Electron beam lithography mainframe housing
CN309342108SActive Publication Date: 2025-06-17北京金竟科技有限责任公司
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Patent Information
- Application Number
- CN202430698771.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-05
- Publication Date
- 2025-06-17
- Estimated Expiration
- 2039-11-05
Smart Images
Figure 000001_ABST
Abstract
1. Name of the Design Product: Outer Shell of Electron Beam Lithography Mainframe. 2. Use of the Design Product: The outer shell for the electron beam lithography mainframe, which can reduce noise, insulate heat, keep constant temperature and demagnetize. 3. Design Key Points of the Design Product: Lies in the shape. 4. Picture or Photograph that Best Indicates the Design Key Points: Perspective view.
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