Wafer singulation die testing apparatus

Abstract

The utility model provides a kind of wafer segmentation chip testing device, including test platform, and be located the piece table of test platform surface, its top surface sets up chip seat;Base, three-axis motion module, mounting plate body and test probe card are set on it;Multi-axis displacement adjustment module, support body, optical fiber array and fastening mechanism are set on its movement end;No. 1 visual acquisition module, to detect the connection condition of test probe card and chip;No. 2 visual acquisition module, to detect the position condition of optical fiber array relative to chip.The test probe card for electrical test and the optical fiber array for optical power monitoring are integrated on the same test platform in the application, and are respectively driven by three-axis motion module and multi-axis displacement adjustment module, the synchronization or continuous automatic operation of power-on and monitoring luminous power to optoelectronic chip is realized, the test efficiency is improved, and the cumbersome process of transferring chip between different equipment is avoided.

Description

Technical Field

[0001] This utility model relates to the field of wafer testing technology, specifically, it demonstrates a wafer dicing chip testing device. Background Technology

[0002] With the rapid development of optical communication technology, optoelectronic integrated chips (such as COC, Chip on Carrier) made by wafer dicing have been widely used in high-speed data transmission, sensing and information processing. Such chips need to undergo performance testing before packaging, especially optoelectronic characteristic testing, to verify whether their key parameters such as luminous power and wavelength stability meet the design requirements.

[0003] The existing testing method involves testers directly holding the test electrodes to test the AC light-emitting chip. Since AC power is usually high voltage, exceeding the 36V safety voltage poses a potential danger to the testers. In addition, the testers can only test one optoelectronic integrated chip at a time, which is not efficient. Moreover, the manual operation has low efficiency and accuracy in adjustment. Utility Model Content

[0004] The purpose of this invention is to provide a wafer dicing chip testing device that is simple and practical in structure, has high testing efficiency, and saves time and effort.

[0005] The technical solution is as follows: A wafer dicing chip testing apparatus, comprising: Including the testing machine, and the components located on the surface of the testing machine: A wafer carrier stage, with a chip holder mounted on its top surface; A base is provided on which a three-axis motion module is mounted. A mounting plate is provided on the Z-axis motion end of the three-axis motion module, and a test probe card that extends outward at an angle is provided at the front end of the mounting plate. A multi-axis displacement adjustment module has a support body on its moving end. The front end of the support body faces the chip base and a fiber optic array is mounted on it. A fastening mechanism for positioning the fiber optic array is provided on the side of the support body. The No. 1 vision acquisition module has its illumination end tilted from one side of the chip holder onto the chip surface to detect the connection between the test probe card and the chip. The second vision acquisition module illuminates the chip holder surface vertically downwards from the top of the chip stage to detect the position of the fiber array relative to the chip.

[0006] Optionally, the head end of the support body is provided with an I-shaped slot, and the fiber array is mounted on a housing. The upper part of the housing is provided with a locking part that matches the I-shaped slot, and the housing is installed in an inclined posture. When installing the fiber array, it can be quickly snapped into the predetermined position to complete the initial positioning, saving adjustment time.

[0007] The lower part of the support body is further provided with an extension frame parallel to it at intervals. The head end of the extension frame is provided with a notch for locking the fiber array. The fastening mechanism is provided on the extension frame and is used to apply a compressive force to the fiber array to abut the fiber array within the notch. This provides a second support and positioning point for the fiber array, preventing it from shaking or shifting due to slight external forces or vibrations during testing, and ensuring the stability of the optical path coupling during testing.

[0008] Furthermore, the fastening mechanism includes a pressure arm, the middle of which is hinged to the extension frame. A spring is disposed between the rear of the pressure arm and the outer wall of the extension frame. The spring is always in a compressed state, ensuring that the front end of the pressure arm is always in contact with the outer wall of the fiber array. This design, where the spring is always compressed, allows the front end of the pressure arm to apply a continuous and stable compressive force to the fiber array, firmly securing it within the notch and preventing loosening.

[0009] Optionally, the top surface of the chip holder is provided with two upward-protruding first protrusions and a second protrusion, which are diagonally distributed, and the sidewalls of the first and second protrusions form a right-angled slot. The two diagonally distributed protrusions and the right-angled slot they form perfectly match the right-angled shape of the chip itself, which helps to position the chip.

[0010] Optionally, the first vision acquisition module is mounted on a support frame via a rotating module, and the support frame is fixed to the testing machine. The rotating module allows the vision module to rotate within a certain angle range, thereby enabling observation of the contact between the chip and the test probe card from the optimal angle.

[0011] Optionally, the second vision acquisition module is mounted on a gantry beam via a fine-tuning platform, and the gantry beam is fixed to the testing machine. The fine-tuning platform allows for minute adjustments to the position of the second vision module, which helps to adjust for small positional changes in the fiber array relative to the chip.

[0012] Optionally, the testing platform is provided with two pairs of test probe cards and two pairs of fiber optic arrays. The two test probe cards are distributed in a mirror-symmetric manner with respect to the wafer support stage, and the two fiber optic arrays are also distributed in a mirror-symmetric manner with respect to the wafer support stage. This improves the adaptability of the device, making it suitable for testing at least two types of chips.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows: 1. This application integrates a test probe card for electrical testing and a fiber optic array for optical power monitoring on the same test bench, and drives them separately through a three-axis motion module and a multi-axis displacement adjustment module, thereby realizing synchronous or continuous automated operation of powering on the photoelectric chip (COC) and monitoring its luminous power, improving testing efficiency and avoiding the cumbersome process of transferring chips between different devices.

[0014] 2. The dual vision system can ensure reliable contact between the test probe card and the chip electrode, as well as precise adjustment and control of the distance and angle between the fiber array and the chip's light-emitting surface, thereby ensuring the accuracy of optical power measurement. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of a wafer dicing chip testing device according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the support platform in an embodiment of the present invention; Figure 3 This is a schematic diagram of the chip socket portion in an embodiment of the present invention; Figure 4 This is a schematic diagram of the test probe card part of an embodiment of this utility model; Figure 5 This is a schematic diagram of the fiber optic array portion of an embodiment of the present invention; Figure 6 This is a schematic diagram of the fastening mechanism in an embodiment of the present invention; The following markings in the attached diagram are as follows: 100-Testing machine, 200-Slab support, 300-Three-axis motion module, 400-Multi-axis displacement adjustment module, 500-Vision acquisition module 1, 600-Vision acquisition module 2; 210-Chip socket, 211-First protrusion, 212-Second protrusion, 213-Right-angle slot, 301-Base, 310-Mounting plate, 320-Test probe card, 410-Support body, 411-I-shaped slot, 412-Extension frame, 413-Notch, 420-Fiber optic array, 421-Outer shell, 422-Card section, 430-Fasting mechanism, 431-Pressure arm, 432-Spring component, 510-Rotating module, 520-Support frame, 610-Fine-tuning platform, 620-Gantry beam. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0017] This utility model embodiment provides a wafer dicing chip testing device, such as... Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, it mainly includes a testing platform 100, a plate holder 200, a three-axis motion module 300, a mounting plate 310, a test probe card 320, a multi-axis displacement adjustment module 400, a support body 410, a fiber optic array 420, a first vision acquisition module 500, and a second vision acquisition module 600.

[0018] The test platform 100, as the basic support platform of the entire device, is usually made of marble or high-rigidity metal materials. It has sufficient mass and stability to isolate ground vibration and provide a stable environment for testing. The upper surface of the test platform 100 is machined to provide a reference plane for the installation of other components.

[0019] The wafer support stage 200 is fixedly installed on the center area of ​​the upper surface of the testing machine 100 by bolts or other fastening methods. The top surface of the wafer support stage 200 is provided with a chip holder 210 for supporting the chip under test 10. The chip holder 210 can fix the chip 10 by vacuum adsorption, electrostatic adsorption, or mechanical clamping. In a preferred embodiment, such as... Figure 4 As shown, the top surface of the chip holder 210 is provided with two upward protrusions, a first protrusion 211 and a second protrusion 212. The first protrusion 211 and the second protrusion 212 are diagonally distributed, and the sidewalls of the first protrusion 211 and the sidewalls of the second protrusion 212 form a standard right-angle slot 213. This design allows the chip under test 10 with right-angled edges to quickly and accurately fit against the sidewalls of the two protrusions when placed, automatically completing the positioning and corner correction in the XY plane, ensuring the consistency of the chip placement position each time, which is helpful for subsequent testing.

[0020] The base 301 is fixed on the test platform 100 and located on one side of the chip holder 200. A three-axis motion module 300 is provided on the base 301. The three-axis motion module 300 is usually composed of three linear motion units: X-axis, Y-axis, and Z-axis. In actual implementation, an electric slide or a manual slide can be used. A flat mounting plate 310 is fixedly provided on the Z-axis motion end of the three-axis motion module 300. A test probe card 320 with an inclined outward extension is provided at the front end of the mounting plate 310 (i.e., the end facing the chip holder 200). The test probe card 320 integrates several precision probes. The positions of these probes correspond one-to-one with the electrode pads on the surface of the chip under test 10. By controlling the movement of the three-axis motion module 300, the test probe card 320 can be precisely moved above the chip holder 210 and driven downward by the Z-axis to make reliable contact between the probes and the chip electrodes, thereby powering the chip and transmitting test electrical signals. It should be noted that the test probe card is also oriented directly towards the right-angle slot on the chip socket. In other words, during the power-on process, the test probe card can also apply an inward force to the chip, so that the chip can better abut against the right-angle slot and ensure the chip is placed stably.

[0021] The multi-axis displacement adjustment module 400 is also fixed on the test platform 100, and its position is opposite to the substrate 200. It is usually placed on the adjacent sides of the substrate 200 along with the three-axis motion module 300. The multi-axis displacement adjustment module 400 should have linear movement in at least three directions: X, Y, and Z, in order to achieve minute spatial attitude adjustment. Specifically, it can be a combination of various electric slides or manual slides. A support body 410 is provided on its moving end. The front end of the support body 410 faces the chip holder 210. The fiber array 420 is installed at the front end of the support body 410 through a housing 421. The fiber array 420 is composed of multiple optical fibers arranged in a precise manner. Its end face is precision polished and used to receive the optical signal emitted by the chip under test 10 and transmit the optical signal to an external optical power meter (not shown in the figure) for measurement.

[0022] To achieve rapid and stable installation and angle preset of the fiber optic array 420, this utility model incorporates corresponding design improvements. For example... Figure 5 and Figure 6As shown, an I-shaped slot 411 is provided at the head end of the support body 410, and a locking part 422 adapted to the I-shaped slot 411 is provided on the upper part of the outer shell 421 on which the fiber array 420 is mounted. During installation, simply align the locking part 422 of the outer shell 421 and lock it into the I-shaped slot 411 to make the outer shell 421 (together with the fiber array 420) present a preset tilt posture. This tilt angle is pre-calculated to enable the end face of the fiber array 420 to be initially aligned with the light-emitting surface of the chip at the best coupling angle, reducing the amount of subsequent adjustment. To further enhance the stability of the fixation, an extension frame 412 parallel to it is also provided at intervals on the lower part of the support body 410. The head end of the extension frame 412 is provided with a notch 413 for locking the lower part of the outer shell 421 of the fiber array 420. A fastening mechanism 430 is provided on the extension frame 412 for applying an inward pressing force to the outer shell 421 of the fiber array 420, so that it is firmly abutted against the notch 413.

[0023] Specifically, see Figure 6 As shown, the fastening mechanism 430 includes a pressure arm 431. The middle part of the pressure arm 431 can be hinged to the extension frame 412 via a pin. A spring element 432 (such as a compression spring) is provided between the rear part of the pressure arm 431 and the outer wall of the extension frame 412. The spring element 432 is always in a compressed state, thereby using the lever principle to make the front end of the pressure arm 431 always generate a pressure toward the notch 413, firmly pressing the fiber array 420. This structure realizes the quick clamping and stable fixation of the fiber array, effectively preventing loosening during the testing process.

[0024] The vision system is crucial for achieving high-precision alignment. A primary vision acquisition module 500 (e.g., a high-resolution CCD camera with a telecentric lens) is mounted on a support frame 520 via a rotating module 510 (standard component). The support frame 520 is fixed to the testing platform 100. The illumination end (i.e., lens direction) of the primary vision acquisition module 500 is tilted from one side of the wafer stage 200 onto the surface of the chip holder 210. Its function is to monitor the contact between the probes of the test probe card 320 and the electrodes on the surface of the chip 10 in real time. By rotating the module 510, the camera angle can be finely adjusted to obtain the optimal viewing angle for observing the probe indentations, ensuring reliable contact and preventing damage to the chip due to poor contact or excessive pressure.

[0025] The second visual acquisition module 600 (which can also be a high-resolution camera) is mounted on a gantry beam 620 via a fine-tuning platform 610. The gantry beam 620 spans the substrate stage 200 and is fixed to the test platform 100. The illumination end of the second visual acquisition module 600 shines vertically downwards from the upper side of the substrate stage 200 onto the surface of the chip holder 210. Its function is to detect in real time the position of the end face of the fiber array 420 relative to the light-emitting surface of the chip 10, that is, the relative offset between the two in the XY plane. The fine-tuning platform 610 can be used to finely adjust the position of the second visual acquisition module 600 to ensure that its field of view center is accurately aligned with the observation area and to obtain a clear image. The gantry structure ensures the stability of the camera installation and avoids vibration.

[0026] The principle of optical power testing is briefly described as follows: After the test probe card 320 powers on the chip 10, the optical components inside the chip begin to work and emit light of a specific wavelength. This light signal is emitted from the light-emitting surface of the chip, and the end face of the fiber array 420 is responsible for receiving this light signal. The light signal is transmitted to the optical power meter at the other end through total internal reflection within the fiber. The optical power meter converts the light energy into an electrical signal, thereby reading the real-time optical power value. The solution in this application is to find the "optimal coupling position" where the optical power reading is the maximum and most stable by adjusting the distance and angle of the fiber array 420 relative to the light-emitting surface of the chip. Typically, the test software sets a qualified optical power range (e.g., greater than a certain threshold). The operator or the automated control system controls the multi-axis displacement adjustment module 400 to fine-tune the fiber array 420 based on the position feedback of the second vision acquisition module 600, while simultaneously monitoring the reading of the optical power meter. When the reading reaches and stabilizes within the preset range, the optical performance of the chip is deemed qualified.

[0027] The working process of this utility model device is as follows: 1. Loading and coarse positioning: The robot or operator places the segmented individual chip 10 onto the chip holder 210 and makes its two right-angled sides fit tightly against the right-angled slot 213 to complete the rapid and accurate positioning of the chip.

[0028] 2. Power on: Control the three-axis motion module 300 to drive the test probe card 320 to move above the chip 10. Then, make the probe contact the chip electrode. During this process, the first vision acquisition module 500 continuously acquires images of the contact area. The system performs image analysis to confirm that the probe has formed a good and stable contact with the corresponding electrode.

[0029] 3. Adjust the position of the fiber optic array: Control the multi-axis displacement adjustment module 400 to move the fiber optic array 420 to the vicinity of the light-emitting surface of the chip. The second vision acquisition module 600 takes pictures from directly above. Through image recognition technology, the characteristic positions (such as edges or markers) of the end face of the fiber optic array 420 and the light-emitting surface of the chip 10 are identified respectively, and the deviation between the two in the XY direction and the distance in the Z direction are calculated.

[0030] 4. Power Testing: Based on feedback from the second vision acquisition module 600, the multi-axis displacement adjustment module 400 is controlled for fine-tuning to gradually eliminate positional deviations and fine-tune the tilt angle of the fiber array to achieve optimal parallel alignment between its end face and the chip's light-emitting surface. The chip is powered on via the test probe card, and light is emitted. The system reads the optical power meter readings in real time and may perform final micron-level positional fine-tuning to find the maximum optical power. The stabilized optical power value is recorded.

[0031] 5. Judgment and Unloading: The system compares the measured optical power value with a preset standard range and provides a pass / fail result. After completion, the probe card and fiber array return to a safe position, the robotic arm removes the tested chip, and replaces it with the next chip to be tested, repeating the above process.

[0032] In other possible implementations, the testing machine 100 is equipped with two pairs of test probe cards 320 and two pairs of fiber optic arrays 420. The two test probe cards 320 are arranged in a mirror-symmetrical distribution with the wafer support stage 200 as the center, and the two fiber optic arrays 420 are also arranged in a mirror-symmetrical distribution with the wafer support stage 200 as the center. That is to say, the testing machine is equipped with two systems that can test the chip separately. Each system includes one probe test card and one fiber optic array, which improves the adaptability of the device and can be used for testing at least two types of chips.

[0033] The above descriptions are merely some embodiments of this utility model. For those skilled in the art, various modifications and improvements can be made without departing from the inventive concept of this utility model, and all such modifications and improvements fall within the protection scope of this utility model.

Claims

1. A wafer dicing chip testing device, characterized in that, Includes a test machine (100), and on the surface of the test machine (100): A wafer support stage (200) is provided with a chip holder (210) on its top surface. A base (301) is provided on which a three-axis motion module (300) is provided. A mounting plate (310) is provided on the Z-axis motion end of the three-axis motion module (300). A test probe card (320) is provided at the front end of the mounting plate (310) and extends outward at an angle. A multi-axis displacement adjustment module (400) has a support body (410) on its moving end. The front end of the support body (410) faces the chip holder (210) and a fiber array (420) is mounted on it. A fastening mechanism (430) for positioning the fiber array (420) is provided on the side of the support body (410). The first vision acquisition module (500) has its illumination end tilted from one side of the substrate stage (200) onto the surface of the chip holder (210) to detect the connection between the test probe card and the chip. The second vision acquisition module (600) illuminates the chip holder (210) surface vertically downward from the upper side of the chip stage (200) to detect the position of the fiber array relative to the chip.

2. The wafer dicing chip testing apparatus according to claim 1, characterized in that, The head end of the bracket (410) is provided with an I-shaped slot (411), the fiber array (420) is mounted on a housing (421), the upper part of the housing (421) is provided with a card part (422) that is adapted to the I-shaped slot (411), and the housing (421) is installed in an inclined position.

3. The wafer dicing chip testing device according to claim 2, characterized in that, The lower part of the support body (410) is also provided with an extension frame (412) parallel to it at intervals. The head end of the extension frame (412) is provided with a notch (413) for locking the fiber array (420). The fastening mechanism (430) is provided on the extension frame (412) and is used to apply a squeezing force to the fiber array (420) to abut against the notch (413).

4. The wafer dicing chip testing apparatus according to claim 3, characterized in that, The fastening mechanism (430) includes a pressure arm (431), the middle part of which is hinged to the extension frame (412). A spring (432) is provided between the rear part of the pressure arm (431) and the outer wall of the extension frame (412). The spring (432) is always in a compressed state so that the front end of the pressure arm (431) is always in contact with the outer wall of the fiber array (420).

5. The wafer dicing chip testing apparatus according to claim 1, characterized in that, The chip holder (210) has two upward protrusions, a first protrusion (211) and a second protrusion (212), on its top surface. The first protrusion (211) and the second protrusion (212) are diagonally distributed, and a right-angle slot (213) is formed between the sidewall of the first protrusion (211) and the sidewall of the second protrusion (212).

6. The wafer dicing chip testing apparatus according to claim 1, characterized in that, The first visual acquisition module (500) is mounted on a support frame (520) via a rotating module (510), and the support frame (520) is fixed to the test machine (100).

7. The wafer dicing chip testing apparatus according to claim 1, characterized in that, The second visual acquisition module (600) is mounted on a gantry beam (620) via a fine-tuning platform (610), and the gantry beam (620) is fixed to the test machine (100).

8. The wafer dicing chip testing apparatus according to claim 1, characterized in that, The test bench (100) is provided with two pairs of test probe cards (320) and two pairs of fiber arrays (420). The two test probe cards (320) are distributed in a mirror symmetry with the substrate (200) as the center, and the two fiber arrays (420) are distributed in a mirror symmetry with the substrate (200) as the center.

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