A wireless routing circuit

CN224935791UActive Publication Date: 2026-11-03SHENZHEN SHENZHOU DIGITAL MICROELECTRONICS CO LTD
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Patent Information

Application Number
CN202522318376.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-10-31
Publication Date
2026-11-03
Estimated Expiration
2035-10-31

AI Technical Summary

Technical Problem

Existing routers require Ethernet cabling, which makes construction and renovation difficult, costly, and maintenance expensive.

Method used

Design a wireless router circuit that includes a 5G communication module, a power supply module, a WiFi antenna module, a SIM card switching module, and an Ethernet switching module. It enables wireless networking through SDIO and RGMII interfaces and supports free switching between wired and wireless modes.

Benefits of technology

It solves the high cost problem caused by Ethernet cabling in routers, and achieves the flexibility of wireless networking while retaining the wired mode, adapting to different user needs.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a wireless routing circuit, wherein, the wireless routing circuit includes: 5G communication module, power module, WiFi antenna module, SIM card switch module, ethernet switch module, routing antenna, the 5G communication module is connected power module SIM card switch module routing antenna respectively, the 5G communication module is connected through SDIO interface WiFi antenna module, the 5G communication module is connected through RGMII interface ethernet switch module Routing antenna is used for transmitting and receiving cellular signal. In the utility model scheme, through the integration connection of multiple WiFi antenna module, SIM card switch module, ethernet switch module on 5G communication module, the technical problem of the cost of the router being too large due to the use of ethernet wiring is solved.
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Description

Technical Field

[0001] This utility model relates to the field of routing communication, and in particular to a wireless routing circuit. Background Technology

[0002] With the continuous improvement of broadband access speeds, the core equipment of home and enterprise networks—routers—has evolved from the early 100 Mbps single-band form to gigabit dual-band and even Wi-Fi 6 / 7 specifications. However, these high-performance routers still use the traditional architecture of "wired power supply + Ethernet backhaul": the router must be placed near the information box or weak current cabinet and connected to the optical modem through the pre-buried Cat5e / Cat6 cables in the wall; when providing gigabit coverage in multiple rooms, additional network cables still need to be laid to each panel AP or Mesh node, and the construction requires drilling walls, running conduits, and drilling RJ45 connectors, which is difficult and costly to modify in already renovated houses.

[0003] If the network cable ages or the RJ45 connector has poor contact, users will need to remove the wall for repairs, resulting in high maintenance costs. Therefore, to solve the technical problem of excessive costs caused by the need for Ethernet cabling in current routers, a new technology is needed to address this issue. Utility Model Content

[0004] The main purpose of this invention is to propose a wireless routing circuit that aims to solve the technical problem of excessive costs caused by the need for Ethernet cabling in routers.

[0005] To achieve the above objectives, the present invention proposes a wireless routing circuit, which includes: 5G communication module, power supply module, WiFi antenna module, SIM card switching module, Ethernet switching module, and router antenna; The 5G communication module is connected to the power module, the SIM card switching module, and the routing antenna respectively. The 5G communication module is connected to the WiFi antenna module through the SDIO interface and the Ethernet switching module through the RGMII interface. The routing antenna is used to transmit and receive cellular signals.

[0006] Optionally, in the first implementation, the 5G communication module includes an IM2501 communication chip.

[0007] Optionally, in the second implementation, the WiFi antenna module includes an AIC8800D80 network chip.

[0008] Optionally, in the third implementation, the SIDO_D3, SIDO_D2, SIDO_D1, SIDO_D0, SIDO_CLK, and SIDO_CMD pins of the IM2501 communication chip form an SDIO interface connected to the AIC8800D80 network chip.

[0009] Optionally, in the fourth implementation, the SIDO_D3 pin of the IM2501 communication chip is connected to the GPIOA14 pin of the AIC8800D80 network chip, the SIDO_D2 pin of the IM2501 communication chip is connected to the GPIOA15 pin of the AIC8800D80 network chip, the SIDO_D1 pin of the IM2501 communication chip is connected to the GPIOA10 pin of the AIC8800D80 network chip, the SIDO_D0 pin of the IM2501 communication chip is connected to the GPIOA11 pin of the AIC8800D80 network chip, the SIDO_CLK pin of the IM2501 communication chip is connected to the GPIOA12 pin of the AIC8800D80 network chip, and the SIDO_CMD pin of the IM2501 communication chip is connected to the GPIOA13 pin of the AIC8800D80 network chip.

[0010] Optionally, in the fifth implementation, the routing antenna includes a main antenna and a diversity antenna, wherein the main antenna is connected to the ANT_MAIN pin of the IM2501 communication chip, and the diversity antenna is connected to the ANT_DIV pin of the IM2501 communication chip.

[0011] Optionally, in the sixth implementation, the Ethernet switching module includes an RTL8211F-CG chip.

[0012] Optionally, in the seventh implementation, the RGMII_MDC pin, RGMII_MDIO pin, RGMII_TX_D0 pin, RGMII_TX_D1 pin, RGMII_TX_D2 pin, RGMII_TX_D3 pin, RGMII_CTL_TX pin, and RGMII_TX_CLK pin of the IM2501 communication chip form an RGMII interface connected to the RTL8211F-CG chip.

[0013] Optionally, in the eighth implementation, the RMGII_MDC pin of the IM2501 communication chip is connected to the MDC pin of the RTL8211F-CG chip, the RMGII_MDIO pin of the IM2501 communication chip is connected to the MDIO pin of the RTL8211F-CG chip, the RMGII_TX_D0 pin of the IM2501 communication chip is connected to the TD0 pin of the RTL8211F-CG chip, and the RMGII_TX_D1 pin of the IM2501 communication chip is connected to the TD0 pin of the RTL8211F-CG chip. 1. The RMGII_TX_D2 pin of the IM2501 communication chip is connected to the TD2 pin of the RTL8211F-CG chip; the RMGII_TX_D3 pin of the IM2501 communication chip is connected to the TD3 pin of the RTL8211F-CG chip; the RMGII_CTL_TX pin of the IM2501 communication chip is connected to the TXCTL pin of the RTL8211F-CG chip; and the RMGII_TX_CLK pin of the IM2501 communication chip is connected to the TXC pin of the RTL8211F-CG chip.

[0014] Optionally, in the ninth implementation, the SIM card switching module includes: a BCT4567EGE-TR switch, an ESIM connector, and a NANO-SIM connector. The BCT4567EGE-TR switch is connected to the ESIM connector and the NANO-SIM connector, respectively, and the BCT4567EGE-TR switch is connected to the 5G communication module.

[0015] In this embodiment of the invention, a WiFi antenna module, a SIM card switching module, a routing antenna, and an Ethernet switching module are connected to a 5G communication module. Specifically, the 5G communication module connects to the WiFi antenna module via an SDIO interface and to the Ethernet switching module via an RGMII interface, enabling the wireless router circuit to support various wireless networking methods, including antenna, WiFi, and SIM wireless networking. This not only solves the technical problem of excessive costs associated with Ethernet cabling for routers but also retains the wired Ethernet connection and allows for free switching between wired and wireless modes, adapting to different user needs for wired and wireless connections. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the wireless routing circuit of this utility model; Figure 2a This is the first structural schematic diagram of the IM2501 communication chip of this utility model; Figure 2b This is a second structural schematic diagram of the IM2501 communication chip of this utility model; Figure 3 This is a schematic diagram of the structure of the AIC8800D80 network chip of this utility model; Figure 4a This is a schematic diagram of the main antenna structure of this utility model; Figure 4b This is a schematic diagram of the diversity antenna of this utility model; Figure 5 This is a schematic diagram of the structure of the RTL8211F-CG chip of this utility model; Figure 6 This is a schematic diagram of the SY8113BADC power management chip of this utility model; Figure 7a This is a schematic diagram of the structure of the BCT4567EGE-TR switch of this utility model; Figure 7b This is a schematic diagram of an embodiment of the ESIM connector of this utility model; Figure 7c This is a schematic diagram of an embodiment of the NANO-SIM connector of this utility model.

[0018] Explanation of icon numbers: 101-5G communication module, 102-power supply module, 103-WiFi antenna module, 104-SIM card switching module, 105-Ethernet switching module, 106-routing antenna.

[0019] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0022] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, if the word "and / or" appears throughout the text, it means including three parallel solutions; for example, "A and / or B" includes solution A, solution B, or a solution that simultaneously satisfies A and B. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0023] This utility model proposes a wireless routing circuit.

[0024] In the embodiments of this utility model, such as Figure 1 As shown, Figure 1 This is a schematic diagram of the wireless routing circuit of this utility model. The wireless routing circuit includes: a 5G communication module 101, a power supply module 102, a WiFi antenna module 103, a SIM card switching module 104, an Ethernet switching module 105, and a routing antenna 106. The 5G communication module 101 is connected to the power supply module 102, the SIM card switching module 104, and the routing antenna 106. The power supply module 102 receives 220V and converts it to 5V, modulates the 5V to 3.8V, and supplies the 3.8V to the 5G communication module 101. The routing antenna 106 is used to transmit and receive cellular signals based on the SIM card switching module 104.

[0025] The 5G communication module 101 is connected to the WiFi antenna module 103 through the SDIO interface. The SDIO interface is the SD input / output interface, a high-speed host-to-slave serial bus standard developed by the SD Association based on the SD physical layer specification. It is used to integrate various input / output functions in slots compatible with SD card form factors. It provides a standardized solution for embedded systems that saves pins, has readily available drivers, sufficient bandwidth, and is fully compatible with memory card form factors. It turns ordinary SD card slots into universal high-speed buses with a speed of 200Mbps, readily available drivers, plug-and-play functionality, and a cost close to SPI but 4 times faster.

[0026] The 5G communication module 101 is connected to the Ethernet switching module 105 via the RGMII interface. The RGMII interface is a parallel bus standard defined by IEEE 802.3 for interconnecting media access control layer and physical layer chips. RGMII is a simplified version of GMII, which significantly reduces hardware complexity and cost while maintaining gigabit speeds by reducing the number of data lines and introducing a DDR sampling mechanism.

[0027] First specific embodiment like Figure 2a , 2b As shown, Figure 2a This is the first structural schematic diagram of the IM2501 communication chip of this utility model. Figure 2b This is the second structural schematic diagram of the IM2501 communication chip of this utility model; the IM2501 communication chip is a 5G RedCap (Reduced Capability) IoT chip platform produced by Chengdu Xinjixun Technology Co., Ltd., targeting the "lightweight 5G" direction. Figure 2a , 2b This is the LGA module version of the IM2501 communication chip, which integrates the baseband SoC, memory, RF front-end, power management, and passive components onto a single substrate, and presents the complete communication subsystem via a planar grid array. For example... Figure 3 As shown, Figure 3 This is a schematic diagram of the structure of the AIC8800D80 network chip of this utility model. The AIC8800D80 is a Wi-Fi 6 / Bluetooth 5.4 dual-mode chip manufactured by AGCO Microelectronics Co., Ltd. The 5G communication module 101 is set to the IM2501 communication chip, and the WiFi antenna module 103 is set to the AIC8800D80 network chip.

[0028] The SIDO_D3, SIDO_D2, SIDO_D1, SIDO_D0, SIDO_CLK, and SIDO_CMD pins of the IM2501 communication chip form an SDIO interface to connect to the AIC8800D80 network chip. The specific connection method is as follows: connect the SIDO_D3 pin of the IM2501 communication chip to the GPIOA14 pin of the AIC8800D80 network chip; connect the SIDO_D2 pin of the IM2501 communication chip to the GPIOA15 pin of the AIC8800D80 network chip; connect the SIDO_D1 pin of the IM2501 communication chip to the GPIOA10 pin of the AIC8800D80 network chip; connect the SIDO_D0 pin of the IM2501 communication chip to the GPIOA11 pin of the AIC8800D80 network chip; connect the SIDO_CLK pin of the IM2501 communication chip to the GPIOA12 pin of the AIC8800D80 network chip; and connect the SIDO_CMD pin of the IM2501 communication chip to the GPIOA13 pin of the AIC8800D80 network chip.

[0029] Please refer to 4a and 4b. Figure 4a This is a schematic diagram of the main antenna structure of this utility model. Figure 4b This is a schematic diagram of the diversity antenna structure of this utility model. The routing antenna 106 is equipped with a main antenna and a diversity antenna. One end of the main antenna is connected to the ANT_MAIN pin of the IM2501 communication chip, and one end of the diversity antenna is connected to the ANT_DIV pin of the IM2501 communication chip. The impedance of both the main antenna and the diversity antenna is 50 ohms. The main antenna and diversity antenna are used in the RF receiving and transmitting antenna system for SIM card cellular communication. The main antenna is responsible for the main transmitting and receiving tasks, while the diversity antenna is only used for receiving signals and does not transmit signals; its main function is to enhance the quality of the received signal.

[0030] Second specific embodiment like Figure 2a , 2b As shown in Figure 5, Figure 2a This is the first structural schematic diagram of the IM2501 communication chip of this utility model. Figure 2b This is the second structural schematic diagram of the IM2501 communication chip of this utility model. Figure 5This is a schematic diagram of the RTL8211F-CG chip of this utility model. The RTL8211F-CG chip is a single-port gigabit Ethernet transceiver chip manufactured by Realtek, which implements all physical layer functions between the MAC and the twisted pair, and can convert the SoC's RGMII signal into a 1000BASE-T signal that can be plugged into the Ethernet cable. The 5G communication module 101 is set to the IM2501 communication chip, and the Ethernet switching module is set to the RTL8211F-CG chip. The RGMII_MDC, RGMII_MDIO, RGMII_TX_D0, RGMII_TX_D1, RGMII_TX_D2, RGMII_TX_D3, RGMII_CTL_TX, and RGMII_TX_CLK pins of the IM2501 communication chip form the RGMII interface and connect to the RTL8211F-CG chip. The specific connection method is as follows: the RMGII_MDC pin of the IM2501 communication chip is connected to the MDC pin of the RTL8211F-CG chip; the RMGII_MDIO pin of the IM2501 communication chip is connected to the MDIO pin of the RTL8211F-CG chip; the RMGII_TX_D0 pin of the IM2501 communication chip is connected to the TD0 pin of the RTL8211F-CG chip; and the RMGII_TX_D1 pin of the IM2501 communication chip is connected to the TD1 pin of the RTL8211F-CG chip. The RMGII_TX_D2 pin of the IM2501 communication chip is connected to the TD2 pin of the RTL8211F-CG chip, the RMGII_TX_D3 pin of the IM2501 communication chip is connected to the TD3 pin of the RTL8211F-CG chip, the RMGII_CTL_TX pin of the IM2501 communication chip is connected to the TXCTL pin of the RTL8211F-CG chip, and the RMGII_TX_CLK pin of the IM2501 communication chip is connected to the TXC pin of the RTL8211F-CG chip.

[0031] It should be noted that you should refer to [link / reference]. Figure 6 , Figure 6This is a schematic diagram of the SY8113BADC power management chip of this utility model. The power module supplying power to the IM2501 communication chip includes the SY8113BADC power management chip. The SY8113BADC power management chip is a synchronous buck DC-DC power management chip manufactured by Silergy, with specifications of 500 kHz, 3A, 18V input synchronous buck regulator. The 220V voltage is converted to 5V DC by the buck circuit and input to the VIN pin of the SY8113BADC power management chip. After processing by the chip, a 3.8V voltage is output from the LX pin of the SY8113BADC power management chip and connected to the IM2501 communication chip at the 3v8_RCMD point, supplying the IM2501 communication chip with a 3.8V DC voltage.

[0032] Third specific embodiment like Figure 7a , 7b As shown in 7c, Figure 7a This is a schematic diagram of the structure of the BCT4567EGE-TR switch of this utility model. Figure 7b This is a schematic diagram of an embodiment of the ESIM connector of this utility model. Figure 7c This is a schematic diagram of an embodiment of the NANO-SIM connector of this utility model. The BCT4567EGE-TR switch is a low-power dual-SIM card analog switch manufactured by Guangxin Electronics Co., Ltd., using a TQFN-16-EP (3 mm × 3 mm) package. It is used to time-multiplex all signals (power, clock, data, reset) of two SIM cards in a single baseband or single card slot scenario to achieve dual-SIM single-standby function. The ESIM connector model is designated as eSIM-0202. eSIM-0202 is a general term for eSIM chips in a "2mm × 2 mm DFN-8 package", which is 70% smaller than Nano-SIM. The NANO-SIM connector is designated as SMN-305-ARP7. SMN-305-ARP7 is a flip-type Nano-SIM card socket connector manufactured by Xunpu Co., Ltd., used to fix the Nano-SIM card on the PCB and realize the electrical connection between the SIM card and the baseband chip.

[0033] The SIM card switching module is equipped with a BCT4567EGE-TR switch, an ESIM connector, and a NANO-SIM connector.

[0034] The BCT4567EGE-TR switch is connected to the ESIM connector in the following ways: the 1VSIM pin of the BCT4567EGE-TR switch is connected to the VDD pin of the ESIM connector; the 1RST pin of the BCT4567EGE-TR switch is connected to the RST pin of the ESIM connector; the 1CLK pin of the BCT4567EGE-TR switch is connected to the CLK pin of the ESIM connector; and the 1DAT pin of the BCT4567EGE-TR switch is connected to the I / O pin of the ESIM connector.

[0035] The BCT4567EGE-TR switch is connected to the NANO-SIM connector in the following ways: the 2VSIM pin of the BCT4567EGE-TR switch is connected to the VCC pin of the NANO-SIM connector; the 2RST pin of the BCT4567EGE-TR switch is connected to the RST pin of the NANO-SIM connector; the 2CLK pin of the BCT4567EGE-TR switch is connected to the CLK pin of the NANO-SIM connector; and the 2DAT pin of the BCT4567EGE-TR switch is connected to the I / O pin of the NANO-SIM connector.

[0036] The BCT4567EGE-TR switch is connected to the 5G communication module. When the 5G communication module is set to the IM2501 communication chip, the specific connection method is that the SEL pin, VISM pin, RST pin, CLK pin, and DAT pin of the BCT4567EGE-TR switch are respectively connected to the Keyout_3 pin, USIM_VDD pin, USIM_RST pin, USIM_CLK pin, and USIM_DATA pin of the IM2501 communication chip.

[0037] In this embodiment of the invention, a WiFi antenna module, a SIM card switching module, a routing antenna, and an Ethernet switching module are connected to a 5G communication module. Specifically, the 5G communication module connects to the WiFi antenna module via an SDIO interface and to the Ethernet switching module via an RGMII interface, enabling the wireless router circuit to support various wireless networking methods, including antenna, WiFi, and SIM wireless networking. This not only solves the technical problem of excessive costs associated with Ethernet cabling for routers but also retains the Ethernet wired connection and allows for free switching between wired and wireless modes, adapting to different user needs for wired and wireless connections.

[0038] The above description is only an optional embodiment of the present utility model and does not limit the patent scope of the present utility model. All equivalent structural transformations made under the inventive concept of the present utility model using the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A wireless routing circuit, characterized in that, The wireless routing circuit includes: 5G communication module, power supply module, WiFi antenna module, SIM card switching module, Ethernet switching module, and router antenna; The 5G communication module is connected to the power module, the SIM card switching module, and the routing antenna respectively. The 5G communication module is connected to the WiFi antenna module through the SDIO interface and the Ethernet switching module through the RGMII interface. The routing antenna is used to transmit and receive cellular signals.

2. The wireless routing circuit according to claim 1, characterized in that, The 5G communication module includes: IM2501 communication chip.

3. The wireless routing circuit according to claim 2, characterized in that, The WiFi antenna module includes an AIC8800D80 network chip.

4. The wireless routing circuit according to claim 3, characterized in that, The SIDO_D3, SIDO_D2, SIDO_D1, SIDO_D0, SIDO_CLK, and SIDO_CMD pins of the IM2501 communication chip form an SDIO interface that connects to the AIC8800D80 network chip.

5. The wireless routing circuit according to claim 4, characterized in that, The SIDO_D3 pin of the IM2501 communication chip is connected to the GPIOA14 pin of the AIC8800D80 network chip; the SIDO_D2 pin of the IM2501 communication chip is connected to the GPIOA15 pin of the AIC8800D80 network chip; the SIDO_D1 pin of the IM2501 communication chip is connected to the GPIOA10 pin of the AIC8800D80 network chip; the SIDO_D0 pin of the IM2501 communication chip is connected to the GPIOA11 pin of the AIC8800D80 network chip; the SIDO_CLK pin of the IM2501 communication chip is connected to the GPIOA12 pin of the AIC8800D80 network chip; and the SIDO_CMD pin of the IM2501 communication chip is connected to the GPIOA13 pin of the AIC8800D80 network chip.

6. The wireless routing circuit according to claim 2, characterized in that, The routing antenna includes a main antenna and a diversity antenna. The main antenna is connected to the ANT_MAIN pin of the IM2501 communication chip, and the diversity antenna is connected to the ANT_DIV pin of the IM2501 communication chip.

7. The wireless routing circuit according to claim 2, characterized in that, The Ethernet switching module includes an RTL8211F-CG chip.

8. The wireless routing circuit according to claim 7, characterized in that, The RGMII pins RGMII_MDC, RGMII_MDIO, RGMII_TX_D0, RGMII_TX_D1, RGMII_TX_D2, RGMII_TX_D3, RGMII_CTL_TX, and RGMII_TX_CLK of the IM2501 communication chip form the RGMII interface, which is connected to the RTL8211F-CG chip.

9. The wireless routing circuit according to claim 8, characterized in that, The RMGII_MDC pin of the IM2501 communication chip is connected to the MDC pin of the RTL8211F-CG chip; the RMGII_MDIO pin of the IM2501 communication chip is connected to the MDIO pin of the RTL8211F-CG chip; the RMGII_TX_D0 pin of the IM2501 communication chip is connected to the TD0 pin of the RTL8211F-CG chip; and the RMGII_TX_D1 pin of the IM2501 communication chip is connected to the TD1 pin of the RTL8211F-CG chip. The RMGII_TX_D2 pin of the M2501 communication chip is connected to the TD2 pin of the RTL8211F-CG chip, the RMGII_TX_D3 pin of the M2501 communication chip is connected to the TD3 pin of the RTL8211F-CG chip, the RMGII_CTL_TX pin of the M2501 communication chip is connected to the TXCTL pin of the RTL8211F-CG chip, and the RMGII_TX_CLK pin of the M2501 communication chip is connected to the TXC pin of the RTL8211F-CG chip.

10. The wireless routing circuit according to claim 1, characterized in that, The SIM card switching module includes: a BCT4567EGE-TR switch, an ESIM connector, and a NANO-SIM connector. The BCT4567EGE-TR switch is connected to the ESIM connector and the NANO-SIM connector, respectively, and the BCT4567EGE-TR switch is connected to the 5G communication module.