FPC chip dispensing and curing oven

CN309990713SActive Publication Date: 2026-05-19常州光迅工业设备有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Designs(China)
Current Assignee / Owner
常州光迅工业设备有限公司
Filing Date
2025-11-05
Publication Date
2026-05-19

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Abstract

1. Name of the product in this design: FPC chip dispensing and curing oven. 2. Application of this design: It is used in semiconductor packaging equipment. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: a 3D model.
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