A composite competitive computer mainboard heat dissipation structure

Abstract

The utility model relates to computer accessories field discloses a compound formula competitive computer mainboard heat radiation structure, including system board, the upper surface of system board is installed with radiator, the lower surface fixed connection of radiator has sole, the lower surface of sole is provided with clamping assembly, clamping assembly includes rotation cover, rotation cover detachable connection is in the lower surface of sole, the outer wall fixed connection of rotation cover has hinged block, the inner wall hinged of hinged block has ratchet pawl. In the utility model, when needing to replace the heat -conducting silicone grease, only need to rotate rotation cover, and the thread cooperation of rotation cover and threaded rod will drive clamping assembly to go up, then dial dial block and make the card block to go up and unlock the handle restriction, rotate handle and drive ratchet wheel rotation, make the sliding rod retract into rotation cover, first spring elastic reset drive ratchet pawl rotation and unlock sole, take down radiator and replace heat -conducting silicone grease.

Description

Technical Field

[0001] This utility model relates to the field of computer accessories, and in particular to a composite heat dissipation structure for gaming computer motherboards. Background Technology

[0002] The computer motherboard is one of the most basic and important components of a computer. As the core of the computer hardware system, it provides installation slots and connection interfaces for key components such as the CPU, memory, graphics card, and hard drive. Its performance and compatibility directly affect the overall operating efficiency of the computer. It is indispensable in various computer devices such as desktops and laptops and is the basic hardware that ensures the normal startup and operation of the computer.

[0003] During the use of gaming computer motherboards, thermal paste needs to be replaced regularly to ensure heat dissipation efficiency. However, most existing motherboard heatsinks use traditional fixing methods. Since disassembly requires the use of special tools to gradually disassemble the fixing structure, the operation steps are cumbersome. This makes the process of replacing thermal paste each time take a long time, which not only affects the normal use of the computer, but may also delay the equipment debugging and use needs in gaming scenarios due to long downtime. Utility Model Content

[0004] To overcome the above shortcomings, this utility model provides a composite heat dissipation structure for gaming computer motherboards, aiming to solve the problem in the prior art that "because the motherboard heatsink adopts a traditional fixing method, it will take a long time to replace the thermal grease".

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a composite gaming computer motherboard heat dissipation structure, including a system board, a heat sink mounted on the upper surface of the system board, a foot fixedly connected to the lower surface of the heat sink, and a clamping component provided on the lower surface of the foot; The clamping assembly includes a rotating sleeve detachably connected to the lower surface of the base. A hinge block is fixedly connected to the outer wall of the rotating sleeve, and a pawl is hinged to the inner wall of the hinge block. The pawl is elastically connected to the outer wall of the rotating sleeve via a first spring. A rotating ring and a limiting ring are rotatably connected to the inner wall of the rotating sleeve. A ratchet is fixedly connected to the lower surface of the rotating ring, and a connecting sleeve is fixedly connected to the lower surface of the ratchet. A threaded rod is threadedly connected to the inner wall of the rotating sleeve. A limiting sleeve is fixedly connected to the inner wall of the limiting sleeve, and a sliding rod is slidably connected to the inner wall of the limiting sleeve. A ball bearing is provided on the inner wall of the pawl, and a locking assembly is provided on the inner wall of the rotating sleeve.

[0006] As a further description of the above technical solution: The limiting ring is fixedly connected to the upper surface of the rotating ring, the threaded rod is rotatably connected to the inner wall of the ratchet and the connecting sleeve, the lower end of the threaded rod is fixedly connected to the inner wall of the system plate, and the ball slides on the upper surface of the foot.

[0007] As a further description of the above technical solution: The locking assembly includes a locking block that is slidably connected to the inner wall of the rotating sleeve. Limiting blocks are fixedly connected to both ends of the locking block, and the limiting blocks are elastically connected to the inner wall of the rotating sleeve through a second spring.

[0008] As a further description of the above technical solution: A connecting block is fixedly connected to the front end of the card block, a lever is fixedly connected to the outer wall of the connecting block, and a handle is fixedly connected to the front end of the connecting sleeve.

[0009] As a further description of the above technical solution: The hinge blocks are provided in multiple sets, and the multiple sets of hinge blocks are arranged in a rotating array on the outer wall of the rotating sleeve with the center line of the rotating sleeve as the rotation axis. The pawls are provided in multiple sets, and the multiple sets of pawls are arranged in a rotating array on the inner wall of the hinge blocks with the center line of the rotating sleeve as the rotation axis.

[0010] As a further description of the above technical solution: The limiting sleeve is provided in multiple sets, and the multiple sets of limiting sleeves are arranged in a rotating array on the inner wall of the rotating sleeve with the center line of the rotating sleeve as the rotation axis. The sliding rod is provided in multiple sets, and the multiple sets of sliding rods are arranged in a rotating array on the inner wall of the limiting sleeve with the center line of the rotating sleeve as the rotation axis.

[0011] As a further description of the above technical solution: The lower end of the card block is designed with an inclined structure.

[0012] As a further description of the above technical solution: The cross-section of the push block is designed with an L-shaped structure.

[0013] This utility model has the following beneficial effects: 1. In this utility model, by means of the clamping and locking components provided on the lower surface of the foot, when it is necessary to replace the thermal grease, simply rotate the rotating sleeve. The threaded engagement between the rotating sleeve and the threaded rod will cause the clamping component to move upward. Then, move the lever to move the locking block upward to unlock the handle restriction. Rotate the handle to drive the ratchet to rotate, causing the sliding rod to retract into the rotating sleeve. The first spring elastically resets and drives the pawl to rotate to unlock the foot. In this way, the heat sink can be removed and the thermal grease can be replaced, thereby shortening the replacement time and avoiding delays in equipment debugging in competitive scenarios due to long downtime.

[0014] 2. In this utility model, by rotating the threaded rod on the inner wall of the rotating sleeve, after replacing the thermal grease, align the bottom of the heat sink with the top of the rotating sleeve, rotate the handle to drive the ratchet to rotate, causing the sliding rod to extend and squeeze the pawl. The top of the pawl forms a limit on the bottom. Because the lower end of the clamping block has an inclined structure, rotating the handle causes the clamping block to move upward. After the clamping block moves downward, it limits the handle. Then, rotating the rotating sleeve causes the clamping assembly to move downward through the threaded engagement with the threaded rod, so that the lower end of the heat sink clamps the CPU. In this way, the thermal grease can be replaced, and the installation gap can be reduced. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of the overall device in this utility model; Figure 2 This is a three-dimensional structural breakdown diagram of the radiator in this utility model; Figure 3 In this utility model Figure 2 Enlarged schematic diagram of the three-dimensional structure of part A in the middle; Figure 4 This is a three-dimensional cross-sectional view of the clamping assembly in this utility model; Figure 5 This is a three-dimensional sectional view of the threaded rod in this utility model. Figure 6 This is a three-dimensional structural disassembly diagram of the pawl in this utility model; Figure 7 This is a three-dimensional sectional view of the locking component in this utility model.

[0016] Legend: 1. System board; 2. Clamping assembly; 21. Rotating sleeve; 22. Hinge block; 23. Pawl; 24. First spring; 25. Rotating ring; 26. Limiting ring; 27. Ratchet; 28. Connecting sleeve; 29. ​​Threaded rod; 211. Limiting sleeve; 212. Sliding rod; 213. Ball bearing; 3. Locking assembly; 31. Locking block; 32. Limiting block; 33. Second spring; 34. Connecting block; 35. Handle; 36. Pulley; 4. Radiator; 5. Foot. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0018] Reference Figure 1 - Figure 3This utility model provides an embodiment of a composite gaming computer motherboard heat dissipation structure, including a system board 1. The system board 1 is a key basic component ensuring the overall heat dissipation structure is compatible with the computer motherboard. A heat sink 4 is mounted on the upper surface of the system board 1. The heat sink 4 is used to quickly conduct and dissipate the heat generated by the CPU during operation, preventing the CPU from throttling due to high temperature. A foot 5 is fixedly connected to the lower surface of the heat sink 4. The foot 5 is a connecting bridge between the heat sink 4 and the clamping assembly 2, enabling the heat sink 4 to be detachably installed. The clamping assembly 2 is provided on the lower surface of the foot 5. The clamping assembly 2 is used to clamp the heat sink 4. The clamping assembly 2 includes a rotating sleeve 21. The rotating sleeve 21 is used to form a threaded engagement with the threaded rod 29 by its own rotation, driving... The entire clamping assembly 2 moves up and down to clamp and release the radiator 4. The rotating sleeve 21 is detachably connected to the lower surface of the foot 5. The outer wall of the rotating sleeve 21 is fixedly connected to the hinge block 22, which is the hinge support structure of the pawl 23. It provides a rotation fulcrum for the pawl 23, allowing the pawl 23 to rotate around the hinge point, thereby achieving the limit unlocking and locking of the foot 5. The inner wall of the hinge block 22 is hinged to the pawl 23, which is used to limit the foot 5 and fix the radiator 4. The pawl 23 is elastically connected to the outer wall of the rotating sleeve 21 through the first spring 24. The first spring 24 provides elastic restoring force for the pawl 23. The material of the first spring 24 is 310S stainless steel, which further improves the elastic stability at high temperature.

[0019] Reference Figure 1 - Figure 3The inner wall of the rotating sleeve 21 is rotatably connected to a rotating ring 25 and a limiting ring 26. The rotating ring 25 drives the ratchet 27 to rotate synchronously on the inner wall of the rotating sleeve 21. The limiting ring 26 limits the rotating ring 25 to prevent it from moving up and down along the inner wall of the rotating sleeve 21 during rotation. The lower surface of the rotating ring 25 is fixedly connected to the ratchet 27, which cooperates with the sliding rod 212 to push the sliding rod 212 to slide within the limiting sleeve 211, thereby squeezing and releasing the pawl 23. The lower surface of the ratchet 27 is fixedly connected to a connecting sleeve 28, which transmits the rotational force of the handle 35 to the ratchet 27. Rotating the handle 35 drives the ratchet 27 to rotate. The inner wall of the rotating sleeve 21 is threadedly connected to a threaded rod 29, which is used to connect with the rotating sleeve... The threaded engagement of 21 converts the rotational motion of the rotating sleeve 21 into vertical linear motion, thereby driving the clamping assembly 2 to lift and lower as a whole, realizing the clamping and loosening of the radiator 4. The inner wall of the rotating sleeve 21 is fixedly connected to the limiting sleeve 211, which provides sliding guidance and limitation for the sliding rod 212, restricting the sliding rod 212 to move only along its own axis. The inner wall of the limiting sleeve 211 is slidably connected to the sliding rod 212, which is used to rotate the pawl 23 when the ratchet 27 rotates, realizing the clamping or loosening of the foot 5. The inner wall of the pawl 23 is provided with a ball bearing 213, which is used to reduce the friction between the pawl 23 and the foot 5. The inner wall of the rotating sleeve 21 is provided with a locking assembly 3, which is used to prevent the handle 35 from accidentally loosening and causing the radiator 4 to fall off.

[0020] Reference Figure 5 - Figure 7The limiting ring 26 is fixedly connected to the upper surface of the rotating ring 25. The threaded rod 29 is rotatably connected to the inner wall of the ratchet 27 and the connecting sleeve 28. The lower end of the threaded rod 29 is fixedly connected to the inner wall of the system plate 1. The ball 213 slides on the upper surface of the foot 5. The locking assembly 3 includes a locking block 31, which is used to limit the reverse rotation of the handle 35, thereby locking the position of the ratchet 27 and the sliding rod 212. The locking block 31 is slidably connected to the inner wall of the rotating sleeve 21. Limiting blocks 32 are fixedly connected to both the left and right ends of the locking block 31. The limiting blocks 32 are used to limit the sliding direction of the locking block 31 to prevent the locking block 31 from shifting or falling off during the up and down sliding process. The limiting blocks 32 are connected to the inner wall of the rotating sleeve 21 by the second spring 33. The second spring 33 provides elastic restoring force to the locking block 31. The second spring 33 is made of 310S stainless steel, which further improves the elastic stability at high temperatures. The front end of the locking block 31 is fixedly connected to a connecting block 34. The connecting block 34 is used to indirectly drive the locking block 31 upward by moving the lever 36, thereby releasing the lock on the handle 35. The outer wall of the connecting block 34 is fixedly connected to the lever 36. The lever 36 is used to drive the locking block 31 upward by moving the connecting block 34, thereby quickly releasing the lock on the handle 35. The front end of the connecting sleeve 28 is fixedly connected to a handle 35. The handle 35 is used by the operator to rotate the handle 35 to drive the connecting sleeve 28 and the ratchet 27 to rotate synchronously, thereby controlling the sliding of the sliding rod 212.

[0021] Reference Figure 4 - Figure 5 Multiple sets of hinge blocks 22 are provided, and the multiple sets of hinge blocks 22 are arranged in a rotating array on the outer wall of the rotating sleeve 21 with the center line of the rotating sleeve 21 as the rotation axis. Multiple sets of pawls 23 are provided, and the multiple sets of pawls 23 are arranged in a rotating array on the inner wall of the hinge blocks 22 with the center line of the rotating sleeve 21 as the rotation axis. Multiple sets of limiting sleeves 211 are provided, and the multiple sets of limiting sleeves 211 are arranged in a rotating array on the inner wall of the rotating sleeve 21 with the center line of the rotating sleeve 21 as the rotation axis. Multiple sets of sliding rods 212 are provided, and the multiple sets of sliding rods 212 are arranged in a rotating array on the inner wall of the limiting sleeve 211 with the center line of the rotating sleeve 21 as the rotation axis. The lower end of the locking block 31 is set with an inclined structure. The cross-section of the lever block 36 is set with an L-shaped structure. The L-shaped structure of the lever block 36 increases the contact area of ​​the hand, and the user can easily move the lever block 36.

[0022] Working principle: When it is necessary to replace the thermal paste between the CPU and the heatsink 4, the operator manually rotates the rotating sleeve 21. The rotational motion of the rotating sleeve 21 is converted into an upward linear motion, which in turn drives the entire clamping assembly 2 to move upward synchronously, causing the heatsink 4 to disengage from the CPU surface. Then, the operator moves the lever 36, which, through the connecting block 34, drives the locking block 31 to slide upward along the inner wall of the rotating sleeve 21. At this time, the limiting blocks 32 at both ends of the locking block 31 compress the second spring 33, and the lower end of the locking block 31 connects with the handle 35. Disengage the latch and release the restriction on the reverse rotation of the handle 35. Rotate the handle 35, and the handle 35 will drive the connecting sleeve 28 to rotate synchronously. The connecting sleeve 28 will drive the ratchet 27 above to rotate. As the ratchet 27 rotates, the pushing force of its tooth structure on the sliding rod 212 disappears, and the sliding rod 212 naturally retracts within the limiting sleeve 211. At this time, the first spring 24 releases its elastic potential energy, pushing the pawl 23 to rotate around the hinge point of the hinge block 22. The pawl 23 disengages from the foot 5, thus releasing the lateral restriction on the foot 5.

[0023] Once the longitudinal clamping force and the lateral limit are released, lift the heatsink 4 directly. This will allow you to remove the heatsink 4 and the base 5 from the top of the system board 1. Afterward, you can clean the CPU surface and the bottom of the heatsink 4 and replace the thermal paste.

[0024] After replacing the thermal grease, align the bottom foot 5 of the heat sink 4 with the top of the rotating sleeve 21, and slowly lower the heat sink 4 so that the bottom foot 5 fits against the upper surface of the rotating sleeve 21 to complete the initial positioning. Then, rotate the handle 35 in the opposite direction. The handle 35 will drive the connecting sleeve 28 and the ratchet 27 to rotate in sequence. The toothed structure of the ratchet 27 pushes the sliding rod 212 to extend outward along the inner wall of the limiting sleeve 211. The sliding rod 212 squeezes the pawl 23, causing the pawl 23 to rotate around the hinge block 22 and fit against the outer wall of the bottom foot 5, forming a lateral limit on the bottom foot 5. At the same time, when the handle 35 rotates, it will squeeze the inclined surface of the locking block 31, push the locking block 31 to move upward and compress the second spring 33.

[0025] Once the pawl 23 is tightly engaged with the base 5, stop rotating the handle 35. The second spring 33 releases its elastic potential energy, pushing the limit block 32 and the locking block 31 to slide downwards. The lower end of the locking block 31 engages in the gap of the handle 35, restricting the handle 35 from rotating in the opposite direction. This locks the position of the ratchet 27 and the sliding rod 212, ensuring that the pawl 23 is stably positioned on the base 5. Manually rotate the rotating sleeve 21 in the opposite direction. The rotating sleeve 21 moves downwards along the threaded structure of the threaded rod 29, causing the entire clamping assembly 2 to move downwards synchronously. The clamping assembly 2 pushes the heatsink 4 downwards through the base 5 until the bottom of the heatsink 4 is tightly engaged with the CPU surface. This completes the longitudinal clamping. At this point, the heatsink 4 is installed in place and can perform its heat dissipation function normally.

[0026] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A composite heat dissipation structure for a gaming computer motherboard, comprising a system board (1), characterized in that: A heat sink (4) is installed on the upper surface of the system board (1), and a foot (5) is fixedly connected to the lower surface of the heat sink (4). A clamping assembly (2) is provided on the lower surface of the foot (5). The clamping assembly (2) includes a rotating sleeve (21), which is detachably connected to the lower surface of the base (5). A hinge block (22) is fixedly connected to the outer wall of the rotating sleeve (21), and a pawl (23) is hinged to the inner wall of the hinge block (22). The pawl (23) is elastically connected to the outer wall of the rotating sleeve (21) through a first spring (24). A rotating ring (25) and a limiting ring (26) are rotatably connected to the inner wall of the rotating sleeve (21). 5) The lower surface of the rotating sleeve (21) is fixedly connected to a ratchet (27), the lower surface of the ratchet (27) is fixedly connected to a connecting sleeve (28), the inner wall of the rotating sleeve (21) is threadedly connected to a threaded rod (29), the inner wall of the rotating sleeve (21) is fixedly connected to a limiting sleeve (211), the inner wall of the limiting sleeve (211) is slidably connected to a sliding rod (212), the inner wall of the pawl (23) is provided with a ball (213), and the inner wall of the rotating sleeve (21) is provided with a locking component (3).

2. The composite gaming computer motherboard heat dissipation structure according to claim 1, characterized in that: The limiting ring (26) is fixedly connected to the upper surface of the rotating ring (25), the threaded rod (29) is rotatably connected to the inner wall of the ratchet (27) and the connecting sleeve (28), the lower end of the threaded rod (29) is fixedly connected to the inner wall of the system plate (1), and the ball (213) slides on the upper surface of the foot (5).

3. The composite gaming computer motherboard heat dissipation structure according to claim 1, characterized in that: The locking assembly (3) includes a locking block (31), which is slidably connected to the inner wall of the rotating sleeve (21). Limiting blocks (32) are fixedly connected to both the left and right ends of the locking block (31). The limiting blocks (32) are elastically connected to the inner wall of the rotating sleeve (21) through a second spring (33).

4. The composite gaming computer motherboard heat dissipation structure according to claim 3, characterized in that: The front end of the card block (31) is fixedly connected to a connecting block (34), the outer wall of the connecting block (34) is fixedly connected to a toggle block (36), and the front end of the connecting sleeve (28) is fixedly connected to a handle (35).

5. The composite gaming computer motherboard heat dissipation structure according to claim 1, characterized in that: The hinge block (22) is provided in multiple sets, and the multiple sets of hinge blocks (22) are arranged in a rotating array on the outer wall of the rotating sleeve (21) with the center line of the rotating sleeve (21) as the rotation axis. The pawl (23) is provided in multiple sets, and the multiple sets of pawl (23) are arranged in a rotating array on the inner wall of the hinge block (22) with the center line of the rotating sleeve (21) as the rotation axis.

6. The composite gaming computer motherboard heat dissipation structure according to claim 1, characterized in that: The limiting sleeve (211) is provided in multiple sets, and the multiple sets of the limiting sleeve (211) are arranged in a rotating array on the inner wall of the rotating sleeve (21) with the center line of the rotating sleeve (21) as the rotation axis. The sliding rod (212) is provided in multiple sets, and the multiple sets of the sliding rod (212) are arranged in a rotating array on the inner wall of the limiting sleeve (211) with the center line of the rotating sleeve (21) as the rotation axis.

7. The composite gaming computer motherboard heat dissipation structure according to claim 3, characterized in that: The lower end of the card block (31) is configured as an inclined structure.

8. The composite gaming computer motherboard heat dissipation structure according to claim 4, characterized in that: The cross-section of the pusher block (36) is set as an L-shaped structure.

Images