Flexible liquid cooling module

Abstract

The utility model discloses a kind of flexible liquid cooling modules, including liquid cooling plate body, liquid cooling plate body includes substrate, cover plate and fluid pump, multiple microchannels by inner outward equidistant arrangement are set on substrate, microchannel has the channel inlet and channel outlet of mutual close and disconnect;Cover plate is fixed on the side of substrate towards microchannel, cover plate is provided with the connecting terminal that is communicated with channel inlet and channel outlet respectively;Fluid pump is located in cover plate and is connected with connecting terminal, for driving fluid circulation flow in microchannel.This utility model is driven by fluid pump, makes fluid circulation flow in the microchannel of substrate, realizes efficient heat conduction process;Multiple microchannels are arranged in regular equidistant manner, increase the contact area of fluid, promote heat uniform distribution, effectively avoid the problem of local overheating, improve the overall heat conduction performance and reliability of module, while simple structure is low in cost.

Description

Technical Field

[0001] This utility model relates to the field of laptop heat sink technology, specifically a flexible liquid cooling module for assisting in the heat dissipation of electronic products. Background Technology

[0002] With the continuous improvement of electronic device performance, chip power consumption has increased significantly, making heat dissipation a key factor restricting the performance and stability of electronic devices. Traditional heat dissipation methods, such as air cooling, are gradually failing to meet the requirements for high-power chips and also suffer from problems such as high noise. Liquid cooling technology has gradually gained attention due to its high-efficiency heat dissipation performance. However, existing liquid cooling modules are mostly rigid structures with many components, making it difficult to adapt to the development trend of thinner and more flexible electronic devices. Summary of the Invention

[0003] To overcome the above-mentioned defects, this utility model provides a flexible liquid cooling module with a simple structure, good flexibility and efficient heat dissipation performance, which can meet the development needs of electronic devices to be thinner and more flexible.

[0004] The technical solution adopted by this utility model to solve its technical problem is to provide a flexible liquid cooling module, including a liquid cooling plate body, wherein the liquid cooling plate body includes: A substrate having multiple microchannels arranged at equal intervals from the inside out, the microchannels having channel inlets and channel outlets that are close to each other; A cover plate is fixed on the side of the substrate facing the microchannel, and the cover plate is provided with connection terminals that communicate with the inlet and outlet of the channel respectively. A fluid pump, located on the cover plate and connected to the connection terminal, is used to drive the fluid to circulate within the microchannel.

[0005] As a further improvement of this utility model, the microchannel includes a regularly wavy channel A arranged along the long side of the substrate, and channels B and C for connecting the channel A with the channel inlet and the channel outlet. The flow channels B and C are mirror images of each other with the line connecting the midpoint of the long side of the substrate as the mirror line, and have an arc-shaped flow channel connected to the end of the flow channel A and a straight flow channel arranged parallel to the long side of the substrate.

[0006] As a further improvement of this utility model, both the substrate and the cover plate are rectangular sheet-like parts integrally formed from copper alloy material. The thickness of the substrate is 0.3 to 0.6 mm, and the thickness of the cover plate is 0.2 to 0.4 mm.

[0007] As a further improvement of this utility model, the cross-sectional height of the microchannel is 0.2 to 0.4 mm, and the cross-sectional width is 1.0 to 3.0 mm; Meanwhile, the cross-sectional width of each microchannel is consistent with the spacing between adjacent microchannels.

[0008] As a further improvement of this utility model, it also includes a PI film, which is coated on the outer surface of the liquid cooling plate body and has a thickness of 0.05 to 0.15 mm.

[0009] As a further improvement of this utility model, an adhesive backing is provided on the surface of the PI film facing away from the cover plate.

[0010] As a further improvement of this utility model, the microchannel is formed by either etching or micromachining.

[0011] As a further improvement of this utility model, the substrate and the cover plate are sealed together by any one of diffusion welding, resistance welding or laser welding.

[0012] The beneficial effects of this utility model are: 1. The present invention uses a thin sheet substrate and cover plate made of copper alloy material, which has good flexibility and can adapt to the development trend of electronic devices becoming thinner and more flexible. The structure is simple and convenient to install and use. 2. The microchannel adopts a regular wave-shaped design, which increases the contact area between the fluid and the substrate and improves the heat exchange efficiency; 3. By setting a PI film, the safety and reliability of the liquid cooling plate body are ensured, and by setting an adhesive backing, the ease of module installation is improved, the liquid cooling plate components are simplified, and production costs are reduced. Attached Figure Description

[0013] Figure 1 This is a side view of the flexible liquid cooling module of this utility model; Figure 2 This is a front view schematic diagram of the substrate of this utility model; Figure 3 This is a schematic diagram of the front and cross-section at point AA of the flexible liquid cooling module of this utility model.

[0014] Referring to the accompanying drawings, the following explanations are provided: 1. Substrate; 10. Flow channel; 100. Flow channel A; 101. Flow channel B; 102. Flow channel C; 10a. Arc-shaped flow channel; 10b. Straight flow channel; 11. Flow channel inlet; 12. Flow channel outlet; 2. Cover plate; 21. Connecting terminal; 3. Fluid pump; 4. PI film; 5. Adhesive backing. Detailed Implementation

[0015] The preferred embodiment of the present invention will be described in detail below with reference to the accompanying drawings.

[0016] See Figures 1 to 3 The flexible liquid cooling module provided by this utility model includes a liquid cooling plate body, which includes a base plate 1, a cover plate 2 and a fluid pump 3.

[0017] First, regarding the substrate.

[0018] Multiple microchannels 10 are arranged at equal intervals from the inside to the outside on the substrate 1. The substrate 1 is a rectangular sheet integrally formed from copper alloy material, with a thickness of 0.3 to 0.6 mm. The cross-sectional height of the microchannel 10 is 0.2 to 0.4 mm, and the cross-sectional width is 1.0 to 3.0 mm; at the same time, the cross-sectional width of each microchannel 10 is consistent with the spacing between adjacent microchannels 10.

[0019] Furthermore, the microchannels 10 have inlet 11 and outlet 12 that are close to each other. Fluid enters the microchannels 10 from the inlet 11 and exits from the outlet 12. That is, the microchannels 10 are directly formed on the substrate using one of etching or micromachining methods, thereby simplifying the liquid cooling module components and reducing production costs. In addition, the fluid forms a circulating flow path within the microchannels, and the multiple microchannels 10 are arranged at equal intervals to increase the contact area with the fluid, promoting rapid heat transfer and ensuring uniform heat distribution, avoiding localized overheating and improving the overall performance and reliability of the module.

[0020] Preferably, the microchannel 10 includes a regularly wavy channel A100 arranged along the long side of the substrate 1, and channels B101 and C102 for connecting the channel A100 with the channel inlet 11 and the channel outlet 12. Channels B101 and C102 are symmetrically distributed with the line connecting the midpoint of the long side of the substrate 1 as a mirror line, and both are composed of an arc-shaped channel 10a connected to the end of channel A100 and a straight channel 10b arranged parallel to the long side of the substrate 1.

[0021] The regularly wavy flow channel A is also known as a serpentine or meandering flow channel. When fluid flows through it, turbulence is easily formed due to centrifugal force and the continuous change in the flow direction. Fluid in a turbulent state can fully mix hot and cold fluids, effectively reducing the boundary layer thickness, thereby increasing the convective heat transfer coefficient and enhancing heat dissipation efficiency.

[0022] Meanwhile, flow channel A can extend the flow channel length within a limited space. The increased flow channel length increases the contact opportunities between the fluid and the flow channel wall, expanding the heat exchange area and facilitating heat transfer from the heat-generating components to the fluid, thus improving overall heat dissipation efficiency. Furthermore, the fluid can flow sequentially through each area along a pre-defined path, effectively avoiding localized overheating or undercooling and ensuring uniform temperature distribution on the heat dissipation surface. In addition, this flow channel design also offers the advantage of ease of manufacturing.

[0023] Secondly, regarding the cover plate.

[0024] The cover plate 2 is connected to the side of the substrate 1 facing the microchannel 10 through any of the precision welding processes of diffusion welding, resistance welding, or laser welding to achieve a high-strength and high-sealing connection. Among them, diffusion welding can achieve solid-state bonding of materials under lower pressure, ensuring the uniformity and density of the weld joint; resistance welding uses the resistance heat generated by the current to melt locally, and the welding speed is fast and efficient; laser welding, with its high-energy-density laser beam, achieves precise and rapid welding with a small heat-affected zone, which can effectively ensure the integrity of the microchannel structure.

[0025] Furthermore, the cover plate 2 has two connection terminals 21, which are respectively connected to the flow channel inlet 11 and the flow channel outlet 12. That is, one connection terminal connects multiple inlet ends of the microchannel 10 in series, and the other connects multiple outlet ends of the microchannel 10 in series, providing a stable and reliable connection interface for fluid transmission between the fluid pump and the microchannel, ensuring that the fluid can circulate smoothly within the system. The cover plate 2 is made of copper alloy material and is manufactured using a one-piece molding process, presenting a regular rectangular sheet structure. Copper alloy material has excellent thermal conductivity, which can quickly transfer heat away, and together with the fluid circulation within the microchannel, achieves a highly efficient heat dissipation effect.

[0026] In addition, the cover plate 2 has a thickness of 0.2 to 0.4 mm. This thickness ensures that the cover plate has sufficient strength and rigidity to withstand the thermal stress during welding and various loads during use. It also gives the cover plate a certain degree of flexibility, making it easy to adapt to certain deformations during installation and use. At the same time, it can effectively reduce thermal resistance, improve heat dissipation efficiency, and ensure the stable and reliable performance of the entire flexible liquid cooling module.

[0027] Finally, regarding fluid pumps.

[0028] Fluid pump 3 employs a miniature piezoelectric pump, which connects the microchannels within the liquid cooling plate body into a unified whole. During operation, the miniature piezoelectric pump utilizes the inverse piezoelectric effect of the piezoelectric ceramic. By applying voltage, the piezoelectric ceramic undergoes minute deformation, which in turn drives the internal diaphragm to vibrate, thereby driving the fluid and ensuring continuous and stable flow of the fluid within the channels, providing a constant power source for the heat dissipation system.

[0029] For the fluid medium, deionized water, a mixture of water and ethylene glycol, or a mixture of water and propylene glycol can be selected. Deionized water has a high specific heat capacity and good thermal conductivity, which can effectively absorb and transfer heat; a mixture of water and ethylene glycol or a mixture of water and propylene glycol can prevent the fluid from freezing at low temperatures and affecting the normal operation of the system. Different fluid media with different properties can be selected according to the specific operating environment and heat dissipation requirements.

[0030] Furthermore, the liquid cooling plate is covered with a PI film 4 with a thickness between 0.05 and 0.15 mm. The PI film effectively isolates current, preventing electrical interference between the liquid cooling plate and the electronic product, ensuring the safe and stable operation of the electronic product's circuitry. Simultaneously, it adheres tightly to the surface of the liquid cooling plate, forming a reliable protective layer to prevent damage during daily use, transportation, or installation, reducing the risk of physical damage. In addition, the PI film prevents liquid leakage into the electronic product, avoiding serious consequences such as short circuits and damage caused by liquid corrosion, thus improving the safety and reliability of the electronic product.

[0031] Furthermore, an adhesive backing 5 is attached to the bottom of the PI film to facilitate the installation and use of the liquid cooling plate. Thanks to the adhesive's stickiness, the liquid cooling plate can be firmly attached to the inner surface of the electronic product without the need for complex installation processes or additional fixing devices. This not only saves installation time and costs but also ensures a tight fit between the liquid cooling plate and the inner surface of the electronic product, improving heat dissipation efficiency and guaranteeing timely and effective heat dissipation during high-efficiency operation.

[0032] In summary, the flexible liquid cooling module provided in this embodiment utilizes a fluid pump to drive fluid circulation within the microchannels of the substrate, achieving a highly efficient heat transfer process. Multiple microchannels are arranged in a regular, equidistant manner, increasing the fluid contact area and promoting uniform heat distribution, effectively avoiding localized overheating and improving the overall thermal conductivity and reliability of the module. Encapsulation with a flexible PI film and adhesive backing results in a module that is ultra-thin, flexible, highly thermally conductive, and easy to install, meeting the needs of various electronic products for efficient heat dissipation and convenient installation.

[0033] The following embodiment provides a feasible manufacturing method for a flexible liquid-cooled module, which includes the following steps.

[0034] Step S1: Obtain a substrate 1 and a cover plate 2 with the same perimeter. The substrate 1 and the cover plate 2 are made of copper alloy, such as C5191 or C18400, which have good thermal conductivity and ductility. The thickness of the substrate 1 is 0.5 mm and the thickness of the cover plate 2 is 0.3 mm. The substrate and cover plate materials can be transported by winding.

[0035] Step S2: The substrate 1 is processed to form microchannels 10 on the substrate 1, and a channel inlet 11 and a channel outlet 12 connecting the microchannels 10.

[0036] Specifically, the steps for forming the microchannel 10 include: Step S2.0, graphic design: design the graphic pattern of the microchannel 10 and make a mask according to the pattern.

[0037] Step S2.1, substrate preparation: Clean the surface of the substrate 1, use an alkaline degreaser to remove oil stains from the substrate surface, and ensure that the etching solution is in full contact with the substrate.

[0038] Step S2.2, Photoresist Coating: 88-12μm photoresist is uniformly coated on the surface of the substrate 1.

[0039] Step S2.3, Exposure: The mask is attached to the upper surface of the substrate, and LDI laser direct writing is used to achieve a positioning accuracy of ±2μm to meet the microchannel design requirements.

[0040] Step S2.4, Development: Place the exposed substrate 1 into the developer to remove the photoresist in the unexposed areas, exposing the copper layer and forming a microchannel pattern.

[0041] Step S2.5, Etching: Reactive ion etching (RIE) is used, and the plasma bombardment direction is controlled by an electric field to achieve a side etching depth of ≤0.5μm.

[0042] Step S2.6, Removal and Cleaning: Use an alkaline solution to remove the residual resist layer and rinse the inside of the flow channel with deionized water to prevent corrosion.

[0043] In step S3, the upper surface of the cover plate 2 is formed with an installation area 21a for connecting the fluid pump 3 and a through channel 21b that is perpendicularly connected to the flow channel inlet 11 and the flow channel outlet 12 respectively.

[0044] Step S4: The substrate 1 and the edge of the cover plate 2 are fused together using diffusion welding (wavelength 1064nm, power 500W), with a weld strength ≥50MPa. A fluid pump 3 is then installed in the mounting area 21a to obtain the liquid-cooled plate body. The diffusion welding results in a small heat-affected zone (<0.5mm), avoiding brittle fracture caused by metal grain coarsening.

[0045] Step S5: The PI film 4 and the liquid cooling plate body are hot-pressed in a vacuum environment (<10 Pa) (temperature 180-220℃, pressure 0.5-1 MPa) to tightly bond the PI film to the metal surface through chemical bonding. The vacuum environment can eliminate air bubbles and prevent delamination caused by bubble expansion during bending. A notch is made in the PI film 4 corresponding to the mounting area 21a.

[0046] Step S6: Apply adhesive 5 to the surface of the PI film 4 on the side of the substrate 1 away from the cover plate 2, and the peel strength of the adhesive 5 is ≥3N / cm.

[0047] The cooling medium is a 30% ethylene glycol aqueous solution. When the fluid pump speed is 2000 rpm, the module thermal resistance is ≤0.05℃ / W, which is 60% lower than the traditional air-cooling solution.

[0048] The method for manufacturing the flexible liquid cooling module provided in this embodiment uses etching technology to form microchannels. The process is mature, highly precise, optimizes the liquid cooling plate components and production process, and reduces production costs.

[0049] Many specific details have been set forth in the above description to provide a full understanding of this utility model. However, the above description is only a preferred embodiment of this utility model, and this utility model can be implemented in many other ways different from those described herein. Therefore, this utility model is not limited to the specific embodiments disclosed above. Furthermore, any person skilled in the art can make many possible variations and modifications to the technical solution of this utility model using the methods and techniques disclosed above, or modify it into equivalent embodiments with equivalent changes, without departing from the scope of the technical solution of this utility model. Any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of this utility model, without departing from the content of the technical solution of this utility model, shall still fall within the protection scope of the technical solution of this utility model.

Claims

1. A flexible liquid-cooled module, comprising a liquid-cooled plate body, characterized in that, The liquid cooling plate body includes: The substrate (1) has a plurality of microchannels (10) arranged at equal intervals from the inside to the outside. The microchannels (10) have channel inlets (11) and channel outlets (12) that are close to each other. A cover plate (2) is fixed on the side of the substrate (1) facing the microchannel (10). The cover plate (2) is provided with connecting terminals (21) that communicate with the channel inlet (11) and the channel outlet (12) respectively. One of the connecting terminals connects multiple inlet ends of the microchannel in series, and the other connects multiple outlet ends of the microchannel in series. A fluid pump (3) is provided on the cover plate (2) and connected to the connection terminal (21) for driving fluid to circulate within the microchannel (10); The microchannel (10) includes a regular wavy channel A (100) arranged along the long side of the substrate (1), and channels B (101) and C (102) for connecting the channel A (100) with the channel inlet (11) and the channel outlet (12); the channels B (101) and C (102) are mirrored with the line connecting the midpoint of the long side of the substrate (1) as the mirror line, and have an arc-shaped channel (10a) connected to the end of the channel A (100) and a straight channel (10b) arranged parallel to the long side of the substrate (1).

2. The flexible liquid-cooled module according to claim 1, characterized in that: The substrate (1) and the cover plate (2) are both rectangular sheet-like parts integrally formed from copper alloy material; The thickness of the substrate (1) is 0.3 to 0.6 mm, and the thickness of the cover plate (2) is 0.2 to 0.4 mm.

3. The flexible liquid-cooled module according to claim 2, characterized in that: The cross-sectional height of the microchannel (10) is 0.2 to 0.4 mm, and the cross-sectional width is 1.0 to 3.0 mm; Meanwhile, the cross-sectional width of each microchannel (10) is consistent with the spacing between adjacent microchannels (10).

4. The flexible liquid-cooled module according to claim 3, characterized in that: It also includes a PI film (4), which is coated on the outer surface of the liquid cooling plate body and has a thickness of 0.05 to 0.15 mm.

5. The flexible liquid-cooled module according to claim 4, characterized in that: The PI film (4) has an adhesive backing (5) on the side facing away from the cover plate (2).

6. The flexible liquid-cooled module according to claim 1, characterized in that: The microchannel (10) is formed by either etching or micromachining.

7. The flexible liquid-cooled module according to claim 1, characterized in that: The substrate (1) and cover plate (2) are sealed together by any one of diffusion welding, resistance welding or laser welding.

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