A kind of buffer structure for ultra-thin loudspeaker, loudspeaker and sound equipment
Patent Information
- Application Number
- CN202522466253.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-20
- Publication Date
- 2026-11-03
- Estimated Expiration
- 2035-11-20
AI Technical Summary
Existing ultra-thin speakers are prone to damage to core components and have a short lifespan under transient abnormal operating conditions, and existing solutions are unable to fundamentally solve the problem.
A soft, elastic buffer is installed at the connection between the vibration assembly and the frame and magnetic circuit assembly to absorb instantaneous impact energy through elastic deformation, thus preventing damage to the core components.
It effectively protects the core components of the speaker, avoids damage caused by transient overload, extends its service life, and maintains sound quality.
Smart Images
Figure CN224935769U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of television audio technology, and in particular to a buffer structure for an ultra-thin loudspeaker, a loudspeaker, and an audio device. Background Technology
[0002] With the increasing popularity of ultra-thin TVs, the demand for slimmer built-in sound systems has placed stringent requirements on speaker design. To match this trend, current TV speakers generally employ short-stroke speaker designs, significantly reducing device thickness by compressing the linear stroke of the voice coil. Under ideal operating conditions, the acoustic performance of these speakers can meet sound quality requirements, but their structural characteristics expose significant reliability flaws under transient abnormal operating conditions. Transient abnormal operating conditions refer to situations where, during TV playback, the signal source itself contains strong transient pulses (such as explosions or gunshots), the user suddenly increases the volume, or the power amplifier circuit experiences a momentary overload, causing the speaker voice coil to withstand power exceeding its rated value for a very short period.
[0003] Because amplifier protection circuits inherently have a response delay (typically a few milliseconds), they cannot suppress the output in time, causing the voice coil to experience transient high-amplitude vibrations, with displacement far exceeding the designed linear travel. This enormous impact can easily lead to voice coil deformation, spider tearing, cone damage, or glue separation. A single severe abnormal condition is enough to permanently damage a speaker, and repeated occurrences will inevitably lead to rapid performance degradation. Currently, mainstream solutions in the industry mainly focus on optimizing amplifier protection algorithms or strictly limiting maximum output power; however, these methods essentially sacrifice the dynamic range and sound quality of the audio system, failing to fundamentally solve the problem.
[0004] Therefore, existing technologies still need improvement. Utility Model Content
[0005] In view of the shortcomings of the prior art, the purpose of this utility model is to provide an impact-resistant buffer structure for ultra-thin short-stroke loudspeakers, which aims to solve the problem of short service life caused by damage to core components due to accidental overload in existing loudspeakers.
[0006] The buffer structure, speaker, and audio equipment provided in this application adopt the following technical solution: A buffer structure for an ultra-thin loudspeaker, comprising: Sink stand; A magnetic circuit assembly is disposed at the bottom of the basin frame and connected to the basin frame; the magnetic circuit assembly forms a magnetic circuit gap; A vibrating assembly includes a paper cone, a voice coil frame, and a spider. The paper cone is connected to the frame, forming a first assembly area. One end of the voice coil frame is connected to the paper cone, and the other end extends to the magnetic circuit gap. A second assembly area is provided in the magnetic circuit gap, directly opposite the bottom of the voice coil frame. A spider ring is disposed on the voice coil frame, forming a spider center. The edge of the spider is connected to the frame. A third assembly area is provided on the magnetic circuit assembly, directly opposite the spider center. At least one of the first assembly area, the second assembly area, and the third assembly area is provided with a buffer.
[0007] Optionally, in the buffer structure for the ultra-thin speaker, the buffer includes a first buffer layer; the first buffer layer is disposed in the first assembly area.
[0008] Optionally, in the buffer structure for the ultra-thin loudspeaker, the buffer element includes a second buffer layer; the magnetic circuit assembly includes: The T-iron includes an interconnected base and a column; the base is provided with a second assembly area. A magnet is sleeved on the column and connected to the base; a magnetic circuit gap is formed between the magnet and the column. A magnetic guide plate is disposed on the magnet and connected to the basin frame; The second buffer layer is disposed in the second assembly area and located in the magnetic circuit gap.
[0009] Optionally, in any of the above-described buffer structure for an ultra-thin loudspeaker, the buffer includes a third buffer layer; the third buffer layer is disposed in the third assembly area.
[0010] Optionally, in the buffer structure for ultra-thin speakers, the thickness of the buffer is from 0.05 mm to 1.5 mm.
[0011] Optionally, in the buffer structure for ultra-thin speakers, the buffer element is a soft, elastic element.
[0012] Optionally, in the buffer structure for ultra-thin loudspeakers, the buffer is any one of polyurethane foam, silicone rubber, nitrile rubber, thermoplastic elastomer, and special acoustic sponge.
[0013] Optionally, in the buffer structure for ultra-thin loudspeakers, the buffer element is fixed to any connection point between the vibration assembly and the frame or the magnetic circuit assembly by means of adhesive bonding, hot pressing, or integral molding.
[0014] This utility model also discloses a loudspeaker, which includes the buffer structure for an ultra-thin loudspeaker described in any one of the above-mentioned claims.
[0015] This utility model also discloses an audio device, comprising the aforementioned speaker, wherein the speaker is provided with the buffer structure for an ultra-thin speaker as described in any one of the above claims. Compared with the prior art, the embodiments of this utility model have the following advantages: This application incorporates a buffer with elastic damping properties at any connection point between the vibration assembly and the frame or magnetic circuit assembly, replacing the traditional direct rigid contact with a flexible connection medium. When the speaker is subjected to abnormal operating conditions such as instantaneous overload or sudden impact, the core components generate displacement or force exceeding the normal range. The buffer absorbs the instantaneous impact energy through elastic deformation and returns to its initial state through elastic restoring force after the impact disappears, ensuring normal speaker operation and preventing damage to the speaker's core components. Attached Figure Description
[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0017] Figure 1 This is a schematic diagram of the main structure of the loudspeaker in an embodiment of this application; Figure 2 This is a cross-sectional view of the loudspeaker in an embodiment of this application; Figure 3 yes Figure 2 Enlarged view of point A in the middle; Figure 4 yes Figure 2 Enlarged view of point B in the middle; Figure 5 yes Figure 2 Enlarged view of point C in the middle; Explanation of reference numerals in the attached drawings: 100, frame; 200, magnetic circuit assembly; 210, magnetic circuit gap; 220, T-iron; 2201, column; 2202, base; 230, magnet; 240, magnetic guide plate; 300, vibrating assembly; 310, paper cone; 3101, paper cone R-ring; 320, voice coil frame; 330, spider; 3301, spider center; 410, first buffer layer; 420, second buffer layer; 430, third buffer layer. Detailed Implementation
[0018] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0019] The present application will be further described in detail below with reference to the accompanying drawings.
[0020] Under transient abnormal operating conditions, the structure of ultra-thin short-stroke loudspeakers has significant defects that severely affect their performance and lifespan. "Transient abnormal operating conditions" refer to situations where, during television playback, the signal source itself contains strong transient pulses (such as explosions or gunshots), the user suddenly increases the volume, or the amplifier circuit experiences a momentary overload, causing the speaker's voice coil to withstand power exceeding its rated value for a very short period. Due to the inherent response delay (typically a few milliseconds) of the amplifier's protection circuit, it cannot suppress the output in time, resulting in transient high-amplitude vibrations in the voice coil, with displacement far exceeding the designed linear travel. This transient high power can trigger severe "bottoming out" phenomena, specifically: the bottom of the voice coil frame impacts the magnetic circuit assembly; the spider, due to excessive stretching or compression, rigidly collides with the magnetic circuit assembly; and the diaphragm's edge (i.e., the cone R-ring) makes hard contact with the speaker frame during excessive displacement. These collisions can easily lead to voice coil deformation, spider tearing, cone breakage, or glue separation; even a single severe abnormal condition can permanently damage the speaker.
[0021] like Figure 1 and Figure 2As shown, based on the above, this application discloses a buffer structure for an ultra-thin loudspeaker, comprising: a frame 100, a magnetic circuit assembly 200, a vibration assembly 300, and a buffer member; the magnetic circuit assembly 200 is disposed at the bottom of the frame 100 and connected to the frame 100; the magnetic circuit assembly 200 forms a magnetic circuit gap 210; the vibration assembly includes a paper cone 310, a voice coil frame 320, and a spider 330; the paper cone 310 is connected to the frame 100 and forms a first assembly area; the voice coil frame 320... One end of the assembly is connected to the cone 310, and the other end extends to the magnetic circuit gap 210; a second assembly area is provided in the magnetic circuit gap 210 directly opposite the bottom of the voice coil frame 320; the spring 330 is arranged around the voice coil frame 320, forming a spring center 3301; the edge of the spring 330 is connected to the frame 100; a third assembly area is provided on the magnetic circuit assembly directly opposite the spring center 3301; wherein, at least one of the first, second, and third assembly areas is provided with a buffer. The buffer is a soft elastic element.
[0022] In use, a buffer is installed at any connection point between the vibration assembly 300 and the frame 100 and the magnetic circuit assembly 200. The buffer is a soft, elastic component, replacing the traditional direct rigid contact with a soft connection medium. When the speaker is under abnormal operating conditions such as instantaneous overload or sudden impact, the core components generate displacement or force beyond the normal range. The buffer absorbs the instantaneous impact energy through elastic deformation and returns to its initial state by elastic restoring force after the impact disappears, ensuring the speaker works normally and avoiding damage to the core components of the speaker.
[0023] like Figure 2 As shown, specifically, the buffer structure disclosed in this utility model is applicable to ultra-thin short-stroke loudspeakers, including a frame 100, a magnetic circuit assembly 200 connected to the frame 100, and a vibration assembly 300. The magnetic circuit assembly 200 forms a magnetic circuit gap 210; the vibration assembly 300 includes a paper cone 310 and a voice coil frame 320 connected to the frame 100, with one end of the voice coil frame 320 connected to the paper cone 310 and the other end extending to the magnetic circuit gap 210. A buffer is disposed at the contact point between the frame 100 and the vibration assembly 300, or at any one or more of the contact points between the magnetic circuit assembly 200 and the vibration assembly 300. When the ultra-thin short-stroke loudspeaker is under transient abnormal operating conditions (such as sudden extremely high volume or signal transient overload), the buffer disposed at the contact point absorbs most of the impact energy through compression deformation, ensuring that the core components such as the voice coil frame 320 and the paper cone 310 remain intact.
[0024] like Figure 3As shown, in this embodiment, the buffer includes a first buffer layer 410; the first buffer layer 410 is disposed at the connection between the cone 310 and the frame 100, i.e., the first assembly area. The cone 310 of the speaker has an annular suspension structure (i.e., cone R-ring 3101) at its edge, and a gap is formed at the connection between the cone R-ring 3101 and the frame 100. The first buffer layer 410 is disposed on the lower surface of the cone R-ring 3101 and located at the gap. From the working principle, when the speaker encounters a transient overload of the audio signal, the cone 310 generates a vibration amplitude far exceeding the normal range. At this time, the cone R-ring 3101 is subjected to a severe impact force and displaces downward (i.e., in the gap direction), making soft contact with the pre-set first buffer layer 410. The first buffer layer 410 absorbs most of the impact energy through its own compression deformation, so as to transform the hard collision that might have occurred between the paper cone R ring 3101 and the frame 100 into a soft contact, thereby avoiding damage such as cracking or deformation of the paper cone 310 due to rigid impact, and ensuring the stable operation of the sound unit.
[0025] In this embodiment, the first buffer layer 410 can also be disposed on the annular area of the frame 100 where it may collide with the paper cone R ring 3101. That is, the first buffer layer 410 is disposed around the end face of the frame 100 that contacts the paper cone R ring 3101. By expanding the actual effective area of the first buffer layer 410, it is ensured that the first buffer layer 410 can cover the area where the paper cone 310 is most likely to collide with the frame 100. This ensures that the paper cone R ring 3101 can form effective contact with the first buffer layer 410 under different vibration angles and different displacement amplitudes. At the same time, it can also disperse local forces and prevent the first buffer layer 410 from failing due to excessive force at a single point. This effectively prevents damage to the paper cone 310 and extends the overall service life of the speaker.
[0026] like Figure 4 As shown, in one embodiment, the buffer includes a second buffer layer 420; the magnetic circuit assembly 200 includes a T-iron 220, a magnet 230, and a magnetic guide plate 240; the T-iron 220 includes a base 2202 and a column 2201 connected to each other; a second assembly area is provided on the base; the magnet 230 is sleeved on the column 2201 and connected to the base 2202; a magnetic circuit gap 210 is formed between the magnet 230 and the column 2201; the magnetic guide plate 240 is disposed on the magnet 230 and connected to the frame 100; wherein, the second buffer layer 420 is disposed in the second assembly area and located in the magnetic circuit gap 210.
[0027] Specifically, the T-shaped iron 220 includes a base 2202 and a column 2201, and is generally T-shaped. A magnet 230 is fitted onto the column 2201 of the T-shaped iron 220, with one side surface of the magnet 230 in contact with the base 2202. A magnetic guide plate 240 is fitted onto the column 2201 of the T-shaped iron 220, and is in contact with the side surface of the magnet 230 facing away from the base 2202. The diameters of the magnetic guide plate 240 and the magnet 230 are not equal, forming a magnetic circuit gap 210 between the magnet 230 and the column 2201. One end of the voice coil frame 320 is connected to the cone 310, and the other end extends into the magnetic circuit gap 210. A second buffer layer 420 is disposed on the base 2202 and located within the magnetic circuit gap 210. When the ultra-thin short-stroke loudspeaker experiences a sudden surge in volume or a transient signal overload, the voice coil frame 320 shifts downwards (i.e., moves towards the base 2202 of the T-iron 220). The voice coil frame 320 then contacts the second buffer layer 420. The second buffer layer 420 absorbs most of the impact energy through compression deformation, preventing damage to the voice coil frame 320 and extending the lifespan of the ultra-thin short-stroke loudspeaker. In this embodiment, the second buffer layer 420 is disposed on the upper surface of the base 2202 and located on the expected impact surface of the voice coil frame 320, ensuring effective contact between the second buffer layer 420 and the voice coil frame 320.
[0028] In one embodiment, the second buffer layer 420 can also be disposed on the end face of the voice coil frame 320 near the T-iron 220. When the voice coil frame 320 is displaced downward, the second buffer layer 420 makes elastic contact with the base 2202 of the T-iron 220, which can also absorb the impact force and prevent the voice coil frame 320 from being damaged.
[0029] like Figure 5 As shown, in one embodiment, the buffer includes a third buffer layer 430; the vibration assembly 300 also includes a spring 330; one end of the spring 330 is connected to the frame 100, and the other end is circumferentially abutted against the voice coil skeleton 320 to form a spring center 3301; the third assembly area is disposed on the magnetic guide plate and located directly below the spring center; the third buffer layer 430 is provided with the third assembly area.
[0030] Specifically, the vibration assembly 300 includes a spider 330, which is arranged around and abuts against the voice coil frame 320 to form a spider center 3301; the edge of the spider 330 is connected to the frame 100. In the magnetic circuit assembly 200, one side surface of the magnetic guide plate 240 is in contact with the magnet 230, and the other side surface is connected to the frame 100. The third buffer layer 430 is disposed on the end face of the magnetic guide plate 240 that is in contact with the frame 100, and is located below the spider center 3301. Under transient abnormal operating conditions, the spider 330 is over-compressed, and the spider center 3301 is displaced downward (i.e., displaced towards the magnetic guide plate 240). The spider center 3301 makes elastic contact with the third buffer layer 430, and the third buffer layer 430 absorbs most of the impact energy through compression deformation, preventing damage to the spider 330. In this embodiment, the third buffer layer 430 is disposed in the area where the spring wave 330 is over-compressed, causing it to be positioned downwards to contact the basin frame 100.
[0031] In one embodiment, the third buffer layer 430 may also be disposed on the end face of the basin frame 100 near the connection between the spring 330 and the basin frame 100, that is, on the end of the basin frame 100 away from the center 3301 of the spring. When the spring 330 is overstretched, the edge of the spring 330 makes elastic contact with the third buffer layer 430 on the basin frame 100, which can also absorb the impact energy.
[0032] In one embodiment, the buffer can be individually installed at any connection point between the vibration assembly 300 and the frame 100, or between the vibration assembly 300 and the magnetic circuit assembly 200, or it can be applied to multiple connection points in any combination to achieve all-round protection.
[0033] In another embodiment of this utility model, the thickness of the buffer is 0.05 mm to 1.5 mm. Specifically, the thickness of the buffer is 0.1 mm to 0.8 mm. This thickness balances the core function of buffer protection while minimizing interference from the buffer on the normal operation of the ultra-thin short-stroke speaker. That is, under normal volume and signal input conditions, the buffer maintains a stable and safe gap with the vibration component 300 (such as the paper cone R-ring 3101 and the spider 330), preventing contact between the buffer and the vibration component 300. This ensures that the buffer does not negatively affect the frequency response curve, sound sensitivity, and total harmonic distortion of the ultra-thin short-stroke speaker, guaranteeing that the original sound quality and acoustic performance of the speaker remain undisturbed.
[0034] When the ultra-thin short-stroke speaker encounters abnormal operating conditions, such as receiving a sudden ultra-high volume signal or experiencing a transient overload of the audio signal, the vibration component 300 generates an amplitude movement far exceeding the norm. At this time, the buffer absorbs the impact energy by utilizing its own elastic deformation, preventing the vibration component 300 from being damaged by rigid collision and extending the service life of the ultra-thin short-stroke speaker.
[0035] In this embodiment, a second annular buffer layer 420 is adhered to the base 2202 of the T-iron 220 using high-temperature resistant adhesive. This second buffer layer 420 is made of polyurethane foam with a thickness of 0.2 mm. Simultaneously, a first annular buffer layer 410 is adhered to the lower surface of the paper cone R-ring 3101, and a third annular buffer layer 430 is adhered to the upper surface of the magnetic plate 240. Both the first and third buffer layers 410 and 430 are made of silicone rubber with a thickness of 0.2 mm. Under normal operating conditions, the amplitude of the core component of the ultra-thin short-stroke loudspeaker is within a preset linear stroke. A safety gap of 0.1 mm to 0.3 mm exists between each buffer layer and its corresponding component, which has no impact on the acoustic characteristics of the ultra-thin short-stroke loudspeaker. When the ultra-thin short-stroke loudspeaker experiences a sudden high volume or transient signal overload, the voice coil cone R-ring 3101, voice coil frame 320, and spider center 3301 are displaced beyond the preset linear stroke, respectively contacting the first buffer layer 410, the second buffer layer 420, and the third buffer layer 430. The first buffer layer 410, the second buffer layer 420, and the third buffer layer 430 absorb most of the impact energy through compression deformation, ensuring that the core components such as the voice coil frame 320 and the cone 310 remain intact.
[0036] Based on the above embodiments, the present invention also discloses a loudspeaker, wherein the loudspeaker includes the buffer structure for ultra-thin loudspeakers described in any one of the above embodiments.
[0037] Based on the above embodiments, this utility model also discloses an audio device, which includes the speaker described above.
[0038] In summary, this utility model discloses a buffer structure, a speaker, and an audio device for an ultra-thin loudspeaker. The buffer structure for the ultra-thin loudspeaker includes: a frame, a magnetic circuit assembly, a vibration assembly, and a buffer element. The magnetic circuit assembly is connected to the frame. The magnetic circuit assembly forms a magnetic circuit gap. The vibration assembly includes a paper cone connected to the frame and a voice coil frame. One end of the voice coil frame is connected to the paper cone, and the other end extends to the magnetic circuit gap. The buffer element is disposed at any connection point between the vibration assembly and the frame or the magnetic circuit assembly. The buffer element is used to absorb the impact energy between the vibration assembly and the frame or the magnetic circuit assembly. The buffer element is a soft, elastic element. This application provides a buffer element with elastic buffering characteristics at any connection point between the vibration assembly and the frame or the magnetic circuit assembly, transforming the rigid collision at the core component connection point into elastic contact. Under transient abnormal operating conditions, the buffer element absorbs instantaneous impact energy through elastic deformation, solving the problem of existing loudspeakers suffering damage to core components and short service life due to accidental overload.
[0039] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other.
[0040] It should be noted that this utility model uses a buffer structure for ultra-thin loudspeakers as an example to introduce the specific structure and working principle of this utility model, but the application of this utility model is not limited to the buffer structure for ultra-thin loudspeakers, and can also be applied to the production and use of other similar workpieces.
[0041] It should be understood that this invention is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this invention is limited only by the appended claims.
[0042] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A buffer structure for an ultra-thin loudspeaker, characterized in that, include: Sink stand; A magnetic circuit assembly is disposed at the bottom of the basin frame and connected to the basin frame; the magnetic circuit assembly forms a magnetic circuit gap; A vibrating assembly includes a paper cone, a voice coil frame, and a spider. The paper cone is connected to the frame, forming a first assembly area. One end of the voice coil frame is connected to the paper cone, and the other end extends to the magnetic circuit gap. A second assembly area is provided in the magnetic circuit gap, directly opposite the bottom of the voice coil frame. A spider ring is disposed on the voice coil frame, forming a spider center. The edge of the spider is connected to the frame. A third assembly area is provided on the magnetic circuit assembly, directly opposite the spider center. At least one of the first assembly area, the second assembly area, and the third assembly area is provided with a buffer.
2. The buffer structure for an ultra-thin loudspeaker according to claim 1, characterized in that, The buffer component includes a first buffer layer; the first buffer layer is disposed in the first assembly area.
3. The buffer structure for an ultra-thin loudspeaker according to claim 1, characterized in that, The buffer includes a second buffer layer; the magnetic circuit assembly includes: The T-iron includes an interconnected base and a column; the base is provided with a second assembly area. A magnet is sleeved on the column and connected to the base; a magnetic circuit gap is formed between the magnet and the column. A magnetic guide plate is disposed on the magnet and connected to the basin frame; The second buffer layer is disposed in the second assembly area and located in the magnetic circuit gap.
4. The buffer structure for an ultra-thin loudspeaker according to any one of claims 1 to 3, characterized in that, The buffer component includes a third buffer layer; the third buffer layer is disposed in the third assembly area.
5. The buffer structure for an ultra-thin loudspeaker according to claim 1, characterized in that, The thickness of the buffer is 0.05 mm to 1.5 mm.
6. The buffer structure for an ultra-thin loudspeaker according to claim 1, characterized in that, The buffer is a soft, elastic element.
7. The buffer structure for an ultra-thin loudspeaker according to claim 1, characterized in that, The cushioning component is any one of polyurethane foam, silicone rubber, nitrile rubber, thermoplastic elastomer, and special acoustic sponge.
8. The buffer structure for an ultra-thin loudspeaker according to claim 1, characterized in that, The buffer is fixed to any connection point between the vibration assembly and the frame or the magnetic circuit assembly by means of adhesive bonding, hot pressing or integral molding.
9. A loudspeaker, characterized in that, Includes the buffer structure for ultra-thin loudspeakers as described in any one of claims 1 to 8.
10. An audio device, characterized in that, The speaker includes the speaker as described in claim 9, wherein the speaker is provided with a buffer structure for an ultra-thin speaker as described in any one of claims 1 to 8.