Wafer transfer robot

Abstract

The utility model discloses a wafer transfer manipulator, including installation support, and the installation support is sleeved with the pivot, and one end of pivot is driven by first power component, and the other end is installed with wafer transfer execution mechanism, and the pivot is rotatably installed with drive shaft, and one end of drive shaft is driven by second power component, and the other end drives wafer transfer execution mechanism, and the outer circle of pivot is rotatably matched with the lift seat, and the lift seat is guided to be installed on the installation support, and the lift seat is driven by the elevating system. Realized the wafer transfer around the same rotation center, satisfied the material taking and the material placing between the work station of different height, different distance and different direction simultaneously, simple structure, and need not reserve the oversize activity space, reached the effect of small size, low space occupancy, provided the convenience and space for the arrangement of other link structure.

Description

Technical Field

[0001] This utility model belongs to the field of wafer transfer technology, and in particular relates to a wafer transfer robot. Background Technology

[0002] Currently, most wafer handling equipment used in semiconductor manufacturing has a multi-axis structure with multiple swing arms. The ends of each pair of swing arms are rotatably connected. During wafer picking and placing, all swing arms extend and retract, and multiple rotation centers are required to achieve long-distance picking and placing. Therefore, a large amount of space needs to be reserved, resulting in a large space occupancy rate and a complex overall structure for this wafer handling equipment. Utility Model Content

[0003] This invention provides a wafer transfer robot that achieves small size and low space occupancy.

[0004] To solve the above-mentioned technical problems, the technical solution of this utility model is: a wafer transfer robot, including a mounting bracket, on which a rotating shaft is mounted, one end of which is driven by a first power component and the other end of which is equipped with a wafer transfer actuator;

[0005] A drive shaft is rotatably mounted inside the rotating shaft. One end of the drive shaft is driven by a second power component, and the other end drives the wafer transfer actuator.

[0006] The outer circumference of the rotating shaft is rotatably fitted with a lifting seat, which is guided and mounted on the mounting bracket and driven by a lifting mechanism.

[0007] As an improvement, the wafer transfer actuator includes a fixed base mounted on the rotating shaft, a slide table slidably mounted on the fixed base, and a material carrier mounted on the slide table;

[0008] It also includes a first belt drive mechanism disposed on the fixed base, the slide is fixedly connected to the belt body on the first belt drive mechanism, and the first belt drive mechanism is driven by the drive shaft.

[0009] As a further improvement, the loading platform includes a plate-type platform body, one end of which is fixedly connected to the slide table, and the other end is integrally formed with a loading tray.

[0010] The plate-type platform is provided with a negative pressure air passage, which extends to the material tray. The material tray is provided with a plurality of suction cups that communicate with the negative pressure air passage.

[0011] As a further improvement, the loading tray is provided with a weight-reducing groove through the end.

[0012] As an improvement, the lifting mechanism includes a support seat disposed on the mounting bracket, a lead screw driven by a third power component is rotatably mounted on the support seat, a lead screw nut is fitted on the lead screw, and the lead screw nut is fixedly connected to the lifting seat.

[0013] As a further improvement, the lead screw and the drive shaft are coaxially arranged, with one end of the lead screw extending into the drive shaft.

[0014] As a further improvement, the mounting bracket is provided with at least three guide rods arranged parallel to the rotating shaft, and the lifting seat is provided with at least three guide sleeves that correspond one-to-one with the guide rods and are slidably engaged.

[0015] As a further improvement, the rotating shaft is provided with an arc-shaped detection plate, and the lifting seat is provided with a rotation detection sensor for detecting the arc-shaped detection plate;

[0016] The lifting base is equipped with a plate-type detection plate, and the mounting bracket is equipped with a lifting detection sensor for detecting the plate-type detection plate.

[0017] As a further improvement, the first power assembly, the second power assembly, and the third power assembly are all second belt drive mechanisms.

[0018] As a further improvement, protective plates are provided around the periphery of the mounting bracket and the periphery of the fixing base.

[0019] After adopting the above technical solution, the effect of this utility model is:

[0020] The wafer transfer robot includes a mounting bracket with a rotating shaft mounted on it. One end of the rotating shaft is driven by a first power component, and the other end is equipped with a wafer transfer actuator. A drive shaft is rotatably mounted inside the rotating shaft. One end of the drive shaft is driven by a second power component, and the other end drives the wafer transfer actuator. A lifting seat is rotatably fitted around the outer periphery of the rotating shaft. The lifting seat is guided and mounted on the mounting bracket and is driven by a lifting mechanism. Based on the above structure, during operation, the wafer transfer robot uses the lifting mechanism to drive the lifting seat and the rotating shaft to rise or fall, thereby driving the wafer transfer actuator to rise or fall. When transferring wafers at different distances, the second power component drives the drive shaft to enable the wafer transfer actuator to pick up and place wafers, and the first power component drives the rotating shaft to rotate, thus enabling picking up and placing wafers in different directions.

[0021] In summary, this wafer transfer robot enables wafer transfer to proceed around a single rotation center, while simultaneously accommodating material handling and loading between workstations at different heights, distances, and directions. Its simple structure eliminates the need for excessively large operating space. Furthermore, the modular design of the rotating and drive shafts achieves miniaturization and low space occupancy, providing convenience and space for the arrangement of other connecting structures.

[0022] The wafer transfer actuator includes a fixed base mounted on a rotating shaft, a slide table slidably mounted on the fixed base, and a material carrier mounted on the slide table; it also includes a first belt drive mechanism mounted on the fixed base, the slide table being fixedly connected to the belt on the first belt drive mechanism, and the first belt drive mechanism being driven by a drive shaft. Thus, when picking up and placing wafers at different distances, the drive shaft drives the first belt drive mechanism to work, and the first belt drive mechanism drives the slide table and the material carrier mounted on it to reciprocate, covering a large range and laying the foundation for picking up and placing wafers at different distances.

[0023] The loading stage includes a plate-type stage body, one end of which is fixedly connected to a slide table, and the other end is integrally formed with a loading tray. The plate-type stage body is provided with a negative pressure air channel that extends to the loading tray. The loading tray is provided with multiple suction cups that communicate with the negative pressure air channel. Thus, when picking up and placing wafers, the operation is completed through the cooperation of the negative pressure air channel and the suction cups. The structure is simple, and there are no other parts on the loading stage, which avoids the problem of mutual interference during the lifting, translation and rotation of the wafer transfer robot.

[0024] Because the loading tray has a weight-reducing groove that runs through the end, the weight of the loading tray is reduced through the weight-reducing groove, which prevents the suspended loading tray from being too heavy and sagging. This effectively ensures the straightness of the loading platform during operation and provides a guarantee for accurate material picking and unloading.

[0025] Because the lifting mechanism includes a support seat mounted on the mounting bracket, a lead screw driven by a third power component is rotatably mounted on the support seat, a lead screw nut is fitted on the lead screw, the lead screw nut is fixedly connected to the lifting seat, the lead screw and the drive shaft are coaxially arranged, and one end of the lead screw extends into the drive shaft, this not only ensures the stability of the center of gravity of the lifting seat, but also facilitates the compactness of the layout, and also helps to improve the structural strength.

[0026] Because the mounting bracket has at least three guide rods arranged parallel to the rotating shaft, and the lifting seat has at least three guide sleeves that correspond one-to-one with the guide rods and slide in cooperation, the lifting seat is guided during the rising or falling process through the cooperation of the guide rods and guide sleeves. The structure is simple and the guiding effect is good.

[0027] Because the rotating shaft is equipped with an arc-shaped detection plate, and the lifting seat is equipped with a rotation detection sensor for detecting the arc-shaped detection plate; the lifting seat is equipped with a plate-type detection plate, and the mounting bracket is equipped with a lifting detection sensor for detecting the plate-type detection plate, the rotational displacement of the rotating shaft is accurately detected by the cooperation of the rotation detection sensor and the arc-shaped detection plate, and the lifting displacement of the lifting seat is accurately detected by the cooperation of the lifting detection sensor and the plate-type detection plate, so as to ensure accurate material picking and unloading.

[0028] Since the first power assembly, the second power assembly, and the third power assembly are all second belt drive mechanisms, the structure is simple and easy to arrange and assemble while ensuring normal drive.

[0029] Because protective plates are provided around the mounting bracket and the fixed base, the various components are protected during use, effectively ensuring the safe operation of the wafer transfer robot. Attached Figure Description

[0030] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0031] Figure 1 This is a schematic diagram of the structure of this utility model;

[0032] Figure 2 yes Figure 1 A structural diagram from another angle;

[0033] Figure 3 yes Figure 1 A sectional view;

[0034] Figure 4 yes Figure 2 Enlarged view of A in the middle;

[0035] Among them, 1-mounting bracket; 101-guide rod; 102-lifting detection sensor; 103-third power element; 104-third drive pulley; 105-guard plate; 2-rotating shaft; 201-arc-shaped detection plate; 202-rotating shaft pulley; 3-wafer transfer actuator; 301-fixed base; 302-slide rod; 303-slide table; 304-material loading platform; 3041-plate-type platform; 3042-material loading tray; 3043-negative pressure air passage; 3044-weight reduction groove; 3045 - Suction cup; 305 - Driven pulley; 4 - Drive shaft; 401 - Drive pulley; 402 - Drive shaft pulley; 5 - Lifting seat; 501 - Guide sleeve; 502 - Rotation detection sensor; 503 - Plate-type detection plate; 504 - First power element; 505 - First driving pulley; 506 - Second power element; 507 - Second driving pulley; 6 - Lifting mechanism; 601 - Support seat; 602 - Lead screw; 6021 - Lead screw pulley; 603 - Lead screw nut. Detailed Implementation

[0036] The present invention will be further described in detail below through specific embodiments.

[0037] like Figures 1 to 3 As shown, a wafer transfer robot includes a frame structure mounting bracket 1, on which a vertically arranged rotating shaft 2 is mounted. One end of the rotating shaft 2 is driven by a first power component, and the other end is equipped with a wafer transfer actuator 3. A drive shaft 4 is rotatably mounted inside the rotating shaft 2. One end of the drive shaft 4 is driven by a second power component, and the other end drives the wafer transfer actuator 3. A lifting seat 5 is rotatably fitted around the outer periphery of the rotating shaft 2. The lifting seat 5 is guided and mounted on the mounting bracket 1 and driven by a lifting mechanism 6. In this embodiment, the lifting mechanism 6 is arranged directly below the rotating shaft 2.

[0038] The wafer transfer actuator 3 includes a fixed base 301 mounted on the end of the rotating shaft 2. The fixed base 301 is provided with a horizontally arranged slide rod 302. A slide table 303 is slidably mounted on the slide rod 302. A material carrier 304 is mounted on the slide table 303. It also includes a first belt drive mechanism disposed on the fixed base 301. The slide table 303 is fixedly connected to the belt body on the first belt drive mechanism. The first belt drive mechanism is driven by a drive shaft 4. The first belt drive mechanism includes: a drive pulley 401 disposed on the drive shaft 4; a plurality of driven pulleys 305 disposed on the fixed base 301; and a belt body (not shown in the figure) fixedly connected to the slide table 303 is disposed between all the driven pulleys 305 and the drive pulleys 401.

[0039] The loading platform 304 includes a plate-type platform body 3041, one end of which is fixedly connected to the slide table 303, and the other end is integrally formed with a loading tray 3042. The plate-type platform body 3041 is provided with a negative pressure air passage 3043 (for ease of illustration, the negative pressure air passage 3043 shown in the figure is exposed; in actual use, a sealing cover is also installed). The negative pressure air passage 3043 extends to the loading tray 3042, and the loading tray 3042 is provided with multiple suction cups 3045 communicating with the negative pressure air passage 3043 (see...). Figure 4 In this scheme, the suction cup 3045 is arranged below the material tray 3042; the material tray 3042 is provided with a weight reduction groove 3044 that extends through the end.

[0040] The lifting mechanism 6 includes a support base 601 mounted on the mounting bracket 1. A lead screw 602 driven by a third power component is rotatably mounted on the support base 601. A lead screw nut 603 is fitted on the lead screw 602 and is fixedly connected to the lifting seat 5. Preferably, the lead screw 602 and the drive shaft 4 are coaxially arranged, and one end (non-driving end) of the lead screw 602 extends into the drive shaft 4.

[0041] In this design, the mounting bracket 1 is provided with at least three guide rods 101 arranged parallel to the rotating shaft 2, and the lifting seat 5 is provided with at least three guide sleeves 501 that correspond one-to-one with the guide rods 101 and are slidably engaged; the rotating shaft 2 is provided with an arc-shaped detection piece 201, and the lifting seat 5 is provided with a rotation detection sensor 502 for detecting the arc-shaped detection piece 201; the lifting seat 5 is also provided with a vertically arranged plate-type detection piece 503, and the mounting bracket 1 is provided with a lifting detection sensor 102 for detecting the plate-type detection piece 503.

[0042] The first power assembly, the second power assembly, and the third power assembly are all second belt drive mechanisms, with the following specific structures:

[0043] The first power assembly includes a shaft pulley 202 mounted on the rotating shaft 2, and a first power element 504 (e.g., a power combination of a motor and a reducer) mounted on the lifting base 5. The first power element 504 has a first drive pulley 505, and a first transmission belt (not shown in the figure) is provided between the first drive pulley 505 and the shaft pulley 202. The second power assembly includes a drive shaft pulley 402 mounted on the drive shaft 4, and a second power element 506 (e.g., a power combination of a motor and a reducer) mounted on the lifting base 5. The second power element 506 is provided with a second drive pulley 507, and a second transmission belt (not shown in the figure) is provided between the second drive pulley 507 and the drive shaft pulley 402; the third power assembly includes a screw pulley 6021 provided on the screw 602, and also includes a third power element 103 (such as a power combination of a motor and a reducer) provided on the mounting bracket 1, the third power element 103 is provided with a third drive pulley 104, and a third transmission belt (not shown in the figure) is provided between the screw pulley 6021 and the third drive pulley 104.

[0044] The mounting bracket 1 and the fixing base 301 are both provided with protective plates 105.

[0045] The above-described embodiments are merely preferred embodiments of the present utility model and are not intended to limit the scope of the present utility model. Any modifications and alterations to the technical solution of the present utility model without departing from its design spirit shall fall within the protection scope defined by the claims of the present utility model.

Claims

1. A wafer transfer robot, comprising a mounting bracket, characterized in that: The mounting bracket is fitted with a rotating shaft, one end of which is driven by a first power component and the other end is fitted with a wafer transfer actuator. A drive shaft is rotatably mounted inside the rotating shaft. One end of the drive shaft is driven by a second power component, and the other end drives the wafer transfer actuator. The outer circumference of the rotating shaft is rotatably fitted with a lifting seat, which is guided and mounted on the mounting bracket and driven by a lifting mechanism.

2. The wafer transfer robot as described in claim 1, characterized in that: The wafer transfer actuator includes a fixed base mounted on the rotating shaft, a slide table slidably mounted on the fixed base, and a material carrier mounted on the slide table; It also includes a first belt drive mechanism disposed on the fixed base, the slide is fixedly connected to the belt body on the first belt drive mechanism, and the first belt drive mechanism is driven by the drive shaft.

3. The wafer transfer robot as described in claim 2, characterized in that: The loading platform includes a plate-type platform body, one end of which is fixedly connected to the slide table, and the other end is integrally formed with a loading tray; The plate-type platform is provided with a negative pressure air passage, which extends to the material tray. The material tray is provided with a plurality of suction cups that communicate with the negative pressure air passage.

4. A wafer transfer robot as described in claim 3, characterized in that: The material tray is provided with a weight reduction groove that extends through the end.

5. A wafer transfer robot as described in claim 1, characterized in that: The lifting mechanism includes a support base mounted on the mounting bracket, a lead screw driven by a third power component is rotatably mounted on the support base, a lead screw nut is fitted on the lead screw, and the lead screw nut is fixedly connected to the lifting base.

6. A wafer transfer robot as described in claim 5, characterized in that: The lead screw and the drive shaft are coaxially arranged, and one end of the lead screw extends into the drive shaft.

7. A wafer transfer robot as described in claim 5, characterized in that: The mounting bracket is provided with at least three guide rods arranged parallel to the rotating shaft, and the lifting seat is provided with at least three guide sleeves that correspond one-to-one with the guide rods and are slidably engaged.

8. A wafer transfer robot as described in claim 7, characterized in that: The rotating shaft is provided with an arc-shaped detection plate, and the lifting seat is provided with a rotation detection sensor for detecting the arc-shaped detection plate; The lifting base is equipped with a plate-type detection plate, and the mounting bracket is equipped with a lifting detection sensor for detecting the plate-type detection plate.

9. A wafer transfer robot as described in claim 5, characterized in that: The first power component, the second power component, and the third power component are all second belt drive mechanisms.

10. A wafer transfer robot as described in claim 2, characterized in that: The mounting bracket and the fixing base are both provided with protective plates.

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