Middle frame assembly and electronic device

Abstract

This utility model discloses a mid-frame assembly and an electronic device. The mid-frame assembly includes a metal frame, a carrier plate, and a coupler. The metal frame has a protective cavity and includes a radiator. The carrier plate is fixedly connected to the metal frame, and at least a portion of the carrier plate is disposed within the protective cavity. The carrier plate has a wiring channel. The coupler is fixed between the carrier plate and the radiator. One end of the coupler is electrically connected to the radiator, and the other end of the coupler is grounded to the carrier plate. At least a portion of the wiring channel is located below the coupler along the thickness direction of the carrier plate and is spaced apart from the coupler. This mid-frame assembly integrates the coupler and the wiring channel, achieving decoupling between them, which is beneficial for improving the communication quality of the electronic device.

Description

Technical Field

[0001] This disclosure relates to the field of electronic technology, and in particular to a mid-frame assembly and an electronic device. Background Technology

[0002] Mobile phones, tablets, smartwatches, and other electronic devices have become indispensable technological products in people's lives, studies, and entertainment. With the development of communication technology, the number of antennas required on electronic devices is also increasing. To improve the structural compactness of electronic devices, radiators are typically placed within the metal frame to form frame antennas.

[0003] In related technologies, the radiators of some frame antennas are grounded through couplers, and these couplers are integrated with the radiators into the mid-frame assembly. However, when the antenna clearance space is limited, the coupler, the radiator connected to the coupler, and the transmission line are all on the same plane, which can easily encroach on the clearance space of the frame antenna, leading to a decrease in the radiation performance of the frame antenna and thus hindering the improvement of the communication quality of electronic devices. Utility Model Content

[0004] This disclosure provides a mid-frame assembly and an electronic device. The mid-frame assembly integrates and decouples couplers and wiring channels, thereby improving the communication quality of the electronic device.

[0005] The technical solution is as follows:

[0006] According to a first aspect of the present disclosure, a mid-frame assembly is provided, including a metal frame, a carrier plate, and a coupler. The metal frame has a protective cavity and includes a radiator. The carrier plate is fixedly connected to the metal frame, at least a portion of which is disposed within the protective cavity, and the carrier plate has a wiring channel. The coupler is fixedly disposed between the carrier plate and the radiator. One end of the coupler is electrically connected to the radiator, and the other end of the coupler is grounded to the carrier plate. At least a portion of the wiring channel is disposed below the coupler along the thickness direction of the carrier plate and is spaced apart from the coupler.

[0007] The technical solution of this disclosure will be further explained below:

[0008] In one embodiment, the spacing between the wiring channel and the coupler along the thickness direction of the carrier plate is L1, where L1 ≥ 0.8 mm.

[0009] In one embodiment, the support plate is further provided with a battery compartment spaced apart from the radiator, and a wiring channel is provided on the side wall of the battery compartment and communicates with the battery compartment.

[0010] In one embodiment, the carrier plate includes a ground plane spaced apart from the radiator to form a gap, and an insulator disposed within the gap. The coupler includes a first connecting end fixedly connected to the radiator, a connecting body disposed within the gap, and a second connecting end fixedly connected to the ground plane. One end of the connecting body is connected to the first connecting end, and the other end of the connecting body is connected to the second connecting end.

[0011] In one embodiment, the connector is embedded in an insulator.

[0012] And / or, the wiring channel is positioned further away from the radiator than the connector.

[0013] And / or, the metal frame, ground plane, and coupler and insulator are injection molded in a secondary manner.

[0014] In one embodiment, the first connecting end is provided with a first inclined surface disposed between the radiator and the connecting body. Along the thickness direction of the bearing plate, the first inclined surface extends obliquely from the plate surface of the bearing plate to the connecting body. On the front projection surface of the bearing plate, the length of the first inclined surface is L2, 1.2mm≤L2≤1.7mm.

[0015] And / or, the second connecting end is provided with a second inclined surface disposed between the ground plate and the connecting body. Along the thickness direction of the bearing plate, the second inclined surface extends inclinedly from the plate surface of the bearing plate to the connecting body. On the front projection surface of the bearing plate, the length of the second inclined surface is L3, 1.2mm≤L3≤1.7mm.

[0016] And / or, the minimum width from the connector to the ground plane is W1, 0.3mm≤W1≤0.7mm.

[0017] And / or, on the orthographic projection plane of the support plate, the minimum width of the connector is W2, 0.4mm≤W2≤0.8mm.

[0018] In one embodiment, the shortest distance from the first connecting end to the first inclined surface is L4, where 0.8mm ≤ L4 ≤ 1.2mm.

[0019] And / or, the maximum distance between the first inclined surface and the second inclined surface is L5, 4mm≤L5≤6mm.

[0020] In one embodiment, L2 = 1.55 mm, L3 = 1.55 mm, L4 = 1 mm, L5 = 5.14 mm, W1 = 0.5 mm, and W2 = 0.6 mm.

[0021] In one embodiment, at least a portion of the wiring channel extends through a portion of the ground plane and an insulating portion;

[0022] And / or, on the orthographic projection plane of the carrier plate, one end of the connector is bent and connected to the first connector, and the other end of the connector is bent and connected to the second connector, so that the coupler is in a "Z" shape.

[0023] In one embodiment, a first arc-shaped transition surface is provided between one end of the connector and the first connecting end.

[0024] And / or, a second arc-shaped transition surface is provided between one end of the connector and the second connecting end.

[0025] According to a second aspect of the present disclosure, an electronic device is also provided, including a radio frequency module, a transmission line, and a mid-frame assembly of any of the above embodiments. The radio frequency module is disposed on a carrier plate and is fed in cooperation with a radiator, and at least a portion of the transmission line is embedded in a trace channel.

[0026] The technical solutions provided by the embodiments of this disclosure may include the following beneficial effects:

[0027] During assembly of this electronic device, the mid-frame assembly integrates the coupler and the trace channel, with the trace channel spaced apart from the coupler along the thickness direction of the carrier plate. This allows at least a portion of the transmission line to be embedded within the trace channel, increasing the distance between the transmission line and the coupler as the transmission line travels along the trace channel. When the RF module is mounted on the carrier plate and fed in conjunction with the radiator, the radiator acts as a frame antenna. Because the transmission element and coupler are spaced apart from each other along the thickness direction of the carrier plate, sufficient spacing allows for decoupling between them on the mid-frame assembly. Thus, the routing of the transmission line does not, or does not easily, degrade the radiation performance of the radiator, which helps ensure the radiation performance of the frame antenna, thereby improving the communication quality of the electronic device.

[0028] The technical solution of this disclosure will be further explained below:

[0029] In one embodiment, the support plate is further provided with a battery compartment spaced apart from the radiator, and a wiring channel is provided on the side wall of the battery compartment and communicates with the battery compartment.

[0030] The electronic device also includes a control motherboard and a first circuit board. The control motherboard and the first circuit board are spaced apart at both ends of the battery compartment. The radio frequency module is located on the control motherboard. The control motherboard is connected to the first circuit board via a transmission line.

[0031] And / or, the electronic device also includes a limiting element, at least a portion of which is disposed within the battery compartment to confine the transmission line within the wiring path.

[0032] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0033] The accompanying drawings, which form part of this disclosure, are used to provide a further understanding of this disclosure. The illustrative embodiments of this disclosure and their descriptions are used to explain this disclosure and do not constitute an undue limitation of this disclosure.

[0034] To more clearly illustrate the technical solutions in the embodiments of this disclosure, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0035] Figure 1 This is a schematic diagram of the structure of an electronic device shown in one embodiment.

[0036] Figure 2 This is a top view schematic diagram of an electronic device shown in one embodiment.

[0037] Figure 3 for Figure 1 A partial schematic diagram of the assembly structure of the mid-frame component and transmission line shown.

[0038] Figure 4 for Figure 3 The diagram shows a top view of the assembly structure.

[0039] Figure 5 This is a half-sectional view of the assembly structure in the thickness direction as shown in another embodiment.

[0040] Figure 6 for Figure 4 The diagram shows the connection between the coupler and the carrier plate.

[0041] Figure 7 This is a schematic diagram of the coupler structure shown in one embodiment.

[0042] Figure 8 This is a schematic diagram of the hardware structure of an electronic device shown in one embodiment.

[0043] Explanation of reference numerals in the attached figures:

[0044] 10. Electronic device; 11. Processing component; 12. Memory; 13. Power supply component; 14. Multimedia component; 15. Audio component; 16. Input / output interface; 17. Sensor component; 18. Communication component; 100. Mid-frame component; 101. Gap; 110. Metal frame; 111. Radiator; 112. Second frame antenna; 120. Support plate; 121. Wiring channel; 122. Battery compartment; 123. Ground plane; 124. Insulator; 130. Coupler; 131. First connection terminal; 102. First inclined surface; 132. Connector; 133. Second connection terminal; 103. Second inclined surface; 134. First arc transition surface; 135. Second arc transition surface; 200. Radio frequency module; 210. Feed spring; 300. Transmission line; 400. Control motherboard; 500. First circuit board; 600. Limiting component. Detailed Implementation

[0045] To make the objectives, technical solutions, and advantages of this disclosure clearer, the following detailed description is provided in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative and do not limit the scope of protection of this disclosure.

[0046] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this disclosure.

[0047] For ease of understanding and explanation, some of the terms and technical terms that appear in the embodiments below this specification are explained.

[0048] A radiator, or antenna stub, is a device in an antenna used to receive / transmit electromagnetic wave radiation. In some cases, the term "antenna" is narrowly defined as a radiator, which converts guided wave energy from the transmitter into radio waves, or converts radio waves into guided wave energy, for radiating and receiving radio waves. The modulated high-frequency current energy (or guided wave energy) generated by the transmitter is transmitted to the transmitting radiator via a feed line, where it is converted into electromagnetic wave energy of a specific polarization and radiated in the desired direction. The receiving radiator converts electromagnetic wave energy of a specific polarization from a specific direction in space back into modulated high-frequency current energy, which is then transmitted to the receiver input via a feed line.

[0049] A radio frequency (RF) module, also called a power supply circuit, is a combination of all circuits used for receiving and transmitting radio frequency (RF) signals. An RF module can include a transceiver and RF front-end circuitry. In some cases, the term "RF module" is narrowly defined as an RF chip (RFIC), which can be considered to include both the RF front-end chip and the transceiver. An RF module has the function of converting radio waves (e.g., RF signals) into electrical signals (e.g., digital signals). It is generally considered the RF component.

[0050] A matching circuit is a circuit associated with adjusting the radiation characteristics of an antenna. In one embodiment, the matching circuit is coupled between the RF module and the corresponding radiator. Typically, the matching circuit is coupled between the test mount and the radiator. In one embodiment, the matching circuit has impedance matching and / or frequency tuning functions. It is generally considered part of the antenna.

[0051] A tuning circuit is a circuit associated with adjusting the resonant frequency of an antenna. In one embodiment, the tuning circuit is coupled between the radiator and the ground. In another embodiment, the tuning circuit is coupled between the radio frequency module and the radiator. In yet another embodiment, the tuning circuit functions as impedance matching and / or frequency tuning. Typically, it is considered part of the antenna.

[0052] Ground / Plane: This can broadly refer to at least a portion of any grounding layer, ground plane, or grounding metal layer within an electronic device (such as a mobile phone), or at least a portion of any combination of the aforementioned grounding layers, ground planes, or floating components. "Ground / Plane" can be used for grounding components within an electronic device. In one embodiment, "Ground / Plane" may include any one or more of the following: a grounding layer of the electronic device's circuit board, a ground plane formed by the frame of the electronic device, a grounding metal layer formed by a thin metal film beneath the screen, a conductive grounding layer of the battery, and conductive or metallic components electrically connected to the aforementioned grounding layer / ground plane / metal layer.

[0053] Any of the aforementioned grounding layers, ground planes, or grounding metal layers are made of conductive materials. In one embodiment, the conductive material may be any of the following: copper, aluminum, stainless steel, brass and their alloys, copper foil on an insulating substrate, aluminum foil on an insulating substrate, gold foil on an insulating substrate, silver-plated copper, silver-plated copper foil on an insulating substrate, silver foil on an insulating substrate and tin-plated copper, graphite-impregnated cloth, graphite-coated substrates, copper-plated substrates, brass-plated substrates, and aluminum-plated substrates. Those skilled in the art will understand that grounding layers / ground planes / grounding metal layers may also be made of other conductive materials.

[0054] Grounding: refers to coupling with the aforementioned ground / floor via a grounding structure and / or grounding circuit. In one embodiment, grounding can be achieved through physical grounding, such as through a structural component of the mid-frame to achieve physical grounding at a specific location on the frame (or, physical ground). In another embodiment, grounding can be achieved through device grounding, such as through devices like capacitors / inductors / resistors connected in series or parallel (or, device ground).

[0055] Currently, mobile phones, tablets, and other electronic devices have become indispensable technological products in people's lives, studies, and entertainment, bringing them numerous conveniences and enjoyment. With the diversification of electronic device functions, there are now many types and brands available, offering consumers a wide range of choices. Simply improving the functional features of electronic devices is no longer sufficient to meet people's demands.

[0056] With the development of communication technology, the number of antennas required on electronic devices is increasing. In order to improve the structural compactness of electronic devices, radiators are usually placed in the metal frame to form a frame antenna.

[0057] In related technologies, the radiators of some bezel antennas are grounded via couplers, and these couplers are integrated with the radiators into the mid-frame assembly. When multiple bezel antennas are installed on an electronic device, some of them need to be connected to the RF module via transmission lines. However, with limited antenna clearance space, having the coupler, the radiator connected to the coupler, and the transmission line on the same plane can easily encroach on the clearance space of the bezel antenna, leading to a decrease in the radiation performance of the bezel antenna and thus hindering the improvement of the communication quality of the electronic device.

[0058] For example, the mid-frame assembly has a battery compartment, and its metal frame includes a first frame antenna located on the side of the battery compartment and a second frame antenna located below the battery compartment. When the second frame antenna is fed by an RF module located above the battery compartment, a transmission line is required to connect the second frame antenna to the RF module. During this process, the transmission element is mounted on the mid-frame assembly, close to the radiator of the first frame antenna and passing through a coupler connected to the radiator. Given limited antenna clearance, the coupler, the radiator connected to the coupler, and the transmission line are all on the same plane, which can easily encroach on the clearance of the first frame antenna, leading to a decrease in its radiation performance. Conversely, if the transmission line bypasses the first frame antenna, the feeding distance between the RF module and the second frame antenna increases, resulting in increased losses and further reducing the radiation performance of the second frame antenna. This, in turn, is detrimental to improving the communication quality of the electronic device.

[0059] Based on this, the present disclosure provides a mid-frame assembly that integrates the coupler and the wiring channel together, and the wiring channel is spaced apart from the coupler along the thickness direction of the carrier plate. This increases the spacing between the transmission line and the coupler when the transmission line runs along the wiring channel, thereby decoupling the two and ensuring the radiation performance of the radiator, which in turn helps to improve the communication quality of electronic devices.

[0060] To better understand the mid-frame component of this disclosure, the following description uses an electronic device employing the mid-frame component.

[0061] like Figures 1 to 3 As shown, in some embodiments of this disclosure, an electronic device 10 is provided, including a mid-frame assembly 100, a radio frequency module 200, and a transmission line 300. The mid-frame assembly 100 includes a metal frame 110, a carrier plate 120, and a coupler 130. The metal frame 110 has a protective cavity and includes a radiator 111. The carrier plate 120 is fixedly connected to the metal frame 110, and at least a portion of the carrier plate 120 is disposed within the protective cavity. The carrier plate 120 has a wiring channel 121. The coupler 130 is fixedly disposed between the carrier plate 120 and the radiator 111. One end of the coupler 130 is electrically connected to the radiator 111, and the other end of the coupler 130 is grounded to the carrier plate 120. At least a portion of the wiring channel 121 is disposed below the coupler 130 along the thickness direction of the carrier plate 120 and is spaced apart from the coupler 130. The radio frequency module 200 is mounted on the carrier plate 120 and is fed in conjunction with the radiator 111. At least a portion of the transmission line 300 is embedded in the trace channel 121.

[0062] When the electronic device 10 is assembled, the mid-frame assembly 100 integrates the coupler 130 and the wiring channel 121, with the wiring channel 121 spaced apart from the coupler 130 along the thickness direction of the carrier plate 120. This allows at least a portion of the transmission line 300 to be embedded within the wiring channel 121, increasing the distance between the transmission line 300 and the coupler 130 as it travels along the channel 121. When the RF module 200 is mounted on the carrier plate 120 and fed in conjunction with the radiator 111, the radiator 111 acts as a first frame antenna. Because the transmission element and the coupler 130 are spaced apart along the thickness direction of the carrier plate 120, sufficient spacing allows for decoupling between them on the mid-frame assembly 100. Thus, the routing of the transmission line 300 does not or easily degrades the radiation performance of the radiator 111, which helps ensure the radiation performance of the first frame antenna and improves the communication quality of the electronic device 10.

[0063] Furthermore, it is understood that the transmission line 300 is embedded in the mid-frame assembly 100 through the wiring channel 121, which makes full use of the thickness space of the mid-frame assembly 100 to accommodate the transmission line 300, which helps to improve the structural compactness of the electronic device 10 and improve the space utilization of the electronic device 10.

[0064] In conventional techniques, the transmission line 300 needs to be fixed to the mid-frame assembly 100 using clamps or other fasteners. However, using the technique disclosed herein, the transmission element can be embedded in the mid-frame assembly 100 through the wiring channel 121, which facilitates the use of the wiring channel 121 to restrict the transmission element, reducing or eliminating the need for fasteners.

[0065] like Figure 2 as well as Figure 3 As shown, in some embodiments, the support plate 120 is further provided with a battery compartment 122 spaced apart from the radiator 111, and a wiring channel 121 is provided on the side wall of the battery compartment 122 and communicates with the battery compartment 122. In this way, the transmission line 300 can be inserted into the wiring channel 121 through the battery compartment 122, which can improve assembly efficiency.

[0066] Optionally, the electronic device 10 also includes a battery fixed in the battery compartment 122. In this way, after the battery is fixed in the battery compartment 122, the battery can be used to restrict the transmission line 300 from coming out of the wiring channel 121, which helps to improve the structural compactness of the electronic device 10.

[0067] like Figure 2 As shown, in some embodiments, the electronic device 10 further includes a control motherboard 400 and a first circuit board 500. The control motherboard 400 and the first circuit board 500 are spaced apart at both ends of the battery compartment 122. The radio frequency module 200 is disposed on the control motherboard 400, and the control motherboard 400 is connected to the first circuit board 500 via a transmission line 300. Thus, the radio frequency module 200 is disposed on the control motherboard 400, which also allows it to be spaced apart from the first circuit board 500 at both ends of the battery compartment 122 and connected to the first circuit board 500 via the transmission line 300. This also facilitates the transfer of radio frequency energy to the first circuit board 500 via the transmission line 300.

[0068] like Figure 2As shown, the first frame antenna is disposed on the side of the battery compartment 122. The metal frame 110 includes a second frame antenna 112 disposed below the battery compartment 122, and the second frame antenna 112 is electrically connected to the first circuit board 500. The radio frequency module 200 is disposed above the battery compartment 122 and is electrically connected to the first circuit board 500 via a transmission line 300, so as to connect the first circuit board 500 to the second frame antenna 112. In this way, the routing of the transmission line 300 will not or will not easily reduce the radiation performance of the radiator 111, which is beneficial to ensuring the radiation performance of the first frame antenna. At the same time, the transmission line 300 connects the radio frequency module 200 to the first circuit board 500 through the routing channel 121, which can reduce the feeding distance between the radio frequency module 200 and the second frame antenna 112, thereby reducing losses and improving the radiation performance of the second frame antenna 112, which is beneficial to improving the communication quality of the electronic device 10.

[0069] like Figures 3 to 5 As shown, in some embodiments, the carrier plate 120 includes a ground plane 123 that forms a gap 101 at a distance from the radiator 111, and an insulator 124 disposed in the gap 101. The coupler 130 includes a first connecting end 131 fixedly connected to the radiator 111, a connecting body 132 disposed in the gap 101, and a second connecting end 133 fixedly connected to the ground plane 123. One end of the connecting body 132 is connected to the first connecting end 131, and the other end of the connecting body 132 is connected to the second connecting end 133. Thus, the coupler 130 can also serve as a connecting rib to connect the metal frame 110 and the carrier plate 120. At the same time, by filling the gap 101 with the insulator 124, the metal frame 110 and the carrier plate 120 can be further fixed, thereby improving the structural strength of the middle frame assembly 100.

[0070] like Figure 3 as well as Figure 5 As shown, in some embodiments, the connector 132 is embedded in the insulator 124. This improves the structural strength of the coupler 130, making the structure of the mid-frame assembly 100 more stable.

[0071] like Figure 5 As shown, in some embodiments, the electronic device 10 further includes a limiting member 600, at least a portion of which is disposed within the battery compartment 122 to confine the transmission line 300 within the wiring channel 121. Thus, the limiting member 600 can confine the transmission line 300 within the wiring channel 121, improving the secure fixation of the transmission line 300 to the mid-frame assembly 100.

[0072] It should be noted that the limiting member 600 can be implemented in various ways, including but not limited to snap-fit ​​members, coated members, adhesive members, etc. In some embodiments, the limiting member 600 is a coated member, which can reduce the space occupied by the electronic device 10.

[0073] like Figure 5 As shown, in some embodiments, the distance between the wiring channel 121 and the coupler 130 along the thickness direction of the support plate 120 is L1, where L1 ≥ 0.8 mm. Thus, the wiring channel 121 is offset 1 mm below the coupler 130 in the thickness direction of the mid-frame assembly 100, allowing the transmission line 300 to be positioned below the coupler 130, achieving structural decoupling and increased clearance in the mid-frame assembly 100 in the X-axis direction.

[0074] Optionally, 1mm≤L1≤5mm.

[0075] Optionally, 1.5mm≤L1≤3mm.

[0076] Optionally, L1 can be 0.8mm, 0.85mm, 0.9mm, 0.93mm, 0.95mm, 0.98mm, 1mm, 1.2mm, 1.5mm, 1.8mm, 2mm, 2.5mm, 3mm, 4mm, 5mm, 6mm, 7mm, etc.

[0077] like Figure 5 As shown, in some embodiments, the routing channel 121 is positioned further away from the radiator 111 than the connector 132. This allows the transmission line 300 to be positioned as far away from the radiator 111 as possible along the X-axis, further reducing any adverse effects on the radiator 111.

[0078] Furthermore, in conjunction with the aforementioned embodiment of the battery compartment 122, it is also convenient for the transmission line 300 to be inserted from the battery compartment 122 into the wiring channel 121, facilitating assembly.

[0079] Optionally, in some embodiments, the metal frame 110, ground plane 123, and coupler 130 are injection molded together with the insulator 124. This reduces assembly steps, increases the structural strength of the mid-frame assembly 100, and improves the reliability of the electronic device 10.

[0080] Optionally, after the metal frame 110, the ground plane 123 and the coupler 130 are welded and fixed, they are then injection molded together with the insulator 124.

[0081] Combination Figures 4 to 6 As shown, the thickness direction of the carrier plate 120, the thickness direction of the middle frame assembly 100, and the thickness direction of the electronic device 10 are the Z-axis direction, the width direction of the middle frame assembly 100 and the width direction of the electronic device 10 are the X-axis direction, and the length direction of the radiator 111, the length direction of the middle frame assembly 100, and the length direction of the electronic device 10 are the Y-axis direction.

[0082] In conjunction with any of the aforementioned embodiments of the connector 132, such as Figure 6as well as Figure 7 As shown, in some embodiments, the first connecting end 131 is provided with a first inclined surface 102 disposed between the radiator 111 and the connector 132. Along the thickness direction of the support plate 120, the first inclined surface 102 extends obliquely from the plate surface of the support plate 120 towards the connector 132, and the length of the first inclined surface 102 on the front projection plane of the support plate 120 is L2, 1.2mm≤L2≤1.7mm. Thus, the provision of the first inclined surface 102 increases the connection area between the first connecting end 131 and the radiator 111, improving their connection strength. Simultaneously, it also increases the volume of the first connecting end 131, making it easier to suppress structural deformation at the connection position between the connector 132 and the first connecting end 131, thereby effectively preventing deformation of the middle frame assembly 100 caused by injection molding, reducing processing difficulty, and improving yield.

[0083] Optionally, 1.3mm≤L2≤1.65mm.

[0084] Optionally, 1.35mm≤L2≤6mm.

[0085] Optionally, L2 can be 1.2mm, 1.3mm, 1.4mm, 1.45mm, 1.5mm, 1.55mm, 1.6mm, 1.65mm, 1.7mm, etc.

[0086] like Figure 6 as well as Figure 7 As shown, in some embodiments, the second connecting end 133 is provided with a second inclined surface 103 disposed between the base plate 123 and the connecting body 132. Along the thickness direction of the support plate 120, the second inclined surface 103 extends obliquely from the plate surface of the support plate 120 towards the connecting body 132. On the frontal projection plane of the support plate 120, the length of the second inclined surface 103 is L3, 1.2mm≤L3≤1.7mm. Thus, the provision of the second inclined surface 103 can increase the connection area between the second connecting end 133 and the support plate 120, thereby improving the connection strength between the two. At the same time, it also increases the volume of the second connecting end 133, which helps to suppress structural deformation at the connection position between the support plate 120 and the second connecting end 133, thereby effectively preventing deformation of the middle frame assembly 100 caused by injection molding, reducing processing difficulty, and improving yield.

[0087] Optionally, 1.3mm≤L3≤1.65mm.

[0088] Optionally, 1.35mm≤L3≤6mm.

[0089] Optionally, L3 can be 1.2mm, 1.3mm, 1.4mm, 1.45mm, 1.5mm, 1.55mm, 1.6mm, 1.65mm, 1.7mm, etc.

[0090] like Figure 6 as well as Figure 7 As shown, in some embodiments, the minimum width from the connector 132 to the ground plane 123 is W1, where 0.3mm ≤ W1 ≤ 0.7mm. This improves the structural strength of the coupler 130 and suppresses structural deformation.

[0091] Optionally, 0.4mm≤W1≤0.6mm.

[0092] Optionally, 0.45mm≤W1≤0.55mm.

[0093] Optionally, W1 = 0.3mm, 0.35mm, 0.4mm, 0.43mm, 0.45mm, 0.48mm, 0.5mm, 0.51mm, 0.55mm, 0.6mm, 0.7mm, etc.

[0094] In conjunction with the foregoing embodiments, such as Figure 6 as well as Figure 7 As shown, in some embodiments, the shortest distance from the first connecting end 131 to the first inclined surface 102 is L4, where 0.8mm ≤ L4 ≤ 1.2mm. This wide-area reverse extension in the Y-axis direction increases the connection distance between the connector 132 and the first connecting end 131, facilitating the suppression of structural deformation at the connection point between the support plate 120 and the second connecting end 133. This effectively prevents deformation of the middle frame assembly 100 caused by injection molding, reduces processing difficulty, and improves yield.

[0095] Optionally, 0.9mm≤L4≤1.15mm.

[0096] Optionally, 0.95mm≤L4≤1.1mm.

[0097] Optionally, L4 can be 0.8mm, 0.85mm, 0.9mm, 0.93mm, 0.95mm, 0.98mm, 1mm, 1.1mm, 1.15mm, 1.18mm, 1.2mm, etc.

[0098] like Figure 6 as well as Figure 7 As shown, in some embodiments, the minimum width of the connector 132 on the orthographic projection plane of the support plate 120 is W2, where 0.4mm ≤ W2 ≤ 0.8mm. This ensures the structural strength of the connector 132.

[0099] Optionally, 0.45mm≤W2≤0.75mm.

[0100] Optionally, 0.5mm ≤ W2 ≤ 0.6mm.

[0101] Optionally, W2 can be 0.4mm, 0.43mm, 0.45mm, 0.48mm, 0.5mm, 0.51mm, 0.55mm, 0.6mm, 0.65mm, 0.7mm, 0.8mm, etc.

[0102] In conjunction with the foregoing embodiments, such as Figure 6 as well as Figure 7 As shown, in some embodiments, the maximum distance between the first inclined surface 102 and the second inclined surface 103 is L5, where 4mm ≤ L5 ≤ 6mm. This ensures structural strength while increasing the length of the connector 132, thereby increasing the clearance space of the radiator 111 and improving its radiation performance.

[0103] Optionally, 4.5mm≤L5≤5.5mm.

[0104] Optionally, 5mm≤L5≤5.3mm.

[0105] Optionally, L5 can be 4mm, 4.5mm, 4.8mm, 5mm, 5.14mm, 5.15mm, 5.2mm, 5.5mm, 6mm, etc.

[0106] In one example, L2 = 1.55 mm, L3 = 1.55 mm, L4 = 1 mm, L5 = 5.14 mm, W1 = 0.5 mm, and W2 = 0.6 mm.

[0107] See you later Figure 5 As shown, in some embodiments, at least a portion of the wiring channel 121 extends through a portion of the ground plane 123 and a portion of the insulator 124. This facilitates full utilization of the internal space of the carrier to form the wiring channel 121.

[0108] like Figure 4 , Figure 6 as well as Figure 7 As shown, in some embodiments, on the orthographic projection plane of the support plate 120, one end of the connector 132 is bent and connected to the first connecting end 131, and the other end of the connector 132 is bent and connected to the second connecting end 133, so that the coupler 130 is in a "Z" shape. Thus,

[0109] like Figure 7 As shown, in some embodiments, a first arc-shaped transition surface 134 is provided between one end of the connector 132 and the first connecting end 131. This reduces stress concentration at the connection point between the connector 132 and the first connecting end 131, ensuring a reliable connection and suppressing structural deformation of the coupler 130.

[0110] like Figure 7As shown, in some embodiments, a second arc-shaped transition surface 135 is provided between one end of the connector 132 and the second connecting end 133. This reduces stress concentration at the connection point between the connector 132 and the first connecting end 131, ensuring a reliable connection and suppressing structural deformation of the coupler 130.

[0111] The electronic device 1 disclosed herein includes ranging devices, scanning devices, shooting devices, handheld devices, wearable devices (e.g., smartwatches), monitoring devices, cellular phones, smartphones, tablet computers, laptop computers, in-vehicle computers, and other devices with communication functions.

[0112] Reference Figure 8 As shown, in some embodiments, the electronic device 1 further includes at least one or more of the following components: a processing component 11, a memory 12, a power supply component 13, a multimedia component 14, an audio component 15, an input / output interface 16, a sensor component 17, and a communication component 18.

[0113] Processing components typically control the overall operation of electronic devices, such as operations associated with display, telephone calls, data communication, camera operation, and recording. A processing component includes at least one or more processors to execute instructions to complete all or part of the steps described above. Furthermore, a processing component includes at least one or more modules to facilitate interaction between the processing component and other components. For example, a processing component may include at least a multimedia module to facilitate interaction between multimedia components and the processing component.

[0114] Memory is configured to store various types of data to support the operation of electronic devices. Examples of this data include instructions for any application or method used to operate on the electronic device, contact data, phonebook data, messages, pictures, videos, etc. Memory can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory, read-only memory, magnetic storage, flash memory, disk, or optical disk.

[0115] Optionally, the control motherboard includes a second circuit board and a processing component and a memory disposed on the second circuit board.

[0116] Power supply components provide power to various components of electronic devices. A power supply component includes at least a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power to electronic devices.

[0117] The multimedia component includes the display module of this disclosure, facilitating human-computer interaction. If the display module includes a touch panel, the display module can be implemented as a touchscreen to receive input signals from the user. The touch panel includes one or more touch sensors to sense touches, swipes, and gestures on the touch panel. The touch sensors can sense not only the boundaries of touch or swipe actions but also the duration and pressure associated with the touch or swipe operation. In some embodiments, the multimedia component includes a front-facing camera and / or a rear-facing camera. When the electronic device is in an operating mode, such as a shooting mode or a video mode, the front-facing camera and / or the rear-facing camera can receive external multimedia data. Each front-facing camera and rear-facing camera can be a fixed optical lens system or have focal length and optical zoom capabilities.

[0118] The audio component is configured to output and / or input audio signals. For example, the audio component includes a microphone (MIC) configured to receive external audio signals when the electronic device is in an operating mode, such as call mode, recording mode, or voice recognition mode. The received audio signals may be further stored in memory or transmitted via a communication component. In some embodiments, the audio component also includes a speaker for outputting audio signals.

[0119] The input / output interface provides an interface between the processing component and the peripheral interface module, which can be a keyboard, click wheel, buttons, etc. These buttons may include, but are not limited to: home button, volume buttons, start button, and lock button.

[0120] The sensor assembly includes one or more sensors for providing state assessments of various aspects of the electronic device. For example, the sensor assembly can detect the on / off state of the electronic device, the relative positioning of components such as the display and keypad of the electronic device, changes in the position of the electronic device or a component of the electronic device, the presence or absence of user contact with the electronic device, the orientation or acceleration / deceleration of the electronic device, and temperature changes of the electronic device. The sensor assembly includes at least a proximity sensor configured to detect the presence of nearby objects without any physical contact. The sensor assembly also includes at least a photosensitizing element, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, the sensor assembly also includes at least an accelerometer, a gyroscope, a magnetometer, a pressure sensor, or a temperature sensor.

[0121] The communication component is configured to facilitate wired or wireless communication between electronic devices and other devices. The electronic device can access wireless networks based on communication standards, such as WiFi, 2G, 3G, 4G, or 6G, or combinations thereof. In one exemplary embodiment, the communication component receives broadcast signals or broadcast-related information from an external broadcast management system via a broadcast channel. In one exemplary embodiment, the communication component also includes a Near Field Communication (NFC) module to facilitate short-range communication. For example, the NFC module may be implemented based on Radio Frequency Identification (RFID) technology, Infrared Data Association (IrDA) technology, Ultra-Wideband (UWB) technology, Bluetooth (BT) technology, and other technologies.

[0122] In the description of this disclosure, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this disclosure.

[0123] Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first," "second," etc., may explicitly or implicitly include at least one of that feature. In the description of this disclosure, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0124] In this disclosure, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this disclosure according to the specific circumstances.

[0125] In this disclosure, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0126] It should be noted that when a component is referred to as "fixed to," "set on," "fixed to," or "mounted on" another component, it can be directly on the other component or there may be an intervening component. When a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be an intervening component.

[0127] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0128] The above embodiments are merely illustrative of several implementation methods of this disclosure, and their descriptions are relatively specific and detailed. However, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the inventive concept of this disclosure, and these modifications and improvements all fall within the protection scope of this disclosure.

Claims

1. A mid-frame component, characterized in that, include: A metal frame with a protective cavity, the metal frame including a radiator; and A support plate, fixedly connected to the metal frame, at least a portion of the support plate being disposed within the protective cavity, and the support plate having a wiring channel; and A coupler is fixed between the carrier plate and the radiator, one end of the coupler is electrically connected to the radiator, and the other end of the coupler is grounded to the carrier plate; Wherein, along the thickness direction of the support plate, at least a portion of the wiring channel is disposed below the coupler and spaced apart from the coupler.

2. The mid-frame assembly according to claim 1, characterized in that, Along the thickness direction of the bearing plate, the distance between the wiring channel and the coupler is L1, where L1 ≥ 0.8 mm.

3. The mid-frame assembly according to claim 1, characterized in that, The support plate is also provided with a battery compartment spaced apart from the radiator, and the wiring channel is provided on the side wall of the battery compartment and communicates with the battery compartment.

4. The mid-frame assembly according to any one of claims 1 to 3, characterized in that, The carrier plate includes a ground plate that is spaced apart from the radiator to form a gap and an insulator disposed in the gap; the coupler includes a first connecting end fixedly connected to the radiator, a connecting body disposed in the gap and a second connecting end fixedly connected to the ground plate, one end of the connecting body being connected to the first connecting end and the other end of the connecting body being connected to the second connecting end.

5. The mid-frame assembly according to claim 4, characterized in that, The connector is embedded in the insulator; And / or, the wiring channel is located away from the radiator compared to the connector; And / or, the metal frame, the ground plane, and the coupler are injection molded together with the insulator in a secondary injection molding process.

6. The mid-frame assembly according to claim 4, characterized in that, The first connecting end is provided with a first inclined surface disposed between the radiator and the connecting body. Along the thickness direction of the supporting plate, the first inclined surface extends obliquely from the plate surface of the supporting plate to the connecting body. On the frontal projection surface of the supporting plate, the length of the first inclined surface is L2, 1.2mm≤L2≤1.7mm. And / or, the second connecting end is provided with a second inclined surface disposed between the ground plate and the connecting body. Along the thickness direction of the bearing plate, the second inclined surface extends obliquely from the plate surface of the bearing plate to the connecting body. On the front projection plane of the bearing plate, the length of the second inclined surface is L3, 1.2mm≤L3≤1.7mm. And / or, the minimum width from the connector to the ground plane is W1, 0.3mm≤W1≤0.7mm; And / or, on the orthographic projection plane of the support plate, the minimum width of the connector is W2, 0.4mm≤W2≤0.8mm.

7. The mid-frame assembly according to claim 6, characterized in that, The shortest distance from the first connecting end to the first inclined surface is L4, where 0.8mm ≤ L4 ≤ 1.2mm; And / or, the maximum distance between the first inclined surface and the second inclined surface is L5, where 4mm ≤ L5 ≤ 6mm.

8. The mid-frame assembly according to claim 7, characterized in that, L2=1.55mm, L3=1.55mm, L4=1mm, L5=5.14mm, W1=0.5mm, W2=0.6mm.

9. The mid-frame assembly according to claim 4, characterized in that, The wiring channel is provided to penetrate at least a portion of the ground plane and the insulator portion; And / or, on the orthographic projection surface of the carrier plate, one end of the connector is bent and connected to the first connector, and the other end of the connector is bent and connected to the second connector, so that the coupler is in a "Z" shape.

10. The mid-frame assembly according to claim 4, characterized in that, A first arc-shaped transition surface is provided between one end of the connector and the first connecting end; And / or, a second arc-shaped transition surface is provided between one end of the connector and the second connector end.

11. An electronic device, characterized in that, The device includes a radio frequency module, a transmission line, and a mid-frame assembly as described in any one of claims 1 to 10, wherein the radio frequency module is disposed on the carrier plate and is fed in conjunction with the radiator, and at least a portion of the transmission line is embedded in the trace channel.

12. The electronic device according to claim 11, characterized in that, The support plate is also provided with a battery compartment spaced apart from the radiator, and the wiring channel is provided on the side wall of the battery compartment and communicates with the battery compartment; The electronic device also includes a control motherboard and a first circuit board. The control motherboard and the first circuit board are spaced apart at both ends of the battery compartment. The radio frequency module is disposed on the control motherboard. The control motherboard is connected to the first circuit board through the transmission line. And / or, the electronic device further includes a limiting member, at least a portion of which is disposed within the battery compartment to confine the transmission line within the wiring channel.

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