Bonded wafer ultrasonic testing machine
CN309566313SActive Publication Date: 2025-10-28SHIRUI (HANGZHOU) INFORMATION TECH CO LTD
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Patent Information
- Application Number
- CN202530137208.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-20
- Publication Date
- 2025-10-28
- Estimated Expiration
- 2040-03-20
Smart Images
Figure 000001_ABST
Abstract
1. Name of the product in this design: Bonded Sheet Ultrasonic Testing Machine. 2. Purpose of this design: Ultrasonic testing machine for bonded sheets. 3. The key point of the design of this product lies in its shape. 4. The image or photograph that best illustrates the design's key points: a 3D model.
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