A curing apparatus for semiconductor packages

Abstract

This utility model discloses a curing apparatus for semiconductor packaging, relating to the field of semiconductor processing technology. It includes a carrier and a carrier frame for placing the carrier; the carrier includes a substrate with a receiving cavity and positioning holes at its four corners; the carrier frame includes a base, with supports consisting of a pair of columns on each side of the upper surface of the base; several support modules are evenly spaced on the support; each support module includes a connecting sleeve connected to the columns, a telescopic rod connected to one side of the connecting sleeve, and a positioning post penetrating the positioning hole at the end of the telescopic rod. This utility model achieves precise three-dimensional positioning of the carrier through the telescopic rod supported by the columns and the positioning post penetrating the positioning hole of the carrier; and the spacing between the upper and lower carrier layers can be adjusted as needed by adjusting the position on the connecting sleeve.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor processing technology, and in particular relates to a curing device for semiconductor packaging. Background Technology

[0002] In semiconductor packaging, wafers from the front-end processes are diced into individual dies. These dies are then mounted onto a substrate using an encapsulating adhesive such as epoxy resin. Metal wires or conductive posts connect the die's bonding pads to the corresponding pins on the substrate to form the desired circuitry. Finally, the wafers are encapsulated for protection. After encapsulation, the encapsulating adhesive used in the mounting and encapsulation processes is typically cured in a curing machine to improve bonding, prevent oxidation, and release stress. Existing curing equipment suffers from low efficiency when multiple carriers are stacked, and there is a risk of detachment when placed on a fixed carrier frame during controlled movement. Furthermore, existing carrier stacks cannot remove carriers located in the middle without affecting the stability of other carriers. Utility Model Content

[0003] The purpose of this invention is to provide a curing device for semiconductor packaging, which achieves precise three-dimensional positioning of the carrier by means of a telescopic rod supported by a column and a positioning post penetrating the positioning hole of the carrier, thus solving the problems raised in the prior art.

[0004] To solve the above-mentioned technical problems, this utility model is achieved through the following technical solution: This utility model relates to a curing device for semiconductor packaging, comprising a carrier and a carrier frame for placing the carrier; the carrier includes a substrate with a receiving cavity and positioning holes at its four corners; the carrier frame includes a base with a support consisting of a pair of columns on each side of the upper surface of the base; several support modules are evenly spaced on the support; each support module includes a connecting sleeve connected to the columns, a telescopic rod connected to one side of the connecting sleeve, and a positioning post penetrating the positioning hole at the end of the telescopic rod; the telescopic rod supported by the columns and the positioning post penetrating the positioning hole of the carrier achieve three-dimensional precise positioning of the carrier; and the spacing between the upper and lower carriers can be adjusted as needed by adjusting the position on the connecting sleeve.

[0005] Furthermore, the telescopic rod includes an outer sleeve and an inner sleeve that cooperate with each other; the outer sleeve is fixed to one side of the connecting sleeve, and the positioning post is fixed to the inner end of the inner sleeve. The outer sleeve and the inner sleeve cooperate to provide axial telescopic stroke; the top of the positioning post is provided with a limiting plate that passes through the positioning hole. The limiting plate passes through the positioning hole to form a mechanical limit, so as to avoid the displacement of the vehicle caused by vibration.

[0006] Furthermore, a connecting rod is connected between the two connecting sleeves on the same support module.

[0007] Furthermore, the inner walls of the two outer sleeves of the same support module are each provided with rectangular holes along their length; it also includes a movable rod, the two ends of which pass through the rectangular holes and are connected to the two inner sleeves of the same support module; the middle of the movable rod is connected to an L-shaped connecting frame, and the upper and lower ends of the L-shaped connecting frame are respectively connected to a limiting part and an operating part, so that the movable rod passing through the rectangular holes can be used to control the synchronous movement of the two inner sleeves.

[0008] Furthermore, it also includes a diagonal tie rod connected to the base, the end of which is connected to a connecting seat with an L-shaped block structure, the connecting seat being connected to the column / connecting sleeve.

[0009] Furthermore, the connecting seat is provided with connecting bolts, and the column / connecting sleeve is provided with threaded holes that are threadedly connected to the connecting bolts, so that the connecting bolts and threaded holes can be modularly and quickly disassembled.

[0010] This utility model has the following beneficial effects: 1. This utility model achieves three-dimensional precise positioning of the vehicle by using the telescopic rod of the upright support and the positioning column through the positioning hole of the vehicle; and adjusts the distance between the upper and lower vehicles by adjusting the position of the connecting sleeve as needed.

[0011] 2. The top of the positioning column of this utility model is provided with a limiting plate that passes through the positioning hole. The limiting plate passes through the positioning hole to form a mechanical limit, thereby preventing the vehicle from shifting due to vibration.

[0012] 3. In this utility model, the movable rod passes through the rectangular hole of the outer sleeve and connects to the double inner sleeve rod, so as to realize the synchronous extension and retraction of the double inner sleeve rod on the same support module.

[0013] Of course, any product implementing this utility model does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0014] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a schematic diagram of the cooperation between the vehicle and the vehicle frame in Embodiment 1 of this utility model; Figure 2 This is a schematic diagram of the vehicle structure according to Embodiment 1 of this utility model; Figure 3 This is a schematic diagram of the vehicle frame structure in Embodiment 1 of this utility model; Figure 4 This is a schematic diagram of the vehicle frame structure in Embodiment 2 of this utility model; Figure 5 for Figure 4 Enlarged view of a portion of point A in the middle; Figure 6 This is a schematic diagram of the vehicle frame structure in Embodiment 3 of this utility model; Figure 7 for Figure 6 Enlarged view of a section at point B in the middle; The attached diagram lists the components represented by each number as follows: 1-Base, 3-Carrier, 11-Column, 12-Connecting sleeve, 13-Connecting rod, 14-Outer sleeve, 15-Inner sleeve rod, 16-Positioning column, 17-Modular rod, 18-L-shaped connecting frame, 19-Diagonal tie rod, 30-Base plate, 31-Receiving cavity, 32-Positioning hole, 141-Rectangular hole, 161-Limiting plate, 181-Limiting part, 182-Operating part, 191-Connecting seat, 192-Connecting bolt. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0017] In the description of this utility model, it should be understood that the terms "opening", "upper", "lower", "thickness", "top", "middle", "length", "inner", "around" and other terms indicating orientation or positional relationship are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the components or elements referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0018] Example 1: Please see Figure 1-3 As shown, this utility model is a curing device for semiconductor packaging, including a carrier frame and a plurality of carriers 3 placed thereon. The carrier 3 includes a substrate 30, and a receiving cavity 31 is provided on the substrate 30. In use, the semiconductor product is placed on the receiving cavity 31, then the carrier 3 is placed on the carrier frame, and finally the entire carrier frame is sent into the curing chamber for curing.

[0019] To facilitate the placement of the carrier 3 layer by layer onto the carrier frame, and to prevent the carrier 3 from shifting on the carrier frame due to vibration, this application provides positioning holes 32 on the four corner sides of the substrate 30, and the carrier frame includes a base 1, with a bracket consisting of a pair of columns 11 on both sides of the upper surface of the base 1; several support modules are provided on the bracket with equal intervals; the support module includes a connecting sleeve 12 connected to the column 11, a telescopic rod connected to one side of the connecting sleeve 12, and a positioning post 16 penetrating the positioning hole 32 at the end of the telescopic rod.

[0020] Specifically, based on the above, in order to prevent the vehicle 3 from falling off the vehicle frame due to shaking, a limiting plate 161 passing through the positioning hole 32 is provided at the top of the positioning post 16.

[0021] Specifically, the telescopic rod includes an outer sleeve 14 and an inner sleeve 15 that cooperate with each other; the outer sleeve 14 is fixed on one side of the connecting sleeve 12, the positioning post 16 is fixed on the inner end of the inner sleeve 15, and a connecting rod 13 connects the two connecting sleeves 12 on the same support module.

[0022] The specific steps for placing vehicle 3 onto the vehicle rack include: The support modules of the two brackets are extended towards each other, that is, the inner sleeve rods 15 located on both sides of the upper surface of the base 1 are pulled out towards the center of the base 1. Then the carrier 3 is placed on the support surface formed by the four inner sleeve rods 15, and the limiting plate 161 and the positioning post 16 pass through the positioning hole 32.

[0023] Example 2: Based on Example 1 above, as follows... Figure 4-5 To facilitate the movement of the inner sleeve rod 15 relative to the outer sleeve tube 14 during use, rectangular holes 141 are opened along the length direction on the inner wall surface of both outer sleeve tubes 14 in the same support module; it also includes a movable rod 17, with both ends of the movable rod 17 passing through the rectangular holes 141 and connected to the two inner sleeve rods 15 in the same support module; and to restrict the movement of the inner sleeve rod 15 relative to the outer sleeve tube 14, a limiting part 181 is installed on the bottom side of the end of the L-shaped connecting frame 18. The limiting part 181 can be installed at any position along the length direction of the horizontal section of the L-shaped connecting frame 18, and to facilitate the operation and control of the L-shaped connecting frame 18, an operating part 182 is installed on the upper surface of the end of the L-shaped connecting frame 18.

[0024] Example 3: Based on Example 1 or 2, in order to improve the stability of the connection between the base 1 and the column 11, such as... Figure 6-7A diagonal brace 19 is fixed on the upper surface of the base 1. The end of the diagonal brace 19 is connected to a connecting seat 191 with an L-shaped block structure. A connecting bolt 192 is provided on the connecting seat 191. A threaded hole is provided on the column 11 / connecting sleeve 12 for threaded connection with the connecting bolt 192. That is, during actual installation, the connecting seat 191 is connected to the column 11 / connecting sleeve 12 by the action of the connecting bolt 192.

[0025] The connecting sleeve 12 is fixed to the column 11 by welding, pinning, or bolting.

[0026] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0027] The preferred embodiments of this utility model disclosed above are merely illustrative of the present utility model. These preferred embodiments do not exhaustively describe all details, nor do they limit the utility model to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of this utility model, thereby enabling those skilled in the art to better understand and utilize it. This utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A curing apparatus for semiconductor packaging, characterized in that: Includes the vehicle (3) and the vehicle rack for placing the vehicle (3); The carrier (3) includes a base plate (30), a receiving cavity (31) is provided on the base plate (30), and positioning holes (32) are provided on the four corner sides of the base plate (30). The vehicle frame includes a base (1), and the upper surface of the base (1) is provided with a bracket composed of a pair of columns (11) on both sides; The bracket is provided with several support modules at equal intervals; The support module includes a connecting sleeve (12) connected to the column (11), a telescopic rod connected to one side of the connecting sleeve (12), and a positioning post (16) with a through positioning hole (32) provided at the end of the telescopic rod.

2. The curing apparatus for semiconductor packaging according to claim 1, characterized in that, The telescopic rod includes an outer sleeve (14) and an inner sleeve (15) that cooperate with each other. The outer sleeve (14) is fixed to one side of the connecting sleeve (12), and the positioning post (16) is fixed to the inner end of the inner sleeve rod (15).

3. The curing apparatus for semiconductor packaging according to claim 2, characterized in that, The top of the positioning post (16) is provided with a limiting plate (161) that passes through the positioning hole (32).

4. The curing apparatus for semiconductor packaging according to claim 2, characterized in that, A connecting rod (13) is connected between two connecting sleeves (12) on the same support module.

5. A curing apparatus for semiconductor packaging according to claim 2, characterized in that, The inner walls of the two outer sleeves (14) of the same support module are provided with rectangular holes (141) along their length direction; it also includes a movable rod (17), the two ends of which pass through the rectangular holes (141) and are connected to the two inner sleeves (15) of the same support module. The middle part of the movable rod (17) is connected to an L-shaped connecting frame (18), and the upper and lower sides of the L-shaped connecting frame (18) are respectively connected to a limiting part (181) and an operating part (182).

6. The curing apparatus for semiconductor packaging according to claim 1, characterized in that, It also includes a diagonal brace (19) connected to the base (1), the end of which is connected to a connecting seat (191) with an L-shaped block structure, the connecting seat (191) being connected to the column (11) / connecting sleeve (12).

7. A curing apparatus for semiconductor packaging according to claim 6, characterized in that, The connecting seat (191) is provided with a connecting bolt (192), and the column (11) / connecting sleeve (12) is provided with a threaded hole that is threadedly connected to the connecting bolt (192).

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