Head-mounted thermal imager
CN309586718SActive Publication Date: 2025-11-07HEFEI YINGJU INNOVATION TECHNOLOGY CO LTD
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Patent Information
- Application Number
- CN202530097739.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-04
- Publication Date
- 2025-11-07
- Estimated Expiration
- 2040-03-04
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Figure 000007_ABST
Abstract
1. The name of the design product: head-mounted thermal imager. 2. The use of the design product: used as observation and monitoring instruments, mainly including various electronic devices such as infrared thermal imagers, cameras, thermometers, etc. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: perspective view 1.
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