Mobile phone motherboard (X20PCB and components)
CN309936996SActive Publication Date: 2026-04-21SHENZHEN KUSAI INTELLIGENT CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- SHENZHEN KUSAI INTELLIGENT CO LTD
- Filing Date
- 2025-09-10
- Publication Date
- 2026-04-21
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Figure 000007_ABST
Abstract
1. Name of the product in this design: Mobile phone motherboard (X20 PCB and components). 2. Purpose of this design: As a motherboard in a mobile phone. 3. The key design features of this product are its overall shape and the layout of its surrounding components. 4. The image or photograph that best illustrates the design's key points: 3D view 1.
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