Opto-coupler emitter lead frame (through-connection rib high-density)

CN309716337SActive Publication Date: 2026-01-02SHENZHEN ORIENT COMPONENTS CO LTD
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Patent Information

Application Number
CN202530382659.7
Authority / Receiving Office
CN · China
Patent Type
Designs(China)
Current Assignee / Owner
Filing Date
2025-07-01
Publication Date
2026-01-02
Estimated Expiration
2040-07-01

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Abstract

1. The name of the design product: light coupling emission end lead frame (through type high density). 2. The use of the design product: used for the device of the packaging of the patch type photoelectric coupler. 3. The design points of the design product: in shape. 4. The picture or photo that can best show the design points: design 1 front view. 5. Design 1 is specified as the basic design.
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