Method for detecting a solder bead crack and electronic device

Abstract

Method for detecting a solder bead crack in an electronic device (101) comprising a printed circuit board (103) on which an electronic component (107) is soldered by means of a solder bead (105), such that an electrical connection (109) is formed between the printed circuit board (103) and the electronic component (107), comprising the following steps: - Applying an electrical voltage to the electronic component (107), thereby generating a forward electromagnetic wave (111) propagating from the printed circuit board (103) towards the solder bead (105) and a reflected electromagnetic wave (113) reflected from the solder bead (105) towards the printed circuit board (103), - Detecting the forward (111) and reflected (113) electromagnetic waves by means of a power sensor (115) coupled to the electrical connection (109),- Determining the incident power associated with the incident electromagnetic wave (111) and the reflected power associated with the reflected electromagnetic wave (113) using the power sensor (115), - Calculating a reflection factor by taking the difference between the reflected power and the incident power.

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