Food-grade low-carbon composite heat insulation board
CN309971454SActive Publication Date: 2026-05-08YUANCHUANGXIANG (SUZHOU) NEW MATERIAL TECH CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- YUANCHUANGXIANG (SUZHOU) NEW MATERIAL TECH CO LTD
- Filing Date
- 2025-10-23
- Publication Date
- 2026-05-08
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Figure 000002_ABST
Abstract
1. The name of the design product: food-grade low-carbon composite heat insulation board. 2. The use of the design product: increase the heat preservation of the cold storage, and solve the hidden danger of condensate water caused by the convection effect of the joint of the plate-shaped board. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: perspective view.
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