A chip test socket
Patent Information
- Application Number
- CN202522133072.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-09
- Publication Date
- 2026-09-22
- Estimated Expiration
- 2035-10-09
AI Technical Summary
[0003]现有的测试座在拆卸时往往需要手动将托盘与底座分离,而在将托盘与底座分离过程中极易因为抓取力度和方向的不当,导致托盘与探针相碰,使得探针损坏
[0017](1)测试后托盘自动弹升,避免了探针与芯片/托盘的接触和剐蹭;
Smart Images

Figure CN224788801U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of electronic product testing technology, and in particular to a chip test socket. Background Technology
[0002] As electronic circuits become increasingly integrated, multiple functional circuits are integrated and packaged into a single chip module, such as SiP (System-in-Package) and SOC (System-on-Chip) technologies, to save space and simplify circuit design. These chips typically have small gold fingers or solder pads. To accurately test various parameters of SiP / SOC packaged chips, high-precision pogo pin modules are used to create specialized test sockets for continuity testing.
[0003] Existing test fixtures often require manual separation of the tray from the base during disassembly. However, improper gripping force and direction can easily cause the tray to collide with the probe, resulting in probe damage. Utility Model Content
[0004] To achieve the above objectives, this application proposes a chip test socket, comprising: a base and a tray; the base body has a cavity, a probe is disposed within the cavity, and bolt mounting holes are provided around the periphery of the cavity, the bolt mounting holes extending to the edge of the cavity and having a depth less than that of the cavity; the tray can be embedded into the cavity, and a relief recess is provided at the position corresponding to the bolt mounting holes; during installation, the tray is fixed to the base by bolts, compressing a preset spring within the cavity; the tray is provided with insertion holes corresponding to the probes.
[0005] Specifically, the area formed by the socket is the same size as the chip under test.
[0006] Specifically, the tray has at least one extended recess; the extended recess is located at the edge of the area where the socket is formed.
[0007] Specifically, the tray has four extended recesses; the extended recesses are respectively located at the four corners of the area formed with the insertion hole.
[0008] Using the above technical solution, the chip to be tested can be easily removed from the extended recess.
[0009] Specifically, the spring height is greater than the probe height.
[0010] Specifically, when the tray is placed on the spring, the probe does not contact the socket.
[0011] The above technical solution uses a spring with a specific elastic coefficient set according to the weight of the tray. This ensures that when the bolts are removed after the test, the tray can automatically lift off the probe due to the elastic force provided by the spring, thus avoiding damage to the probe caused by manual operation.
[0012] Specifically, the base has a first positioning notch and the tray has a second positioning notch. When installing the tray on the base, the first positioning notch and the second positioning notch need to be aligned to avoid the probe not being able to extend smoothly from the corresponding socket due to incorrect installation direction.
[0013] Specifically, the cavity is equipped with positioning posts, and the tray is equipped with positioning holes corresponding to the positioning posts.
[0014] Specifically, the tray has a third positioning notch to indicate the installation direction of the chip to be tested, thus avoiding incorrect installation.
[0015] Specifically, the base has several round holes for mounting the test fixture on the test platform.
[0016] Compared with the prior art, the advantages of this application are:
[0017] (1) The tray automatically pops up after testing, avoiding contact and scratches between the probe and the chip / tray;
[0018] (2) The four corner recesses provide leverage points, making it easy to grip the chip;
[0019] (3) Dual calibration of direction and position is achieved through positioning notches and positioning posts. Attached Figure Description
[0020] The accompanying drawings are included to provide a further understanding of the embodiments and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments and, together with the description, serve to explain the principles of this application. Other embodiments and many anticipated advantages of these embodiments will be readily recognized as they become better understood through reference to the following detailed description. Elements in the drawings are not necessarily to scale. The same reference numerals refer to corresponding similar parts.
[0021] Figure 1 This is a schematic diagram of the structure of the base of a chip test socket according to an embodiment of this application;
[0022] Figure 2 This is a schematic diagram of the structure of a chip test socket tray according to an embodiment of this application;
[0023] Figure 3 This is a schematic diagram of the mounting structure of a chip test socket according to an embodiment of this application.
[0024] The meanings of the numbers in the diagram are as follows: 1. Base; 2. Tray; 100. Cavity; 101. Bolt mounting hole; 102. Spring; 103. Round hole; 104. Positioning pin; 105. First positioning notch; 106. Probe; 107. Second positioning hole; 201. Extension recess; 202. Avoidance recess; 203. Insertion hole; 204. Positioning hole; 205. Second positioning notch; 206. Third positioning notch. Detailed Implementation
[0025] In the following detailed description, reference is made to the accompanying drawings, which form part of the detailed description and illustrate illustrative specific embodiments in which the present application may be practiced. In this regard, directional terms such as “top,” “bottom,” “left,” “right,” “up,” “down,” etc., are used with reference to the orientation of the described figures. Because components of the embodiments can be positioned in several different orientations, directional terms are used for illustrative purposes and are by no means limiting. It should be understood that other embodiments may be utilized or logical changes may be made without departing from the scope of the present application. Therefore, the following detailed description should not be taken in a limiting sense, and the scope of the present application is defined by the appended claims.
[0026] like Figure 1 and Figure 2 As shown, a chip test socket includes: a base 1 and a tray 2; the base 1 has a cavity 100, a probe 106 is provided in the cavity 100, and bolt mounting holes 101 are provided around the cavity 100, with the bolt mounting holes 101 extending to the edge of the cavity 100 and having a depth less than the cavity 100; the tray 2 can be embedded in the cavity 100, and has a relief recess 202 at the position corresponding to the bolt mounting holes 101; during installation, the tray 2 is fixed to the base 1 by bolts, compressing the preset spring 102 in the cavity 100; the tray 2 has an insertion hole 203 corresponding to the probe 106.
[0027] Preferably, the area formed by the socket 203 is the same size as the chip under test.
[0028] Preferably, the tray 2 has at least one extended recess 201; the extended recess 201 is disposed at the edge of the area formed by the insertion hole 203.
[0029] In one specific embodiment, the tray 2 is provided with four extended recesses 201; the extended recesses 201 are respectively located at the four corners of the area formed with the insertion hole 203.
[0030] Preferably, the height of spring 102 is greater than the height of probe 106.
[0031] Preferably, when the tray 2 is placed on the spring 102, the probe 106 does not contact the socket 203.
[0032] The spring 102 is set with a specific elastic coefficient according to the weight of the tray 2, so that when the bolt is removed after the test, the tray 2 can automatically rise away from the probe 106 due to the elastic force provided by the spring 102, avoiding damage to the probe 106 due to manual operation errors; at the same time, when selecting the spring 102, the elastic coefficient of the spring 102 should also be avoided so that the tray 2 will fly away due to excessive elastic force after the bolt is removed.
[0033] In an optional embodiment, the spring constant of spring 102 is selected using the following formula:
[0034]
[0035] Preferably, the base 1 is provided with a first positioning notch 105 and the tray 2 is provided with a second positioning notch 205. When the tray 2 is installed on the base 1, the first positioning notch 105 and the second positioning notch 205 need to be aligned to avoid the probe 106 being unable to extend smoothly from the corresponding socket 203 due to incorrect installation direction.
[0036] Preferably, the cavity 100 is provided with a positioning post 104, and the tray 2 is provided with a positioning hole 204 corresponding to the positioning post 104.
[0037] Preferably, the tray 2 is provided with a third positioning notch 206 to indicate the installation direction of the chip to be tested and to avoid misinstallation.
[0038] Preferably, the base 1 has several round holes 103 for mounting the test fixture on the test platform.
[0039] Example 1:
[0040] In this example, the tray 2 has a placement cavity, the insertion hole 203 is located at the bottom of the placement cavity, and the placement cavity has an inverted trapezoidal structure that is wider at the top and narrower at the bottom, which facilitates the placement and removal of the chip to be tested.
[0041] Example 2:
[0042] In this embodiment, a second positioning hole 107 is provided on the base 1. The second positioning hole 107 is located on the outside of the cavity 100, that is, between the edge of the base 1 and the edge of the cavity 100. The second positioning hole 107 plays a positioning role when the test seat is placed on the test platform.
[0043] Specifically, the second positioning holes 107 are symmetrically arranged around the upper surface of the base 1.
[0044] Example 3:
[0045] In this embodiment, the heights of the positioning post 104, the spring 102, and the probe 106 have the following relationship: h 定位柱104 >h 弹簧102 >h 探针106This design scheme ensures that when the tray 2 is installed on the base 1, it will pass through the positioning post 104, the spring 102, and the probe 106 in sequence, thereby further limiting the movement path of the tray 2 and better protecting the probe 106.
[0046] It is obvious that those skilled in the art can make various modifications and alterations to the embodiments of this application without departing from the spirit and scope of this application. In this way, this application also aims to cover such modifications and alterations if they fall within the scope of the claims and their equivalents. The word "comprising" does not exclude the presence of other elements or steps not listed in the claims. The simple fact that certain measures are described in mutually different dependent claims does not indicate that a combination of these measures cannot be used for profit. Any reference numerals in the claims should not be considered limiting in scope.
Claims
1. A chip test socket, characterized in that, include: The base and tray are provided. The base body has a cavity, and a probe is provided inside the cavity. Bolt mounting holes are provided around the periphery of the cavity, and the bolt mounting holes extend to the edge of the cavity and are less than the depth of the cavity. The tray can be embedded in the cavity, and it has a relief recess corresponding to the position of the bolt mounting holes. During installation, the tray is fixed to the base by bolts, compressing a preset spring in the cavity. The tray has an insertion hole corresponding to the probe.
2. A chip test socket according to claim 1, characterized in that, The area formed by the socket is the same size as the chip under test.
3. A chip test socket according to claim 2, characterized in that, The tray has at least one extended recess; the extended recess is located at the edge of the area formed by the insertion hole.
4. A chip test socket according to claim 3, characterized in that, The tray has four extended recesses; the extended recesses are respectively located at the four corners of the area formed with the insertion hole.
5. A chip test socket according to any one of claims 1 to 4, characterized in that, The height of the spring is greater than the height of the probe.
6. A chip test socket according to claim 5, characterized in that, When the tray is placed on the spring, the probe does not contact the socket.
7. A chip test socket according to claim 1, characterized in that, The base has a first positioning notch, and the tray has a second positioning notch.
8. A chip test socket according to claim 1, characterized in that, The cavity is provided with a positioning post, and the tray is provided with a positioning hole corresponding to the positioning post.
9. A chip test socket according to claim 1, characterized in that, The tray has a third positioning notch.
10. A chip test socket according to claim 1, characterized in that, The base has several round holes.