Self-circulation liquid cooling heat dissipation system and liquid cooling heat dissipation field controller

Abstract

The utility model relates to the technical field of domain controller heat dissipation, disclose a kind of self-circulation liquid cooling heat dissipation system and liquid cooling heat dissipation domain controller, the self-circulation liquid cooling heat dissipation system includes heat dissipation main body and radiator module, the heat dissipation main body has first water inlet, first water outlet and the first flow channel of intercommunication first water inlet and first water outlet, the radiator module has second water inlet, second water outlet and the second flow channel of intercommunication second water inlet and second water outlet, second water inlet is communicated with first water outlet, second water outlet is communicated with first water inlet.The self-circulation liquid cooling heat dissipation system provided by the utility model, heat dissipation main body and radiator module are split type setting, radiator module can be inserted and used immediately to heat dissipation main body;And radiator module can be adapted to different heat dissipation main body, realize the heat dissipation to different electronic equipment.

Description

Technical Field

[0001] This utility model belongs to the field of domain controller heat dissipation technology, specifically relating to a self-circulating liquid cooling heat dissipation system and a liquid-cooled heat dissipation domain controller. Background Technology

[0002] With the continuous advancement of technology, gasoline-powered vehicles are moving towards intelligentization, with increasingly sophisticated applications such as autonomous driving assistance functions, intelligent connectivity systems, and complex vehicle condition monitoring and analysis. The realization of these functions relies on powerful computing capabilities, meaning that the vehicle's internal systems need to process massive amounts of data, much like a computer running complex software, placing ever-increasing demands on the computing power of onboard chips and other hardware.

[0003] On the other hand, the current trend towards miniaturization and integration of chips, while bringing numerous advantages such as improved performance, has also led to a significant increase in the power consumption of individual chips. In gasoline-powered vehicles, the onboard domain controller integrates numerous functional modules, processing data from various sensors in different parts of the vehicle and executing corresponding control commands. The increased power consumption of the chips causes a substantial rise in the overall heat generation of the domain controller. Traditional air-cooling solutions mainly rely on fans to drive airflow and remove heat from the heat sink. However, given the current high heat generation of domain controllers, their heat dissipation efficiency is limited, making it difficult to ensure that the domain controller can operate stably within a suitable temperature range.

[0004] In electric vehicles, battery pack liquid cooling systems provide a coolant source for the entire vehicle's thermal management and are already relatively maturely applied to heat dissipation of the battery and some other key components. However, gasoline-powered vehicles lack similar battery pack liquid cooling systems, resulting in a lack of readily available coolant sources for cooling the vehicle's domain controllers. This makes it difficult to widely adopt liquid cooling solutions in gasoline-powered vehicles, despite their high cooling efficiency. However, the reality is that the cooling needs of domain controllers in gasoline-powered vehicles are very urgent. Therefore, developing a cooling system specifically adapted for gasoline-powered vehicle domain controllers is particularly important. This directly relates to whether gasoline-powered vehicles can successfully achieve intelligent development, as poor heat dissipation will affect the performance of the domain controllers and thus hinder the normal operation of intelligent functions.

[0005] Furthermore, the limited space in a vehicle makes conventional liquid cooling systems too bulky to be directly applied to gasoline-powered vehicles. Also, the main cooling unit and either air-cooled or liquid-cooled systems are integrated into the domain controller, limiting their cooling capabilities to specific devices. Utility Model Content

[0006] To address the issues of low heat dissipation efficiency in existing air-cooled domain controllers for gasoline vehicles and the limited adoption of liquid cooling solutions in gasoline vehicles, this invention provides a self-circulating liquid cooling system and a liquid-cooled domain controller.

[0007] The technical effects to be achieved by this utility model are realized through the following technical aspects: In a first aspect, the present invention provides a self-circulating liquid cooling heat dissipation system, comprising: a heat dissipation body and a heat sink module, wherein the heat dissipation body has a first water inlet, a first water outlet and a first flow channel connecting the first water inlet and the first water outlet, and the heat sink module has a second water inlet, a second water outlet and a second flow channel connecting the second water inlet and the second water outlet, wherein the second water inlet is connected to the first water outlet and the second water outlet is connected to the first water inlet.

[0008] In some optional implementations, the radiator module includes a liquid-cooled heat dissipation component and an air-cooled heat dissipation component, which are detachably connected; the second water inlet, the second water outlet, and the second flow channel are disposed on the liquid-cooled heat dissipation component.

[0009] In some optional implementations, the liquid cooling heat dissipation assembly includes a body, a liquid cooling radiator, and a water tank. The water tank is mounted on the body, the liquid cooling radiator is detachably connected to the body, a second water inlet and a second water outlet are provided on the body, a second flow channel is provided on the liquid cooling radiator, the water tank is connected to the second flow channel, and the air cooling heat dissipation assembly is mounted on the liquid cooling radiator.

[0010] In some optional implementations, the liquid-cooled radiator has an inlet chamber and an outlet chamber, which are located on opposite sides of the liquid-cooled radiator and are connected by a cooling pipe. A second flow channel is formed between the inlet chamber, the cooling pipe, and the outlet chamber. The inlet end of the inlet chamber is provided with a third inlet, and the outlet end of the outlet chamber is provided with a third outlet. The third inlet is connected to the first outlet through the second inlet, and the third outlet is connected to the first inlet through the second outlet.

[0011] In some alternative implementations, the liquid-cooled radiator further includes heat dissipation fins disposed on the second flow channel.

[0012] In some optional implementations, the cooling pipes are configured as a plurality of pipes, which are arranged in parallel. Both ends of the plurality of cooling pipes are respectively connected to the water inlet chamber and the water outlet chamber; Alternatively, two adjacent cooling pipes can be connected end to end, with the input end of the first cooling pipe connected to the water inlet chamber and the output end of the last cooling pipe connected to the water outlet chamber.

[0013] In some alternative implementations, the liquid cooling system further includes a controller mounted on the housing, which is communicatively connected to both the liquid cooling assembly and the air cooling assembly.

[0014] In some optional implementations, the liquid cooling heat dissipation assembly further includes a pump body, a liquid level sensor, and a temperature sensor that are communicatively connected to the controller. The pump body and the temperature sensor are mounted on the body. The pump body is connected to the second flow channel, the liquid level sensor is connected to the water tank, and the temperature sensor is in contact with the second water inlet and the second water outlet, respectively.

[0015] In some alternative implementations, the second water inlet is connected to the first water outlet via a first pipe, and the second water outlet is connected to the first water inlet via a second pipe.

[0016] Secondly, this utility model provides a liquid-cooled heat dissipation domain controller, including the self-circulating liquid cooling heat dissipation system described in any of the above claims, wherein the heat dissipation body of the self-circulating liquid cooling heat dissipation system is disposed inside the housing of the domain controller, and the heat sink module of the self-circulating liquid cooling heat dissipation system is disposed outside the housing of the domain controller.

[0017] In summary, this utility model has at least the following advantages: 1. The self-circulating liquid cooling heat dissipation system provided by this utility model separates the heat dissipation body and the heat sink module. The heat sink module can be plugged and used with the heat dissipation body. Moreover, the heat sink module can be adapted to different heat dissipation bodies to dissipate heat from different electronic devices.

[0018] 2. The liquid-cooled heat dissipation domain controller provided by this utility model uses the above-mentioned self-circulating liquid cooling heat dissipation system to dissipate heat, thereby separating the domain controller from the heat sink module and achieving flexible heat dissipation according to requirements. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of a self-circulating liquid cooling system provided in an embodiment of the present invention.

[0020] Figure 2 This is a schematic diagram of the structure of a radiator module of a self-circulating liquid cooling system provided in an embodiment of the present invention.

[0021] Figure 3An exploded view of a radiator module of a self-circulating liquid cooling system provided in an embodiment of this utility model.

[0022] Figure 4 An exploded view of the liquid cooling component of a radiator module in a self-circulating liquid cooling system provided in this embodiment of the present invention.

[0023] Figure 5 This is a schematic diagram of the water tank structure of the liquid cooling component of a radiator module in a self-circulating liquid cooling system provided in an embodiment of the present invention.

[0024] Marked in the image: 100. Heat dissipation unit; 101. First water inlet; 102. First water outlet; 103. Second pipe; 104. First pipe; 200. Heat sink module; 210. Liquid cooling heat dissipation component; 201. Second water inlet; 202. Second water outlet; 211. Organism; 212. Liquid-cooled radiator; 2121. Water inlet chamber; 2122. Water outlet chamber; 2123. Cooling pipe; 2124. Third water inlet; 2125. Third water outlet; 2126. Heat dissipation fins; 213. Water tank; 2131. Liquid level sensor; 2132. Water outlet pipe; 2133. Water tank cover; 2134. Overflow pipe; 214. Mounting bracket; 215. Connector; 216. Pump body; 217. Fourth pipe; 218. Third pipe; 219. Temperature sensor; 220. Air-cooled heat dissipation components; 230. Controller. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. The described embodiments are some, but not all, of the embodiments of this utility model.

[0026] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0027] Example 1: To address the problems of low heat dissipation efficiency and the lack of widespread adoption of liquid cooling solutions in fuel-powered vehicles, this invention provides a self-circulating liquid cooling system.

[0028] In this embodiment, the heat dissipation liquid used in the liquid cooling heat dissipation system can be water, coolant, or other liquids capable of heat exchange. In the following embodiments, coolant will be used as the heat dissipation liquid for explanation.

[0029] In this embodiment, as Figure 1 As shown, the self-circulating liquid cooling system includes: a heat dissipation body 100 and a heat sink module 200. The heat dissipation body 100 has a first water inlet 101, a first water outlet 102 and a first flow channel connecting the first water inlet 101 and the first water outlet 102. The heat sink module 200 has a second water inlet 201, a second water outlet 202 and a second flow channel connecting the second water inlet 201 and the second water outlet 202. The second water inlet 201 is connected to the first water outlet 102 and the second water outlet 202 is connected to the first water inlet 101.

[0030] In this embodiment, the heat dissipation body 100 and the heat sink module 200 are designed separately. The heat dissipation body 100 is the core control mechanism of the electronic device. It is equipped with various chip systems and various heat-generating components according to the type of electronic device. During the operation of the heat dissipation body 100, the chip systems and heat-generating components on it will generate high heat, resulting in a high temperature of the heat dissipation body 100. At this time, the coolant flowing out from the second outlet 202 of the heat sink module 200 flows into the first flow channel from the first inlet 101 of the heat dissipation body 100, and then flows out from the first outlet 102 and enters the heat sink module 200 from the second inlet 201, thereby carrying away the heat on the heat dissipation body 100 and achieving rapid heat dissipation through the heat sink module 200.

[0031] In this embodiment, since the heat dissipation body 100 can be adapted to different electronic devices, and the heat sink module 200 can be plug-and-play for the heat dissipation body 100, it can be adapted to different heat dissipation bodies 100, and further realize heat dissipation for different electronic devices, with wide application.

[0032] In this preferred embodiment, the second water inlet 201 is connected to the first water outlet 102 through the first pipe 104, and the second water outlet 202 is connected to the first water inlet 101 through the second pipe 103.

[0033] In this embodiment, the first pipe 104 and the second pipe 103 can be flexible hoses that are directly plugged in and fixed, or they can be metal pipes that are screwed in and fixed. Both can be quickly plugged in to adapt to different heat dissipation bodies 100.

[0034] This embodiment is a preferred embodiment, and the specific structure of the heat sink module 200 has been optimized.

[0035] like Figure 2-3 As shown, the radiator module 200 includes a liquid cooling heat dissipation component 210 and an air cooling heat dissipation component 220, which are detachably connected; a second water inlet 201, a second water outlet 202 and a second flow channel are provided on the liquid cooling heat dissipation component 210.

[0036] Specifically, the air-cooled heat dissipation component 220 mainly uses fans, the number and specifications of which can be adjusted according to the heat generated by the electronic equipment that needs to be cooled.

[0037] The air-cooled heat dissipation component 220 is mounted on the liquid-cooled heat dissipation component 210 by screws. During operation, it can improve the air convection heat transfer capacity of the liquid-cooled heat dissipation component 210, thereby improving the heat dissipation effect of the liquid-cooled heat dissipation component 210.

[0038] Furthermore, since the air-cooled heat dissipation component 220 is mounted on the liquid-cooled heat dissipation component 210 via screws, the air-cooled heat dissipation component 220 and the liquid-cooled heat dissipation component 210 are detachable. This facilitates the installation and removal of the heat sink module 200 and allows for the decision of whether or not to assemble the air-cooled heat dissipation component 220 based on the heat dissipation requirements of the electronic device.

[0039] This embodiment is a preferred embodiment, and the specific structure of the liquid cooling heat dissipation component 210 has been optimized.

[0040] like Figure 3-4 As shown, the liquid cooling heat dissipation assembly 210 includes a body 211, a liquid cooling radiator 212, and a water tank 213. The water tank 213 is mounted on the body 211, the liquid cooling radiator 212 is detachably connected to the body 211, a second water inlet 201 and a second water outlet 202 are provided on the body 211, a second flow channel is provided on the liquid cooling radiator 212, the water tank 213 is connected to the second flow channel, and the air cooling heat dissipation assembly 220 is mounted on the liquid cooling radiator 212.

[0041] Specifically, the water tank 213 is installed on the body 211, and the liquid cooling radiator 212 is installed on one side of the body 211 via the connector 215. The connector 215 is a detachable structural component, thus allowing the liquid cooling radiator 212 to be detachably connected to the body 211. That is, the liquid cooling radiator 212 and the body 211 can be connected as one unit via the connector 215, or they can be installed separately as needed, so that the liquid cooling heat dissipation component 210 can be flexibly installed according to actual installation requirements.

[0042] A mounting bracket 214 is provided on the upper or lower surface of the liquid-cooled radiator 212, and the air-cooled heat dissipation component 220 is fixedly connected to the mounting bracket 214 by fixing screws, thereby being installed on the liquid-cooled radiator 212.

[0043] In this embodiment, the liquid-cooled radiator 212 has an inlet chamber 2121 and an outlet chamber 2122, which are located on opposite sides of the liquid-cooled radiator 212. The inlet chamber 2121 and the outlet chamber 2122 are connected by a cooling pipe 2123, and a second flow channel is formed between the inlet chamber 2121, the cooling pipe 2123, and the outlet chamber 2122. The inlet end of the inlet chamber 2121 is provided with a third inlet 2124, and the outlet end of the outlet chamber 2122 is provided with a third outlet 2125. The third inlet 2124 is connected to the first outlet 102 through the second inlet 201, and the third outlet 2125 is connected to the first inlet 101 through the second outlet 202.

[0044] Specifically, the second inlet 201 is connected to the first outlet 102 through the first pipe 104, the second outlet 202 is connected to the first inlet 101 through the second pipe 103, the second inlet 201 is connected to the third inlet 2124 through the third pipe 218, and the second outlet 202 is connected to the third outlet 2125 through the fourth pipe 217.

[0045] In this embodiment, the third pipe 218 and the fourth pipe 217 can be made of flexible tubing and directly plugged in for fixation, or they can be made of metal pipes and screwed in for fixation. Both methods can achieve quick plugging in. The lengths of the third pipe 218 and the fourth pipe 217 can be adjusted in accordance with the assembly method of the liquid cooling radiator 212 and the body 211.

[0046] The cooling pipes 2123 are configured as a number, and the cooling pipes 2123 are arranged in parallel.

[0047] In this embodiment, the two ends of a plurality of cooling pipes 2123 are respectively connected to the water inlet chamber 2121 and the water outlet chamber 2122; the coolant in the water inlet chamber 2121 flows into the water outlet chamber 2122 through the plurality of cooling pipes 2123.

[0048] In some optional embodiments, two adjacent cooling pipes 2123 are connected end to end. The input end of the first cooling pipe 2123 is connected to the water inlet chamber 2121, and the output end of the last cooling pipe 2123 is connected to the water outlet chamber 2122, so that the cooling pipes 2123 form an S-shaped flow channel. The coolant in the water inlet chamber 2121 enters from the input end of the first cooling pipe 2123, passes through multiple cooling pipes 2123 in sequence, and then flows out from the output end of the last cooling pipe 2123 into the water outlet chamber 2122.

[0049] In this preferred embodiment, the liquid-cooled radiator 212 further includes heat dissipation fins 2126, which are disposed on the second flow channel.

[0050] Specifically, a number of heat dissipation fins 2126 are provided, and these heat dissipation fins 2126 are arranged between two adjacent cooling pipes 2123 to enable the cooling pipes 2123 to exchange heat quickly.

[0051] In this preferred embodiment, the liquid cooling heat dissipation system further includes a controller 230, which is mounted on the body 211 and is communicatively connected to the liquid cooling heat dissipation component 210 and the air cooling heat dissipation component 220.

[0052] The controller 230 can control the flow rate of the liquid cooling heat dissipation component 210 and the air speed of the air cooling heat dissipation component 220, so as to realize more intelligent heat dissipation of the heat dissipation body 100 according to the heat dissipation requirements of the heat dissipation body 100.

[0053] In this preferred embodiment, the liquid cooling heat dissipation assembly 210 further includes a pump body 216, a liquid level sensor 2131, and a temperature sensor 219 that are communicatively connected to the controller 230. The pump body 216 and the temperature sensor 217 are mounted on the body 211. The pump body 216 is connected to the second flow channel, the liquid level sensor 2131 is connected to the water tank 213, and the temperature sensor 219 is in contact with the second water inlet 201 and the second water outlet 202, respectively.

[0054] Specifically, in this embodiment, the pump body 216 is an electronic water pump used to control the flow rate of the driving coolant in the liquid cooling heat dissipation component 210. Therefore, the pump body 216 can be set between the second inlet 201 and the third inlet 2124, or between the second outlet 202 and the third outlet 2125. Its specific setting position can be optimized according to the layout of the liquid cooling heat dissipation component 210.

[0055] The liquid level sensor 2131 is connected to the water tank 213 and is used to collect the liquid level information in the water tank 213 in real time and feed it back to the controller 230 to determine whether the water tank 213 needs to be replenished.

[0056] In addition, in this embodiment, the water tank 213 has a water outlet pipe 2132, which is connected to the fourth pipe 217 to replenish the second flow channel.

[0057] Meanwhile, the water tank 213 also has a water tank cover 2133, through which the water tank 213 is replenished. The water tank cover 2133 is provided with an overflow pipe 2134 to prevent the water tank 213 from continuously flowing in and causing the liquid level to rise continuously during the replenishment process.

[0058] At least two temperature sensors 219 are provided, each connected to the second inlet 201 and the second outlet 202 respectively, to detect the coolant temperature at the second inlet 201 and the second outlet 202 in real time and feed it back to the controller 230. The controller 230 controls the flow rate of the coolant in the liquid cooling heat dissipation component 210 through the pump body 216 according to the heat dissipation requirements of the heat dissipation body 100, and at the same time controls the wind speed of the output power of the air cooling heat dissipation component 220 to achieve intelligent heat dissipation.

[0059] In some preferred embodiments, the present invention also provides a liquid-cooled heat dissipation domain controller.

[0060] In this embodiment, the liquid-cooled heat dissipation domain controller includes the self-circulating liquid-cooled heat dissipation system of any of the above embodiments.

[0061] The heat dissipation body 100 of the self-circulating liquid cooling system is located inside the housing of the domain controller 230, while the heat sink module 200 of the self-circulating liquid cooling system is located outside the housing of the domain controller 230.

[0062] In this liquid-cooled heat dissipation domain controller, the heat dissipation body 100 serves as the core control mechanism of the domain controller. It is equipped with various chip systems and various heat-generating components. During the operation of the domain controller, the chip systems and heat-generating components on the heat dissipation body 100 generate high heat, resulting in a high temperature of the heat dissipation body 100. At this time, the coolant flowing out from the second outlet 202 of the heat sink module 200 flows into the first flow channel from the first inlet 101 of the heat dissipation body 100, and then flows out from the first outlet 102 and enters the heat sink module 200 from the second inlet 201, thereby carrying away the heat on the heat dissipation body 100 and rapidly dissipating it through the heat sink module 200.

[0063] The radiator module 200 can meet the heat dissipation requirements of the domain controller of the fuel vehicle during operation. In the process of heat dissipation, it can adjust the heat dissipation effect in real time according to the working status of the domain controller and the heat generated by the heat dissipation body 100, thereby realizing the function of flexible heat dissipation according to needs.

[0064] In this embodiment, the working process of the heat sink module 200 is described in detail in the above embodiment of the self-circulating liquid cooling system, and will not be repeated in this embodiment.

[0065] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0066] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0067] Furthermore, terms such as "horizontal," "vertical," and "sag" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal relative to "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0068] In this invention, unless otherwise expressly specified and limited, "above or below" the first feature may include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on" the first feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the first feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0069] Although the description of this utility model has been given in conjunction with the specific embodiments described above, it is obvious to those skilled in the art that many substitutions, modifications, and variations can be made based on the above description. Therefore, all such substitutions, modifications, and variations are included within the spirit and scope of the appended claims.

Claims

1. A self-circulating liquid cooling heat dissipation system, characterized in that, include: The heat dissipation body (100) and the heat sink module (200) are provided. The heat dissipation body (100) has a first water inlet (101), a first water outlet (102) and a first flow channel connecting the first water inlet (101) and the first water outlet (102). The heat sink module (200) has a second water inlet (201), a second water outlet (202) and a second flow channel connecting the second water inlet (201) and the second water outlet (202). The second water inlet (201) is connected to the first water outlet (102) and the second water outlet (202) is connected to the first water inlet (101).

2. The self-circulating liquid cooling system according to claim 1, characterized in that, The radiator module (200) includes a liquid-cooled heat dissipation component (210) and an air-cooled heat dissipation component (220), which are detachably connected; the second water inlet (201), the second water outlet (202) and the second flow channel are disposed on the liquid-cooled heat dissipation component (210).

3. The self-circulating liquid cooling system according to claim 2, characterized in that, The liquid cooling heat dissipation assembly (210) includes a body (211), a liquid cooling radiator (212), and a water tank (213). The water tank (213) is installed on the body (211). The liquid cooling radiator (212) is detachably connected to the body (211). The second water inlet (201) and the second water outlet (202) are provided on the body (211). The second flow channel is provided on the liquid cooling radiator (212). The water tank (213) is connected to the second flow channel. The air cooling heat dissipation assembly (220) is installed on the liquid cooling radiator (212).

4. The self-circulating liquid cooling system according to claim 3, characterized in that, The liquid-cooled radiator (212) has an inlet chamber (2121) and an outlet chamber (2122), which are located on opposite sides of the liquid-cooled radiator (212). The inlet chamber (2121) and the outlet chamber (2122) are connected by a cooling pipe (2123). The inlet chamber (2121), the cooling pipe (2123), and the outlet chamber (2122) are connected by a cooling pipe (2123). A second flow channel is formed between the two; the water inlet end of the water inlet chamber (2121) is provided with a third water inlet (2124), and the water outlet end of the water outlet chamber (2122) is provided with a third water outlet (2125). The third water inlet (2124) is connected to the first water outlet (102) through the second water inlet (201), and the third water outlet (2125) is connected to the first water inlet (101) through the second water outlet (202).

5. The self-circulating liquid cooling system according to claim 3, characterized in that, The liquid-cooled radiator (212) further includes heat dissipation fins (2126), which are disposed on the second flow channel.

6. The self-circulating liquid cooling system according to claim 3, characterized in that, The cooling pipe (2123) is configured as a plurality of units, and the plurality of cooling pipes (2123) are arranged in parallel. The two ends of several cooling pipes (2123) are respectively connected to the water inlet chamber (2121) and the water outlet chamber (2122); Alternatively, two adjacent cooling pipes (2123) are connected end to end, with the input end of the first cooling pipe (2123) connected to the water inlet chamber (2121) and the output end of the last cooling pipe (2123) connected to the water outlet chamber (2122).

7. The self-circulating liquid cooling system according to claim 3, characterized in that, The liquid cooling system also includes a controller (230), which is mounted on the body (211) and is communicatively connected to the liquid cooling component (210) and the air cooling component (220).

8. The self-circulating liquid cooling system according to claim 7, characterized in that, The liquid cooling heat dissipation assembly (210) also includes a pump body (216), a liquid level sensor (2131), and a temperature sensor (219) that are communicatively connected to the controller (230). The pump body (216) and the temperature sensor (219) are mounted on the body (211). The pump body (216) is connected to the second flow channel, the liquid level sensor (2131) is connected to the water tank (213), and the temperature sensor (219) is in contact with the second water inlet (201) and the second water outlet (202) respectively.

9. The self-circulating liquid cooling system according to claim 1, characterized in that, The second water inlet (201) is connected to the first water outlet (102) through a first pipe (104), and the second water outlet (202) is connected to the first water inlet (101) through a second pipe (103).

10. A liquid-cooled heat dissipation domain controller, characterized in that, The system includes the self-circulating liquid cooling system according to any one of claims 1-9, wherein the heat dissipation body (100) of the self-circulating liquid cooling system is disposed inside the housing of the domain controller (230), and the heat sink module (200) of the self-circulating liquid cooling system is disposed outside the housing of the domain controller (230).

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