Vapor phase etching equipment (HF)
CN309928253SActive Publication Date: 2026-04-17JIANGSU PENGJU SEMICON EQUIP TECH CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- JIANGSU PENGJU SEMICON EQUIP TECH CO LTD
- Filing Date
- 2025-08-25
- Publication Date
- 2026-04-17
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Figure 000007_ABST
Abstract
1. Name of the product in this design: Vapor phase etching equipment (HF). 2. Application of this design: It is used to house vacuum chambers, pipelines, electrical control components, etc., to achieve HF vapor phase etching, and can achieve etching of substrates of 4 inches and below. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: a 3D model.
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