Chuck fork device

CN224791070UActive Publication Date: 2026-09-22HEFEI SHANGHEXIN TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202521381327.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-07-02
Publication Date
2026-09-22
Estimated Expiration
2035-07-02

AI Technical Summary

Benefits of technology

[0011]且各所述限位部会穿过该第一穿孔以及各所述第二穿孔以及各所述第三穿孔,各所述限位部略大于该第一穿孔以及各所述第二穿孔以及各所述第三穿孔,各所述限位部受所述气体经过而膨胀撑起将各所述吸盘卡扣于该第一穿孔以及各所述第二穿孔以及各所述第三穿孔中,并各所述吸盘利用各该内沟槽以及各该外沟槽可产生一股强劲真空吸力增加吸合贴附所述晶圆,方便后续所述晶圆的各项加工作业,最后在所述气体停止提供负压吸力于该第一气道、该第二气道以及该第三气道时,各所述孔道不再产生膨胀的现象,各所述内沟槽以及各所述外沟槽少了真空吸力而确实脱离所述晶圆,达到所述载叉装置可吸合贴附以及确实脱离所述晶圆的效果。

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Abstract

The utility model provides a kind of sucking disc fork loading device, the fork loading device includes: a fork body, multiple sucking discs and a wafer, the fork body has: a first air passage and one end is formed with a first perforation, a second air passage and one end is formed with at least three second perforations and a third air passage and one end is formed with at least three third perforations, each described sucking disc is arranged in each described perforation and surface each has a suction part, the suction part is formed with an inner groove and an outer groove, and each described sucking disc is centrally located on each with a channel, each described channel and the first air passage, the second air passage and the third air passage are interconnected, when a gas is provided negative pressure suction force via the first air passage, the second air passage and the third air passage, each described sucking disc uses the inner groove and the outer groove to increase suction and adhere to the wafer, facilitate subsequent the wafer each item of working operation.
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Description

Technical Field

[0001] This utility model relates to a fork carrier device, and more particularly to the suction cup fork carrier device that can increase suction adhesion and reliable detachment from a wafer. Background Technology

[0002] Today, with the rapid development of modern technology, many technological products are constantly being developed and launched. Especially in recent years, the emergence of artificial intelligence-related products has brought many convenient or faster intelligent goods. Among these, the use of chips is one of the most important and ubiquitous components. Any electronic component or product relies on chips to achieve its intended function or result. Chips are components made by further processing and reprocessing wafers. In other words, a chip is made from a large wafer through layers of processing and cutting into smaller sheet-like pieces. The transportation of these wafers requires automated equipment; it is unlikely to be done manually. Traditionally, bulky equipment is used as tools. During various processing steps, wafers often require precise and accurate carriers to move or rotate them. Moreover, wafers are usually not in a complete and flat state; their surfaces will have some degree of bulges, depressions, and other deformations. Therefore, if a wafer is to be taken out of one workstation and transported to another, even over a very short distance of just a few centimeters, the carrier must be able to overcome the unevenness of the wafer surface and reach the correct position for various processing or pending processes during movement or rotation. There can be no errors or problems, as these are all related to the wafer yield. Utility Model Content

[0003] To achieve the above objectives, this utility model provides a suction cup fork carrier device, comprising: a fork carrier body, wherein the fork carrier body has: a first air passage, a second air passage, and a third air passage; the first air passage is located at the center of the fork carrier body, and a first through hole is formed at one end edge of the first air passage; the second air passage is located on one side of the first air passage, and at least three second through holes are formed at one end of the second air passage; the third air passage is located on the other side of the first air passage, and at least three third through holes are formed at one end of the third air passage; and a plurality of suction cups, each suction cup being disposed on the first air passage. In the first through hole, each of the second through holes, and each of the third through holes, each of the suction cups has a suction portion on its surface. Each suction portion forms an inner groove and an outer groove from the inside to the outside. Each of the suction cups has a channel at its central position, and each of the suction cups has at least two interference portions extending outward from one end toward opposite sides. Each of the suction cups also has a limiting portion extending outward from one end toward opposite sides, and each of the limiting portions passes through the first through hole, each of the second through holes, and each of the third through holes. A wafer is also included, which can be attached to the suction portion.

[0004] In some embodiments, each of the second perforations is arranged at equal intervals at one end of the second airway.

[0005] In some embodiments, each of the third perforations is arranged at equal intervals at one end of the third airway.

[0006] In some embodiments, each of the channels is interconnected with the first airway, the second airway, and the third airway.

[0007] In some embodiments, the outer diameter of each of the interference portions after expansion is greater than the inner diameter of the first perforation, each of the second perforations, and each of the third perforations.

[0008] In some embodiments, the outer diameter of each of the limiting portions after expansion is greater than the inner diameter of the first through hole, each of the second through holes, and each of the third through holes.

[0009] In some embodiments, each of the limiting portions is in the shape of an inverted trapezoid.

[0010] Therefore, since each of the interference portions is slightly larger than the first, second, and third perforations, and each of the channels can be interconnected with the first, second, and third air channels respectively, when a gas provides negative pressure suction through the first, second, and third air channels, each of the interference portions expands strongly due to the expansion phenomenon caused by the gas passing through the channels, and can support the interference portions in the gripping force of the first, second, and third perforations, thereby increasing the friction and achieving the fixed effect of each suction cup being disposed in the first, second, and third perforations.

[0011] Furthermore, each of the aforementioned limiting portions passes through the first through hole, the second through hole, and the third through hole. Each of the aforementioned limiting portions is slightly larger than the first through hole, the second through hole, and the third through hole. Each of the aforementioned limiting portions expands and supports itself as the gas passes through, thus securing each of the aforementioned suction cups into the first through hole, the second through hole, and the third through hole. Each of the aforementioned suction cups utilizes the inner groove and the outer groove to generate a strong vacuum suction force to increase the adhesion to the wafer, facilitating subsequent wafer processing operations. Finally, when the gas stops providing negative pressure suction force to the first air channel, the second air channel, and the third air channel, the aforementioned channels no longer expand. The aforementioned inner groove and the outer groove lose vacuum suction force and are thus effectively detached from the wafer, achieving the effect that the carrier fork device can adhere to and effectively detach from the wafer. Attached Figure Description

[0012] Figure 1 This is a three-dimensional view of the present invention.

[0013] Figure 2 This is an exploded perspective view of the present invention.

[0014] Figure 3 This is a partial schematic diagram of the present invention. Figure 1 .

[0015] Figure 4 This is a partial schematic diagram of the present invention. Figure 2 .

[0016] Figure 5 This is a partial schematic diagram of the present invention. Figure 3 .

[0017] Figure 6 This is a partial schematic diagram of the present invention. Figure 4 .

[0018] Figure 7 This is a schematic diagram of a preferred embodiment of the present invention. Figure 1 .

[0019] Figure 8 This is a schematic diagram of a preferred embodiment of the present invention. Figure 2 .

[0020] Figure 9 This is a schematic diagram of a preferred embodiment of the present invention. Figure 3 .

[0021] Figure 10 This is a schematic diagram of a preferred embodiment of the present invention. Figure 4 .

[0022] Explanation of markings in the diagram: Forklift assembly: 1; Carrier fork body: 2; First airway: 21; First perforation: 211; Second airway: 22; Second perforation: 221; Third airway: 23; Third perforation: 231; Suction cups: 3; Suction part: 31; Inner groove: 311; External groove: 312; Channel: 32; Interference part: 33; Limiting part: 34; Wafer: 4; Gas: 5. Detailed Implementation

[0023] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand and implement the present invention. However, the embodiments described are not intended to limit the present invention. Please also refer to... Figures 1 to 10 The figures shown are a perspective view, an exploded perspective view, a partial schematic diagram, and a schematic diagram of a preferred embodiment of the present invention. As can be clearly seen from the figures, the forklift device 1 has: A fork body 2, the fork body 2 having a first air passage 21, a second air passage 22 and a third air passage 23 respectively. The first air passage 21 is located at the center of the fork body 2 and a first perforation 211 is formed at one end edge of the first air passage 21. The second air passage 22 is located on one side of the first air passage 21 and at least three second perforations 221 are formed at one end of the second air passage 22. The third air passage 23 is located on the other side of the first air passage 21 and at least three third perforations 231 are formed at one end of the third air passage 23.

[0024] A plurality of suction cups 3 are disposed in the first through hole 211, the second through hole 221, and the third through hole 231. Each suction cup 3 has a suction portion 31 on its surface. Each suction portion 31 forms an inner groove 311 and an outer groove 312 from the inside to the outside. Each suction cup 3 has a channel 32 at its center. Each suction cup 3 has at least two interference portions 33 extending outward from one end toward two opposite sides. Each suction cup 3 has a limiting portion 34 extending outward from one end toward two opposite sides. Each limiting portion 34 passes through the first through hole 211, the second through hole 221, and the third through hole 231. A wafer 4 is attached to the suction portion 31.

[0025] The second perforations 221 are arranged at equal intervals on one end of the second airway 22.

[0026] The third perforations 231 are arranged at equal intervals on one end of the third airway 23.

[0027] Each of the aforementioned channels 32 can be interconnected with the first airway 21, the second airway 22, and the third airway 23, respectively.

[0028] Each of the interference portions 33 is slightly larger than the first through hole 211, each of the second through holes 221, and each of the third through holes 231.

[0029] Each of the limiting portions 34 is slightly larger than the first through hole 211, each of the second through holes 221, and each of the third through holes 231.

[0030] Each of the limiting parts 34 is in the shape of an inverted trapezoid.

[0031] The main features are as follows: the fork body 2 has a first air passage 21, a second air passage 22, and a third air passage 23. The first air passage 21 is located at the center of the fork body 2, and a first perforation 211 is formed at one end edge of the first air passage 21. The second air passage 22 is located on one side of the first air passage 21, and at least three second perforations 221 are formed at one end of the second air passage 22, with each second perforation 221 equidistantly arranged at one end of the second air passage 22. The third air passage 23 is located on the other side of the first air passage 21, and at least three third perforations 231 are formed at one end of the third air passage 23, with each third perforation 231 equidistantly arranged at one end of the third air passage 23. At one end, each of the suction cups 3 is disposed in the first through hole 211, the second through hole 221, and the third through hole 231. Each of the suction cups 3 has suction portions 31 on its surface. Each suction portion 31 forms an inner groove 311 and an outer groove 312 from the inside to the outside. Each of the suction cups 3 has a channel 32 at its central position. Each channel 32 can communicate with the first air passage 21, the second air passage 22, and the third air passage 23, respectively. Each of the suction cups 3 has at least two interference portions 33 extending outward from one end towards opposite sides. Each interference portion 33 is slightly larger than the first through hole 211 and the third through hole 231. The second through hole 221 and each of the third through holes 231 are described, and each of the suction cups 3 has a limiting portion 34 extending outward from one end towards opposite sides. Each limiting portion 34 is slightly larger than the first through hole 211, each of the second through holes 221 and each of the third through holes 231, and each limiting portion 34 passes through the first through hole 211, each of the second through holes 221 and each of the third through holes 231. Each limiting portion 34 has an inverted trapezoidal shape, and the wafer 4 can be attracted and attached to the suction portion 31. Therefore, because each limiting portion 34 has an inverted trapezoidal shape and extends outward from opposite sides, The suction cups 3 are extended and slightly larger than the first through hole 211, each of the second through holes 221, and each of the third through holes 231, so that each suction cup 3 can pass through and be snapped into the first through hole 211, each of the second through holes 221, and each of the third through holes 231. Furthermore, each interference portion 33 extends outward side by side to opposite sides and is slightly larger than the first through hole 211, each of the second through holes 221, and each of the third through holes 231. Each channel 32 can communicate with the first air channel 21, the second air channel 22, and the third air channel 23 respectively. When a gas 5 provides negative pressure suction through the first air channel 21, the second air channel 22, and the third air channel 23,Each interference portion 33 expands forcefully due to the expansion of the gas 5 through each of the channels 32, and can increase the gripping force of each interference portion 33 in the first through hole 211, each of the second through hole 221, and each of the third through hole 231, thereby increasing the friction. This makes the fixation of each suction cup 3 in the first through hole 211, each of the second through hole 221, and each of the third through hole 231 more tight and firm. Furthermore, the limiting portion 34, affected by the expansion of the gas 5, will more firmly lock the suction cup 3 in the first through hole 211, each of the second through hole 221, and each of the third through hole 231. At this time, the gas 5 is continuously supplied. The gas supply provides negative pressure suction. Each suction unit 31 utilizes its inner groove 311 and outer groove 312 to expel excess air and generate a strong vacuum suction, enhancing the adhesion of the wafer 4 and facilitating subsequent processing of the wafer 4. Finally, when the gas supply to the first air channel 21, the second air channel 22, and the third air channel 23 is stopped, the channels 32 no longer experience expansion due to the gas 5 passing through them. Furthermore, because the gas 5 no longer provides negative pressure suction and the inner groove 311 and outer groove 312 lack vacuum suction, each suction unit 31 effectively detaches from the wafer 4, achieving the effect of the carrier fork device 1 being able to adhere to and effectively detach from the wafer 4.

[0032] The above-described embodiments are merely preferred embodiments provided to fully illustrate the present utility model, and the protection scope of the present utility model is not limited thereto. Equivalent substitutions or modifications made by those skilled in the art based on the present utility model, or reasonable combinations of solutions from various embodiments, are all within the protection scope of the present utility model.

Claims

1. A suction cup fork carrier device, characterized in that, Including: A fork body, the fork body having: a first air passage, a second air passage and a third air passage, the first air passage being located at the center of the fork body and having a first perforation formed at one end edge of the first air passage, the second air passage being located on one side of the first air passage and having at least three second perforations formed at one end of the second air passage, the third air passage being located on the other side of the first air passage and having at least three third perforations formed at one end of the third air passage; A plurality of suction cups, each suction cup being disposed in the first through hole, each of the second through holes, and each of the third through holes. Each suction cup has a suction portion on its surface. Each suction portion forms an inner groove and an outer groove from the inside to the outside. Each suction cup has a channel at its central position. At least two interference portions are formed on one end of each suction cup extending outward side by side toward opposite sides. A limiting portion is formed on one end of each suction cup extending outward side by opposite sides. Each limiting portion passes through the first through hole, each of the second through holes, and each of the third through holes. A wafer, which can be attached to the suction part.

2. The suction cup fork carrier device as described in claim 1, characterized in that, Each of the second perforations is arranged at equal intervals at one end of the second airway.

3. The suction cup fork carrier device as described in claim 1, characterized in that, Each of the third perforations is arranged at equal intervals at one end of the third airway.

4. The suction cup fork carrier device as described in claim 1, characterized in that, Each of the aforementioned channels is interconnected with the first airway, the second airway, and the third airway, respectively.

5. The suction cup fork carrier device as described in claim 1, characterized in that, The outer diameter of each of the interference portions after expansion is greater than the inner diameter of the first perforation, each of the second perforations, and each of the third perforations.

6. The suction cup fork carrier device as described in claim 1, characterized in that, The outer diameter of each of the limiting parts after expansion is greater than the inner diameter of the first through hole, each of the second through holes, and each of the third through holes.

7. The suction cup fork carrier device as described in claim 1, characterized in that, Each of the aforementioned limiting parts is in the shape of an inverted trapezoid.