas collection chamber 52 is connected to a vacuum interface 54 via a high-pressure resistant hose 53. Three diamond positioning posts 6 are provided on the edge of the positioning stage 2, with silicon carbide wear-resistant ball heads 61 embedded at the top of each post. The drive mechanism 3 includes an X-axis adjustment assembly 7, a Y-axis adjustment assembly 8, and... The angle fine-tuning component 9, the X-axis adjustment component 7, and the Y-axis adjustment component 8 are all composed of a piezoelectric push rod 71, a flexible hinge 72, and a grating displacement sensor 73. The output end of the piezoelectric push rod 71 is connected to the positioning table 2 through a universal joint 74. The grating displacement sensor 73 is set between the push rod and the hinge. The angle fine-tuning component 9 consists of two sets of symmetrical eccentric adjustment cams 91, an arc-shaped guide rail 92, and an elastic preload seat 93. The eccentric adjustment cam 91 is driven by a precision fine-tuning handwheel 94. The edge of the wheel abuts against the tungsten steel wear-resistant block 95 on the side of the positioning table 2. The arc-shaped guide rail 92 is embedded with silicon nitride ceramic steel balls 96. The ceramic steel balls 96 cooperate with the arc-shaped groove 97 at the bottom of the positioning table 2.

[0026] This technical solution addresses the shortcomings of traditional semiconductor device positioning and adjustment devices in terms of adsorption stability, positioning accuracy, angle adjustment accuracy, and overall stability through a series of innovative designs. First, the honeycomb vacuum adsorption groove 5 and the 0.2mm diameter adsorption through-hole 51 on the upper surface of the positioning stage 2, combined with the internal gas collection chamber 52 and high-pressure resistant hose 53, form a high-precision vacuum adsorption system. This design ensures uniform distribution of vacuum adsorption force, guaranteeing that the semiconductor device is firmly and flatly fixed on the positioning stage during processing or testing, solving the problem of uneven adsorption caused by the large aperture and sparse distribution of traditional suction cups. Second, the three diamond positioning posts 6 on the edge of the positioning stage 2, with silicon carbide wear-resistant ball heads 61 embedded at their tops, further improve positioning accuracy and wear resistance. This high-precision positioning post design ensures high accuracy and stability of the semiconductor device during repeated positioning, solving the problem of insufficient positioning accuracy in traditional mechanical fixtures. In the design of the drive mechanism 3, both the X-axis adjustment component 7 and the Y-axis adjustment component 8 employ a combination of piezoelectric push rods 71, flexible hinges 72, and grating displacement sensors 73. The piezoelectric actuator 71 provides high-precision displacement control, the flexible hinge 72 ensures the flexibility of angle adjustment, and the grating displacement sensor 73 monitors the displacement in real time, forming a closed-loop feedback control. This design achieves sub-micron level planar positioning accuracy, solving the problem of insufficient accuracy caused by backlash and frictional temperature rise in traditional lead screw-stepper motor structures. The angle fine-tuning component 9 consists of an eccentric adjusting cam 91, an arc-shaped guide rail 92, and an elastic preload seat 93, driven by a precision fine-tuning handwheel 94, achieving an angle fine-tuning accuracy of 0.001°. This design solves the problem of traditional devices lacking angle deviation compensation methods, ensuring high-precision angle adjustment of semiconductor devices during processing or testing. In addition, the sliding component 4 uses a precision guide rail 41 and a load-bearing slider 42, in conjunction with silicon nitride ceramic rollers 421, to achieve low-friction, high-precision movement. This design further improves the movement accuracy and stability of the positioning stage 2. In summary, this technical solution comprehensively addresses the shortcomings of traditional positioning and adjustment devices in terms of adsorption stability, positioning accuracy, angle adjustment accuracy, and overall stability through the synergistic effect of a high-precision vacuum adsorption system, a high-precision positioning column design, displacement adjustment via piezoelectric drive and closed-loop feedback control, high-precision angle fine-tuning, and low-friction sliding components. This significantly improves the accuracy and reliability of semiconductor device processing and testing.

[0027] In the above specific embodiments, the high-precision semiconductor device positioning and adjustment device of this utility model is essentially achieved through a precise mechanical structure and advanced driving technology to realize high-precision positioning and adjustment of semiconductor devices. The core of the device lies in the coordinated work of the positioning stage, the driving mechanism, and the sliding components. The honeycomb vacuum adsorption groove on the upper surface of the positioning stage is connected to the gas collection chamber inside the stage through adsorption through holes with a diameter of 0.2mm. The gas collection chamber is then connected to a vacuum interface through a high-pressure resistant hose, forming a stable vacuum adsorption system that can firmly adsorb semiconductor devices, ensuring that they do not shift during processing or testing. Three diamond positioning posts at the edge are fitted with silicon carbide wear-resistant ball heads at their tips, further improving positioning accuracy and wear resistance. The driving mechanism consists of an X-axis adjustment component, a Y-axis adjustment component, and an angle fine-tuning component. Both the X-axis and Y-axis adjustment components use piezoelectric actuators as power sources, achieving high-precision displacement control through flexible hinges. A grating displacement sensor monitors the displacement in real time, forming a closed-loop feedback to ensure positioning accuracy. The output end of the piezoelectric actuator is connected to the positioning stage through a universal joint, enabling flexible adjustment with multiple degrees of freedom. The angle fine-tuning assembly consists of two sets of symmetrical eccentric adjusting cams, an arc-shaped guide rail, and an elastic preload seat. The eccentric adjusting cams are driven by a precision fine-tuning handwheel, with the wheel edge abutting against a tungsten steel wear-resistant block on the side of the positioning stage to achieve fine-tuning of the angle. The arc-shaped guide rail embeds silicon nitride ceramic steel balls, which cooperate with the arc-shaped groove on the bottom of the positioning stage to ensure the smoothness and accuracy of angle adjustment. The sliding assembly provides stable support for the movement of the positioning stage, ensuring that it maintains high-precision flatness and straightness during adjustment. Through these precise structural designs and working principles, the entire device achieves high-precision positioning and multi-degree-of-freedom adjustment of semiconductor devices, meeting the stringent positioning accuracy requirements of high-end semiconductor manufacturing and testing equipment.

[0028] The flexible hinge 72 is an integral wire-cut straight round hinge 721 with a hinge neck thickness of 0.4mm and a nickel-phosphorus alloy anti-corrosion layer 722 on the surface, and the corner error is ≤0.001°.

[0029] In the above specific embodiments, the flexible hinge is one of the key components in this device for achieving high-precision angle adjustment and displacement control. Its technical essence lies in the use of an integrated wire-cut forming process to manufacture a straight-round hinge, ensuring the hinge's geometric accuracy and structural consistency. The hinge neck thickness is only 0.4mm; this ultra-thin design allows the flexible hinge to achieve minimal angular change under external force, thus achieving high-precision angle adjustment. The nickel-phosphorus alloy anti-corrosion layer on the surface not only enhances the wear resistance and corrosion resistance of the flexible hinge but also improves its service life in complex environments. This anti-corrosion layer effectively prevents performance degradation caused by friction and chemical corrosion during long-term use, ensuring the long-term stable operation of the device. During operation, the flexible hinge connects the piezoelectric actuator and the positioning stage. When the piezoelectric actuator applies force, the flexible hinge undergoes a slight elastic deformation, thereby driving the positioning stage to achieve precise displacement or angle adjustment. Since the hinge's angular error is controlled within the range of ≤0.001°, the entire device can achieve sub-micron level positioning and angle adjustment accuracy. This high-precision adjustment capability is crucial for the precision machining and testing of semiconductor devices, and can significantly improve production efficiency and product quality.

[0030] The sliding component 4 includes a precision guide rail 41 and a load-bearing slider 42. The precision guide rail 41 is made of silicon nitride ceramic 411 and the surface is ground to Ra0.01μm. The load-bearing slider 42 is embedded with silicon nitride ceramic rollers 421 with a diameter of 2mm and an adjacent spacing of 4mm.

[0031] In the above specific embodiments, the sliding assembly is the core component of this device that enables the stable and high-precision movement of the positioning stage. Its technical essence lies in ensuring precise movement and high stability of the positioning stage in the X and Y directions through high-precision mechanical design and material selection. The precision guide rail is made of silicon nitride ceramic, a material with high hardness, low coefficient of friction, and good wear resistance, which significantly reduces wear during long-term use, thereby extending the service life of the device. The guide rail surface undergoes high-precision grinding, achieving a surface roughness of Ra0.01μm. This ultra-smooth surface effectively reduces friction, improves movement accuracy, and reduces vibration and noise caused by surface unevenness, ensuring the stability of the positioning stage during movement. Silicon nitride ceramic rollers are embedded within the load-bearing slider, with a roller diameter of 2mm and an adjacent spacing of 4mm. This design utilizes the principle that rolling friction is much less than sliding friction; the movement of the positioning stage is achieved by the rolling of the rollers on the guide rail, further reducing friction and improving the flexibility and accuracy of movement. The uniform distribution and precise spacing of the rollers ensure smooth movement of the slider on the guide rail, avoiding wobbling or jamming caused by uneven local force. During operation, the positioning stage is connected to the frame via a sliding assembly. When the drive mechanism applies force, the positioning stage moves along the precision guide rail, and the silicon nitride ceramic rollers roll on the guide rail, achieving high-precision displacement. Due to the high-precision design of the guide rail and rollers, the positioning stage maintains extremely high straightness and flatness during movement, thereby ensuring the precise positioning of semiconductor devices during processing or testing. This high-precision, low-friction sliding assembly design provides reliable mechanical support for the high-precision processing and testing of semiconductor devices.

[0032] The diamond positioning post 6 is fixed to the positioning platform 2 by an eccentric locking bolt 62. A laser calibration hole 63 is provided on the side of the positioning post. The coaxiality between the axis of the calibration hole and the center of the silicon carbide wear-resistant ball head 61 is ≤0.002mm.

[0033] In the above specific embodiment, the diamond positioning post is a key component for high-precision positioning in this device. Its technical essence lies in ensuring the stability and positioning accuracy of the positioning post through high-precision machining and material selection. The diamond positioning post is fixed to the positioning table by an eccentric locking bolt. This eccentric locking design enables rapid and stable fixing while allowing for fine adjustments during installation to ensure the precise position of the positioning post. The eccentric locking bolt design ensures that the positioning post is firmly fixed to the positioning table after installation, preventing displacement due to vibration or external forces during processing or testing. A laser calibration hole is provided on the side of the positioning post, and its axis is coaxial with the center of the silicon carbide wear-resistant ball head within a range of ≤0.002mm. This high-precision coaxial design is achieved through precision machining and assembly, ensuring that the positioning post provides extremely high positioning accuracy during operation. The laser calibration hole allows for rapid and accurate calibration using laser measuring equipment, further improving the installation accuracy and reliability of the positioning post. During operation, the diamond positioning post and the silicon carbide wear-resistant ball head cooperate to form a high-precision positioning system. Silicon carbide wear-resistant ball joints not only possess high wear resistance but also provide excellent contact performance when in contact with semiconductor devices, reducing wear and scratches. The high hardness and stability of diamond positioning posts ensure reliable positioning, maintaining high precision even after prolonged use. Through this design, diamond positioning posts can provide sub-micron level positioning accuracy for semiconductor devices, ensuring their precise placement during processing or testing. This high-precision positioning system is crucial for high-end semiconductor manufacturing and testing equipment, significantly improving production efficiency and product quality.

[0034] The elastic preload seat 93 is a disc spring assembly 931, and the elastic seat contains a memory alloy preload spring 932. The spring force is adjusted by adjusting the adjusting stud 933, with an adjustment range of 20-150N.

[0035] In the above specific embodiments, the elastic preload seat is a key component in this device for providing stable support and elastic preload for the angle fine-tuning assembly. Its technical essence lies in the combination of a disc spring assembly and a shape memory alloy preload spring to achieve high-precision, high-stability elastic preload adjustment. The disc spring assembly is a spring structure with high stiffness and good elastic recovery capability, providing stable support force. Its design allows for rapid response and restoration to its original shape under external force, ensuring the stability of the device. The shape memory alloy preload spring further enhances the adjustability of the elastic preload seat. Shape memory alloys have a unique shape memory effect, capable of recovering to a preset shape at a specific temperature, thereby providing stable preload force. The use of this material not only improves the adaptability and reliability of the elastic preload seat but also ensures high-precision preload force under different working conditions. The spring force is adjusted via an adjusting stud, with an adjustment range of 20-150N. This design allows users to flexibly adjust the preload force according to actual needs and working conditions. The use of the adjusting stud makes the adjustment process simple and quick, and enables precise force control. By rotating the adjusting stud, the compression degree of the disc spring assembly and the shape memory alloy preload spring can be changed, thereby adjusting the preload force. During operation, the elastic preload seat provides stable support and elastic preload force for the angle fine-tuning component. When the eccentric adjusting cam is driven by the precision fine-tuning handwheel, the elastic preload seat ensures a stable contact force between the cam and the tungsten carbide wear-resistant block on the side of the positioning stage, thus achieving high-precision angle fine-tuning. This design not only improves the accuracy and stability of angle adjustment but also extends the service life of the device and reduces errors caused by friction and wear. Through this high-precision, high-stability elastic preload seat design, this device can achieve sub-micron level angle fine-tuning accuracy, meeting the stringent positioning accuracy requirements of high-end semiconductor manufacturing and testing equipment.

[0036] The bottom of the frame 1 is equipped with four composite shock absorbers 10. The shock absorbers are composed of nitrile rubber pads 101 and stainless steel coil springs 102. The hardness of the nitrile rubber pads 101 is 70±5 Shore A, and the stiffness coefficient of the stainless steel coil springs 102 is 50 N / mm.

[0037] In the above specific embodiment, the composite vibration damping seat is a key component in this device used to reduce the impact of external vibrations on the high-precision positioning and adjustment device. Its technical essence lies in achieving a multi-level vibration damping effect through the combination of nitrile rubber pads and stainless steel coil springs, ensuring the stability of the device in complex environments. The nitrile rubber pad has good elasticity and wear resistance, with a hardness of 70±5 Shore A, effectively absorbing high-frequency vibrations and impacts. This hardness provides sufficient support while maintaining good flexibility, ensuring the vibration damping effect. Nitrile rubber has strong chemical stability, adapting to different working environments, including humidity changes and chemical corrosion. The stainless steel coil spring provides additional vibration damping and support functions. Its stiffness coefficient is 50 N / mm, maintaining stable support force under large loads while absorbing low-frequency vibrations. The elastic characteristics of the spring allow it to respond quickly and return to its original shape when subjected to external forces, further enhancing the dynamic stability of the vibration damping seat. During operation, the four composite vibration damping seats at the bottom of the frame effectively isolate vibrations from the ground or work platform through the synergistic effect of the nitrile rubber pads and stainless steel coil springs. When external vibrations are transmitted to the damping seat, the nitrile rubber pads first absorb high-frequency vibrations, while the stainless steel coil springs further buffer low-frequency vibrations, ensuring the frame remains stable during operation. This multi-level damping design not only improves the stability of the device but also extends its service life, reducing mechanical fatigue and accuracy degradation caused by vibration. Through this composite damping seat design, the device can maintain high-precision positioning and adjustment capabilities in complex working environments, meeting the stringent stability requirements of high-end semiconductor manufacturing and testing equipment.

[0038] The bottom of the positioning platform 2 is provided with an annular air-bearing support ring 11. The air-bearing support ring is connected to a high-pressure air source through a copper air pipe 111. When working, it forms an air film with a thickness of 3-5μm. The edge of the air-bearing support ring is provided with a polytetrafluoroethylene anti-scratch ring 112.

[0039] In the above specific embodiment, the annular air-bearing support ring is a key component in this device for achieving high-precision, low-friction support. Its technical essence lies in achieving non-contact support of the positioning stage through air-bearing technology, thereby significantly reducing friction and improving positioning accuracy and stability. The air-bearing support ring is installed at the bottom of the positioning stage and connected to a high-pressure gas source via a copper air pipe. When the device is operating, high-pressure gas enters the air-bearing support ring through the air pipe and is evenly sprayed from the surface of the ring, forming an air film with a thickness of 3-5 μm. This air film forms a tiny air cushion between the positioning stage and the support surface, allowing the positioning stage to move with almost no friction. This air-bearing technology not only greatly reduces wear caused by mechanical contact but also improves the moving accuracy and stability of the positioning stage. The edge of the air-bearing support ring is equipped with a polytetrafluoroethylene (PTFE) anti-scratch ring. PTFE is a material with excellent wear resistance and a low coefficient of friction, effectively preventing the air-bearing support ring from scratching with surrounding components during movement, thus protecting the surface of the air-bearing support ring from damage. This design not only extends the service life of the air-bearing support ring but also ensures the stability and uniformity of the air film. During operation, the air-bearing support ring forms a stable air film using gas supplied by a high-pressure gas source, enabling the positioning stage to move with high precision without contact. This non-contact support method significantly reduces errors and vibrations caused by mechanical friction, improving the positioning accuracy and repeatability of the positioning stage. Simultaneously, the presence of a PTFE scratch-resistant ring further enhances the reliability and durability of the device. Through this air-bearing support ring design, this device achieves extremely low friction and high stability during high-precision positioning and adjustment, meeting the stringent requirements of high-end semiconductor manufacturing and testing equipment for positioning accuracy and reliability.

[0040] While specific embodiments of this utility model have been described above, those skilled in the art should understand that these specific embodiments are merely illustrative. Those skilled in the art can omit, substitute, and modify the details of the above methods and systems in various ways without departing from the principles and essence of this utility model. For example, combining the above method steps to perform substantially the same function and achieve substantially the same result according to substantially the same method falls within the scope of this utility model. Therefore, the scope of this utility model is defined only by the appended claims.

Claims

1. A high-precision semiconductor device dedicated equipment positioning adjustment device, characterized by: The device includes a frame (1), a positioning stage (2) for placing semiconductor devices, and a drive mechanism (3) for moving the positioning stage. The positioning stage (2) is connected to the frame (1) via a sliding assembly (4), and the drive mechanism (3) is mounted on one side of the frame (1). Its features include: The upper surface of the positioning platform (2) is provided with a honeycomb vacuum adsorption groove (5), and the bottom of the adsorption groove is distributed with adsorption through holes (51) with a diameter of 0.2 mm. The adsorption through holes (51) are connected to the gas collection chamber (52) inside the platform. The gas collection chamber (52) is connected to the vacuum interface (54) through a high-pressure resistant hose (53). The edge of the positioning platform (2) is provided with three diamond positioning posts (6), and the top of the positioning posts is fitted with silicon carbide wear-resistant ball heads (61). The drive mechanism (3) includes an X-axis adjustment component (7), a Y-axis adjustment component (8), and an angle fine-tuning component (9). The X-axis adjustment component (7) and the Y-axis adjustment component (8) are both composed of a piezoelectric push rod (71), a flexible hinge (72), and a grating displacement sensor (73). The output end of the piezoelectric push rod (71) is connected to the positioning stage (2) through a universal joint (74). The grating displacement sensor (73) is located between the push rod and the hinge. The angle fine-tuning component (9) consists of two sets of symmetrical eccentric adjustment cams (91), arc-shaped guide slide rails (92) and elastic preload seats (93). The eccentric adjustment cams (91) are driven by a precision fine-tuning handwheel (94). The edge of the wheel abuts against the tungsten steel wear-resistant block (95) on the side of the positioning table (2). The arc-shaped guide slide rails (92) are embedded with silicon nitride ceramic steel balls (96). The ceramic steel balls (96) cooperate with the arc-shaped slide groove (97) at the bottom of the positioning table (2).

2. The apparatus of claim 1, wherein: The flexible hinge (72) is an integral wire-cut straight round hinge (721), with a hinge neck thickness of 0.4mm and a nickel-phosphorus alloy anti-corrosion layer (722) plated on the surface, and an angle error ≤0.001°.

3. The apparatus of claim 1, wherein: The sliding assembly (4) includes a precision guide rail (41) and a load-bearing slider (42). The precision guide rail (41) is made of silicon nitride ceramic (411) and the surface is ground to Ra0.01μm. The load-bearing slider (42) is embedded with silicon nitride ceramic rollers (421) with a diameter of 2mm and an adjacent spacing of 4mm.

4. The apparatus of claim 1, wherein: The diamond positioning post (6) is fixed to the positioning platform (2) by an eccentric locking bolt (62). A laser calibration hole (63) is provided on the side of the positioning post. The coaxiality between the axis of the calibration hole and the center of the silicon carbide wear-resistant ball head (61) is ≤0.002mm.

5. The apparatus of claim 1, wherein: The elastic preload seat (93) is a disc spring assembly (931), and the elastic seat is equipped with a memory alloy preload spring (932). The spring force is adjusted by adjusting the stud (933), and the adjustment range is 20-150N.

6. The apparatus of claim 1, wherein: The frame (1) is provided with four composite shock absorber seats (10) at the bottom. The shock absorber seats are composed of nitrile rubber pads (101) and stainless steel helical springs (102). The hardness of the nitrile rubber pads (101) is 70±5 Shore A, and the stiffness coefficient of the stainless steel helical springs (102) is 50 N / mm.

7. The apparatus of claim 1, wherein: The bottom of the positioning platform (2) is provided with an annular air-floating support ring (11). The air-floating support ring is connected to a high-pressure air source through a copper air pipe (111). When working, it forms an air film with a thickness of 3-5μm. The edge of the air-floating support ring is provided with a polytetrafluoroethylene anti-scratch ring (112).

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