Organic optoelectronic device and method for fabricating an organic optoelectronic device

Abstract

Method for manufacturing an optoelectronic component (100a, 400b, 500, 600), comprising the method: • Forming (701) an organic first layer (104) over a substrate (102), wherein the first layer (104) has a surface (104t); • wherein the surface (104t) is opposite the substrate (102) and has a first surface area (104b) and a second surface area (104r), wherein the second surface area (104r) surrounds the first surface area (104b); • Forming (703) an organic second layer (106) over the first surface region (104b), wherein the second surface region (104r) remains free of the second layer (106), • where successively formed layers are processed from solvents that are orthogonal to each other.

Description

[0001] The invention relates to an organic optoelectronic component and a method for manufacturing an organic optoelectronic component.

[0002] The following publications concern organic optoelectronic devices: US 2013 / 0 256 603 A1, US 8 840 808 B2, US 2010 / 0 289 019 A1, WO 2014 / 145 609 A1.

[0003] In general, layers of organic semiconductors (also called organic layers) can be used for a variety of applications, such as converting electrical energy into light or vice versa. For example, organic light-emitting diodes (OLEDs) can be manufactured, which are used in electronic devices, such as in displays for televisions, billboards, or mobile phones, or as planar light sources to generate light.

[0004] High-efficiency organic light-emitting diodes (OLEDs) consist of a layer stack of many materials and material mixtures, each fulfilling different functions (e.g., transport or injection of charge carriers, blocking of individual charge carriers, trapping of charge carrier pairs and generation of excitons, followed by light emission). These multilayer OLEDs can be manufactured either by vacuum processing or by so-called hybrid processing, in which several (e.g., up to three) layers are produced from a solution (i.e., as a liquid phase), and the remaining layers are processed in a vacuum. A limiting factor for multilayer solution-processed OLEDs (also referred to as liquid-phase processed OLEDs) is that existing layers are dissolved during subsequent wet-chemical processing steps.

[0005] In surface coating methods such as spin coating, the entire layer stack can be detached and float off, i.e., slide off, as soon as a solvent is used for subsequent layers in which at least one existing layer is soluble.

[0006] Traditionally, at least two solution-processed layers are crosslinked to improve their bonding. However, this reduces the lifespan of OLEDs compared to vacuum-processed devices due to the additional materials required for crosslinking or residues left behind after the process.

[0007] In structuring-capable processing methods (e.g., slot die coating, inkjet printing, or screen printing), undercutting of existing layers is observed, particularly at the edges. For example, a first layer is applied in a polar solvent (e.g., water, dichloromethane, tetrahydrofuran, N-methyl-2-pyrrolidone (NMP)), followed by a second layer in a nonpolar solvent (e.g., toluene or xylene), and then a third layer again in a polar solvent (e.g., water alternatives such as dichloromethane, tetrahydrofuran, or NMP). With layer-by-layer application, the problem arises that the solvent of the third layer dissolves the edges of the first layer by undercutting. Similarly, undercutting would occur at the edges of the second layer if a fourth layer is applied using a nonpolar solvent.The solvent in the top layer extends beyond the area to be coated and dissolves existing layers that exhibit some solubility in the new solvent. This can lead to undesirable mixing, especially in the edge regions (up to a few millimeters). This impairs the functionality of the entire layer stack, the homogeneity of the emission color, and the lifespan of the OLED.

[0008] Traditionally, multilayer components can be built up using solution processing by applying successive layers of so-called orthogonal solvents (e.g., one polar, the other nonpolar). In this process, the existing layer is insoluble in the solvent of the subsequently applied layer. This method is limited to a maximum of four layers, with polar and nonpolar solvents alternating, or supplemented by perfluorinated solvents, which represent an intermediate class.

[0009] If more layers are to be processed, the existing layers may detach completely, depending on the coating method. Particularly in the edge regions of the active areas, existing layers swell, leading to undesirable layer mixing that impairs the functionality of the OLED. This difficulty or impairment in the edge regions is especially noticeable with coating methods capable of creating patterns. In the case of planar coating methods such as spin coating or dip coating, the entire layer often floats off.

[0010] According to various embodiments, a method for manufacturing an optoelectronic component (e.g., an OLED) is provided which makes it possible to form several layers on top of each other using solution processing, without one or more layers being dissolved or even detached, and which avoids mixing the layers with each other.

[0011] The invention is defined by the claims.

[0012] According to various embodiments, the number of stackable solution-processed layers can be increased, enabling faster throughput and lower area costs for large processed areas due to higher material utilization. For example, more than three, four, five, six, seven, eight, or nine layers can be formed on top of each other, or more than ten or twenty solvent-processed layers can be stacked on top of each other to form a so-called layer stack. This can significantly reduce costs because the manufacturing process can be simplified and fewer expensive processing steps (e.g., in a vacuum) are required. Furthermore, this can make it possible to manufacture an optoelectronic component in a continuous coating system, e.g., from roll to roll.

[0013] According to various embodiments, the number of required solvents or solvent types can be reduced, thereby saving on storage and manufacturing costs, especially since inexpensive solvents can be used. For example, according to various embodiments, only one polar and one nonpolar solvent are required, regardless of the number of layers to be produced in the layer stack.

[0014] Furthermore, according to various embodiments, an optoelectronic component is provided which can be manufactured by this method.

[0015] A method for manufacturing an optoelectronic device, according to various embodiments, comprises: forming a first layer over or on a substrate, wherein the first layer has a surface; wherein the surface faces the substrate and has a first surface region and a second surface region, wherein the second surface region partially or completely surrounds the first surface region; forming a second layer over or on the first surface region, wherein the second surface region remains free of the second layer.

[0016] The first layer can be an organic layer, an inorganic layer, or a hybrid layer. Alternatively or additionally, the second layer can be an organic layer, an inorganic layer, or a hybrid layer.

[0017] The first surface area can also be understood as the deposition area or deposition area, over or on which the second layer is to be deposited, and the second surface area can also be referred to as the boundary area or free area, which is to remain free of the second layer.

[0018] Visually, the second surface area can be adjacent to the outer edge of the first layer. By keeping the second surface area free of the second layer, overflow of the outer edge by material from the second layer can be avoided. In other words, the second layer can remain on the surface of the first layer without running down its edges.

[0019] The formation of the second layer can occur at a distance from the outer edge of the first layer, for example, viewed laterally (i.e., along the surface of the first layer or projected onto a plane parallel to the surface of the first layer). The outer edge of a layer can be defined, for example, by a side face of the layer and / or define the extent of the layer. In other words, the second layer can be formed or become withdrawn from the edge of the first layer.

[0020] According to various embodiments, the extent of the second surface area, i.e., the distance of the second layer from the edge or side surface of the first layer, can have a value that is greater than the thickness of the second layer, e.g. 10% greater than the thickness of the second layer, e.g. 30% greater than the thickness of the second layer, e.g. 50% greater than the thickness of the second layer, e.g. 100% greater than the thickness of the second layer.

[0021] For example, the extent of the second surface area can have a value greater than 0.1 mm, e.g. greater than 0.5 mm, e.g. greater than 1 mm, e.g. in a range of approximately 0.1 mm to approximately 10 mm, e.g. in a range of approximately 0.5 mm to approximately 5 mm.

[0022] According to various embodiments, the first and second layers can be applied using liquid-phase processing, i.e., as a solution. The first layer can be visualized as a barrier, protecting the layers of the optoelectronic device formed beneath it from being dissolved (in other words, from being partially dissolved) by the solvent in the second layer. Further layers can be formed between the first and second layers (e.g., if more than two different solvents / solvent types are used), which can then be covered by the second layer.

[0023] According to various embodiments, the second layer can contain a solvent (also referred to as a second solvent, e.g., an organic solvent) which is configured such that it (the solvent) is essentially insoluble in the material of the first layer. In other words, the second solvent can be configured such that the material of the first layer is sparingly soluble in the second solvent.

[0024] Layers formed successively (e.g., in physical contact with each other) are processed from solvents that are orthogonal to each other.

[0025] According to various embodiments, the formation of a layer (the first layer and / or the second layer) can involve applying the layer as a solution over or onto the substrate. The solution can comprise a solvent (e.g., an organic solvent) and a layer material (e.g., an organic material, an inorganic material, and / or a hybrid material) dissolved in the solvent.

[0026] According to various embodiments, the material of the first layer can be a solvent of the first layer or a layer material of the first layer (e.g. an organic material of the first layer) which is dissolved in the solvent of the first layer.

[0027] According to various embodiments, the first layer can be processed from a solvent or exhibit significant solubility in a solvent.

[0028] According to various embodiments, the first layer can contain a solvent (also referred to as the first solvent), e.g., of a first type of solvent, and the solvent of the second layer can be, e.g., a solvent of a second type of solvent, wherein the first and second solvents are orthogonal to each other (in other words, the two solvents can be sparingly or insoluble in each other). For example, the material(s) of the first layer can be less soluble, e.g., by at least one, e.g., two, orders of magnitude, in the solvent of the second layer than in the solvent of the first layer (also referred to as relative solubility). In this case, the first and second solvent types can also be different from each other, e.g., orthogonal to each other.

[0029] In other words, the relative solubility of the materials forming the layers and processed from a solution in different solvents can influence the dissolution process. That is, the more soluble a material from an existing layer is in a solvent used to process a subsequent layer, the faster and more extensively the existing layer will be dissolved upon contact with the solvent.

[0030] The solvents in the different layers (e.g., applied successively) can be orthogonal to each other. Low solubility of the solvents used with each other (e.g., due to their orthogonality) can enhance this effect, but is not necessarily required, for example, if no solvent remains in the layer or layer stack after the last layer has dried.

[0031] According to various embodiments, the first solvent and / or the second solvent can each be one of the following group of solvent types: • perfluorinated solvent (also known as fluorine-based solvent), • hydroxyl solvent (also known as solvent with a hydroxy group or as a protic solvent, e.g. water-based solvent), • nonpolar organic solvent (also known as aprotic nonpolar solvent), or • aprotic polar solvent.

[0032] To illustrate, successive layers of solvent types (also referred to as solvent groups) are processed, which are orthogonal to each other (e.g., polar and nonpolar solvent).

[0033] According to various embodiments, the formation of the first layer may involve removing at least some, i.e., partially or completely, of the solvent from the first layer to allow the first layer to dry before the second layer is formed. Once the solvent has been removed from the layer, a material may remain (also referred to as the layer material), for example, in the form of a solid, which is part of the layer or constitutes the layer. The layer material may be an organic material, an inorganic material, or an organic-inorganic material, or may be composed of or made from such materials.

[0034] Alternatively, the second layer can be formed before the solvent is removed from the first layer. If the second layer is formed before the solvent is completely (or substantially completely) removed from the first layer, dissolution of any material in the first layer can be avoided, for example, by additionally or alternatively exploiting the fact that the first and second solvents are essentially immiscible. For instance, the first and second solvents can be made hydrophobic, hydrophilic, lipophobic, or lipophilic, making them sparingly miscible (which can be understood analogously to poorly intermixable). In this case, the removal of the first solvent from the first layer and the removal of the second solvent from the second layer can occur simultaneously.

[0035] According to various embodiments, the first layer and / or the second layer can be part of an organic light-emitting diode (OLED), i.e., they can have or form a layer of the OLED. For example, the first layer and / or the second layer can be part of or form a barrier layer, insulating layer, or electrode (also called a contact layer).

[0036] According to various embodiments, the first layer and / or the second layer can be part of an optically functional layer structure designed to convert electrical energy into electromagnetic radiation. This optically functional layer structure can be part of the organic light-emitting diode (OLED).

[0037] According to various embodiments, the first layer and / or the second layer can be designed as a dissolution stop layer, wherein the dissolution stop layer has a thickness of less than 20 nm, e.g., in a range of approximately 1 nm to approximately 20 nm, e.g., a thickness of less than 10 nm, e.g., a thickness of less than 5 nm. The dissolution stop layer can be figuratively arranged between two layers of the optically functional layer structure and act as a barrier that protects the layer formed below from dissolution by a solvent of the layer formed above it.

[0038] According to various embodiments, the release stop layer can comprise an organic semiconductor or a metal oxide and can alternatively or additionally be transparent. High transparency of the release stop layer is advantageous, for example, if light is to be transmitted through it, since a high light efficiency of the optoelectronic component is achieved the greater the transparency of the release stop layer.

[0039] According to various embodiments, the first layer and / or the second layer can be configured as a metallization layer, wherein the metallization layer has exposed contact areas. In other words, the first layer and / or the second layer can be part of, or form, a wiring structure or a contact structure (with one or more contact layers).

[0040] According to various embodiments, the method can further include forming an encapsulation over or on the substrate, which covers the first and second layers. The encapsulation can figuratively prevent or at least hinder the penetration of environmental influences into the interior of the optoelectronic component, thus increasing the lifetime of the first and second layers.

[0041] According to various embodiments, an optoelectronic device may comprise: a substrate; a first layer, wherein the first layer has a surface; wherein the surface faces the substrate and has a first surface region and a second surface region, wherein the second surface region surrounds the first surface region; and a second layer above or on top of the first surface region, wherein the second surface region is free of the second layer.

[0042] According to various embodiments, the second layer can comprise a material that is soluble in a solvent (e.g., the second solvent), and the first layer can comprise a material that is essentially insoluble in the solvent. In other words, a material of the first layer can be essentially insoluble in a solvent in which a material of the second layer is soluble.

[0043] According to various embodiments, a method for manufacturing an optoelectronic device may include: forming a first layer over or on a substrate, wherein the first layer comprises a first solvent, e.g., of a first type of solvent, and wherein the first layer has a surface facing the substrate with a first surface region and a second surface region surrounding the first surface region; forming a second layer over or on the first surface region, wherein the second layer comprises a second solvent, e.g., of a second type of solvent, and wherein the second surface region remains free of the second layer; and wherein the first solvent is arranged orthogonally to the second solvent. For example, the first type of solvent may be different from the second type of solvent, e.g.,The first solvent type can be orthogonal to the second solvent type.

[0044] A method for producing a layer stack can, according to various embodiments, include: forming a first layer from a first solution over a substrate, wherein the first layer has a surface; wherein the surface faces the substrate and has a first surface region and a second surface region, the second surface region surrounding the first surface region; forming a second layer from a second solution over the first surface region, wherein the second surface region remains free of the second layer.

[0045] The second solution may contain a solvent that does not substantially dissolve a material (e.g., a solvent or a layer material) of the first layer. In other words, the relative solubility of the layers to each other, e.g., a material of the first layer in a solvent of the second layer, may be low or nonexistent.

[0046] Two solvents (or their respective solvent types) are orthogonal to each other if, for example, one is polar and the other nonpolar. Substances that dissolve in a polar solvent are usually insoluble or at least sparingly soluble in a nonpolar solvent. Thus, using orthogonal solvents, it is possible to deposit two or more layers from a solution on top of each other without dissolving a layer that has already been deposited.

[0047] If the solvent types of two solvents are orthogonal to each other, then the two solvents are also orthogonal to each other. However, two solvents of the same solvent type can be soluble or miscible in each other, i.e., non-orthogonal to each other.

[0048] Aprotic polar solvents and hydroxyl solvents are polar solvents, meaning these solvents contain molecules with a dipole moment. A polar solvent can be understood as having molecules with a dipole moment greater than 0.5 Debye (approximately 1.66 × 10⁻⁶). -30 C·m) exhibits, e.g. in a range of approximately 1.66·10 -30 C·m to approximately 60·10 -30 C·m, e.g., of more than 2·10 -30 C·m, e.g., of more than 5·10 -30 C·m, e.g. of more than 10·10 -30 C·m, e.g., of more than 20·10 -30 Cm.

[0049] An aprotic-polar solvent may, for example, contain a strongly polarizing functional group (e.g., a carbonyl group or a nitrile group). For instance, an aprotic-polar solvent may contain or be composed of dichlorobenzene, tetrahydrofuran, and / or phenetol.

[0050] A hydroxyl solvent can, for example, possess a functional group from which hydrogen atoms in the molecule can be released as protons. For instance, a hydroxyl solvent can be water, carboxylic acid, methanol, ethanol, and other alcohols. As an exception, a hydroxyl solvent can also be an aldehyde, which, although structurally polar and aprotic, can release hydrogen as a proton due to its highly polarized CH bond.

[0051] Aprotic nonpolar solvents and perfluorinated solvents are examples of nonpolar solvents, meaning these solvents have molecules with a small or negligible dipole moment. A nonpolar solvent can be understood as one whose molecules have a dipole moment in the range of approximately 0 Debye (corresponding to approximately 0 C·m) to approximately 0.5 Debye (corresponding to approximately 1.66·10⁻⁶). -30 exhibits C·m), e.g. in a range from approximately 0 C·m to approximately 1·10 -30 C·m, e.g. in a range from approximately 0 C·m to approximately 0.5·10 -30 C·m, e.g. in a range from approximately 0 C·m to approximately 0.2·10 -30 Cm.

[0052] An aprotic nonpolar solvent can be, for example, lipophilic and hydrophobic. Furthermore, highly polar substances may be sparingly soluble in aprotic nonpolar solvents. For example, an aprotic nonpolar solvent may contain or be composed of alkenes, alkanes, benzenes (such as toluene), other symmetrically structured molecules (e.g., tetramethylsilane), and other organic solvents (such as halogenated hydrocarbons).

[0053] Perfluorinated solvents can contain, for example, perfluorinated hydrocarbons (e.g., hexafluorobenzene). Perfluorinated solvents are not only nonpolar but also very poorly polarizable and therefore do not mix well with other nonpolar solvents (e.g., organic solvents). For example, their miscibility can be temperature-dependent and increase with higher temperatures. Perfluorinated solvents can have a low dipole moment and yet dissolve substances that are more soluble in polar solvents. Therefore, perfluorinated solvents can be used to form a second layer on top of a first layer formed, for example, with a nonpolar solvent (i.e., one containing a material soluble in nonpolar solvents), without dissolving the first layer.

[0054] According to various embodiments, two solvents can be orthogonal to each other if their electric dipole moment (the measure of polarity) differs significantly, e.g., if their electric dipole moment is in a range of approximately 1.66 × 10 -30 C·m to approximately 60·10 -30 C·m differs, e.g., from more than 2·10 -30 C·m, e.g., of more than 5·10 -30 C·m, e.g. of more than 10·10 -30 C·m, e.g., of more than 20·10 -30 Cm.

[0055] If two solvents are orthogonal to each other, they can be difficult to dissolve in each other. The greater the difference in the electric dipole moment of the solvents and / or materials, the more difficult it is for them to dissolve in each other.

[0056] A substance (e.g., a solvent or a solid, such as a layered material, e.g., an organic material) can be considered sparingly soluble in a solvent if it dissolves only in small amounts in the solvent, meaning that the substance is essentially insoluble. A substance that is essentially insoluble in the solvent may, for example, have a solubility in a range of approximately 0 g / L to approximately 10 g / L (i.e., that approximately up to 10 grams (g) of the substance dissolve in 1 liter (L) of solvent), e.g., in a range of approximately 0 g / L to approximately 1 g / L, e.g., in a range of approximately 0 g / L to approximately 0.1 g / L, e.g., in a range of approximately 0 g / L to approximately 0.01 g / L.

[0057] To illustrate, a substance can be more easily dissolved in a solvent the more similar the interaction forces are between the molecules of the substance and the molecules of the solvent.

[0058] For example, the first layer is formed in a polar solvent (e.g. water, dichloromethane, tetrahydrofuran, N-methyl-2-pyrrolidone (NMP)) and a second layer is formed on top of it in a nonpolar solvent (e.g. toluene or xylene).

[0059] The formation of a layer (e.g., the first layer and / or the second layer or another layer) of the optoelectronic device can be achieved using liquid-phase processing (also known as solution processing). In liquid-phase processing, the layer material (layer material) is dissolved in a solvent to form a liquid phase of the layer (also known as the solution). Furthermore, layer formation can involve applying the liquid phase of the layer to a surface to be coated (e.g., the substrate or another layer of the optoelectronic device) using liquid-phase deposition (also known as wet chemical deposition or wet chemical coating).Furthermore, the formation of the layer can involve drying the applied liquid phase of the layer by removing the solvent from the liquid phase, causing the liquid phase to harden and transform into a solid layer. The layer material may remain behind, forming the solid layer. In other words, the layer can be formed from the liquid phase.

[0060] Liquid phase deposition can be achieved, for example, by means of a spray coating, a curtain coating, a slot die coating, an inkjet printing coating, or a screen printing coating.

[0061] Liquid-phase processing can be carried out using a mask (also called a stencil) in various embodiments, in the case of so-called structured liquid-phase processing. The mask can, for example, have a pattern that defines an area to be coated; the pattern can consist of one or more shapes, such as circles, squares, rectangles, triangles, other polygons, or even irregular shapes. For example, the pattern can be formed by means of a through-hole in the mask, e.g., in a plate. The solution (i.e., the liquid phase) of the coating can pass through this through-hole onto the area to be coated. In other words, the shape of the pattern can be or will be mapped onto the coated area, so that the coated area has the shape of the pattern. In the case of screen-printed coating, the mask can, for example, be part of the coating device.The mask can be removed after the shift has been completed.

[0062] For example, in liquid-phase processing, the first layer can be formed using a first mask, such as by applying the first mask to a surface to be coated, e.g., on a main processing side of the substrate, and removing it after the first layer has formed. The first mask can have a through-hole through which the first layer is applied to a surface area of ​​the main processing side, e.g., as the liquid phase of the first layer. In other words, the mask can have a through-hole corresponding to the surface area of ​​the main processing side to be coated.

[0063] To form the second layer, a second mask can be applied to a second surface of the first layer to be coated, and then removed after the second layer has formed. The second mask can have a through-opening through which the second layer is applied to the first surface area of ​​the first layer, for example, as the liquid phase of the second layer. In other words, the mask can have an opening corresponding to the first surface area, for example, such that the second surface area of ​​the first layer remains uncoated.

[0064] The opening of the first mask can be larger than the opening of the second mask, so that the edge of the first layer remains free from the second layer.

[0065] The formation of a layer using a mask can be achieved, for example, with a tolerance in the range of approximately 50 µm to approximately 200 µm, or with a tolerance of approximately 100 µm. This means that the lateral extent of the layer (i.e., the distance between its lateral surfaces) can be increased or decreased by the tolerance, and / or that the layer's position can be shifted by the tolerance. Therefore, it may be necessary for an edge region, which is to remain free of the layer, to have an extent larger than the tolerance, e.g., twice as large, e.g., three times as large.

[0066] Alternatively or additionally, structured liquid-phase processing can be carried out using a nozzle that defines the area where the liquid phase is applied to the substrate. The nozzle can be moved across the substrate along a predefined path, so that the liquid phase is applied along the path, forming a coated surface in the shape of the path. If a closed surface is to be coated, adjacent sections of the path can be positioned so close together that newly applied liquid phase comes into contact with and mixes with previously applied liquid phase. In this way, for example, one or more shapes can be formed.

[0067] If, for example, a nozzle is used to form a layer, the tolerance in the direction of movement of the nozzle can be increased, e.g. in a range of approximately 0.1 mm to approximately 2 mm, e.g. approximately 1 mm.

[0068] Structured liquid phase processing eliminates the need to expose areas after layer formation, as these areas are not coated in the first place. For example, the areas can be defined by contact pads, which must be exposed or remain exposed for contacting the optoelectronic component.

[0069] Alternatively or additionally, the formation of at least some layers can be carried out using vacuum processing and other layers using liquid phase processing, i.e., using so-called hybrid processing, in which at least one layer (e.g., three or more layers) is processed from a solution (i.e., as a liquid phase) and the remaining layers are processed in a vacuum.

[0070] According to various embodiments, at least two, e.g., at least three, successive layers are processed from a solution (i.e., by liquid-phase processing). For example, liquid-phase processing of the layers can begin, and the remaining layers can be processed in a vacuum. Due to the structured deposition of the layers according to various embodiments, a reverse sequence is also possible.

[0071] The formation of a layer can take place in a liquid-phase processing chamber according to various embodiments.

[0072] For the purposes of this description, an optoelectronic component can be understood as a component that emits or absorbs electromagnetic radiation by means of a semiconductor device. This electromagnetic radiation can be, for example, visible light, ultraviolet light, and / or infrared light.

[0073] According to various embodiments, an optoelectronic component can be designed as an electromagnetic radiation-emitting component, e.g., as a light-emitting diode (LED), also known as a light-emitting diode, as an organic light-emitting diode (OLED), as a light-emitting transistor, or as an organic light-emitting transistor. In various embodiments, the optoelectronic component can be part of an integrated circuit. Furthermore, a plurality of optoelectronic components can be provided, for example, housed in a common package. The plurality of optoelectronic components can, for example, interact with each other and, for example, generate and emit superimposed light, so that, for example, a color value, such as white, can be set.

[0074] According to various embodiments, the optoelectronic device (also referred to as an organic optoelectronic device) can have at least one organic layer. Furthermore, the organic optoelectronic device can also have one or more inorganic layers (e.g., in the form of electrodes or barrier layers).

[0075] According to various embodiments, an optoelectronic device can have or be formed from an optically functional layer structure. According to various embodiments, the optoelectronic device can be designed as an organic optoelectronic device, i.e., the optically functional layer structure can have one or more organic semiconductors, e.g., as part of an organic light-emitting diode (OLED). In other words, the optically functional layer structure can be part of an optoelectronic device.

[0076] According to various embodiments, the optically functional layer structure can comprise several organic and / or inorganic layers stacked on top of each other to form a so-called layer stack. For example, more than three, more than four, more than five, more than six, more than seven, more than eight, or more than nine layers can be stacked on top of each other, e.g., more than ten, e.g., more than twenty layers.

[0077] Alternatively or additionally, the optoelectronic component can have at least one further layer, e.g., a layer configured as an electrode, a barrier layer, and / or an encapsulation layer. The optoelectronic component can alternatively or additionally have several further layers, as mentioned above, e.g., in combination with one another.

[0078] For the purposes of this description, an organic substance can be understood as a compound of carbon that exists in a chemically uniform form, regardless of its state of matter, and is characterized by characteristic physical and chemical properties. Furthermore, for the purposes of this description, an inorganic substance can be understood as a compound without carbon or a simple carbon compound (e.g., graphite or graphene) that exists in a chemically uniform form, regardless of its state of matter, and is characterized by characteristic physical and chemical properties.Within the scope of this description, an organic-inorganic substance (hybrid substance) can be understood as a compound, regardless of its state of matter, that exists in a chemically uniform form and is characterized by distinctive physical and chemical properties. It comprises compound parts that contain carbon and those that are carbon-free. Within this context, the term "substance" encompasses all substances mentioned above, for example, an organic substance, an inorganic substance, and / or a hybrid substance. Furthermore, within the scope of this description, a mixture can be understood as something consisting of two or more different substances whose components are, for example, very finely dispersed. A class of substances is defined as a substance or a mixture of substances consisting of one or more organic substances, one or more inorganic substances, or one or more hybrid substances.The term "material" can be used synonymously with the term "fabric".

[0079] Within the scope of this description, a metal can contain at least one metallic element, e.g., copper (Cu), silver (Ag), platinum (Pt), gold (Au), magnesium (Mg), aluminum (Al), barium (Ba), indium (In), calcium (Ca), molybdenum (Mo), samarium (Sm), or lithium (Li). Furthermore, a metal can contain a metallic compound (e.g., an intermetallic compound or an alloy), e.g., a compound of at least two metallic elements, such as bronze or brass, or e.g., a compound of at least one metallic element and at least one non-metallic element, such as steel.

[0080] For the purposes of this description, an organic layer can be understood as a layer that contains or is composed of an organic material. Similarly, an inorganic layer can be understood as a layer that contains or is composed of an inorganic material (e.g., an organic solid or an organic solvent). Similarly, a metallic layer can be understood as a layer that contains or is composed of a metal. Within the context of this description, the term "layer" encompasses all layers that contain or are composed of the aforementioned materials, e.g., an organic layer, an inorganic layer, a metallic layer, or a hybrid layer.

[0081] Exemplary embodiments of the invention are shown in the figures and are explained in more detail below.

[0082] They show Fig. 1A and Fig. 1B each a schematic cross-sectional view or schematic side view of an organic optoelectronic device in a method for manufacturing an organic optoelectronic device; Fig. 2A and Fig. 2B each a schematic top view or schematic cross-sectional view of an organic optoelectronic device in a method for manufacturing an organic optoelectronic device; Fig. 3A, Fig. 3B and Fig. 3C each a schematic sectional view or a schematic side view of an organic optoelectronic device in a method for manufacturing an organic optoelectronic device; Fig. 4A, Fig. 4B, Fig. 4C and Fig. 4D each a schematic cross-sectional view or a schematic side view of an organic optoelectronic device in a method for manufacturing an organic optoelectronic device; Fig. 5 a schematic top view of an organic optoelectronic device in a method for manufacturing an organic optoelectronic device; Fig. 6 a schematic top view of an organic optoelectronic device in a method for manufacturing an organic optoelectronic device; Fig. 7 a method according to various embodiments for manufacturing an organic optoelectronic device; and Fig. 8 a method according to various embodiments for producing a layer stack.

[0083] The following detailed description refers to the accompanying drawings, which form part thereof and in which specific embodiments of the invention are shown for illustrative purposes. In this respect, directional terminology such as "top," "bottom," "front," "back," "anterior," "rear," etc., is used with reference to the orientation of the described figure(s). Since components of embodiments can be positioned in a number of different orientations, the directional terminology serves for illustrative purposes and is in no way restrictive. It is understood that other embodiments may be used and structural or logical modifications may be made. It is understood that the features of the various exemplary embodiments described herein may be combined with one another unless specifically stated otherwise.

[0084] Within the scope of this description, the terms "connected," "attached," and "coupled" are used to describe both direct and indirect connections, direct or indirect links, and direct or indirect couplings. In the figures, identical or similar elements are labeled with identical reference symbols where appropriate.

[0085] The term "over" can be understood in the context of layer formation to mean that a layer formed over or on a surface or component is in direct physical contact with the surface or component. Furthermore, the term "over" can be understood to mean that one or more additional layers are arranged between the layer and the surface or component.

[0086] According to various embodiments, a lateral component architecture (layer sequence for an organic optoelectronic component) is provided which enables liquid phase processing of any number of layers from a given solution and which prevents the dissolution of already existing layers, especially in their edge region.

[0087] Liquid-phase processing can, for example, enable the coating of the largest possible areas at the lowest possible cost, e.g., with maximum throughput, meaning that the largest possible areas can be coated in the shortest possible time. Furthermore, liquid-phase processing allows for greater tolerance to defects, such as unevenness in the surface to be coated, as these can simply be smoothed out.

[0088] In the context of this description, dissolution can be understood as the process by which an already processed layer, which is e.g. partially or completely dried, i.e. from which a large part of the solvent present in the liquid phase of the layer during liquid-phase processing has escaped, dissolves at least partially in a solvent applied to it, e.g. in the solvent of a further layer applied on top.

[0089] For example, dissolving the layer can cause part of it to swell upon contact with the solvent, meaning the layer absorbs the solvent. Furthermore, with prolonged exposure to the solvent, the swollen part of the layer can liquefy and dissolve in the solvent. This can damage the layer.

[0090] The component (the organic optoelectronic device) can be manufactured using alternating layers of mutually orthogonal solvents via a structurable liquid-phase processing method (e.g., inkjet printing, screen printing, slot-die coating, or curtain coating). With each repetition of a similar solvent (e.g., the same solvent and / or the same solvent type), the area to be coated is reduced so that the newly applied layer, even in its wet state (i.e., before the solvent has evaporated), covers a smaller area than the underlying, already processed layers. This prevents the coating from seeping under the preceding layer processed with the same orthogonal solvent.

[0091] According to various embodiments, components consisting of any number of layers can be processed from the solution without the need for crosslinking agents. According to these embodiments, higher material utilization compared to vacuum processing enables faster throughput and lower area costs for large processed areas. The selection of solvents is significantly simplified compared to the mere use of orthogonal solvents, as only two layers (e.g., the first and second layers) need to have mutually orthogonal solvents. For example, the first and second layers can be in physical contact with each other, in other words, directly on top of each other.

[0092] Many materials for organic electronics are processed from (nonpolar) organic solvents. Therefore, according to various embodiments, a structure can be provided in which very thin layers (e.g., less than 5 nm thick) (also called solvent-stop layers) are deposited between the layers of the functional layer structure (also called organic functional layer structure). These serve as solvent stops and can, for example, function as tunnel barriers in OLEDs.

[0093] The layer serving as a solvent stop (also referred to as the solvent stop layer) can be provided, for example, by means of the first layer or the second layer.

[0094] Fig. Figure 1A illustrates a schematic cross-sectional view or schematic side view of an organic optoelectronic device 100a in a method for fabricating an organic optoelectronic device.

[0095] The organic optoelectronic device 100a has an organic first layer 104, wherein the first layer 104 has a surface 104t. The surface 104t has, or is formed from, a first surface region 104b and a second surface region 104r. The organic optoelectronic device 100a has an organic second layer 106, which is formed over or on top of the first layer 104. The second layer 106 is formed over or on top of the first surface region 104b in such a way that the second surface region 104r remains free of the second layer 106. In other words, the second surface region 104r and the second layer 106 do not overlap (projecting onto a plane parallel to the surface 104t).

[0096] Fig. Figure 1B illustrates a schematic cross-sectional view or schematic side view of an organic optoelectronic device 100b in a method for fabricating an organic optoelectronic device.

[0097] The organic first layer 104 can be formed on or over a substrate 102. The first layer 104 can be formed on a main processing surface 102h of the substrate 102, e.g., in a coating area 102b of the main processing surface 102h.

[0098] The surface 104t can face the substrate 102 and have a first surface region 104b and a second surface region 104r. The second surface region 104r can be located on opposite sides of the first surface region 104b and adjoin a side surface 104s of the first layer 104.

[0099] An extent 104d of the first layer 104 can be larger than an extent 106d of the second layer 106, e.g., along a first direction (which, for example, runs parallel to the surface 104t of the first layer 104). Similarly, an extent (not shown) of the first layer 104 can be larger than an extent (not shown) of the second layer 106, e.g., perpendicular to the first direction. Thus, the first layer 104 can extend beyond the second layer 106.

[0100] Fig. 2A and Fig. Figures 2B each illustrate a schematic cross-sectional view or schematic top view of an organic optoelectronic device 200b, e.g., the one described in Fig. 1B illustrated optoelectronic device 100b, in a method for fabricating an organic optoelectronic device.

[0101] The second surface area 104r surrounds the first surface area 104b, as shown in Fig. Figure 2A illustrates this. In other words, the second surface region 104r bounds the first surface region 104b externally. Put another way, the first surface region 104b can be located within the second surface region 104r.

[0102] The second surface region 104r (also referred to as the boundary region 104r) has an extent 204d, which can be defined by the distance of the second layer 106 to an outer edge of the first layer 104, e.g., from a side face 104s of the first layer 104. For example, the extent 204d can be defined by the distance of a side face 106s of the second layer 106 to a side face 104s of the first layer 104 (e.g., projected onto a plane parallel to the surface 104t).

[0103] The second layer 106 is or is formed above the first surface region 104b. Analogous to the first layer 104, the second layer 106 can have a first surface region 106b and a second surface region 106r, with the second surface region 106r surrounding the first surface region 106b.

[0104] The second layer 106 has a lateral extent (e.g., projected onto a plane parallel to the surface 104t or the main processing surface) which is smaller than a parallel extent of the first layer 104. In other words, the second layer 106 cannot extend beyond the first layer 104 and, furthermore, cannot be or will not be formed within its outer boundary (edge).

[0105] Fig. Figures 3A to 3C each illustrate a schematic cross-sectional view or side view of an optoelectronic component 300a, 300b, 300c according to different embodiments in a method according to different embodiments for manufacturing an optoelectronic component.

[0106] The characteristics of the in Fig. The optoelectronic components illustrated in 3A to 3C, 300a, 300b, and 300c, can be understood as alternatives or additions to the features of the optoelectronic components as described above or below, and can, for example, be part of a lighting device.

[0107] Fig. Figure 3A illustrates a sectional or side view of an organic optoelectronic device 300a in a method for fabricating the organic optoelectronic device 300a.

[0108] The formation of the optoelectronic device 300a includes the formation of a first electrode 310, the formation of an organic functional layer structure 312 and the formation of a second electrode 314, which together are part of the optoelectronic device 300a and are arranged on or above or on a substrate 102 (also referred to as support 102).

[0109] According to various embodiments, the first electrode 310, the functional layer structure 312, and the second electrode 314 form an organic light-emitting diode 306 as described below and as shown in Fig. 3A illustrates this.

[0110] The light-emitting diode 306 (organic light-emitting diode 306) is also referred to as a luminescent thin-film device made of semiconducting materials and is designed to generate electromagnetic radiation (e.g., light), for example, when an electric current flows between the first electrode 310 and the second electrode 314 to operate the optoelectronic device 300a through the functional layer structure 312. The generated electromagnetic radiation can pass through at least some layers and components of the optoelectronic device 300a and be emitted away from the optoelectronic device 300a. In other words, the optoelectronic device 300a can be configured to convert electrical energy into electromagnetic radiation (e.g., light), i.e., to act as a light source.

[0111] The first electrode 310 (also referred to as the lower electrode 310 or bottom contact) and / or the second electrode 314 (also referred to as the upper electrode or top contact) can be configured to have at least one layer. The first electrode 310 and / or the second electrode 314 can be configured to have a layer thickness in the range of approximately 1 nm to approximately 50 nm, for example, less than or equal to approximately 40 nm, less than or equal to approximately 20 nm, or less than or equal to approximately 10 nm.

[0112] The first electrode 310 is made of an electrically conductive material. The first electrode 310 is configured as an anode, i.e., as a hole-injecting electrode. The first electrode 310 is designed such that it has a first electrical contact pad (not shown), to which a first electrical potential (provided by an energy source (not shown), for example, a current source or a voltage source) can be applied. Alternatively, the first electrode 310 can be electrically connected to a first electrical contact pad for applying a first potential. The first electrical contact pad (also referred to as the contact surface) can be configured for electrically conductive contact, e.g., for bonding or soldering. The first electrical potential can be the ground potential or another predefined reference potential.

[0113] The functional layer structure 312 (organic functional layer structure 312) is formed on or above the first electrode 310. The functional layer structure 312 can include an emitter layer 318, for example with or made of fluorescent and / or phosphorescent emitter materials.

[0114] The second electrode 314 is formed on or above the functional layer structure 312. The second electrode 314 is configured as a cathode, i.e., as an electron-injecting electrode. The second electrode 314 has a second electrical connection (in other words, a second electrical contact pad) for applying a second electrical potential (which is different from the first electrical potential) provided by the energy source. Alternatively, the second electrode 314 can be electrically connected to a second electrical contact pad for applying a second potential. The second electrical contact pad can be configured for electrically conductive contact, e.g., for bonding or soldering. The second electrical potential can be different from the first electrical potential.

[0115] Alternatively or additionally, an electrical contact pad can have multiple electrical contact pads.

[0116] The first and second electrical potentials can be generated by the energy source (e.g., a power source, such as a power supply or driver circuit) and applied to the first and second electrical contact pads to operate the optoelectronic device 300a, i.e., when the optoelectronic device 300a is to generate electromagnetic radiation (i.e., in an "on" state of the optoelectronic device 300a). The first and second electrical potentials can induce an electric current that flows through the functional layer structure 312, exciting it to generate and emit electromagnetic radiation.

[0117] The second electrical potential has a value such that the difference to the first electrical potential (in other words, the operating voltage of the optoelectronic component 300a, which is applied to the optoelectronic component 300a) has a value in the range of approximately 1.5 V to approximately 20 V, for example, a value in the range of approximately 2.5 V to approximately 15 V, or for example, a value in the range of approximately 3 V to approximately 12 V. The power source can be configured to generate this operating voltage.

[0118] Substrate 102 can be provided as a single piece. Substrate 102 can be a monolithic substrate or an integrally constructed substrate consisting of multiple layers, with the multiple layers being firmly bonded together.

[0119] The substrate 102 can have various forms. For example, the substrate 102 can be a film (e.g., a metallic film or a plastic film, e.g., PE film) or a plate (e.g., a plastic plate, a glass plate, or a metal plate). Alternatively or additionally, the substrate 102 can have at least one flat or at least one curved surface, e.g., a main processing surface on a main processing side of the substrate 102, on or over which the layers of the optoelectronic device 300a (organic optoelectronic device 300a) are formed.

[0120] Substrate 102 may contain or be composed of an electrically insulating material. An electrically insulating material may contain one or more of the following: a plastic, a composite material (e.g., a laminate of several films or a fiber-reinforced plastic composite), or glass.

[0121] A plastic may contain or be composed of one or more polyolefins (for example, high-density or low-density polyethylene (PE) or polypropylene (PP)). Furthermore, the plastic may contain or be composed of polyvinyl chloride (PVC), polystyrene (PS), polyester and / or polycarbonate (PC), polyethylene terephthalate (PET), polyethersulfone (PES), and / or polyethylene naphthalate (PEN). Alternatively or additionally, the substrate 102 may be composed of one or more of the aforementioned substances.

[0122] Alternatively or additionally, the substrate 102 may contain or be formed from an electrically conductive material, e.g. an electrically conductive polymer, a metal (e.g. aluminium or steel), a transition metal oxide or an electrically conductive transparent oxide.

[0123] According to various embodiments, the substrate 102 can be electrically conductive. For this purpose, the substrate 102 can comprise or be formed from an electrically conductive material, or alternatively, it can comprise or be formed from an electrically insulating material coated with an electrically conductive material. The electrically conductive coating can comprise or be formed from an electrically conductive material, e.g., metal (i.e., in the form of a metallic coating).

[0124] For example, a substrate 102, which contains or is formed from a metal, can be configured as a metal foil or a metal-coated foil. The substrate 102 can be configured to conduct electrical current during operation of the optoelectronic device 300a.

[0125] If the substrate 102 is electrically conductive, it can serve as an electrode, e.g., as the lower electrode 310, of the light-emitting diode 306. Alternatively or additionally, the substrate 102 can be made of or possess a material with high thermal conductivity.

[0126] Alternatively or additionally, the substrate 102 can be light-transmitting, e.g. opaque, translucent or even transparent, with respect to at least one wavelength range of electromagnetic radiation, for example in at least one range of visible light, for example in a wavelength range of about 380 nm to 780 nm.

[0127] If the substrate 102 is transparent, the generated light can be emitted through the substrate 102. In this case, the optoelectronic component 300a is configured as a back-emitting light source, a so-called bottom emitter, and the surface of the substrate 102 facing away from the functional layer structure 312 can form a light-emitting surface of the optoelectronic component 300a. If a first electrode 310 is used for a bottom emitter, it can also be transparent.

[0128] If the substrate 102 is opaque, the second electrode 314 can be or become transparent. In this case, generated light can be emitted through the second electrode 314. The optoelectronic device 300a is configured as a front-emitting light source, a so-called top emitter, and the surface of the second electrode 314, which faces away from the functional layer structure 312, can form the light-emitting surface of the optoelectronic device 300a.

[0129] Alternatively or additionally, the substrate 102 can be designed to reflect light, e.g., by being part of or forming a mirror structure. This can increase the light yield.

[0130] According to various embodiments, the optoelectronic component 300a can be configured as a transparent component, i.e., as a combination of a top-side emitter and a bottom-side emitter. In a transparent component, both the first electrode 310 and the second electrode 310 can be or become transparent.

[0131] The first electrode 310 can be made of or comprise a metal. If the first electrode 310 comprises or is made of a metal, it can have a layer thickness in the range of approximately 10 nm to approximately 25 nm, for example, in the range of approximately 10 nm to approximately 18 nm, or in the range of approximately 15 nm to approximately 18 nm.

[0132] To make the first electrode 310 transparent, it can contain, be formed from, or be composed of a transparent conductive oxide (TCO). Transparent conductive oxides are transparent, conductive materials, for example, metal oxides such as zinc oxide, tin oxide, cadmium oxide, titanium oxide, indium oxide, or indium tin oxide (ITO). Besides binary metal-oxygen compounds, such as ZnO, SnO₂, or In₂O₃, ternary metal-oxygen compounds, such as AlZnO, Zn₂SnO₄, CdSnO₃, ZnSnO₃, MgIn₂O₄, GaInO₃, Zn₂In₂O₅, or In₄Sn₃O₄, are also included. 12 or mixtures of different transparent conductive oxides belong to the group of TCOs. Furthermore, TCOs do not necessarily have a stoichiometric composition and can also be p-doped or n-doped, or hole-conducting (p-TCO) or electron-conducting (n-TCO).

[0133] Furthermore, if the first electrode 310 has or is formed from a conductive transparent oxide (TCO), the first electrode 310 can, for example, have a layer thickness in a range of approximately 50 nm to approximately 500 nm, for example, a layer thickness in a range of approximately 75 nm to approximately 250 nm, for example, a layer thickness in a range of approximately 90 nm to approximately 150 nm.

[0134] Alternatively or additionally, the first electrode 310 can be formed from a stack of layers or a combination of the layers described above. An example is a silver layer applied on or over an indium tin oxide (ITO) layer (Ag on ITO) or ITO-Ag-ITO multilayers. Alternatively or additionally, the first electrode 310 can have or be formed from a stack of layers of several layers of the same metal or different metals and / or the same TCO or different TCOs.

[0135] The second electrode 314 can be configured as an anode, i.e., as a hole-injecting electrode. The second electrode 314 can be configured according to one or more of the embodiments of the first electrode 310 described above, e.g., identical, similar, or different to the first electrode 310.

[0136] According to various embodiments, the first electrode 110, the functional layer structure 312 and the second electrode 314 can be formed by means of liquid-phase processing (compare Fig. 1A or Fig. 1B).

[0137] For this purpose, at least one of the above-mentioned substances is dissolved or dispersed in a first solvent, e.g., of a first type of solvent, to form a liquid phase of the first electrode 310. According to various embodiments, the first electrode 310 can be formed on or over the substrate 102 by means of the liquid phase of the first electrode 310 (compare Fig. 1A or Fig. 1B).

[0138] The formation of the functional layer structure 312 can involve dissolving or dispersing one of the substances mentioned herein for a layer of the functional layer structure 312 (e.g., an emitter layer 318) or for the functional layer structure 312 in a second solvent, e.g., of a second type of solvent, to form a liquid phase of the functional layer structure 312, wherein the first solvent can be orthogonal to the second solvent. For example, the second type of solvent can be different (e.g., orthogonal) to the first type of solvent. According to various embodiments, the functional layer structure 312, or at least one layer of the functional layer structure 312, can be formed on or above the first electrode 310 by means of the liquid phase of the functional layer structure 312 (see Figure 3). Fig. 1A or Fig. 1B).

[0139] Forming the second electrode 314 can involve dissolving or dispersing one of the substances mentioned herein for the second electrode 314 in a third solvent, e.g., a third type of solvent, to form a liquid phase of the second electrode 314, wherein the third solvent is orthogonal to the second solvent. For example, the third type of solvent can be different (e.g., orthogonal) to the second type of solvent. According to various embodiments, the second electrode 314 can be formed on or above the functional layer structure 312 by means of the liquid phase of the second electrode 314 (see Figure 1). Fig. 1A or Fig. 1B).

[0140] According to various embodiments, the third solvent type can be the same as the second solvent type (for example, the first solvent can be the same as the second solvent). This makes it possible to require only two different solvents. In this case, the functional layer structure 312 can be formed as the first layer 104, and the second electrode 314 as the second layer 104. This means that the third solvent does not substantially dissolve any material of the functional layer structure 312.

[0141] Fig. Figure 3B shows a schematic cross-sectional or side view of an organic optoelectronic device 300b according to various embodiments, which, for example, largely corresponds to the one described in Fig. The embodiment shown in Figure 3A corresponds to a method for forming an organic optoelectronic device. Alternatively to the embodiment shown in Figure 3A, the following embodiment can be used: Fig. The layer sequence illustrated in 3A shows the organic optoelectronic device 300b, which is in Fig. The layer sequence shown in 3B is described below.

[0142] The formation of the organic functional layer structure 312 can involve the formation of one or more emitter layers 318. For example, several emitter layers 318 can be identical or different from one another.

[0143] Alternatively or additionally, the emitter layer 118 may consist of, be composed of, or be composed of organic polymers, organic oligomers, organic monomers, organic small non-polymeric molecules or a combination of these materials.

[0144] Alternatively or additionally, the emitter materials can be embedded in a suitable matrix material, e.g., a plastic. It should be noted that other suitable emitter materials can also be provided. Alternatively or additionally, the emitter materials of the emitter layer(s) 318 of the optoelectronic device 300b can, for example, be selected such that the optoelectronic device 300b emits white light. Alternatively or additionally, the emitter layer(s) 318 may have several differently colored emitter materials (for example, blue and yellow or blue, green, and red). Alternatively, the emitter layer(s) 318 may also be composed of several sublayers, such as a blue fluorescent emitter layer 318, a blue phosphorescent emitter layer 318, a green phosphorescent emitter layer 318, and / or a red phosphorescent emitter layer 318.Mixing the different colors can result in the emission of light with a white color impression. Alternatively, it is proposed to arrange a converter material in the beam path (i.e., in the light propagation area) of the primary emission generated by these layers. This converter material would at least partially absorb the primary radiation and emit secondary radiation of a different wavelength, so that the combination of primary and secondary radiation from the (not yet white) primary radiation results in a white color impression.

[0145] The first electrode 310 is formed on or above the substrate 102. A hole injection layer (not shown) is formed on or above the first electrode 310. A hole transport layer 316 (also referred to as a hole conduction layer 316) is formed on or above the hole injection layer. Furthermore, the emitter layer 318 is formed on or above the hole transport layer 316. An electron transport layer 320 (also referred to as an electron conduction layer 320) is formed on or above the emitter layer 318. An electron injection layer (not shown) is formed on or above the electron transport layer 320. The second electrode 314 is formed on or above the electron injection layer.

[0146] The layer sequence of the optoelectronic component 300b is not limited to the embodiments described above; for example, one or more of the aforementioned layers can be omitted. Furthermore, the layer sequence can alternatively be configured in reverse order. Additionally, two layers can be configured as a single layer.

[0147] The hole injection layer can be formed or become formed in such a way that it has a layer thickness in a range of approximately 10 nm to approximately 1000 nm, for example in a range of approximately 30 nm to approximately 300 nm, for example in a range of approximately 50 nm to approximately 200 nm.

[0148] Alternatively or additionally, the optoelectronic component 300b can have multiple hole injection layers.

[0149] The hole transport layer 316 can be formed or be formed such that it has a layer thickness in a range of approximately 5 nm to approximately 50 nm, for example in a range of approximately 10 nm to approximately 30 nm, for example approximately 20 nm.

[0150] Alternatively or additionally, the optoelectronic component 300b can have several hole transport layers 316.

[0151] The electron transport layer 320 can be formed or become formed such that it has a layer thickness in a range of approximately 5 nm to approximately 50 nm, for example in a range of approximately 10 nm to approximately 30 nm, for example approximately 20 nm.

[0152] Alternatively or additionally, the optoelectronic component 300b can have several electron transport layers 320.

[0153] The electron injection layer can be designed or made to have a layer thickness in a range of approximately 5 nm to approximately 200 nm, for example in a range of approximately 20 nm to approximately 50 nm, for example approximately 30 nm.

[0154] Alternatively or additionally, the optoelectronic device 300b can have multiple electron injection layers.

[0155] Alternatively or additionally, the optoelectronic device 300b can be designed or configured to have two or more organic functional layer structures 312, e.g. a first organic functional layer structure 312 (also referred to as the first organic functional layer structure unit) and a second organic functional layer structure 312 (also referred to as the second organic functional layer structure unit).

[0156] The second organic functional layer structure unit can be formed above or alongside the first functional layer structure unit. An intermediate layer structure (not shown) can be formed between the organic functional layer structure units.

[0157] The intermediate layer structure can be configured as an intermediate electrode, for example according to one embodiment of the first electrode 310. An intermediate electrode can be electrically connected to an external energy source. The external energy source can provide a third electrical potential at the intermediate electrode. However, the intermediate electrode can also have no external electrical connection, for example by having a floating electrical potential.

[0158] Alternatively or additionally, the interlayer structure can be configured as a charge generation layer (CGL). A charge generation layer comprises or is formed from one or more electron-conducting charge generation layers and one or more hole-conducting charge generation layers. The electron-conducting charge generation layer(s) and the hole-conducting charge generation layer(s) are each formed from an intrinsically conductive material or a dopant within a matrix.The charge carrier pair generation layer structure should be designed with respect to the energy levels of the electron-conducting charge carrier pair generation layer(s) and the hole-conducting charge carrier pair generation layer(s) such that electron and hole separation can occur at the interface between an electron-conducting charge carrier pair generation layer and a hole-conducting charge carrier pair generation layer. Optionally, the charge carrier pair generation layer structure can include a diffusion barrier between adjacent layers, e.g., in the form of a dissolution stop layer.

[0159] Alternatively or additionally, the above-mentioned layers can be formed as mixtures of two or more of the above-mentioned layers.

[0160] It should be noted that alternatively or additionally, one or more of the above-mentioned layers arranged between the first electrode 310 and the second electrode 314 are optional.

[0161] For example, the organic functional layer structure 312 can be configured as a stack of two, three, or four OLED units arranged directly on top of each other. In this case, the organic functional layer structure 312 has a maximum layer thickness of approximately 3 µm.

[0162] In addition, the optoelectronic device 300b can be designed or configured to optionally include further organic functional layers (which may consist of organic functional materials), for example arranged on or above the one or more emitter layers 318 or on or above the electron transport layer(s) 216, which serve to further improve the functionality and thus the efficiency of the optoelectronic device 300b.

[0163] If the first electrode 310 is formed from a liquid phase, the hole injection layer can be or become the first layer 104, the hole transport layer 316 the second layer 106, and the emitter layer 118 the third layer (compare, for example, Fig. 4A to 4D). This makes it possible to use a solvent of the same type or the same solvent for forming the hole transport layer 316 for forming the first electrode 310, and a solvent of the same type or the same solvent for forming the emitter layer 118 for forming the hole injection layer. Thus, for example, only two different solvents are required.

[0164] Alternatively, three different solvents can be used. For example, a first solvent, e.g., of a first solvent type, can be used to form the electrode 310. A second solvent, e.g., of a second solvent type, can be used to form the hole injection layer, wherein the first solvent is orthogonal to the second solvent. For example, the second solvent type can be orthogonal to the first solvent type. A third solvent, e.g., of a third solvent type, can be used to form the hole transport layer 316, wherein the third solvent is orthogonal to both the first and the second solvents. For example, the third solvent type can be orthogonal to both the first and the second solvent types.To form the emitter layer 118, the first solvent or another solvent of the first solvent type can be used again.

[0165] In this case, the hole injection layer or the hole transport layer 316 can be formed in the form of the first layer 104 and the emitter layer 118 in the form of the second layer 106 (compare Fig. 1A or Fig. 1B). In other words, in this case it is sufficient to form one of the layers between the emitter layer 118 and the first electrode 310 in the form of the first layer 104 with exposed edge region 104r. This allows for fewer exposed edge regions to be formed, thus providing more luminescent surface area.

[0166] If the first electrode 310 is not formed from a liquid phase or is generally not soluble in any of the solvents, the scheme described above can be modified accordingly.

[0167] For example, the first electrode 110 can be formed prior to liquid-phase processing, using a different deposition method, e.g., vacuum processing, such as one or more of the following: atomic layer deposition (ALD), plasma-enhanced atomic layer deposition (PEALD), plasma-less atomic layer deposition (PLALD), or chemical vapor deposition (CVD), e.g., plasma-enhanced chemical vapor deposition (PECVD) or plasma-less chemical vapor deposition (PLCVD). Alternatively, the first electrode 110 can be provided as part of the substrate 102, e.g., in the form of the substrate itself or in the form of the metal layer of a metal-coated substrate 102.

[0168] Fig. Figure 3C shows a schematic cross-sectional or side view according to various embodiments of an organic optoelectronic device 300c, which, for example, largely corresponds to the one described in Fig. This corresponds to the embodiment illustrated in 3B. Alternatively, instead of the embodiment shown in Fig. The layer sequence shown in 3B allows the organic optoelectronic device 300c to be manufactured in Fig. 3C illustrates the layer sequence, which is described below.

[0169] A barrier layer 304 is arranged on or above the substrate 102 and between the substrate 102 and the light-emitting diode 306. The substrate 102 and the barrier layer 304 form a hermetically sealed substrate 102. The barrier layer 304 can comprise or be formed from one or more of the following materials: aluminum oxide, zinc oxide, zirconium oxide, titanium oxide, hafnium oxide, tantalum oxide, lanthanum oxide, silicon oxide, silicon nitride, silicon oxynitride, indium tin oxide, indium zinc oxide, aluminum-doped zinc oxide, poly(p-phenylene terephthalamide), nylon 66, as well as mixtures and alloys thereof.

[0170] According to various embodiments, the barrier layer 304 can, for example, be formed from an electrically insulating material (i.e., from an electrical insulator, as a so-called insulating layer).

[0171] The barrier layer 304 can be formed or made such that it has a layer thickness of approximately 0.1 nm (one atomic layer) to approximately 1000 nm, for example a layer thickness of approximately 10 nm to approximately 100 nm according to one embodiment, for example approximately 40 nm according to one embodiment.

[0172] The barrier layer 304 can be formed by means of vacuum processing, liquid phase processing or alternatively by means of other suitable deposition methods.

[0173] Alternatively or additionally, the barrier layer 304 can be configured to have multiple sublayers. In a barrier layer 304 with multiple sublayers, all sublayers can be formed, for example, by an atomic layer deposition (ALD) process. A layer sequence consisting only of ALD layers can also be referred to as a "nanolaminate".

[0174] Alternatively or additionally, the barrier layer 304 is designed such that it has one or more optically high refractive materials, for example one or more material(s) with a high refractive index, for example with a refractive index of at least 2.

[0175] Alternatively or additionally, the above-mentioned layers are formed as mixtures of two or more of the above-mentioned layers.

[0176] Alternatively or additionally, one of the optoelectronic components described herein can have a color filter and / or a converter structure, which can be arranged and / or formed on or above the substrate 102. By selectively varying a surface of planar substrates 102 (variation of the bottom contact 310 or one-sided coating or application of a color filter or converter), a targeted change in emission in one direction can be achieved, independent of emission in the other direction. This applies to opaque and (semi-)transparent embodiments.

[0177] Fig. Figures 4A to 4D each show a schematic cross-sectional view according to different embodiments of an organic optoelectronic device at different process steps 400a to 400c, e.g. one of the organic optoelectronic devices described above.

[0178] As in Fig. As illustrated in Figure 4A, a substance for a first layer 104 (e.g., the barrier layer, the electron injection layer, the electron conduction layer, the emitter layer, etc.) can be dissolved or dispersed in a first solvent, e.g., of a first solvent type, thereby forming a liquid phase 104a (in other words, a solution) of the organic first layer 104, which is also referred to as the first liquid phase 104a.

[0179] The first liquid phase 104a can be applied to or over the substrate 102, e.g. by means of liquid phase processing, e.g. on a coating area 102b (on the surface) of the substrate 102, e.g. on a main processing side of the substrate 102, e.g. over or onto a coating area 102b (on the surface) of the substrate 102, e.g. over or on a main processing side 102h of the substrate 102.

[0180] Between the first liquid phase 104a and the substrate 102, further layers (not shown) can be arranged or become arranged, e.g. at least one layer (not shown) which has been formed from a liquid phase, wherein the layer is not or only slightly soluble in the first solvent.

[0181] Alternatively or additionally, a layer or layer stack not formed from a liquid phase (not shown), which is formed, for example, by means of vacuum processing, can be arranged between the substrate 102 and the first liquid phase 104a, e.g. the first electrode 110 and / or a barrier layer 304.

[0182] The first solvent can then be removed from the first liquid phase 104a, e.g., by being extracted, volatilized, or evaporated. For this purpose, the first liquid phase 104a can be heated, for example. By removing the first solvent, the first liquid phase 104a can be dried and solidified. The volume of the first liquid phase 104a can decrease in the process, for example, the more solvent is removed from the first liquid phase 104a the greater the decrease. By removing the first solvent from the first liquid phase 104a, the first liquid phase 104a can be transformed into the first layer 104, as shown in Fig. Figure 4B illustrates this. In other words, the first layer 104 can be formed from the first liquid phase 104a.

[0183] As in Fig. As illustrated in Figure 4B, a substance for an organic second layer 106 (e.g., the barrier layer, the electron injection layer, the electron conduction layer, the emitter layer, etc.) can be dissolved or dispersed in a second solvent, e.g., a second type of solvent, which is orthogonal to the first solvent, thereby forming a liquid phase 106a (in other words, a solution) of the organic second layer 106, which is also referred to as the second liquid phase 106a. The second liquid phase 106a can be applied to or over the first layer 104, e.g., by means of liquid-phase processing, e.g., to a region 104b of the first layer 104 to be coated. The second liquid phase 106a can be applied in such a way that a boundary region 104r of the first layer 104 remains free of the liquid phase 106a.

[0184] By decreasing the volume of the second liquid phase 106a, its lateral extent may also decrease slightly, so that the edge region 104r of the first layer 104 may increase slightly, e.g. in a range of approximately 1% to approximately 10%.

[0185] Furthermore, additional layers (not shown) can be arranged or will be arranged between the first layer 104 and the second layer 106, e.g., formed from a liquid phase, using solvents that do not dissolve or only dissolve to a limited extent (essentially not) the first layer 104, and which are not dissolved or only dissolve to a limited extent by the second solvent.

[0186] Analogous to the organic first layer 104, the second liquid phase 106a can then be converted into the organic second layer 106 by removing the second solvent from the second liquid phase 106a, as shown in Fig. 4C is illustrated.

[0187] As in Fig. As illustrated in Figure 4C, a substance for an organic third layer 108 (e.g., the electron injection layer, the electron conduction layer, the emitter layer, etc.) can be dissolved or dispersed in a third solvent, e.g., of a third type of solvent, which is orthogonal to the second solvent, thereby forming a liquid phase 108a (in other words, a solution) of the organic third layer 108, which is also referred to as the third liquid phase 108a.

[0188] According to various embodiments, the third solvent type can be identical to the first solvent type and orthogonal to the second solvent type. For example, the third solvent can be identical to the first solvent and orthogonal to the second solvent.

[0189] The third liquid phase 108a can be applied to the second layer 106, e.g. by means of liquid phase processing, e.g. on a region 106b of the organic second layer 106 to be coated. The third liquid phase 108a can be applied in such a way that a boundary region 106r of the second layer 106 remains free of the third liquid phase 108a.

[0190] Analogous to the organic first layer 104, the third liquid phase 108a can then be converted into the organic third layer 106 by removing the solvent from the third liquid phase 108a, as shown in Fig. 4D illustration.

[0191] Analogous to the above description, further layers (not shown) can be arranged or will be arranged between the second layer 106 and the third layer 108, e.g. formed from a liquid phase, using solvents which do not dissolve or only dissolve to a limited extent (essentially not) the second layer 106, and which are not dissolved or only dissolve to a limited extent by the third solvent.

[0192] Analogous to the previously described process, further liquid phases of organic layers, e.g., a fourth organic layer (e.g., the electron conduction layer, the emitter layer, etc.), can be applied to a region 108b of the third organic layer 108 to be coated in such a way that a boundary region 108r of the third organic layer 108 remains free of the liquid phase of the fourth organic layer. The fourth solvent (or the fourth type of solvent of the fourth solvent) in which the substance of the fourth organic layer is dissolved can be orthogonal to the third solvent (or the third type of solvent). Additionally, the fourth solvent (or the fourth type of solvent of the fourth solvent) can be orthogonal to the second solvent (or the second type of solvent).

[0193] According to various embodiments, several different solvents (or solvent types) can be used to form the layers, e.g., n different solvents, each pair being orthogonal to the others. In other words, n layers (layer 1, layer 2, ..., layer n) can be formed, with the solvents used to form successive layers being orthogonal to each other in pairs.

[0194] If one of the solvents (or solvent types) used to form a layer is repeated, i.e., an existing layer is soluble in a solvent used to form another layer (e.g., solvent 1 is used to form layer 1 and layer n+1), these layers are separated from each other by at least one layer m (which can also be called the first layer). Optionally, at least one further layer can be arranged between layer m and layer n+1 and / or between layer m and layer 1.

[0195] The layer in which the solvent type is repeated is formed in such a way that the boundary region of layer m remains free of this layer. In other words, layer n+1 is formed in the form of the second layer 106, and layer m is formed in the form of the first layer. This prevents the liquid phase of the second layer from flowing beyond the boundary region and wetting and dissolving the underlying layers.

[0196] Fig. Figure 5 illustrates a schematic top view of an organic optoelectronic device 500 according to various embodiments. Fig. Figure 5 illustrates a lateral component architecture for a multilayer organic optoelectronic device 500, e.g., an OLED, using structured solution processing. According to various embodiments, such a component architecture can be used for a back-emitting device, also referred to as a bottom-emitting device. This means that the organic optoelectronic device 500 emits light through the first electrode 310 and the substrate 102.

[0197] The organic optoelectronic device 500 can have a substrate 102, e.g. a transparent substrate 102, and a first electrode 310, e.g. made of ITO, applied to the substrate 102. The first electrode 310 can be connected to a first contact surface 510, e.g. in the form of a contact pad.

[0198] Furthermore, the optoelectronic device 500 can have a functional layer structure 312, which is applied to the first electrode 310. The functional layer structure 312 can be designed as a layer stack with several organic layers, e.g., as described above for the organic optoelectronic device 300a or the organic optoelectronic device 300b.

[0199] The functional layer structure 312 can have a thickness (i.e. the sum of the layer thicknesses of the individual layers) in a range of approximately 100 nm to approximately 400 nm.

[0200] The layer stack can be configured such that the boundary region 104r of the organic first layer 104, the boundary region 106r of the organic second layer 106, the boundary region 108r of the organic third layer 108, the boundary region 504r of an organic fourth layer, and the boundary region 506r of an organic fifth layer remain free from the subsequent layer, e.g., exposed. In other words, each layer of the functional layer structure 312 can have an exposed boundary region 104r, 106r, 108r, 504r, 506r.

[0201] Thus, the coated areas of the layers of the functional layer structure 312, projected onto a plane parallel to the main processing surface of the substrate 102, can each be arranged inside one another.

[0202] Visually, the stack of layers can be formed in the shape of a pyramid, e.g. in a stepped shape, where each layer of the stack can form a step.

[0203] Furthermore, the optoelectronic component 500 can have a second electrode 314, which is applied to the functional layer structure 312. The second electrode 314 can be connected to a second contact surface 514, e.g., in the form of a second contact pad (e.g., made of ITO, Cr, Al, or Mo). The second contact surface 514 can be applied to the substrate 102 next to the first electrode 310 and electrically insulated from it.

[0204] The second electrode 314 can be formed, for example, by vacuum processing. Furthermore, the second electrode 314 can be formed such that the boundary region 506r of the fifth organic layer of the functional layer structure 312 remains free of the second electrode 314.

[0205] Furthermore, the optoelectronic component 500 can have a second insulating layer 502, which is arranged above or on the first electrode 310 and partially covers it. The insulating layer 502 can, for example, be in the form of a barrier layer 304 (see Fig. 3C) be or will be trained.

[0206] According to various embodiments, the insulating layer 502 can, for example, be formed from an electrically insulating material (a so-called electrical insulator). According to various embodiments, the insulating layer 502 can be electrically insulating.

[0207] The insulating layer 502 can, for example, extend between the first electrode 310 and the functional layer structure 312. The insulating layer 502 can, for example, extend between the first electrode 310 and the sixth organic layer of the layer structure 312, which can also be referred to as the uppermost organic layer of the layer structure 312 if it borders the second electrode 314.

[0208] The thickness of the insulating layer 502 ranges from a few nanometers (nm) to a few micrometers (µm), e.g., from approximately 100 nm to approximately 5 µm, or from approximately 100 nm to approximately 1 µm. The thinner the insulating layer 502, the smaller the edge that the layers of the optically functional structure above it must overcome.

[0209] According to various embodiments, the lateral extent of the insulating layer 502 can extend into a region above or on which all organic layers are formed (e.g., perpendicular to the lateral extent). This prevents the entire voltage drop from occurring in the region where only a few organic layers are arranged between the first electrode 310 and the second electrode 314. In other words, the insulating layer 502 acts as an electrical insulator, electrically isolating the first electrode 310 from the second electrode 314, regardless of the number of layers in the layered structure 312.

[0210] According to various embodiments, the insulating layer 502 overlaps the first electrode 310, wherein the area with which the insulating layer 502 and the first electrode 310 overlap has a width 512u in a range of approximately 100 µm to approximately 500 µm, e.g. approximately 300 µm.

[0211] According to various embodiments, the insulating layer 502 extends beyond the first layer 104, wherein the area extending beyond the first layer 104 has a width 512h in a range of approximately 100 µm to approximately 500 µm, e.g. approximately 300 µm.

[0212] The lateral width of the insulation layer 502 can have a value in a range of approximately 200 µm to approximately 2000 µm, e.g. in a range of approximately 600 µm to approximately 1000 µm.

[0213] According to various embodiments, the organic optoelectronic device 500 can be configured as a front-emitting device, a so-called top-emitter, i.e., the organic optoelectronic device 500 emits light through the second electrode 314. In a top-emitter, the second electrode 314 (top electrode) can be transparent.

[0214] According to various embodiments, the organic optoelectronic component 500 can be configured as a transparent component, i.e., as a combination of a top-side emitter and a bottom-side emitter. In a transparent component, the first electrode 310 and the second electrode 310 can be or become transparent.

[0215] The uppermost layer of the optically functional layer structure 312 (e.g., the fifth layer) can define the luminescent area of ​​the optoelectronic device 500, i.e., the area that emits light. For example, the luminescent area of ​​the optoelectronic device 500 can correspond to the area of ​​the uppermost layer of the layer stack, e.g., the fifth layer. Therefore, for a given luminescent area, it may be necessary to make the lowest layer of the layer stack, e.g., the first layer 104, laterally larger than the given luminescent area, e.g., laterally larger by at least the extents of the respective boundary regions of the layers formed above it.

[0216] The luminous area of ​​the optoelectronic component can have a value in the range of approximately a few square centimeters (cm²). 2 ) to approximately a few hundred square centimeters, e.g. in an area of ​​approximately 1 cm 2up to approximately 500 cm 2 e.g. in an area of ​​approximately 10 cm 2 up to approximately 500 cm 2 e.g. in an area of ​​approximately 100 cm 2 up to approximately 500 cm 2 .

[0217] Fig. Figure 6 illustrates a schematic top view of an organic optoelectronic device 600 according to various embodiments. The in Fig. The organic optoelectronic component 600 illustrated in Figure 6 can be used analogously to the one in Figure 6. Fig. 5 illustrated organic optoelectronic device 500, with the difference that the insulating layer 502 extends between the second electrode 310 and the functional layer structure 312.

[0218] Alternatively or additionally, one of the organic optoelectronic devices described herein can have a color filter and / or a converter structure, which can be arranged and / or formed on or above the substrate 102. By selectively varying a surface on planar substrates (varying the bottom contact, applying a one-sided coating, or adding a color filter or converter), a targeted change in emission in one direction can be achieved, independent of emission in the other direction. This applies to opaque and (semi-)transparent embodiments.

[0219] The thickness of the insulating layer 502 ranges from a few nanometers (nm) to a few micrometers (µm), for example, from approximately 100 nm to approximately 5 µm, or from approximately 1 µm to approximately 5 µm. The thicker the insulating layer 502, the less influence the stepped edge regions can have on the second electrode 314 formed above it. In other words, the step height that the second electrode 314 has to overcome can be smaller the greater the thickness of the insulating layer 502.

[0220] Fig. Figure 7 illustrates a method 700 according to various embodiments for manufacturing an organic optoelectronic device, e.g. one of the optoelectronic devices described above.

[0221] The method, as described in 701, comprises forming an organic first layer over or on a substrate, wherein the first layer has a surface, the surface being opposite the substrate and comprising a first surface region and a second surface region, the second surface region partially or completely surrounding the first surface region. Furthermore, the method, as described in 703, comprises forming an organic second layer over or on the first surface region, wherein the second surface region remains free of the second layer.

[0222] Retrospectively, an analysis of the optoelectronic component can determine which solvents (or solvent types) would be suitable for fabricating a given layer stack of the optoelectronic component. For example, the material of individual layers in the layer stack can be used to determine whether they are soluble in a polar or nonpolar solvent. The material can be determined, for example, using physical elemental analysis and / or chemical elemental analysis, e.g., by mass spectrometry, nuclear magnetic resonance, mass spectrometry (e.g., secondary ion mass spectrometry), or another suitable spectroscopic method. Based on the material, conclusions can be drawn about suitable solvents or solvent types.

[0223] Fig. Figure 8 illustrates a method 800 according to various embodiments for producing a layer stack (compare, for example, Fig. 1A or Fig. 4A to 4D), e.g. in an organic optoelectronic device, e.g. one of the optoelectronic devices described above.

[0224] The method, as described in 801, comprises forming a first layer of a first solution over a substrate, wherein the first layer has a surface; the surface being opposite the substrate and having a first surface region and a second surface region, the second surface region surrounding the first surface region. The method, as described in 803, comprises forming a second layer of a second solution over the first surface region, the second surface region remaining free of the second layer.

Claims

[1] Method for manufacturing an optoelectronic device (100a, 400b, 500, 600) comprising the method: • Forming (701) an organic first layer (104) over a substrate (102), wherein the first layer (104) has a surface (104t); • wherein the surface (104t) is opposite the substrate (102) and has a first surface area (104b) and a second surface area (104r), wherein the second surface area (104r) surrounds the first surface area (104b); • Forming (703) an organic second layer (106) over the first surface region (104b), wherein the second surface region (104r) remains free of the second layer (106), • where successively formed layers are processed from solvents that are orthogonal to each other. [2] Method according to claim 1, wherein the second layer (106) comprises a solvent which is arranged such that it substantially does not dissolve any material of the first layer (104). [3] Method according to one of claims 1 or 2, wherein the solvent of the first layer (104) and the solvent of the second layer (106) are each from the following group of solvent types: • polar solvent, • perfluorinated solvent, • aprotic polar solvent, • hydroxyl solvent, or • Nonpolar organic solvent. [4] Method (100) according to any one of claims 1 to 3, wherein the formation of the first layer (104) comprises removing at least part of the solvent of the first layer (104) from the layer (104) to dry the first layer (104) before the second layer (106) is formed. [5] Method according to any one of claims 1 to 4, wherein the first layer (104) and / or the second layer (106) are part of an organic light-emitting diode (306). [6] Method according to any one of claims 1 to 5, wherein the first layer (104) and / or the second layer (106) are part of an optically functional layer structure (312) which is configured to convert electrical energy into electromagnetic radiation. [7] Method according to any one of claims 1 to 5, wherein the first layer (104) and / or the second layer (106) are designed as a dissolution stop layer, wherein the dissolution stop layer has a layer thickness of less than 20 nm. [8] Method according to any one of claims 1 to 5, wherein the first layer (104) and / or the second layer (106) are designed as a metallization layer, wherein the metallization layer has exposed contact areas. [9] Method (100) according to any one of claims 1 to 8, further comprising: Forming an encapsulation over the substrate, covering the first layer (104) and the second layer (106). [10] comprising an optoelectronic component (100a, 400b, 500, 600): • a substrate (102); • an organic first layer (104) wherein the first layer (104) has a surface (104t); • wherein the surface (104t) faces the substrate (102) and has a first surface region (104b) and a second surface region (104r), the second surface region (104r) surrounding the first surface region (104b); and • an organic second layer (106) over the first surface region (104b), wherein the second surface region (104r) is free from the second layer (106), wherein • the organic first layer (104) is a hole injection layer and the organic second layer (106) is a hole transport layer, or • the organic first layer (104) is a hole injection layer or a hole transport layer and the organic second layer (106) is an emitter layer. [11] Optoelectronic device (100a, 400b, 500, 600) according to claim 10, wherein the second layer (106) comprises a material which is soluble in a solvent and wherein the first layer (104) comprises a material which is substantially insoluble in the solvent. [12] Method for producing a layer stack, comprising the method: • Forming (801) a first layer (104) from a first solution over a substrate (102), wherein the first layer (104) has a surface (104t); • wherein the surface (104t) is opposite the substrate (102) and has a first surface area (104b) and a second surface area (104r), wherein the second surface area (104r) surrounds the first surface area (104b); • Forming (803) a second layer (106) from a second solution over the first surface region (104b), wherein the second surface region (104r) remains free of the second layer (106), wherein successively formed layers are processed from mutually orthogonal solvents.

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