An IC chip wafer sorting device

Abstract

The utility model embodiment provides a kind of IC chip wafer sorting device, including sorting pedestal, three groups of linear modules are provided with on it in parallel. Linear module in middle is equipped with sorting workbench, linear module on the side of sorting workbench is equipped with first piece of tablet station, and the other side is equipped with second piece of tablet station. The height of sorting workbench is lower than first piece of tablet station and second piece of tablet station, three can slide along y axis. Gantry is equipped on sorting pedestal, negative pressure pickup head, which can move along x axis and z axis, is installed on gantry, and multiple vision systems are moved along x axis. The top pin assembly that can adsorb blue film is equipped in the lower end of sorting workbench. The utility model is set up by the up-down staggered arrangement of sorting workbench and piece of tablet station, saves equipment space, shortens pickup head stroke, improves sorting accuracy, reduces the error caused by stroke, and is applicable to the efficient sorting of IC chip.

Description

Technical Field

[0001] This utility model relates to the field of chip sorting technology, and in particular to an IC chip wafer sorting device. Background Technology

[0002] In the chip manufacturing process, the process of processing crystalline silicon into finished packaged chips is not only complicated, but also requires high precision. After processing silicon into silicon wafers, etching, photolithography and other processes are carried out so that multiple or different types of chips can be placed on a single silicon wafer. The next step is to cut these chips on the whole wafer into individual chips, and then carry out inspection and sorting (which can be regarded as classification by quality) and packaging steps.

[0003] Current IC chip wafer sorting devices are relatively large, occupying a lot of space and increasing the travel distance of precision components, which may negatively impact accuracy. Therefore, this invention proposes an IC chip wafer sorting device to at least partially solve these problems. Utility Model Content

[0004] In view of the above problems, this utility model provides an IC chip wafer sorting device that overcomes or at least partially solves the above problems.

[0005] To address the aforementioned issues, this utility model discloses an IC chip wafer sorting device, comprising: a sorting platform on which three sets of linear modules are arranged in parallel. The linear module in the middle is equipped with a sorting workbench; the sorting workbench has a first sheet-laying platform on one side of the linear module and a second sheet-laying platform on the other side of the linear module; and the height of the sorting workbench is lower than the first sheet-laying platform and the second sheet-laying platform, and all three can slide along the y-axis on the linear module. The sorting platform is equipped with a gantry frame, a negative pressure pickup head that can move along the x-axis and z-axis, and multiple vision systems that can move along the x-axis. The sorting worktable is matched with the first vision system, the first stacking table is matched with the second vision system, and the second stacking table is matched with the third vision system. The lower end of the sorting workbench is equipped with a pin assembly that can absorb blue film.

[0006] Optionally, the first and second film trays are each arranged in two sets side by side.

[0007] Optionally, both the first and second film stacking tables are provided with a support plate at their lower ends; The lower end of the support plate is connected to a contact plate, which is slidably connected to the linear module and matches the limiting component at the end of the linear module.

[0008] Optionally, the gantry frame is provided with parallel slide rails on its sides; The translation component is slidably connected to the slide rail via a slider; The translation component is equipped with a lifting component that can move along the z-axis; The lifting assembly is connected to an adsorption seat, and the adsorption seat is equipped with a rotatable pickup head.

[0009] Optionally, the adsorption base is equipped with a servo motor, which is connected to the pulley of the pickup head via a belt.

[0010] Optionally, the belt is a synchronous belt.

[0011] The embodiments of this utility model have the following advantages: The sorting platform has three sets of linear modules arranged in parallel. A sorting worktable is mounted on the central linear module. One side of the sorting worktable has a first stacking stage, and the other side has a second stacking stage. The height of the sorting worktable is lower than the first and second stacking stages, and all three can slide along the y-axis on the linear modules. The sorting platform has a gantry frame with a negative pressure pickup head that can move along the x and z axes, and multiple vision systems that move along the x-axis. The sorting worktable is matched with the first vision system, the first stacking stage with the second vision system, and the second stacking stage with the third vision system. A pin assembly for adsorbing blue film is located at the lower end of the sorting worktable. Through structural optimization, the equipment size and pickup head stroke are reduced, improving sorting accuracy and efficiency, making it suitable for the precision sorting of IC chips. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the structure of an IC chip wafer sorting device according to an embodiment of the present invention; Figure 2 yes Figure 1 Enlarged view of point A in the middle. Detailed Implementation

[0013] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0014] Reference Figure 1In some embodiments of this utility model, an IC chip wafer sorting device includes: a sorting platform 101 on which three sets of linear modules 103 are arranged in parallel; wherein, a sorting worktable 102 is provided on the central linear module 103; the sorting worktable 102 has a first stacking stage 105 on one side of the linear module 103 and a second stacking stage 106 on the other side of the linear module 103; and the height of the sorting worktable 102 is lower than that of the first stacking stage 105 and the second stacking stage 106, and all three can be configured to... The linear module 103 slides along the y-axis; the sorting platform 101 is equipped with a gantry, a negative pressure pickup head 301 that can move along the x-axis and z-axis, and multiple vision systems that can move along the x-axis. The sorting worktable 102 is matched with the first vision system 201, the first stacking table 105 is matched with the second vision system 202, and the second stacking table 106 is matched with the third vision system 203. The lower end of the sorting worktable 102 is equipped with a pin assembly 104 that can adsorb blue film.

[0015] It should be noted that when wafers are processed into chips, a blue film is attached to the back. When dicing into individual chips, the dicing precision is controlled to preserve the blue film from being damaged. After the chips are inspected, they are sorted. Among them, those with different degrees of goodness are identified, classified, and then sorted again. For example, Intel's i3, i5, i7, and i9 products of the same generation are classified according to the yield rate of their integrated transistors. During mass production, defective transistors are simply shielded.

[0016] In this application, by staggering the sorting worktable 102 and the wafer stacking table, space can be saved, and the travel path of the pick-up head 301 when picking up the chip and then arranging it on the wafer stacking table can be shortened. During operation, the blue film is first stretched to a certain extent to reduce the adhesion between the chip and the blue film while keeping the chip attached to the blue film, and at the same time increasing the distance between the chips. The equipment sorts the chips according to the wafer map stored therein, and places the corresponding chips into different wafer stacking tables after sorting. Specifically, after the blue film is stretched, the blue film and the chip on it have not yet separated. The aforementioned ejector pin assembly 104 adsorbs and fixes the blue film, which can prevent the blue film from shifting or the vibration caused by the equipment or environment during chip picking, which would cause the blue film to misalign, resulting in inaccurate chip picking and inaccurate placement on the wafer stacking table. During operation, the first vision system 201 first locates the chip to be retrieved on the sorting table 102 and determines the chip's position and whether it is offset. If there is an offset, the corresponding negative pressure pickup head 301 is rotated to the corresponding angle. While being adsorbed by negative pressure, the ejector pin assembly 104 pushes the target chip upward to separate it from the blue film without damaging the chip. Since the ejector pin assembly 104 picks up the chip along the z-axis, it moves it along the x-axis above the corresponding first chip stack 105 or second chip stack 106. The first chip stack 105 or second chip stack 106 moves along the axis, coordinating with the x-axis movement of the pickup head 301. The second vision system 202 or third vision system 203 determines whether the chip's position relative to the stack is correct. After adjusting the position, the chip is placed in the corresponding position.

[0017] It should also be noted that after the chips are placed on the wafer stacking stage, they need to undergo processes such as gold wire pulling, lead soldering, and packaging. Because unpackaged chips are small, improper wafer stacking can easily lead to inaccurate lead soldering, resulting in scrapped chips. The aforementioned gold wire pulling and lead soldering refers to soldering gold wires from inside the packaged chip to the silicon wafer. If the chip stacking is misaligned, and the wires are not in the correct position on the silicon wafer, the soldered leads may not correspond to their intended functions, and could even burn out the chip and testing equipment during testing. The wafer stacking stage is equipped with an adhesive to ensure the chips adhere to the stage after placement, preventing misalignment due to the inertia of the pick-up head 301 during its ascent or movement.

[0018] Furthermore, both the first wafer sorting stage 105 and the second wafer sorting stage 106 are arranged in two sets side by side. Setting up multiple sets of wafer sorting stages can further divide the chips into more levels, achieving more precise chip sorting.

[0019] Both the first tray stack 105 and the second tray stack 106 are provided with a support plate 108 at their lower ends. A contact plate 107 is connected to the lower end of the support plate 108. The contact plate 107 is slidably connected to the linear module 103, and the contact plate 107 matches the limiting component 109 at the end of the linear module 103. When the contact plate 107 moves to and contacts the limiting component 109, the first tray stack 105 and the second tray stack 106 are limited and cannot continue to move forward, which can prevent the tray stack from excessively displacing in the y-axis direction and increasing the distance of the tray stack's movement path.

[0020] The gantry frame is provided with parallel slide rails 305 on its side; the translation component 303 is slidably connected to the slide rails 305 via a slider 306; the translation component 303 is provided with a lifting component 304 that can move along the z-axis; the lifting component 304 is connected to an adsorption seat 302, and the adsorption seat 303 is provided with a rotatable pickup head 301.

[0021] Furthermore, a servo motor (not shown in the figure) is provided on the adsorption seat 303, and the servo motor is connected to the pulley of the pickup head 301 via a belt. The belt is a synchronous belt, that is, a toothed belt, wherein the pulley and the output end of the servo motor are provided with matching teeth (not shown in the figure).

[0022] As an example, such as Figure 1 As shown and Figure 2 As shown, an IC chip wafer sorting device includes a sorting platform 101. Three sets of linear modules 103 are arranged in parallel on the sorting platform 101. Each linear module 103 employs a high-precision ball screw structure to ensure smooth sliding. A sorting worktable 102 is mounted on the central linear module 103. A first wafer stacking stage 105 is mounted on one side of the linear module 103, and a second wafer stacking stage 106 is mounted on the other side. The height of the sorting worktable 102 is lower than that of the first wafer stacking stage 105 and the second wafer stacking stage 106. All three stages—sorting worktable 102, first wafer stacking stage 105, and second wafer stacking stage 106—are driven by servo motors to slide along the y-axis on the linear modules 103. This staggered design saves lateral space and shortens the travel distance of the negative pressure pickup head 301.

[0023] It should be noted that as a chip sorting device, the smaller its size, the smaller the physical travel distance from picking up the chip to sorting the chip, and the smaller its error. For example, for the same type of device, the travel distance may produce a greater error when moving within a range of 1 meter and 0.5 meters. Micrometer-level errors may be erroneous data for the chip and may very likely lead to serious consequences.

[0024] A gantry frame, made of aluminum alloy, is fixed on the sorting platform 101, making it lightweight and structurally stable. A negative pressure pickup head 301, movable along the x-axis and z-axis, is mounted on the gantry frame. Specifically, two parallel slide rails 305 are provided on the side of the gantry frame. A translation component 303 is slidably connected to the slide rails 305 via a slider 306, allowing the translation component 303 to move along the x-axis. A lifting component 304 is provided on the translation component 303, driven by a cylinder or servo motor, and can move along the z-axis. An adsorption seat 302 is connected to the lifting component 304, on which the rotatable negative pressure pickup head 301 is mounted. A servo motor (not shown in the figure) is located inside the adsorption seat 302, connected to the pulley of the negative pressure pickup head 301 via a synchronous belt, enabling precise rotation of the negative pressure pickup head 301. The synchronous belt has a toothed structure, with matching teeth on the pulley and the output end of the servo motor to ensure zero slippage in the transmission.

[0025] The gantry is also equipped with multiple vision systems that move along the x-axis, including a first vision system 201, a second vision system 202, and a third vision system 203. The first vision system 201 is matched with the sorting stage 102 to locate the chips on the stage and detect chip position offsets. The second vision system 202 is matched with the first stacking stage 105, and the third vision system 203 is matched with the second stacking stage 106, respectively, to detect the chip positions on the stacking stages. The vision systems employ high-resolution CCD cameras, combined with image processing software, to achieve micron-level positioning.

[0026] The sorting table 102 has a pin assembly 104 at its lower end. The pin assembly 104 includes multiple independently controllable pins and vacuum suction holes for adsorbing and fixing the blue film. During operation, the blue film is first stretched by a stretching device (not shown in the figure) to reduce the adhesion between the chip and the blue film, while increasing the chip spacing. The pin assembly 104 fixes the blue film by vacuum suction to prevent displacement of the blue film when picking up the chip. When the negative pressure pickup head 301 picks up the chip, the pins of the pin assembly 104 push the target chip upward, separating the chip from the blue film without damaging the chip.

[0027] Two sets of first and second chip trays 105 and 106 are arranged side-by-side to increase sorting capacity. Each of the first and second chip trays 105 and 106 has a support plate 108 at its lower end. The support plate 108 is made of stainless steel and is used to support the chips. A contact plate 107 is connected to the lower end of the support plate 108, and the contact plate 107 is slidably connected to the linear module 103. A limiting component 109 is provided at the end of the linear module 103. When the contact plate 107 moves to the limiting component 109, the chip tray is limited to prevent excessive displacement and ensure accurate chip placement.

[0028] The work process is as follows: The sorting workbench 102 loads a blue film with a chip attached. After the blue film is stretched, the ejector pin assembly 104 adsorbs and fixes the blue film.

[0029] The first vision system 201 scans the sorting stage 102 to identify the position and offset angle of the target chip. If there is an offset, the negative pressure pickup head 301 rotates the corresponding angle.

[0030] The negative pressure pickup head 301 moves above the target chip, the ejector pin of the ejector pin assembly 104 lifts the chip, and the negative pressure pickup head 301 adsorbs the chip.

[0031] The negative pressure pickup head 301 moves along the x-axis to above the first film stage 105 or the second film stage 106, while the film stage moves along the y-axis to cooperate.

[0032] The second vision system 202 or the third vision system 203 detects the position of the chip relative to the stacking stage. After adjustment, the negative pressure pickup head 301 places the chip onto the stacking stage. The surface of the stacking stage is coated with an adhesive to fix the chip in place.

[0033] Repeat the above process to complete the chip sorting.

[0034] This invention, through structural optimization, reduces the size of the equipment and the travel of the pickup head, thereby improving sorting accuracy and efficiency, and is suitable for the precision sorting of IC chips.

[0035] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0036] Although preferred embodiments of the present invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of the present invention.

[0037] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or terminal device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or terminal device. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or terminal device that includes said element.

[0038] The IC chip wafer sorting device provided by this utility model has been described in detail above. Specific examples have been used to illustrate the principle and implementation of this utility model. The description of the above embodiments is only for the purpose of helping to understand the method and core idea of ​​this utility model. At the same time, for those skilled in the art, there will be changes in the specific implementation and application scope based on the idea of ​​this utility model. Therefore, the content of this specification should not be construed as a limitation of this utility model.

Claims

1. An IC chip wafer sorting device, characterized in that, include: The sorting platform has three sets of linear modules arranged in parallel on it. The linear module in the middle is equipped with a sorting workbench; the sorting workbench has a first sheet-laying platform on one side of the linear module and a second sheet-laying platform on the other side of the linear module; and the height of the sorting workbench is lower than the first sheet-laying platform and the second sheet-laying platform, and all three can slide along the y-axis on the linear module. The sorting platform is equipped with a gantry frame, a negative pressure pickup head that can move along the x-axis and z-axis, and multiple vision systems that can move along the x-axis. The sorting worktable is matched with the first vision system, the first stacking table is matched with the second vision system, and the second stacking table is matched with the third vision system. The lower end of the sorting workbench is equipped with a pin assembly that can absorb blue film.

2. The IC chip wafer sorting device according to claim 1, characterized in that, The first and second film trays are each arranged in two sets side by side.

3. The IC chip wafer sorting device according to claim 2, characterized in that, Both the first and second film stacking tables are equipped with support plates at their lower ends; The lower end of the support plate is connected to a contact plate, which is slidably connected to the linear module and matches the limiting component at the end of the linear module.

4. The IC chip wafer sorting device according to claim 1, characterized in that, The gantry frame is equipped with parallel slide rails on its sides; The translation component is slidably connected to the slide rail via a slider; The translation component is equipped with a lifting component that can move along the z-axis; The lifting assembly is connected to an adsorption seat, and the adsorption seat is equipped with a rotatable pickup head.

5. The IC chip wafer sorting device according to claim 4, characterized in that, The adsorption base is equipped with a servo motor, which is connected to the pulley of the pickup head via a belt.

6. The IC chip wafer sorting device according to claim 5, characterized in that, The belt is a synchronous belt.

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