Wafer Measurement Equipment
CN310060543SActive Publication Date: 2026-06-30ZHONGJIA MICROVISION (SHENZHEN) SEMICONDUCTOR TECHNOLOGY CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- ZHONGJIA MICROVISION (SHENZHEN) SEMICONDUCTOR TECHNOLOGY CO LTD
- Filing Date
- 2025-12-03
- Publication Date
- 2026-06-30
Smart Images
Figure 000007_ABST
Abstract
1. Name of the product in this design: Wafer Measurement Equipment. 2. Purpose of this design: To inspect the surface of a wafer and measure the film thickness on the wafer surface. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: a 3D model.
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