Integrated heat dissipation expansion board (PCIe TO M.2 Board)
CN309147784SActive Publication Date: 2025-03-04SHENZHEN FEIPAI ELECTRONICS CO LTD
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Patent Information
- Application Number
- CN202430473017.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-27
- Publication Date
- 2025-03-04
- Estimated Expiration
- 2039-07-27
Smart Images
Figure 000009_ABST
Abstract
1. The name of this design product: integrated heat dissipation expansion board (PCIe TO M.2 Board). 2. Purpose of this design product: used as a fan heat dissipation expansion device in electronic equipment. 3. The design key point of this appearance design product lies in the shape. 4. The picture or photo that best illustrates the design points: use the status reference diagram.
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