Temperature-resistant testing device

Abstract

The application discloses a temperature-resistant testing device, which comprises a heat preservation box, a temperature control box and a shunt plate. The heat preservation box is provided with a test cavity for accommodating a test circuit board. The temperature control box is arranged in the test cavity and is provided with an air inlet and a plurality of air outlets. The plurality of air outlets correspond to a plurality of chips on the test circuit board one by one. The shunt plate is arranged in the temperature control box and corresponds to the air inlet. The low-temperature cold air or high-temperature hot air is evenly distributed to the plurality of air outlets through the temperature control box and the shunt plate. The plurality of air outlets correspond to the plurality of chips one by one. Therefore, the temperature uniformity and controllability of the plurality of chips can be ensured when the temperature-resistant test is simultaneously performed on the plurality of chips. The condensation of water is reduced due to the uniform temperature distribution, and the damage risk of the device or the circuit board is reduced.

Description

Technical Field

[0001] This application belongs to the field of temperature resistance testing technology, and in particular relates to a temperature resistance testing device. Background Technology

[0002] Existing methods for low-temperature chip testing involve using a thermal stream to introduce cold airflow to the chip for low-temperature testing. Once the thermal stream temperature stabilizes, temperature data is measured to check whether the target temperature has been reached and whether the temperature of the entire board DUT (Device Under Test) is uniform, thus completing the product test.

[0003] In related technologies, thermal streams have only one vent. As the number of chips being tested simultaneously increases, and the temperature points and areas requiring control expand, the temperature distribution on the test board inside the insulation box becomes uneven, failing to meet the requirements for uniform and precise temperature control of each chip under test. Furthermore, under prolonged, uninterrupted, and high-intensity low-temperature testing conditions, condensation can occur on the testing equipment system and the inner wall of the insulation box, posing a risk of short-circuit damage to the equipment and test circuit boards. Utility Model Content

[0004] This application aims to address at least one of the technical problems existing in the prior art. To this end, this application proposes a temperature resistance testing device that improves the temperature uniformity and controllability during the temperature testing process and reduces the risk of damage to the device or circuit board.

[0005] This application provides a temperature resistance testing device, comprising: An insulated box with a test cavity for accommodating test circuit boards; The temperature control chamber is located inside the test chamber. The temperature control chamber has an air inlet and multiple air outlets. The multiple air outlets correspond one-to-one with multiple chips on the test circuit board. The air distribution plate is located inside the temperature control box and corresponds to the air inlet.

[0006] According to the temperature resistance testing device of this application, by setting up a temperature control box and a flow divider, the low-temperature cold air or high-temperature hot air is more evenly distributed to multiple air outlets, and the multiple air outlets correspond one-to-one with multiple chips. Thus, when multiple chips are tested for temperature resistance at the same time, the temperature uniformity and controllability of multiple chips are guaranteed. Furthermore, because the temperature distribution is uniform, the phenomenon of condensation water is reduced, thereby reducing the risk of damage to the device or circuit board.

[0007] According to one embodiment of this application, the temperature resistance testing device further includes multiple nozzles, which are installed one-to-one with multiple air outlets, and the air volume of each nozzle is adjustable.

[0008] According to one embodiment of this application, a temperature measuring device is provided at the nozzle.

[0009] According to one embodiment of this application, an air inlet is located on the first side of the temperature control box, a plurality of air outlets are located on the second side of the temperature control box opposite to the first side, and a diverter plate is spaced between the first side and the second side.

[0010] According to one embodiment of this application, the insulation box contains multiple temperature-controlled chambers, and the temperatures within the multiple temperature-controlled chambers are not consistent; and / or, The temperature control chamber is equipped with a baffle plate, which divides the internal space of the temperature control chamber into multiple temperature control chambers. There are multiple air inlets corresponding to the multiple temperature control chambers, and multiple flow dividers corresponding to the multiple temperature control chambers. The temperature in the multiple temperature control chambers is not the same.

[0011] According to one embodiment of this application, the diverter plate is fixedly connected to the first side via a connecting rod.

[0012] According to one embodiment of this application, the height of the connecting rod inside the temperature control box is adjustable.

[0013] According to one embodiment of this application, the temperature control chamber has a support leg on the side facing the test circuit board for supporting itself on the test circuit board.

[0014] According to one embodiment of this application, the height of the support leg is adjustable.

[0015] According to one embodiment of this application, the temperature resistance testing device further includes a temperature regulating device. The output end of the temperature regulating device is provided with an inlet and outlet hood. An outlet is provided inside the inlet and outlet hood, and the outlet is connected to the inlet. The inlet and outlet hood has an exhaust chamber that communicates with the test chamber, and an exhaust port that communicates with the exhaust chamber is provided on the inlet and outlet hood.

[0016] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0017] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 This is a partial perspective structural diagram of the temperature resistance testing device provided in the embodiments of this application; Figure 2 This is another partial perspective structural schematic diagram of the temperature resistance testing device provided in the embodiments of this application; Figure 3 This is another partial perspective structural schematic diagram of the temperature resistance testing device provided in the embodiments of this application; Figure 4This is another partial perspective structural schematic diagram of the temperature resistance testing device provided in the embodiments of this application; Figure 5 This is another partial perspective structural schematic diagram of the temperature resistance testing device provided in the embodiments of this application; Figure 6 This is a schematic diagram of the nozzle structure provided in an embodiment of this application; Figure 7 This is another partial perspective structural schematic diagram of the temperature resistance testing device provided in the embodiments of this application; Figure 8 This is a schematic diagram of the temperature regulation device provided in the embodiments of this application.

[0018] Figure label: 100. Temperature resistance testing device; 110. Insulation box; 120. Temperature control box; 121. Air inlet; 122. Air outlet; 130. Diverter plate; 140. Nozzle; 150. Connecting rod; 160. Support leg; 170. Temperature regulation equipment; 171. Air inlet and outlet hood; 172. Air outlet; 173. Exhaust port; 200. Circuit board; 210. Chip. Detailed Implementation

[0019] The embodiments of this application are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0020] The following is for reference. Figures 1-8 Describes a temperature resistance testing apparatus according to an embodiment of this application.

[0021] Please see Figures 1 to 6 This application provides a temperature resistance testing device 100, which includes: an insulation box 110, a temperature control chamber 120, and a flow divider 130. The insulation box 110 has a test cavity for accommodating a test circuit board 200; the temperature control chamber 120 is disposed inside the test cavity, and the temperature control chamber 120 is provided with an air inlet 121 and multiple air outlets 122, with each of the multiple air outlets 122 corresponding to a multiple chip 210 on the test circuit board 200; the flow divider 130 is disposed inside the temperature control chamber 120 and corresponds to the air inlet 121.

[0022] The insulation box 110 serves as the basic housing structure of the entire device. The test chamber formed inside it provides a relatively enclosed space for the entire temperature resistance test process, reducing the influence of the external environment on the temperature inside the test chamber and helping to maintain the stability of the test environment. The test circuit board 200 is placed inside this test chamber, allowing the chip 210 to undergo temperature resistance testing in a relatively stable test environment. The insulation box 110 can be made of materials with good thermal insulation properties, such as polyurethane foam or polystyrene, to enhance its insulation effect.

[0023] The temperature control chamber 120 is located inside the test chamber, and its main function is to distribute the externally input airflow. The air inlet 121 on the temperature control chamber 120 receives low-temperature cold air or high-temperature hot air from equipment such as a heat flow meter, while multiple air outlets 122 direct the airflow to the corresponding chips 210. Each air outlet 122 corresponds one-to-one with a chip 210 on the test circuit board 200, ensuring that each chip 210 receives airflow from its corresponding air outlet 122, guaranteeing targeted airflow distribution. The shape of the temperature control chamber 120 can be designed according to the space of the test chamber and the layout of the test circuit board 200; for example, it can be a cuboid, cube, or other suitable shape. The air inlet 121 can be located on one side or the top of the temperature control chamber 120, and its size can be adjusted according to the airflow input. The number of air outlets 122 can be set according to the number of chips 210. There can be two, three, four or more. When there are two air outlets 122, they can correspond to two different positions of chips 210 on the test circuit board 200 respectively. The distribution of the two air outlets 122 on the temperature control box 120 should match the distribution of chips 210.

[0024] The diffuser plate 130 is disposed inside the temperature control box 120 and corresponds to the air inlet 121. Its main function is to divert and guide the airflow entering the temperature control box 120 from the air inlet 121, so that the airflow can flow more evenly to each air outlet 122. The diffuser plate 130 can be a flat plate or a plate with a flow guiding structure, such as flow guiding grooves or flow guiding protrusions on the surface. When the airflow enters the temperature control box 120 from the air inlet 121, it will first come into contact with the diffuser plate 130. Under the action of the diffuser plate 130, the airflow is dispersed and guided to different directions, thereby avoiding the airflow from concentrating in a certain area within the temperature control box 120 and ensuring the uniformity of airflow at each air outlet 122.

[0025] In actual operation, external low-temperature cold air or high-temperature hot air enters the temperature control chamber 120 through the air inlet 121. The airflow entering the temperature control chamber 120 first comes into contact with the diverter plate 130. Under the diversion and guidance of the diverter plate 130, the airflow is evenly distributed to various areas within the temperature control chamber 120, and then discharged through multiple air outlets 122. Since the multiple air outlets 122 correspond one-to-one with the multiple chips 210 on the test circuit board 200, the discharged airflow can directly act on the corresponding chip 210 to regulate the temperature of the chip 210, thereby realizing the temperature resistance test of multiple chips 210.

[0026] According to the temperature resistance testing device 100 provided in this application embodiment, by setting up a temperature control box 120 and a distribution plate 130, low-temperature cold air or high-temperature hot air can be more evenly distributed to multiple air outlets 122, and each of the multiple air outlets 122 corresponds to a multiple chip 210. This ensures the temperature uniformity and controllability of the multiple chips 210 when performing temperature resistance testing on them simultaneously. Simultaneously, because the temperature distribution is uniform, the phenomenon of condensation on the testing equipment system and the inner wall of the insulation box 110 is reduced, thereby lowering the risk of damage to the device or circuit board 200. Furthermore, the insulation box 110 provides a relatively stable environment for testing, further improving the accuracy and reliability of the test.

[0027] Please see Figures 6 to 7 According to some embodiments of this application, the temperature resistance testing device 100 may further include a plurality of nozzles 140, which are installed one-to-one with a plurality of air outlets 122, and the air volume of each nozzle 140 is adjustable.

[0028] Multiple nozzles 140 are installed one-to-one with multiple air outlets 122 of the temperature control box 120, meaning that one nozzle 140 is installed at each air outlet 122. The nozzles 140 are configured to concentrate and guide the airflow from the air outlets 122, allowing the airflow to act more precisely on the corresponding chip 210, thus enhancing the targetedness and effectiveness of the airflow in regulating the temperature of the chip 210. The nozzles 140 can be made of materials such as metal or high-temperature resistant plastic, and their shape can be designed as cylindrical, conical, or other shapes suitable for guiding airflow. For example, a conical nozzle 140 can create a more concentrated airflow stream when ejected.

[0029] The airflow of each nozzle 140 is adjustable, allowing operators to precisely adjust the airflow at each chip 210 to ensure consistent testing temperatures across all chips 210. Various adjustment methods are possible. For example, a rotatable regulating valve can be installed on the nozzle 140, changing the cross-sectional area of ​​the internal channel to adjust the airflow. Alternatively, the nozzle 140 can employ a telescopic structure, adjusting the airflow resistance by changing its length, thereby achieving airflow regulation.

[0030] During operation, the airflow, after being automatically adjusted by the temperature control box 120 and the flow divider 130, enters the corresponding nozzle 140 through each air outlet 122. The operator then adjusts the airflow of the nozzle 140 according to the test temperature requirements, so that the airflow ejected from each nozzle 140 meets the temperature control requirements of each chip 210 within a certain temperature difference range, ensuring the temperature uniformity among multiple chips 210.

[0031] According to some embodiments of this application, a temperature measuring device may be provided at the nozzle 140.

[0032] A temperature measuring device is positioned at the nozzle 140 to monitor the temperature near the nozzle 140 in real time, thereby obtaining the temperature information of the corresponding chip 210 location. The temperature measuring device can be a thermocouple, a resistance temperature detector (RTD), or an infrared temperature sensor, etc. These sensors have different temperature measurement ranges and accuracies, and the appropriate type can be selected according to specific testing requirements. For example, thermocouples have a fast response speed and are suitable for dynamic temperature monitoring; RTDs offer high measurement accuracy and are suitable for scenarios requiring high temperature accuracy.

[0033] The installation method of the temperature measuring device and the nozzle 140 can be selected according to the actual situation. For example, the temperature measuring device can be embedded in the side wall of the nozzle 140, so that its sensing end is close to the air outlet 122 of the nozzle 140. This can more accurately measure the temperature before the airflow acts on the chip 210. Alternatively, the temperature measuring device can be fixed on a bracket near the nozzle 140, so that it is aligned with the location of the chip 210 and directly monitors the temperature of the surface of the chip 210.

[0034] During operation, the temperature measuring device monitors the temperature of the area corresponding to nozzle 140 in real time and feeds the temperature data back to the operator or control system. Even with the temperature control box 120, there may be slight differences in the airflow temperature at the outlet 122. Based on the temperature data obtained by the measuring device, the operator can adjust the airflow of each nozzle 140. For example, if the temperature measuring device at a certain nozzle 140 shows that the temperature is slightly higher than the target temperature, the airflow of that nozzle 140 can be appropriately increased to accelerate the cooling rate of that area; if the temperature is slightly lower, the airflow can be appropriately decreased to ensure that the temperature in that area remains stable within the target range, ultimately achieving temperature uniformity in the area where all chips 210 are located.

[0035] A temperature measuring device is installed at the nozzle 140, which can provide a precise basis for air volume adjustment, allowing operators to make targeted adjustments to each nozzle 140, effectively compensating for possible slight distribution differences in the temperature control box 120, further ensuring the temperature uniformity of multiple chips 210 during the test, and improving the accuracy of the test results.

[0036] Please see Figure 4 and Figure 5 According to some embodiments of this application, the air inlet 121 may be located on the first side of the temperature control box 120, and a plurality of air outlets 122 may be located on the second side of the temperature control box 120 opposite to the first side. The diverter plate 130 is spaced between the first side and the second side.

[0037] The temperature control chamber 120 has a first side and a second side that are arranged opposite to each other. An air inlet 121 is located on the first side, while multiple air outlets 122 are concentrated on the second side, which is opposite to the first side. This relative arrangement allows the airflow entering through the air inlet 121 to form a relatively stable flow path inside the temperature control chamber 120, reducing airflow turbulence and helping the airflow reach each air outlet 122 more evenly. For example, when the temperature control chamber 120 is a cuboid, the first side can be one side along its thickness direction, and the second side can be another side parallel to and opposite it.

[0038] The diverter plate 130 is spaced between the first side and the second side, meaning there is a certain distance between the diverter plate 130 and the first side, and also a certain distance between the diverter plate 130 and the second side. This arrangement ensures that the airflow entering from the air inlet 121 first contacts the diverter plate 130, is dispersed by the diverter plate 130, and then further diffuses within the space between the diverter plate 130 and the second side, thus being more evenly discharged from the multiple air outlets 122 on the second side. The distance between the diverter plate 130 and the first and second sides can be set according to the size of the temperature control box 120 and the airflow rate. For example, the diverter plate 130 can be positioned in the middle inside the temperature control box 120, maintaining the same distance from both the first and second sides, to ensure balanced airflow within the two spaces.

[0039] According to some embodiments of this application, the shunt plate 130 is adapted to have the same shape as the test circuit board 200.

[0040] The shape of the shunt plate 130 is adapted to the shape of the test circuit board 200. That is, when the test circuit board 200 is rectangular, the shunt plate 130 is also rectangular; when the test circuit board 200 is circular or other irregular shapes, the shunt plate 130 adopts the same shape. This shape matching allows the layout of the shunt plate 130 in the temperature control chamber 120 to correspond to the distribution of the chips 210 on the test circuit board 200.

[0041] The flow divider 130 has the same shape as the test circuit board 200, which can better adapt to the airflow requirements within the temperature control chamber 120, ensuring that the flow divider 130's airflow diversion effect matches the distribution area of ​​the chips 210 on the test circuit board 200. For example, if the chips 210 on the test circuit board 200 are distributed in a matrix on a rectangular board, using a flow divider 130 of the same rectangle can more evenly guide the airflow to the corresponding matrix area, ensuring that the airflow distribution in each area is adapted to the number and distribution of chips 210 in that area.

[0042] Please see Figures 3 to 5 According to some embodiments of this application, the diverter plate 130 can be fixedly connected to the first side via the connecting rod 150.

[0043] The connecting rod 150 is a connecting component used to fix the flow divider 130 to the first side of the temperature control box 120. Its function is to ensure that the flow divider 130 maintains a stable position within the temperature control box 120 and will not shift due to airflow impact or device vibration, thereby ensuring the stability of the flow divider effect. The connecting rod 150 can be made of a material with a certain strength, such as a metal rod or a rigid plastic rod, to provide sufficient support.

[0044] There are several ways to connect the connecting rod 150 to the diverter plate 130 and the first side. For example, one end of the connecting rod 150 can be fixed to the first side of the temperature control box 120 by welding, and the other end can be connected to the diverter plate 130 by bolts; alternatively, both ends of the connecting rod 150 can be snapped together with the first side and the diverter plate 130 respectively; or it can be fixed with adhesives such as glue. All these connection methods can achieve a stable connection between the diverter plate 130 and the first side, and the specific method can be selected according to the materials of the temperature control box 120 and the diverter plate 130 and the actual assembly requirements.

[0045] The number of connecting rods 150 can be set according to the size and weight of the diverter plate 130. For example, for a smaller diverter plate 130, two connecting rods 150 can be set, symmetrically connected to the two side edges of the diverter plate 130 respectively; for a larger diverter plate 130, four connecting rods 150 can be set, connected to the four corners of the diverter plate 130 respectively, to ensure that the diverter plate 130 is subjected to uniform force and more securely fixed. The length of the connecting rods 150 is determined according to the required interval distance between the diverter plate 130 and the first side, to ensure that the diverter plate 130 can be in the preset diversion position.

[0046] According to some embodiments of this application, the height of the connecting rod 150 within the temperature control box 120 is adjustable.

[0047] The connecting rod 150 serves as a component connecting the flow divider 130 and the first side of the temperature control chamber 120. Its height within the temperature control chamber 120 is adjustable, meaning that the vertical position of the flow divider 130 within the temperature control chamber 120 can be changed by adjusting the height of the connecting rod 150. This adjustable design allows the position of the flow divider 130 to accommodate test circuit boards 200 of different sizes, different chip 210 distribution densities, or different airflow input intensities, further enhancing the flexibility of the device.

[0048] The structure for adjusting the height of the connecting rod 150 can take various forms. For example, the connecting rod 150 can be designed as a nested telescopic structure, with the inner rod connected to the diverter plate 130 and the outer rod fixed to the first side of the temperature control box 120. The inner and outer rods are connected by a positioning hole and a positioning pin. When the height needs to be adjusted, the positioning pin is pulled out, the inner rod is stretched or compressed to the target position, and then the positioning pin is inserted to fix it. Alternatively, a mounting hole can be provided on the first side of the temperature control box 120, with one end of the connecting rod 150 passing through the mounting hole. The connecting rod 150 has an external thread and is connected to the mounting hole through a nut. The other end is fixed to the diverter plate 130. By adjusting the position of the nut, the height of the connecting rod 150 extending into the temperature control box 120 can be changed, thereby achieving height adjustment. A threaded adjustment structure can also be used, with the connecting rod 150 connected to the first side by a thread. Rotating the connecting rod 150 can change its extension length, thereby adjusting the height of the diverter plate 130.

[0049] During operation, based on the size of the test circuit board 200, the mounting height of the chip 210 on the board, and the airflow input, the height of the connecting rod 150 is adjusted to position the diverter plate 130 optimally within the temperature control chamber 120. For example, when the test circuit board 200 is large and the chips 210 are widely distributed, the diverter plate 130 is lowered to ensure that the airflow, after being diverted, can more evenly cover the lower air outlets 122. When the airflow input intensity is high, the diverter plate 130 is appropriately raised to prevent the airflow from directly impacting the diverter plate 130 and becoming too concentrated at the bottom of the temperature control chamber 120. After adjustment, the connecting rod 150 is fixed to ensure that the diverter plate 130 stably performs its diverting function, allowing the airflow to flow evenly to each air outlet 122, thus ensuring the uniformity of the chip 210 test temperature.

[0050] Please see Figure 1 , Figure 2 , Figure 5 and Figure 7 According to some embodiments of this application, the side of the temperature control chamber 120 facing the test circuit board 200 may be provided with a support leg 160 for supporting the test circuit board 200.

[0051] The support leg 160 is located on the side of the temperature control chamber 120 facing the test circuit board 200, that is, the side of the temperature control chamber 120 closest to the test circuit board 200. Its main function is to stably support the temperature control chamber 120 on the test circuit board 200, maintaining a preset distance between the temperature control chamber 120 and the test circuit board 200. This ensures that the multiple air outlets 122 on the temperature control chamber 120 can be accurately aligned with the corresponding chips 210, while preventing the temperature control chamber 120 from directly pressing on the test circuit board 200 or the chips 210 and causing damage. The support leg 160 can be made of a rigid plastic, metal, or other materials with a certain strength to provide stable support.

[0052] The connection between the support legs 160 and the temperature control box 120 can be integrally formed, meaning the support leg 160 structure is directly formed during the manufacturing of the temperature control box 120; alternatively, it can be connected via detachable methods such as bolts or clips, facilitating the replacement or adjustment of the support legs 160. The number of support legs 160 can be determined based on the size and weight of the temperature control box 120. For example, four support legs 160 can be provided, located at the four corners of the temperature control box 120; or two support legs 160 can be provided, symmetrically distributed on both sides of the temperature control box 120. Using four support legs 160 allows for more even force distribution and more stable support of the temperature control box 120.

[0053] According to some embodiments of this application, the height of the support leg 160 is adjustable.

[0054] The height of the support leg 160 is adjustable to change the distance between the temperature control chamber 120 and the test circuit board 200, ensuring optimal spacing between the air outlet 122 on the temperature control chamber 120 and the corresponding chip 210, thus accommodating test circuit boards 200 of different thicknesses or chip 210 packages of different heights. This adjustability enhances the device's adaptability to different test objects.

[0055] There are several ways to adjust the height of the support leg 160. For example, the support leg 160 can be designed as a screw and sleeve structure, with the sleeve fixed to the temperature control box 120 and the lower end of the screw supporting the test circuit board 200. The overall height of the support leg 160 can be changed by rotating the screw. Alternatively, a multi-section nested structure can be used, with each section connected by elastic buckles and positioning holes. After stretching or retracting the support leg 160 to the required length, the buckles are engaged with the corresponding positioning holes to achieve fixation. A lockable telescopic rod structure can also be used, which is fixed by locking bolts after adjustment to the target height.

[0056] When assembling or replacing the test circuit board 200, adjust the height of each support leg 160 according to the height of the chip 210 and the testing requirements. For example, when the chip 210 on the test circuit board 200 is packaged high, raise the support leg 160 to move the temperature control chamber 120 upwards as a whole, preventing the air outlet 122 from contacting the chip 210; when it is necessary to increase the intensity of the airflow on the chip 210, lower the support leg 160 to shorten the distance between the air outlet 122 and the chip 210. During adjustment, keep each support leg 160 at the same height to ensure that the temperature control chamber 120 is level as a whole, avoiding uneven airflow distribution due to tilting.

[0057] According to some embodiments of this application, the heat preservation box 110 may be provided with multiple temperature control boxes 120, and the temperatures in the multiple temperature control boxes 120 are not the same.

[0058] Multiple temperature control chambers 120 are set inside the test chamber of the insulation box 110. The number is not specifically limited and can be two, three, four or more, depending on the test requirements.

[0059] For example, when two temperature control chambers 120 are set, the two temperature control chambers 120 can be distributed side by side on both sides of the test chamber; when three temperature control chambers 120 are set, they can be arranged in a triangle or in a linear manner.

[0060] Each temperature control chamber 120 has the same structure as the aforementioned temperature control chamber 120, including an air inlet 121, multiple air outlets 122, and a diffuser 130. Each temperature control chamber 120 can independently receive airflow at different temperatures. Taking three temperature control chambers 120 with different internal temperatures as an example, one receives a low-temperature airflow of -40℃, another receives a normal-temperature airflow of 25℃, and the third receives a high-temperature airflow of 85℃. This results in different temperatures for each temperature control chamber 120, allowing multiple independent temperature testing zones to exist simultaneously within the insulation box 110. This enables simultaneous temperature resistance testing of different batches or types of chips 210 under different temperature conditions without the need for repeated changes in test parameters or disassembly and reassembly of devices, significantly improving testing efficiency.

[0061] It should be noted that among the multiple temperature control chambers 120, some of the temperature control chambers 120 may have the same temperature.

[0062] According to some embodiments of this application, a baffle may be provided inside the temperature control box 120, which divides the internal space of the temperature control box 120 into multiple temperature control chambers. The air inlet 121 is provided with multiple corresponding to the multiple temperature control chambers, and the diverter plate 130 is provided with multiple corresponding to the multiple temperature control chambers. The temperatures in the multiple temperature control chambers are not consistent.

[0063] The baffle is installed inside the temperature control chamber 120. The material can be the same as that of the temperature control chamber 120, such as metal or high-temperature resistant plastic. The number of baffles can be determined according to the number of temperature control chambers required. For example, if it needs to be divided into two temperature control chambers, one baffle is installed; if it needs to be divided into three temperature control chambers, two baffles are installed.

[0064] The baffle plate must be tightly connected to the inner wall of the temperature control chamber 120. This can be achieved through welding, bolt fixing, or sealing with sealant, ensuring that the airflow between each temperature control chamber is not interconnected and that temperatures are independent. Multiple air inlets 121 correspond one-to-one with multiple temperature control chambers, meaning each temperature control chamber has its own dedicated air inlet 121 for receiving airflow at the corresponding temperature. Multiple flow dividers 130 also correspond one-to-one with multiple temperature control chambers. Each flow divider 130 is located at the air inlet 121 of its corresponding temperature control chamber, and its function is to divert the airflow input from the air inlet 121 of that temperature control chamber, ensuring that the airflow is evenly distributed within the temperature control chamber to the corresponding air outlet 122. Each temperature control chamber can be connected to airflow of different temperatures through its dedicated air inlet 121. For example, one temperature control chamber can be connected to airflow at -30℃ and another to airflow at 0℃, so that the temperatures of multiple temperature control chambers are inconsistent. Its function is to realize testing of multiple temperature ranges within a single temperature control chamber 120. It is suitable for scenarios where different chips 210 need to be tested at different temperatures on the same test circuit board 200, further improving the testing flexibility of the device.

[0065] It should be noted that some of the temperature control chambers may have the same temperature.

[0066] Please see Figure 1 and Figure 8 According to some embodiments of this application, the temperature resistance testing device 100 further includes a temperature regulating device 170. The output end of the temperature regulating device 170 is provided with an inlet and outlet hood 171. An outlet 172 is provided inside the inlet and outlet hood 171. The outlet 172 is connected to the air inlet 121. The inlet and outlet hood 171 has an exhaust chamber that communicates with the test chamber. An exhaust port 173 that communicates with the exhaust chamber is provided on the inlet and outlet hood 171.

[0067] Temperature regulation device 170, as a device that provides temperature-regulated airflow, serves to provide a stable low-temperature cold air or high-temperature hot air to the entire temperature resistance testing device 100 to meet the temperature requirements of low-temperature or high-temperature testing of chip 210. Temperature regulation device 170 can be a heat flow meter, a low-temperature fan, a hot air fan, or other device capable of generating and outputting temperature-regulated airflow, and its output temperature can be adjusted according to testing requirements. For ease of explanation, the following description will use the low-temperature cold air output by temperature regulation device 170 as an example.

[0068] An inlet / outlet hood 171 is located at the output end of the temperature regulating device 170, serving the dual purpose of connecting the temperature regulating device 170 to the temperature control chamber 120 and venting gas from the test chamber. The outlet 172 inside the inlet / outlet hood 171 is connected to the inlet 121 of the temperature control chamber 120. This connection can be via pipe connection or a direct sealed connection, ensuring that the low-temperature cold air generated by the temperature regulating device 170 can smoothly enter the temperature control chamber 120 through the outlet 172 and the inlet 121. The exhaust chamber inside the inlet / outlet hood 171 is connected to the test chamber of the insulation box 110, allowing gas from the test chamber to enter the exhaust chamber and then exit through the exhaust port 173 on the inlet / outlet hood 171, forming a gas circulation and preventing excessively high gas pressure or gas stagnation in the test chamber from affecting temperature stability.

[0069] An exhaust port 173 is located on the inlet / outlet shroud 171 and communicates with the exhaust chamber. Its function is to discharge the gas in the test chamber to the outside or to a recovery device. The size of the exhaust port 173 can be designed according to the flow rate of the gas in the test chamber, and its position can be located on the side or top of the inlet / outlet shroud 171 to facilitate gas discharge.

[0070] In actual operation, the low-temperature cold air generated by the temperature control device 170 is delivered to the air inlet 121 of the temperature control box 120 through the air outlet 172 inside the air inlet and exhaust hood 171. After being distributed by the temperature control box 120 and the distribution plate 130, it acts on the chip 210 on the test circuit board 200 through multiple air outlets 122. At the same time, the gas in the test chamber enters the exhaust chamber of the air inlet and exhaust hood 171 under the action of air pressure, and is then discharged through the exhaust port 173, forming a continuous airflow circulation.

[0071] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0072] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0073] In the description of this application, "first feature" and "second feature" may include one or more of the features.

[0074] In the description of this application, "multiple" means two or more.

[0075] In the description of this application, the first feature being "above" or "below" the second feature may include the first and second features being in direct contact, or the first and second features being in contact through another feature between them.

[0076] In the description of this application, the terms "above," "over," and "on top" for the first feature and the second feature include the first feature being directly above or diagonally above the second feature, or simply indicate that the first feature is at a higher horizontal level than the second feature.

[0077] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0078] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A temperature resistance testing device, characterized in that, include: An insulated box with a test cavity for accommodating test circuit boards; A temperature control chamber is located inside the test chamber. The temperature control chamber is equipped with an air inlet and multiple air outlets. Each of the multiple air outlets corresponds to a chip on the test circuit board. A flow divider is located inside the temperature control box and corresponds to the air inlet.

2. The temperature resistance testing device according to claim 1, characterized in that, It also includes multiple nozzles, which are installed one-to-one with the multiple air outlets, and the airflow of each nozzle is adjustable.

3. The temperature resistance testing device according to claim 2, characterized in that, A temperature measuring device is provided at the nozzle.

4. The temperature resistance testing device according to claim 1, characterized in that, The air inlet is located on the first side of the temperature control box, and the plurality of air outlets are located on the second side of the temperature control box opposite to the first side. The diverter plate is spaced between the first side and the second side.

5. The temperature resistance testing device according to claim 4, characterized in that, The diverter plate is fixedly connected to the first side via a connecting rod.

6. The temperature resistance testing device according to claim 5, characterized in that, The height of the connecting rod inside the temperature control box is adjustable.

7. The temperature resistance testing device according to any one of claims 1-6, characterized in that, The insulation box contains multiple temperature control chambers, and the temperatures within these chambers are inconsistent; and / or, The temperature control box is equipped with a baffle plate, which divides the internal space of the temperature control box into multiple temperature control chambers. The air inlet has multiple corresponding to the multiple temperature control chambers, and the flow divider has multiple corresponding to the multiple temperature control chambers. The temperature in the multiple temperature control chambers is not the same.

8. The temperature resistance testing device according to any one of claims 1-6, characterized in that, The temperature control chamber has a support leg on the side facing the test circuit board for supporting the test circuit board.

9. The temperature resistance testing device according to claim 8, characterized in that, The height of the support leg is adjustable.

10. The temperature resistance testing device according to any one of claims 1-6, characterized in that, It also includes a temperature control device, the output end of which is provided with an air inlet and outlet hood, an air outlet is provided inside the air inlet and outlet and is connected to the air inlet, the air inlet and outlet hood has an exhaust chamber that communicates with the test chamber, and the air inlet and outlet hood is provided with an exhaust port that communicates with the exhaust chamber.

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