Wafer defect inspection machine
CN309238554SActive Publication Date: 2025-04-15YOUWEI IMAGE TECH (SUZHOU) CO LTD
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Patent Information
- Application Number
- CN202430520198.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-16
- Publication Date
- 2025-04-15
- Estimated Expiration
- 2039-08-16
Smart Images
Figure 000007_ABST
Abstract
1. The name of the product of this design: wafer defect inspection machine. 2. The purpose of this design product: used for wafer pattern anomalies, edge collapse, cracks (hidden cracks), foreign matter, needle marks, bumping and other defect detection. 3. The design key point of this appearance design product lies in the shape. 4. The picture or photo that best illustrates the design points: three-dimensional picture.
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