Semiconductor heat sink (transparent patch version)

CN309860753SActive Publication Date: 2026-03-20曾银平
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Designs(China)
Current Assignee / Owner
Filing Date
2025-09-11
Publication Date
2026-03-20

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Abstract

1. Name of the designed product: semiconductor heat sink (transparent patch type). 2. Use of the designed product: heat dissipation product for cooling mobile phones. 3. Design points of the designed product: in shape. 4. Picture or photo that best indicates the design points: Design 1 perspective view 1. 5. Design 1 is designated as the basic design.
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