Industrial camera mainboard, industrial camera and camera system

Abstract

The embodiment of the application provides an industrial camera mainboard, an industrial camera and a camera system, relates to the technical field of machine vision, and the industrial camera mainboard comprises a processing module, an I / O interface, a signal conversion circuit, an interboard cascade connector and a sensor connection module; the I / O interface is connected with the signal conversion circuit, and the I / O interface is also connected with the interboard cascade connector; the interboard cascade connector is used for connecting other industrial camera mainboards. The I / O interface is connected with the interboard cascade connector, the industrial camera mainboards are cascaded through the interboard cascade connector, and the exposure trigger signal received by the I / O interface of one industrial camera mainboard can be transmitted to the I / O interface of other industrial camera mainboards through the interboard cascade connector, equivalent to that the I / O interfaces of the industrial camera mainboards simultaneously receive the exposure trigger signal, the difference of exposure time is reduced, and therefore the problem of image disorder is alleviated.

Description

Technical Field

[0001] This application relates to the field of machine vision technology, and in particular to industrial camera motherboards, industrial cameras, and camera systems. Background Technology

[0002] Industrial line-scan CIS (Contact Image Sensor) cameras are integrated image acquisition devices based on photoelectric conversion principles, offering advantages such as low cost, low power consumption, and small size. Industrial line-scan CIS cameras employ a line-scanning image capture method, enabling macro photography. In practical industrial applications, to meet the required capture area, multiple industrial line-scan CIS cameras are often cascaded together to form a cascaded camera system.

[0003] In existing technology, the IO (Input / Output) signals (taking the exposure trigger signal as an example) of the host computer are first transmitted to the main industrial line array CIS camera in the cascaded camera system. After the processor of the main industrial line array CIS camera parses the exposure trigger signal, it sends the exposure trigger signal one by one to the processors of each slave industrial line array CIS camera in the cascaded camera system. In this method, there will be a certain delay in the exposure trigger signal received by each slave industrial line array CIS camera, especially for the last slave industrial line array CIS camera to receive the exposure trigger signal, whose exposure time interval with the main industrial line array CIS camera is relatively long. When the exposure times of the industrial line array CIS cameras in the cascaded camera system differ, the image acquisition time of each industrial line array CIS camera will also differ, resulting in image distortion in the final stitched image. Utility Model Content

[0004] The purpose of this application is to provide an industrial camera motherboard, an industrial camera, and a camera system to alleviate the problem of image distortion. The specific technical solution is as follows:

[0005] In a first aspect, embodiments of this application provide an industrial camera motherboard, comprising:

[0006] Processing module, I / O interface, signal conversion circuit, inter-board cascade connector, sensor connection module;

[0007] The processing module is connected to the signal conversion circuit, the processing module is connected to the sensor connection module, the I / O interface is connected to the signal conversion circuit, and the I / O interface is also connected to the inter-board cascade connector;

[0008] The sensor connection module is used to connect sensor modules, and the inter-board cascading connection machine is used to connect other industrial camera motherboards.

[0009] In one possible implementation, the industrial camera motherboard further includes a high-speed data interface, and the processing module includes a first processor and a second processor;

[0010] The first processor is connected to the second processor, the signal conversion circuit, and the sensor connection module, respectively.

[0011] The second processor is connected to the high-speed data interface.

[0012] In one possible implementation, the industrial camera motherboard further includes: a lamp board connection module and a DIP switch;

[0013] The first processor is also connected to the lamp board connection module;

[0014] The second processor is also connected to the DIP switch.

[0015] In one possible implementation, the inter-board cascade connector includes a first inter-board cascade connector and a second inter-board cascade connector, which are respectively connected to the I / O interface.

[0016] In one possible implementation, the industrial camera motherboard further includes: a high-speed data interface, a lamp board connection module, and a DIP switch, wherein the high-speed data interface, the lamp board connection module, and the DIP switch are respectively connected to the processing module.

[0017] In one possible implementation, the processing module includes a first processor and a second processor;

[0018] The first processor is connected to the second processor, the signal conversion circuit, the sensor connection module, and the lamp board connection module, respectively.

[0019] The second processor is connected to the high-speed data interface and the DIP switch, respectively.

[0020] In one possible implementation, the industrial camera motherboard further includes: a processor cascade module, wherein the processing module is connected to the processor cascade module; the processor cascade module is used to connect to the processor cascade modules of other industrial camera motherboards.

[0021] Secondly, embodiments of this application provide an industrial camera, including a sensor module and any of the industrial camera motherboards described in this application, wherein the sensor module is connected to the sensor connection module of the industrial camera motherboard.

[0022] In one possible implementation, the industrial camera includes multiple sensor modules and multiple industrial camera motherboards, with one of the industrial camera motherboards connected to at least one of the sensor modules via a sensor connection module.

[0023] In one possible implementation, the inter-board cascade connector of the industrial camera motherboard includes a first inter-board cascade connector and a second inter-board cascade connector; the first inter-board cascade connector of the industrial camera motherboard is connected to the second inter-board cascade connector of its upstream industrial camera motherboard, and the second inter-board cascade connector of the industrial camera motherboard is connected to the first inter-board cascade connector of its downstream industrial camera motherboard.

[0024] In one possible implementation, the industrial camera motherboard includes a processor cascade module, and the industrial camera motherboards are also connected to each other through the processor cascade module.

[0025] In one possible implementation, the industrial camera motherboard includes a DIP switch and a lamp board connection module. The industrial camera motherboard with the DIP switch in the first position is the main industrial camera motherboard. The I / O interface in the main industrial camera motherboard is used to connect to a host computer, and the lamp board connection module in the main industrial camera motherboard is used to connect to a lamp board array.

[0026] Thirdly, embodiments of this application provide a camera system, including a light panel array and any of the industrial cameras described in this application. The industrial camera's mainboard includes a light panel connection module, and the light panel connection module is connected to the light panel array.

[0027] The industrial camera motherboard, industrial camera, and camera system provided in this application embodiment have I / O interfaces connected to inter-board cascading connectors. The industrial camera motherboards are cascaded together via these connectors. In this configuration, the exposure trigger signal received by the I / O interface of one industrial camera motherboard can be transmitted to the I / O interfaces of other industrial camera motherboards via the inter-board cascading connectors. This is equivalent to all industrial camera motherboards simultaneously receiving the exposure trigger signal, reducing exposure time differences and thus mitigating image distortion problems. Of course, implementing any product of this application does not necessarily require achieving all of the advantages described above simultaneously. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings.

[0029] Figure 1This is a first schematic diagram of an industrial camera motherboard according to an embodiment of this application;

[0030] Figure 2 This is a first schematic diagram of the connection of the industrial camera motherboard in the embodiments of this application;

[0031] Figure 3 This is a second schematic diagram of an industrial camera motherboard according to an embodiment of this application;

[0032] Figure 4 This is a second schematic diagram illustrating the connection of the industrial camera motherboard in an embodiment of this application;

[0033] Figure 5 This is a third schematic diagram of an industrial camera motherboard according to an embodiment of this application;

[0034] Figure 6 This is a fourth schematic diagram of an industrial camera motherboard according to an embodiment of this application;

[0035] Figure 7 This is a fifth schematic diagram of an industrial camera motherboard according to an embodiment of this application;

[0036] Figure 8a This is a sixth schematic diagram of an industrial camera motherboard according to an embodiment of this application;

[0037] Figure 8b This is a seventh schematic diagram of an industrial camera motherboard according to an embodiment of this application;

[0038] Figure 8c This is an eighth schematic diagram of an industrial camera motherboard according to an embodiment of this application;

[0039] Figure 9 This is a first schematic diagram of an industrial camera according to an embodiment of this application;

[0040] Figure 10 This is a second schematic diagram of an industrial camera according to an embodiment of this application;

[0041] Figure 11 This is a third schematic diagram of an industrial camera according to an embodiment of this application;

[0042] Figure 12 This is a schematic diagram of an industrial camera receiving differential signals in an embodiment of this application;

[0043] Figure 13 This is a schematic diagram of an industrial camera receiving a single-ended signal in an embodiment of this application;

[0044] Figure 14 This is a fourth schematic diagram of an industrial camera according to an embodiment of this application;

[0045] Figure 15 This is a schematic diagram of a camera system according to an embodiment of this application.

[0046] Explanation of reference numerals in the attached figures:

[0047] Industrial camera-1, industrial camera motherboard-10, processing module-101, first processor-1011, second processor-1012, I / O interface-102, signal conversion circuit-103, inter-board cascade connector-104, first inter-board cascade connector-1041, second inter-board cascade connector-1042, sensor connection module-105, high-speed data interface-106, lamp board connection module-107, DIP switch-108; sensor module-20; top cover-30; fan-40; baffle-50;

[0048] Lamp panel array-2. Detailed Implementation

[0049] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art based on this application are within the scope of protection of this application.

[0050] To reduce image distortion in stitched images, this application provides an industrial camera motherboard, an industrial camera, and a camera system, which are described in detail below:

[0051] In a first aspect, embodiments of this application provide an industrial camera motherboard 10, see [link to relevant documentation]. Figure 1 ,include:

[0052] The system includes a processing module 101, an I / O interface 102, a signal conversion circuit 103, an inter-board cascade connector 104, and a sensor connection module 105. The processing module 101 is connected to the signal conversion circuit 103 and the sensor connection module 105. The I / O interface 102 is connected to the signal conversion circuit 103 and the inter-board cascade connector 104.

[0053] The processing module 101 is the core processing unit of the industrial camera motherboard 10, used to control various functions of the industrial camera motherboard 10, including its communication, data processing, and control functions. The I / O interface 102 is used to connect to a host computer and receive I / O signals from the host computer, such as exposure trigger signals. The signal conversion circuit 103 converts the I / O signals received by the I / O interface 102 into digital signals that the processing module 101 can directly recognize; furthermore, the signal conversion circuit 103 can also convert digital signals emitted by the processing module 101 and transmit them to the host computer through the I / O interface 102. The sensor connection module 105 is used to connect to a sensor module (in one example, the sensor connection module 105 is a CIS sensor connection module, and the sensor module is a CIS sensor module). The processing module 101 interacts with the sensor module through the sensor connection module 105, including triggering the sensor module to perform exposure and acquiring image signals collected by the sensor module.

[0054] The inter-board cascading interconnect 104 is used to connect other industrial camera motherboards, that is, industrial camera motherboards are spliced ​​together through the inter-board cascading interconnect 104. In one example, taking four industrial camera motherboards 10, their connection can be as follows: Figure 2 As shown, it can be seen that the I / O signal received by the I / O interface 102 of one industrial camera motherboard 10 can be simultaneously received by the I / O interfaces 102 of the other three industrial camera motherboards 10.

[0055] In this embodiment, the exposure trigger signal received by the I / O interface 102 of one industrial camera motherboard 10 can be transmitted to the I / O interfaces 102 of other industrial camera motherboards 10 via the inter-board cascade connector 104. This is equivalent to each industrial camera motherboard 10's I / O interface 102 receiving the exposure trigger signal simultaneously. Compared to the prior art where the processing module of the main industrial camera sends the exposure trigger signal to the processors of each slave industrial camera one by one, this reduces the time difference in the reception of the exposure trigger signal by the processing modules 101 of each industrial camera, thereby reducing the difference in exposure time and alleviating the problem of image distortion.

[0056] Apart from Figure 2 In addition to the connection method shown, cascading between industrial camera motherboards 10 can also be achieved through bidirectional connection. In one possible implementation, see... Figure 3 The inter-board cascading connector 104 includes a first inter-board cascading connector 1041 and a second inter-board cascading connector 1042, which are respectively connected to the I / O interface 102. Taking four industrial camera motherboards 10 as an example, their cascading configuration can be as follows: Figure 4As shown, for an industrial camera motherboard 10, the first inter-board cascading connector 1041 of the industrial camera motherboard 10 is connected to the second inter-board cascading connector 1042 of its upstream industrial camera motherboard 10; the second inter-board cascading connector 1042 of the industrial camera motherboard 10 is connected to the first inter-board cascading connector 1041 of its downstream industrial camera motherboard 10. The board-to-board cascading cabling and bidirectional connection structure facilitate wiring design and can support the cascading of any number of industrial camera motherboards 10.

[0057] The industrial camera motherboard 10 in this embodiment supports various sensor modules, which can be customized according to actual needs. In one example, the industrial camera motherboard 10 can connect to sensor modules of preset specifications via a sensor connection module 105. The preset specifications of the sensor modules can be set according to actual detection requirements. Through cascading of the industrial camera motherboard 10, the scanning range of the preset specifications can be used as the minimum stitching unit to adapt to any sensor module of integer multiples of the preset specifications in length, reducing the motherboard development cost for sensor modules of different lengths. The sensor connection module 105 supports the transmission of single-ended signals, LVDS (Low Voltage Differential Signaling) signals, and power supply signals. The industrial camera motherboard 10 can configure the sensor modules via single-ended signals and supply power to the sensor modules via power supply signals. Furthermore, the industrial camera motherboard 10 can also receive LVDS signals (image signals acquired by the sensor modules) from the sensor modules.

[0058] In addition to I / O interface 102, the industrial camera motherboard 10 also needs to transmit image signals externally through other interface modules. In one possible implementation, see... Figure 5The industrial camera motherboard 10 further includes a high-speed data interface 106, which is connected to the processing module 101. The high-speed data interface 106 is used to connect to external devices such as a host computer. The processing module 101 processes the image signals acquired by the sensor module, for example, using an ISP (Image Signal Processor), and sends the processed image signals to the external device via the high-speed data interface 106. The high-speed data interface 106 can be an optical module, including an SFP (Small Form Pluggable) and an optical port. In one example, the high-speed data interface 106 can include two sets of SFPs and optical ports, supporting a maximum transmission bandwidth of 20Gbps. For a 600mm CIS module, the required output bandwidth is 14688 (dot) × 10 (bit / dot) × 98.4 (kHz) = 14.45Gbps. The design of two sets of SFPs and optical ports can support the data output of a 600mm CIS module. The communication protocol used by the high-speed data interface 106 can be customized according to actual needs. In one example, the high-speed data interface 106 can use the XoFLink protocol to communicate with the outside world. In addition to optical modules, the high-speed data interface 106 can also be a network port or a CXP (CoaXPress, an asymmetric high-speed point-to-point serial communication digital interface standard), etc., all of which are within the scope of protection of this application.

[0059] In one possible implementation, see Figure 6 The industrial camera motherboard 10 further includes a lamp board connection module 107, which is connected to the processing module 101. The lamp board connection module 107 is used to connect the lamp board array, and the processing module 101 can control the lamp board array through the lamp board connection module 107.

[0060] For multiple cascaded industrial camera motherboards 10, the I / O interfaces of each motherboard are essentially connected in parallel, allowing them to simultaneously receive I / O signals from the host computer. However, when multiple motherboards simultaneously send I / O signals to the host computer via their I / O interfaces, transmission errors can occur. Therefore, for multiple cascaded industrial camera motherboards 10, it is necessary to distinguish between the master and slave motherboards. The master motherboard controls the sending of I / O signals to the host computer. In one possible implementation, see [link to relevant documentation]. Figure 7The industrial camera motherboard 10 further includes a DIP switch 108, which is connected to the processing module 101. The DIP switch 108 has multiple positions. To facilitate differentiation between the various industrial camera motherboards 10, the positions of the DIP switches 108 on cascaded industrial camera motherboards are all different. The DIP switch 108 on the master industrial camera motherboard is in the first position, and the DIP switch 108 on each slave industrial camera motherboard has a separate position and is not in the first position. Therefore, different industrial camera motherboards 10 can be distinguished based on the positions of the DIP switches 108. When the processing module 101 detects that its connected DIP switch 108 is in the first position, the processing module 101 determines that its industrial camera motherboard is the master industrial camera motherboard. When the processing module 101 detects that its connected DIP switch 108 is not in the first position, the processing module 101 determines that its industrial camera motherboard is a slave industrial camera motherboard.

[0061] The main industrial camera motherboard is responsible for controlling the transmission of I / O signals to the host computer. A DIP switch 108 distinguishes between the main and slave industrial camera motherboards. The main industrial camera motherboard has both lamp control signals and output signals. When it receives an exposure trigger signal, the main industrial camera motherboard simultaneously controls the lamp array to illuminate via the lamp board connection module 107, ensuring synchronization between the exposure time of all sensor modules and the lamp array illumination time. When the main industrial camera motherboard performs I / O output, it sets all external I / O ports of the slave industrial camera motherboards to input mode, allowing only the main industrial camera motherboard to perform I / O output. This avoids transmission errors caused by multiple industrial camera motherboards simultaneously sending I / O signals.

[0062] To facilitate information exchange between the various industrial camera motherboards 10, the processing modules 101 of the industrial camera motherboards 10 can also be connected for communication. In one possible implementation, the industrial camera motherboard 10 further includes a processor cascade module, with the processing module 101 connected to the processor cascade module. The processor cascade module is used to connect to the processor cascade modules of other industrial camera motherboards. The communication connection between the processing modules 101 of the industrial camera motherboards 10 via the processor cascade module enables communication between the processing modules 101 of each industrial camera motherboard 10, thereby facilitating the control of the slave industrial camera motherboard by the master industrial camera motherboard. The communication protocol used by the processor cascade module can be customized according to actual conditions. In one example, the processor cascade module can use the SPI (Serial Peripheral Interface) protocol for communication.

[0063] To further improve the processing efficiency of the processing module 101, in one possible implementation, such as Figure 8aAs shown, the processing module 101 includes a first processor 1011 and a second processor 1012; the first processor 1011 is connected to the second processor 1012, the signal conversion circuit 103, and the sensor connection module 105 respectively; the second processor 1012 is connected to the high-speed data interface 106. Specifically, the industrial camera motherboard includes a first processor 1011, a second processor 1012, an I / O interface 102, a signal conversion circuit 103, an inter-board cascade connector 104, a sensor connection module 105, and a high-speed data interface 106. The first processor 1011 is mainly responsible for the driving control of the sensor module and the transmission of image signals; the second processor 1012 is mainly responsible for ISP processing and the transmission of image signals. When the processing module 101 includes a first processor 1011 and a second processor 1012: different industrial camera motherboards 10 can communicate with each second processor 1012 through a processor cascading module, or with each first processor 1011 through a processor cascading module, or with each second processor 1012 and each first processor 1011 through separate processor cascading modules. Compared to a single processor, the advantage of using a dual processor is that it can expand logic resources, solve the problems of insufficient pin count and insufficient logic resources in a single processor, and enable real-time transmission of image signals.

[0064] In another embodiment, such as Figure 8bAs shown, the industrial camera motherboard includes: a first processor 1011, a second processor 1012, an I / O interface 102, a signal conversion circuit 103, an inter-board cascade connector 104, a sensor connection module 105, a high-speed data interface 106, a lamp board connection module 107, and a DIP switch 108. The first processor 1011 is connected to the second processor 1012, the signal conversion circuit 103, the sensor connection module 105, and the lamp board connection module 107. The second processor is connected to the high-speed data interface 106 and the DIP switch 108. The first processor 1011 drives and controls the sensor module through the sensor connection module 105 and transmits the image signals collected by the sensor module to the second processor 1012. The first processor 1011 also transmits I / O signals to the host computer through the I / O interface 102 and the signal conversion circuit 103. In addition, the first processor 1011 drives and controls the lamp board array through the lamp board connection module 107. The second processor 1012 acquires the image signal sent by the first processor 1011 and performs ISP processing. Then, it sends the processed image signal through the high-speed data interface 106. Furthermore, the second processor 1012 is also responsible for identifying the master and slave industrial camera motherboards based on the position of the DIP switch 108. Compared to a single processor, the advantage of using a dual processor is that it can expand logic resources, solving the problems of insufficient pin count and logic resources in a single processor, while also enabling real-time transmission of image signals.

[0065] In yet another embodiment, such as Figure 8c As shown, the industrial camera motherboard includes: a first processor 1011, a second processor 1012, an I / O interface 102, a signal conversion circuit 103, a first inter-board cascade connector 1041, a second inter-board cascade connector 1042, a sensor connection module 105, a high-speed data interface 106, a lamp board connection module 107, and a DIP switch 108. The first processor 1011 is connected to the second processor 1012, the signal conversion circuit 103, the sensor connection module 105, and the lamp board connection module 107. The second processor is connected to the high-speed data interface 106 and the DIP switch 108. The first inter-board cascade connector 1041 and the second inter-board cascade connector 1042 are both connected to the I / O interface 102. Compared with a single processor, the advantage of using a dual processor is that it can expand logic resources, solve the problems of insufficient pin count and insufficient logic resources of a single processor, and at the same time, it can achieve real-time transmission of image signals.

[0066] Secondly, this application provides an industrial camera, see [link to relevant documentation]. Figure 9This includes a sensor module 20 and any of the industrial camera motherboards 10 described in this application. The sensor module 20 is connected to the sensor connection module 105 of the industrial camera motherboard 10. In one example, the industrial camera in this embodiment can specifically be an industrial line-scan CIS camera, the sensor connection module 105 is a CIS sensor connection module, and the sensor module 20 is a CIS sensor module. The sensor module 20 is used for acquiring image signals. Besides the industrial camera motherboard 10 and the sensor module 20, other components include... Figure 10 As shown, the industrial camera in this embodiment may also include a top cover 30, a fan 40, and a baffle 50.

[0067] To accommodate the needs of large-area shooting, see Figure 11 An industrial camera may include multiple sensor modules 20 and multiple industrial camera motherboards 10. Figure 11 This example uses three industrial camera motherboards 10 and three sensor modules 20 (the specific number can be customized according to actual needs). Each industrial camera motherboard 10 is connected to at least one sensor module 20 through a sensor connection module 105. The inter-board cascade connector 104 supports differential and single-ended signal communication. Each industrial camera motherboard 10 has a signal conversion circuit 103 with the same structure, which can convert I / O signals (differential or single-ended signals) into single-ended signals with the same frequency and logic processor level to the processing module 101. This allows external signals to be simultaneously supplied to the processing modules 101 of all cascaded industrial camera motherboards 10.

[0068] In one example, the I / O interface 102 and the signal conversion circuit 103, as well as the I / O interface 102 and the inter-board cascade connector 104, can be connected via differential signal traces. Figure 11 In the diagram, the P-line represents the positive terminal of the differential signal trace, and the N-line represents the negative terminal. When using differential signal traces, the transmission rate is faster, reaching up to 10Mbps, resulting in faster I / O signal transmission. Furthermore, since the I / O signal is transmitted in differential form, this design allows for threshold comparison between the P-line and N-line at the end of the differential signal path. This threshold can be above 200mV to detect the exposure trigger signal. The I / O interface 102 can simultaneously support differential and single-ended signals. When a differential signal is received, for example… Figure 12 As shown, a signal can be detected when the P-line voltage minus the N-line voltage is greater than 200mV, thus generating a level flip and sending it to the processing module 101. When a single-ended signal is received, for example... Figure 13 As shown, there is a clamping voltage at the N terminal for comparison. When the P line voltage minus the clamping voltage is greater than 200mV, a signal can be detected, thereby generating a level flip and sending it to the processing module 101.

[0069] In one possible implementation, see Figure 14 The inter-board cascading connector 104 of the industrial camera motherboard 10 includes a first inter-board cascading connector 1041 and a second inter-board cascading connector 1042. The first inter-board cascading connector 1041 of the industrial camera motherboard 10 is connected to the second inter-board cascading connector 1042 of its upstream industrial camera motherboard 10, and the second inter-board cascading connector 1042 of its downstream industrial camera motherboard 10 is connected to the first inter-board cascading connector 1041 of its downstream industrial camera motherboard 10. In one example, the first inter-board cascading connector 1041 of the first industrial camera motherboard 10 can be left unconnected because it has no upstream industrial camera motherboard 10; similarly, the second inter-board cascading connector 1042 of the last industrial camera motherboard 10 can be left unconnected because it has no downstream industrial camera motherboard 10. In another example, the first inter-board cascading connector 1041 of the first industrial camera motherboard can be connected to the second inter-board cascading connector 1042 of the last industrial camera motherboard 10, forming a ring connection, thereby improving the availability of the circuit. The number of industrial camera motherboards 10 in each industrial camera can be set according to actual needs. Figure 14 The example only uses three industrial camera motherboards 10, and is not intended to limit the number of industrial camera motherboards 10.

[0070] In a scenario where an industrial camera includes multiple industrial camera motherboards 10, in one possible implementation, each industrial camera motherboard 10 includes a DIP switch 108 and a lamp board connection module 107. The industrial camera motherboard 10 with the DIP switch 108 in the first position is the master industrial camera motherboard, and the industrial camera motherboard 10 with the DIP switch 108 not in the first position is the slave industrial camera motherboard. The I / O interface 102 in the master industrial camera motherboard is used to connect to a host computer, and the lamp board connection module 107 in the master industrial camera motherboard is used to connect to a lamp board array. The number of industrial camera motherboards 10 in each industrial camera can be set according to actual needs.

[0071] The DIP switch 108 has multiple positions. When the second processor 1012 detects that the DIP switch 108 connected to it is in the first position, the second processor 1012 determines that the industrial camera motherboard it is connected to is the master industrial camera motherboard. When the second processor 1012 detects that the DIP switch 108 connected to it is not in the first position, the second processor 1012 determines that the industrial camera motherboard it is connected to is the slave industrial camera motherboard. The master industrial camera motherboard has lamp control signals and output signals. When it receives an exposure trigger signal, the first processor 1011 of the master industrial camera motherboard controls the lamp board array to light up through the lamp board connection module 107 and controls the sensor module exposure through the sensor connection module 105. When the slave industrial camera motherboard and the master industrial camera motherboard receive the exposure trigger signal at the same time, the first processor 1011 of the slave industrial camera motherboard simultaneously controls the sensor module exposure through the sensor connection module 105. This allows the exposure time of the sensor modules in all areas to be synchronized with the lighting time of the lamp board array. When the main industrial camera motherboard performs I / O output, the second processor 1012 of the main industrial camera motherboard communicates with the second processor 1012 of the slave industrial camera motherboard, thereby setting the external I / O of each slave industrial camera motherboard to the input state, and only the main industrial camera motherboard performs I / O output; thus avoiding the situation of transmission errors caused by multiple industrial camera motherboards sending I / O signals at the same time.

[0072] In a scenario where an industrial camera includes multiple industrial camera motherboards 10, in one possible implementation, each industrial camera motherboard 10 includes a processor cascade module, and the industrial camera motherboards 10 are also connected to each other through the processor cascade module. When the processing module 101 includes a first processor 1011 and a second processor 1012: the industrial camera motherboards 10 can communicate with each second processor 1012 through the processor cascade module, or with each first processor 1011 through the processor cascade module, or with each second processor 1012 and each first processor 1011 through separate processor cascade modules. The communication between the processing modules 101 of the industrial camera motherboards 10 through the processor cascade module enables communication between the processing modules 101 of each industrial camera motherboard 10, thereby facilitating the control of the slave industrial camera motherboards by the master industrial camera motherboard.

[0073] Thirdly, embodiments of this application provide a camera system, see [link to relevant documentation]. Figure 15 The system includes a light panel array 2 and an industrial camera 1 as described in this application. The industrial camera mainboard 10 of the industrial camera 1 includes a light panel connection module 107, which is connected to the light panel array 2. Figure 15This example uses only one industrial camera, comprising two industrial camera motherboards 10, and is not intended to limit the number of industrial camera motherboards 10 in an industrial camera. The main industrial camera motherboard in industrial camera 1 controls the illumination of the lamp array 2. Upon receiving an exposure trigger signal, the first processor 1011 of the main industrial camera motherboard simultaneously controls the sensor module 20 to perform exposure and illuminate the lamp array 2. The number of lamp arrays 2 can be multiple (…). Figure 15 (This example only uses two light panel arrays 2 and is not intended to limit the number of light panel arrays 2.) The light panel arrays 2 are cascaded, and each light panel array 2 can be lit simultaneously under the control of the main industrial camera motherboard.

[0074] To meet the need for shooting over a larger area, in one possible implementation, the camera system includes multiple industrial cameras 1. The shooting area can be expanded by splicing the industrial cameras 1 together. Splicing the industrial cameras 1 together involves connecting their respective industrial camera motherboards 10. The connection method of the industrial camera motherboards 10 can be found in the above embodiments and will not be repeated here. When multiple industrial cameras 1 are spliced ​​together, only one industrial camera motherboard 10 is the master industrial camera motherboard, and the remaining industrial camera motherboards are slave industrial camera motherboards.

[0075] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0076] The various embodiments in this specification are described in a related manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the various embodiments can be referred to each other.

[0077] The above description is merely a preferred embodiment of this application and is not intended to limit the scope of protection of this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application are included within the scope of protection of this application.

Claims

1. An industrial camera motherboard, characterized in that, include: Processing module, I / O interface, signal conversion circuit, inter-board cascade connector, sensor connection module; The processing module is connected to the signal conversion circuit, the processing module is connected to the sensor connection module, the I / O interface is connected to the signal conversion circuit, and the I / O interface is also connected to the inter-board cascade connector; The sensor connection module is used to connect sensor modules, and the inter-board cascading connection machine is used to connect other industrial camera motherboards.

2. The industrial camera motherboard according to claim 1, characterized in that, The industrial camera motherboard also includes a high-speed data interface, and the processing module includes a first processor and a second processor; The first processor is connected to the second processor, the signal conversion circuit, and the sensor connection module, respectively. The second processor is connected to the high-speed data interface.

3. The industrial camera motherboard according to claim 1, characterized in that, The inter-board cascade connector includes a first inter-board cascade connector and a second inter-board cascade connector, which are respectively connected to the I / O interface.

4. The industrial camera motherboard according to claim 1, characterized in that, The industrial camera motherboard also includes a high-speed data interface, a lamp board connection module, and a DIP switch, wherein the high-speed data interface, the lamp board connection module, and the DIP switch are respectively connected to the processing module.

5. The industrial camera motherboard according to claim 2, characterized in that, The industrial camera motherboard also includes: a lamp board connection module and a DIP switch; The first processor is also connected to the lamp board connection module; The second processor is also connected to the DIP switch.

6. The industrial camera motherboard according to any one of claims 1-5, characterized in that, The industrial camera motherboard further includes a processor cascade module, wherein the processing module is connected to the processor cascade module; the processor cascade module is used to connect to the processor cascade modules of other industrial camera motherboards.

7. An industrial camera, characterized in that, It includes a sensor module and an industrial camera motherboard as described in any one of claims 1-6, wherein the sensor module is connected to the sensor connection module of the industrial camera motherboard.

8. The industrial camera according to claim 7, characterized in that, The industrial camera includes multiple sensor modules and multiple industrial camera motherboards, and one of the industrial camera motherboards is connected to at least one of the sensor modules through a sensor connection module.

9. The industrial camera according to claim 8, characterized in that, The inter-board cascading connector of the industrial camera motherboard includes a first inter-board cascading connector and a second inter-board cascading connector; the first inter-board cascading connector of the industrial camera motherboard is connected to the second inter-board cascading connector of its upstream industrial camera motherboard, and the second inter-board cascading connector of the industrial camera motherboard is connected to the first inter-board cascading connector of its downstream industrial camera motherboard.

10. The industrial camera according to claim 8, characterized in that, The industrial camera motherboard includes a processor cascade module, and the industrial camera motherboards are also connected to each other through the processor cascade module.

11. The industrial camera according to claim 8, characterized in that, The industrial camera motherboard includes a DIP switch and a lamp board connection module. The industrial camera motherboard with the DIP switch in the first position is the main industrial camera motherboard. The I / O interface in the main industrial camera motherboard is used to connect to a host computer. The lamp board connection module in the main industrial camera motherboard is used to connect to a lamp board array.

12. A camera system, characterized in that, The device includes a light panel array and an industrial camera as described in any one of claims 7-11, wherein the industrial camera mainboard of the industrial camera includes a light panel connection module, and the light panel connection module of the industrial camera is connected to the light panel array.

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