CPU liquid cooling radiator components (SPRO series)
CN309569622SActive Publication Date: 2025-10-28DONGGUAN YOULICHUANG ELECTRONIC TECHNOLOGY CO LTD
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Patent Information
- Application Number
- CN202530070725.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-18
- Publication Date
- 2025-10-28
- Estimated Expiration
- 2040-02-18
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Figure 000007_ABST
Abstract
1. Name of the product in this design: CPU water cooling heatsink assembly (S PRO series). 2. Purpose of this product design: The cold block is installed on the CPU, directly contacting the CPU surface, and effectively conducts the heat generated by the CPU to the inside of the cold block through thermal conductive materials (such as thermal grease). The water pump is integrated inside the cold block, which pumps coolant to circulate between the cold block and the radiator to remove heat. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: a 3D model.
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