Support pad body
CN309990418SActive Publication Date: 2026-05-19DNJO TECH CO LTD
View PDF 0 Cites 0 Cited by
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- DNJO TECH CO LTD
- Filing Date
- 2025-10-23
- Publication Date
- 2026-05-19
Smart Images

Figure 000001_ABST
Abstract
1. Name of the product in this design: Body of the support pad. 2. Purpose of this design: The entire product is used as a support pad that can be detachably installed inside a wafer cassette and prevents the wafer from moving during transport or processing; the part of the product for which protection is sought is used as the main body of the support pad. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: 3D view 1. 5. Other situations requiring explanation: The gray semi-transparent layer covering the area shown in the attached drawing is an unprotected area. Perspective 2 is a perspective view of the overall appearance of this design from another angle.
Need to check novelty before this filing date? Find Prior Art