Connecting an electronic component to an interactive textile

The method of using a comb tool to align and strip non-conductive material from conductive threads, followed by bonding and encapsulation, addresses the challenge of connecting interactive textiles to electronic components, ensuring efficient and durable integration.

DE102016014612B4Active Publication Date: 2026-06-11GOOGLE LLC

Patent Information

Authority / Receiving Office
DE · DE
Patent Type
Patents
Current Assignee / Owner
GOOGLE LLC
Filing Date
2016-12-08
Publication Date
2026-06-11

AI Technical Summary

Technical Problem

Manufacturers face difficulties in connecting individual conductive threads of an interactive textile to electronic components such as processors, batteries, and wireless units due to the complexity of integrating conductive threads with non-conductive materials.

Method used

A method involving a comb tool to gather and align conductive threads at a grid spacing matching the electronic component's connection points, followed by stripping non-conductive material, bonding the conductive wires, and encapsulating the connection with a waterproof material to ensure efficient and durable attachment.

🎯Benefits of technology

Facilitates efficient and reliable connection of conductive threads to electronic components, enhancing the integration of interactive textiles in flexible and solid objects while protecting against water ingress and corrosion.

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Abstract

Method for connecting an electronic component to an interactive textile, the method comprising: the collection of loose conductive threads of the interactive textile and the arrangement of these threads in band form with a grid spacing corresponding to a grid spacing of the connection points of the electronic component, wherein the collection and arrangement comprises the collection and arrangement of loose conductive threads with a comb tool which includes openings whose spacing corresponds to the grid spacing of the connection points; the stripping of non-conductive material from the conductive threads of the tape to expose the conductive wires of the conductive threads; bonding the connection points of the electronic component to the exposed conductive wires of the tape; sealing the conductive threads at the base of the tape with an epoxy; and encapsulating the electronic component and the tape with a waterproof material.
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Description

BACKGROUND

[0001] An interactive textile incorporates conductive threads woven into the fabric to form a capacitive touch sensor configured to detect touch input. The textile can process this input to generate touch data that can be used to activate various wirelessly connected devices. For example, the textile can help users adjust the volume of a stereo system, pause a movie playing on a television, or select a webpage on a desktop computer. Due to the flexibility of textiles, the interactive textile can be easily integrated into flexible objects such as clothing, handbags, fabric covers, caps, and the like.

[0002] The interactive textile incorporates a grid or series of conductive threads woven into the fabric. Each conductive thread contains a conductive wire (e.g., a copper wire) twisted, braided, or entangled with one or more flexible threads (e.g., polyester or cotton threads). However, it proves difficult for manufacturers to connect individual conductive threads to electronic components, which include electronic devices such as a processor, batteries, wireless units, sensors, and the like. Documents US 2016 / 0 048 235 A1, US 2012 / 0 156 926 A1, and WO 01 / 030 123 A1 disclose interactive textiles. DE 39 15 286 A1 describes a device for the automatic stripping and welding of insulated conductors. EP 1 083 627 A1 describes a method for manufacturing a combination of a flat cable and a connector. Summary

[0003] An object of the present invention is to improve the connection of an electronic component to an interactive textile. This object is achieved by a method with the features of claim 1 and by a system with the features of claim 11. Further developments of the invention are specified in the dependent claims. This document describes techniques and apparatus for connecting an electronic component to an interactive textile. An interactive textile may include a conductive thread woven into the interactive textile to form a capacitive touch sensor configured to detect touch input. The conductive threads include a conductive wire (e.g., a copper wire) twisted, braided, or entangled with one or more flexible threads (e.g., polyester or cotton threads).To connect the electronic component to the conductive threads of the interactive textile, loose conductive threads of the interactive textile are gathered and arranged in a tape with a grid spacing corresponding to the grid spacing of the electronic component's connection points. This gathering and arrangement of the loose conductive threads is accomplished using a comb tool with openings spaced according to the grid spacing of the connection points. Non-conductive material is then stripped from the conductive threads of the tape to expose the conductive strands. After removing the non-conductive material, the connection points of the electronic component are bonded to the conductive strands of the tape.The conductive threads near the tape are then sealed using a UV-curing or heat-curing epoxy, and the electronic component and tape are encapsulated with the interactive textile using a waterproof material, such as plastic or polymer.

[0004] This summary aims to provide simplified concepts regarding the connection of an electronic component to an interactive textile, which are described in more detail in the detailed description. Brief description of the drawings

[0005] Embodiments of techniques and devices for connecting an electronic component to an interactive textile are described with reference to the following drawings. The same numbers are used in all drawings to refer to identical features and components. Fig. Figure 1 is an illustration of an exemplary environment in which an interactive textile can be implemented. Fig. Figure 2 illustrates an exemplary system that includes an interactive textile and a gesture manager. Fig. Figure 3 illustrates an example of an interactive textile according to one or more versions. Fig. Figure 4 illustrates an exemplary connection system that can be used to connect an electronic component to an interactive textile according to one or more embodiments. Fig. Figure 5 illustrates a system in which the band formation component of the Fig. 4 is carried out to arrange loose conductive threads of an interactive textile in ribbon form. Fig. Figure 6A illustrates an example of a comb tool of a banding component according to various designs. Fig. Figure 6B illustrates an additional example of a comb tool of the banding component according to various designs. Fig. Figure 6C illustrates an example of a heating element of the banding component according to various designs. Fig. Figure 7 illustrates a system in which the stripping component of the Fig. 4 for the removal of non-conductive material from the conductive threads of a tape, according to one or more embodiments. Fig. Figure 8A illustrates an example of a wiper component according to one or more designs. Fig. Figure 8B illustrates an additional example of the wiper component according to one or more embodiments. Fig. Figure 8C illustrates an additional example of the wiper component according to one or more embodiments. Fig. Figure 9 illustrates a system in which the bonding component of the Fig. 4 is used to bond an electronic component to a conductive thread of a tape. Fig. Figure 10 illustrates a system in which the sealing component of the Fig. 4 is carried out to seal the conductive threads according to one or more designs. Fig. Figure 11 illustrates an example of an epoxy tool according to one or more designs. Fig. Figure 12 illustrates a system in which the encapsulation component of the Fig. 4 is executed to encapsulate an electronic component bonded to an interactive textile. Fig. Figure 13 illustrates an exemplary procedure for connecting an electronic component to an interactive textile. Fig. Figure 14 illustrates various components of an exemplary computer system that can be accessed by any client, server, and / or computer device, referring to the Fig. 1-13 previously described, can be carried out to connect an electronic component to an interactive textile. Detailed description Overview

[0006] An interactive textile incorporates conductive threads woven into the fabric to form a capacitive touch sensor configured to detect touch input. The textile can process this input to generate touch data that can be used to activate various wirelessly connected devices. For example, the textile can help users adjust the volume of a stereo system, pause a movie playing on a television, or select a webpage on a desktop computer. Due to the flexibility of textiles, the interactive textile can be easily integrated into flexible objects such as clothing, handbags, fabric covers, caps, and the like.

[0007] To enable the detection of multitouch input from the interactive textile, a connection method is employed to join conductive threads, aligned in a grid or row, to an electronic component, such as a flexible printed circuit board (PCB). This connection method involves a tape formation process in which a comb tool is used to gather loose conductive threads emerging from the fabric surface of the interactive textile and arrange them at a grid spacing that corresponds to the grid spacing of the electronic component's connection points. By configuring the comb tool to align the conductive threads at a spacing that matches the grid spacing of the electronic component's connection points, the tool increases the speed and efficiency of the tape formation process.In one or more versions, the grid spacing of the comb tool can be mechanically adjustable to allow the manufacturer to set the comb tool according to the grid spacing of the connection point of the specific electronic component. A tape is then created by securing the aligned conductive threads using a heat-pressed coating (e.g., adhesive tape, molded silicone polymer, or hot melt adhesive). The formation of a tape in which the conductive threads are arranged to correspond to the grid spacing of the electronic component's connection points allows for easy alignment of the electronic component's connection points with respect to the tape's conductive threads.

[0008] Each conductive thread contains non-conductive material (e.g., silk, cotton, polyester, or enamel) and a conductive wire (e.g., copper). The non-conductive material must be removed to allow the conductive threads to connect to the terminals of the electronic component. After the tape is manufactured, a stripping process is performed to remove the non-conductive material from the conductive threads of the tape, exposing the conductive wires. The stripping process can be carried out in a variety of different ways, for example, stripping by heating the conductive threads using a heating element (e.g., a heat-treated knife) that burns or melts the non-conductive material.In this case, the temperature of the heating element can be configured so that the non-conductive material of the conductive threads is burned or melted without burning or melting the conductive wire itself. If a heat-treated knife is used, the non-conductive material can be stripped from the conductive threads of the tape in a single step, thus increasing the efficiency of the process. Alternatively, a laser beam can be used to remove the non-conductive material. In this case, the absorption of the laser beam is low, so the non-conductive material is removed without damaging the conductive wire.

[0009] A bonding process is then carried out to bond the exposed conductive wires of the tape to the connection points of the electronic component. For this purpose, the conductive threads of the tape are aligned to the connection points of the electronic components by soldering, and heating is applied to bond the connection points of the electronic components to the conductive threads of the tape. Since the conductive wires of the tape and the connection points of the electronic component have the same grid spacing, this process is equivalent to a method for joining standard cables.

[0010] In some embodiments, after bonding the electronic component to the stripped conductive threads of the tape, a sealing and encapsulation process can be applied to protect the conductive wires and the electronic component from water ingress and corrosion. In the sealing process, the conductive threads adjacent to the tape are sealed with UV-curing or heat-curing epoxy. Then, in the encapsulation process, the electronic component bonded to the conductive threads is firmly attached to the interactive textile by encapsulating the electronic component and the tape with a waterproof material, such as plastic or polymer. Exemplary environment

[0011] Fig. Figure 1 is an illustration of an exemplary environment 100 in which an interactive textile can be implemented. The environment 100 includes an interactive textile 102, which is shown as integrated within various objects 104. The interactive textile 102 is a textile configured to detect multitouch input. As described herein, a textile refers to any type of flexible, woven material consisting of a network of natural or artificial fibers, often referred to as thread or yarn. Textiles can be produced by weaving, knitting, crocheting, knotting, or pressing threads together.

[0012] Within environment 100, the objects 104 include "flexible" objects, such as a shirt 104-1, a hat 104-2, and a handbag 104-3. However, it should be noted that the interactive textile 102 can be integrated within any flexible object made of fabric or similar flexible material, such as garments, blankets, shower curtains, towels, bed sheets, bedspreads, and fabric furniture covers, to name just a few. The interactive textile 102 can be integrated within flexible objects 104 in a variety of different ways, including weaving, sewing, gluing, and the like.

[0013] In this example, the objects 104 also include "solid" objects, such as a plastic cup 104-4 and a solid smartphone casing 104-5. However, it should be noted that solid objects 104 can include any type of "solid" or "rigid" object made of non-flexible or semi-flexible materials, such as plastic, metal, aluminum, and the like. Solid objects 104 can also include, for example, plastic chairs, water bottles, plastic balls, or car parts, to name just a few. The interactive textile 102 can be integrated within solid objects 104 using a variety of different manufacturing processes. Injection molding is used in one or more versions to integrate interactive textiles 102 within solid objects 104.

[0014] The interactive textile 102 allows the user to control the object 104 into which the interactive textile 102 is integrated, or to control a variety of other computer devices 106 via a network 108. Computer devices 106 are illustrated by various exemplary, non-restrictive devices: server 106-1, smartphone 106-2, laptop 106-3, computer glasses 106-4, television 106-5, camera 106-6, tablet 106-7, desktop computer 106-8, and smartwatch 106-9, although other devices can also be used, such as home automation and control systems, audio and entertainment systems, household appliances, security systems, netbooks, and e-readers. It should be noted that the computer devices 106 can be portable (e.g. computer glasses or smartwatch), page 5 non-portable but mobile (e.g. laptops and tablets), or relatively immobile (e.g. desktop computers and servers).

[0015] Network 108 includes one or more types of wireless or partially wireless communication networks, for example, a local area network (LAN), a wireless local area network (WLAN), a personal area network (PAN), a wide area network (WAN), an intranet, the Internet, a peer-to-peer network, a point-to-point network, a mesh network, and the like. This text was taken from original sources by the DPMA. It contains no drawings. The presentation of tables and formulas may be unsatisfactory.

[0016] The interactive textile 102 can interact with the computer devices 106 by transmitting touch data over the network 108. The computer device 106 uses the touch data to control the computer device 106 or applications on the computer device 106. For example, the interactive textile 102 integrated into the shirt 104-1 can be configured to control the user's smartphone 106-2 in the user's pocket, the television 106-5 in the user's home, the smartwatch 106-9 on the user's wrist, or various other devices in the user's home, such as thermostats, lighting, music, and the like.For example, the user can swipe up or down on the interactive textile 102 integrated into the user's shirt 104-1 to increase or decrease the volume of the television 106-5, to increase or decrease the temperature controlled by a thermostat in the user's house, or to turn the lights in the user's house on or off. It should be noted that any gesture, such as touching, tapping, swiping, holding, or dragging, can be recognized by the interactive textile 102.

[0017] Fig. Figure 2 illustrates an exemplary System 200, which includes an interactive textile and a gesture manager. In System 200, the interactive textile 102 is integrated into an object 104, which can be designed as a flexible object (e.g., shirt 104-1, cap 104-2, or handbag 104-3) or as a rigid object (e.g., plastic cup 104-4 or smartphone case 104-5).

[0018] The interactive textile 102 is configured to detect multi-touch input from a user when one or more of the user's fingers touch the interactive textile 102. The interactive textile 102 can also be configured to detect full-hand touch input from a user, for example, when the user's entire hand touches or swipes the interactive textile 102. To enable this, the interactive textile 102 has a capacitive touch sensor 202 that is coupled to one or more electronic components 203, such as flexible circuit boards, sensors, heating elements, and the like. In some cases, the electronic component 203 may include a textile controller 204 and a power source 206.

[0019] The capacitive touch sensor 202 is configured to detect touch input when an object, such as the user's finger or hand, or a conductive button, approaches or touches the capacitive touch sensor 202. Unlike conventional fixed touchpads, the capacitive touch sensor 202 uses a conductive thread 208 woven into the interactive textile 102 to detect touch input. Thus, the capacitive touch sensor 202 does not alter the flexibility of the interactive textile 102, enabling easy integration of the interactive textile 102 into objects 104.

[0020] The energy source 206 is connected to the textile controller 204 to supply it with energy and can be implemented as a small battery. The textile controller 204 is connected to the capacitive touch sensor 202. For example, wires of the conductive threads 208 can be connected to the textile controller 204 using a flexible circuit board, crimping, bonding with conductive adhesive, soldering, and the like.

[0021] In one or more versions, the electronic components 203 can also include one or more output devices, such as light sources (e.g., LEDs), displays, or speakers. In this case, the output devices can also be connected to the textile controller 204 to enable the textile controller 204 to control their output.

[0022] The textile controller 204 is implemented with a circuit configured to detect the location of the touch input on the conductive thread 208, as well as the movement of the touch input. When an object, for example, a user's finger, touches the capacitive touch sensor 202, the controller 204 can determine the location of the touch by detecting a change in capacitance on the grid of the conductive thread 208. The textile controller 204 uses the touch input to generate touch data that can be used to control the computer device 102. The touch input can be used, for example, to detect various gestures, such as single-finger touches (e.g., touching, tapping, and holding), multi-finger touches (e.g., two-finger touching, two-finger tapping, two-finger holding, and pinching), and one-finger or multi-finger swipes (e.g.,Swiping upwards, swiping downwards, swiping left, and swiping right (page 6) and whole-hand interactions (e.g., touching the fabric with the user's entire hand, pressing the fabric with the user's entire hand, palm touches, and rolling, twisting, or rotating the user's hand while simultaneously touching the fabric). The capacitive touch sensor 202 can be implemented as an intrinsic capacitance sensor or as a projective capacitance sensor, which is discussed in detail below.

[0023] The object 104 can also include network interfaces 210 for data transmission, for example, touch data, which is transmitted to the computer device 106 via wired, wireless, or optical networks. By way of example, but not limited to, network interfaces 210 can transmit data via a local area network (LAN), a wireless local area network (WLAN), a personal area network (PAN) (e.g., Bluetooth), a wide area network (WAN), an intranet, the internet, a peer-to-peer network, a point-to-point network, a mesh network, and the like (e.g., via the network 108 of the Fig. 1).

[0024] In this example, the computer device 106 includes one or more computer processors 212 and a computer-readable storage medium (storage medium) 214. The storage medium 214 contains applications 216 and / or an operating system (not shown) in the form of computer-readable instructions that can be executed by computer processors 212 to provide, in some cases, the functions described herein. The storage medium 214 also includes a gesture manager 218 (described below).

[0025] The computer device 106 can also include a display 220 and network interfaces 222 for data transmission over wired, wireless, or optical networks. For example, the network interfaces 222 can receive touch data detected by the interactive textile 102 from the network interface 210 of the object 104. By way of example, but not limited to, the network interface 222 can transmit data over a local area network (LAN), a wireless local area network (WLAN), a personal area network (PAN) (e.g., Bluetooth), a wide area network (WAN), an intranet, the internet, a peer-to-peer network, a point-to-point network, a mesh network, and the like.

[0026] The gesture manager 218 is capable of interacting with the applications 216 and the interactive textile 102 to activate various functions of the computer device 106 and / or the applications 216 through touch input (e.g., gestures) received from the interactive textile 102. The gesture manager 218 can be executed on a computer device 106, which may be located locally with respect to the object 104 or remotely from the object 104.

[0027] After discussing a system in which the interactive textile 102 can be implemented, a more detailed discussion of the interactive textile 102 is now required.

[0028] Fig. Figure 3 illustrates an example 300 of an interactive textile 102 according to one or more embodiments. In this example, the interactive textile 102 includes non-conductive threads 302 interwoven with conductive threads 208 to form the interactive textile 102. Non-conductive threads 302 can refer to any form of non-conductive thread, fiber, or fabric, such as cotton, wool, silk, nylon, polyester, and the like.

[0029] Figure 304 illustrates an enlarged view of a conductive thread 208. The conductive thread 208 incorporates a conductive wire 306 that is twisted, braided, or entangled with a flexible thread 308. The twisting of the conductive wire 306 with the flexible thread 308 makes the conductive thread 208 flexible and stretchable, which in turn allows the conductive thread 208 to be easily woven with non-conductive threads 302 to form the interactive textile 102.

[0030] In one or more versions, the conductive wire 306 is a thin copper wire. However, it should be noted that the conductive wire 306 can also be made using other materials, for example, silver, gold, or other materials coated with a conductive polymer. The flexible thread 308 can be in the form of any flexible threads or fibers, for example, cotton, wool, silk, nylon, polyester, and the like.

[0031] In one or more embodiments, the conductive thread 208 comprises a conductive core, which includes at least one conductive wire 306 (e.g., one or more copper wires) and a cover layer, the cover layer being configured to cover the conductive core and being composed of flexible threads 308. In some cases, the conductive wire 306 of the conductive core is insulated. Alternatively, the conductive wire 306 of the conductive core is not insulated.

[0032] In one or more embodiments, the conductive wire can be formed using a single, straight, conductive wire 306. Alternatively, the conductive wire can be formed using a conductive wire 306 and one or more flexible threads 308 (page 7). The conductive wire can be formed, for example, by twisting one or more flexible threads 308 (e.g., silk threads, polyester threads, or cotton threads) with conductive wire 306 (e.g., as shown in Figure 304 of the [reference]). Fig. 3), or by wrapping the flexible threads 308 around the conductive wire 306.

[0033] In one or more embodiments, the conductive wire comprises flexible threads 308 interwoven with the conductive wire 306. A variety of different types of flexible threads 308 can be used to interweave with the conductive wire 306, such as polyester or cotton, to form the conductive wire. However, in one or more embodiments, silk threads are used for the interwoven construction of the conductive wire. Silk threads are slightly twisted, which allows them to grip or hold onto the conductive wire 306. The use of silk threads can thus speed up the production of the interwoven conductive wire. In contrast, a flexible thread like polyester is slippery and therefore does not grip the conductive wire as well as silk. It is thus more difficult to interweave a slippery thread with the conductive wire, which can slow down the manufacturing process.

[0034] An additional advantage of using silk threads in the production of the interwoven conductive core is that silk is both thin and strong, thus enabling the production of a thin conductive core that will not break during the interactions of the textile weaving process. A thin conductive core is advantageous because it allows the manufacturer to select any desired thread thickness (e.g., thick or thin) for the conductive thread 208 when covering the conductive core with the second layer.

[0035] After the conductive core is formed, it is covered with a protective layer. In one or more variations, this protective layer is formed by wrapping the conductive core with flexible threads (e.g., polyester, cotton, wool, or silk). For example, the protective layer can be formed by wrapping the conductive core with polyester threads at 1737.36 turns per meter.

[0036] In one or more variations, the top layer comprises flexible threads braided around the conductive core. The braided top layer can be formed using the braiding method described previously. Any type of flexible thread 308 can be used for the braided top layer. The thread thickness of the flexible thread and the number of flexible threads braided around the conductive core can be determined according to the desired thickness of the conductive thread 208. For example, if the conductive thread 208 is intended for use in denim, a thicker thread (e.g., cotton) and / or a higher number of flexible threads can be used to form the top layer.

[0037] In one or more embodiments, the conductive thread 208 consists of a "double-braided" structure. In this case, the conductive core is formed by interlacing flexible threads, such as silk, with a conductive wire (e.g., copper), as previously described. The top layer is then formed by braiding flexible threads (e.g., silk, cotton, or polyester) around the braided conductive core. The double-braided structure is strong and therefore unlikely to break during pulling operations in the weaving process. For example, when the double-braided conductive thread is pulled, the braided structure contracts, causing the interwoven copper core to also contract, thus increasing the overall strength of the structure.Furthermore, the double-braided structure is soft and, unlike cables, looks like a conventional yarn, which is important in terms of aesthetics and feel.

[0038] The interactive textile 102 can be produced in a cost-effective and efficient manner using conventional weaving techniques (e.g., Jacquard weaving or 3D weaving), which involves joining a set of long threads (called warp) with a set of crosswise threads (called weft). The weaving can be performed on a frame or a machine known as a loom, of which several different types exist. A loom can thus interweave non-conductive threads 302 with conductive threads 208 to produce an interactive textile 102.

[0039] In Example 300, conductive thread 208 is woven into an interactive textile 102 to form a grid comprising a set of substantially parallel conductive threads 208 and a second set of substantially parallel conductive threads 208 that intersects the first set of conductive threads to form the grid. In this example, the first set of conductive threads 208 is horizontally oriented, and the second set of conductive threads 208 is vertically oriented, such that the first set of conductive threads 208 is positioned substantially orthogonally to the second set of conductive threads 208. However, it should be understood that the conductive threads 208 may be oriented in such a way that intersecting conductive threads 208 are not orthogonal to each other. For example, in some cases, the intersecting conductive threads 208 may form a diamond-shaped grid. While in Fig. Figure 3 illustrates the conductive threads 208 at a distance from each other. It should be noted that the conductive threads 208 can be woven very close together. In some cases, for example, two or three conductive threads can be woven very close together in any direction. In some cases, the conductive threads can also be aligned in the form of parallel measuring lines that do not cross or intersect.

[0040] The conductive wires 306 can be insulated to prevent direct contact between intersecting conductive threads 208. For this purpose, the conductive wire 306 can be coated with a material such as enamel or nylon. Alternatively, instead of insulating the conductive wires 306, the interactive textile can be manufactured with three separate textile layers to ensure that no direct contact occurs between intersecting conductive threads 208. The three textile layers can be joined (e.g., by sewing or gluing, etc.) to form the interactive textile 102. In this example, a first textile layer can contain horizontal conductive threads 208, and a second textile layer can contain vertical conductive threads 208.A third textile layer, which does not contain conductive threads, can be positioned between the first and second textile layers to prevent direct contact between vertical conductive threads and horizontal conductive threads 208.

[0041] In one or more embodiments, the interactive textile 102 comprises an upper textile layer and a lower textile layer. The upper textile layer contains conductive threads 208 woven into it, and the lower textile layer also contains conductive threads woven into it. When the upper textile layer is joined to the lower textile layer, the conductive threads of each layer form the capacitive touch sensor 202. The upper and lower textile layers can be joined in a variety of ways, for example, by weaving, sewing, or gluing the layers together to form the interactive textile 102. In one or more embodiments, the upper and lower textile layers are joined using Jacquard weaving or any form of 3D weaving.When the upper and lower textile layers are joined, the conductive threads of the upper layer couple to the conductive threads of the lower layer to form the capacitive touch sensor 202, as previously described.

[0042] During operation, the capacitive touch sensor 202 can be configured to determine, using intrinsic capacitance sensing or projective capacitance sensing on the grid of the conductive thread 208, the locations where touch input occurred.

[0043] If configured as a self-capacitance sensor, the textile controller 204 charges intersecting conductive threads 208 (e.g., horizontal and vertical conductive threads) by delivering a control signal (e.g., a sine wave signal) to each conductive thread 208. When an object, such as the user's finger, touches the grid of conductive threads 208, the touched conductive threads 208 are grounded, causing a change in capacitance (e.g., an increase or decrease in capacitance) on the touched conductive threads 208.

[0044] The textile controller 204 uses changes in capacitance to identify the presence of an object. To do this, the textile controller 204 detects the location of touch input by determining which horizontal conductive thread 208 is being touched and which vertical conductive thread 208 is being touched by detecting a change in capacitance in the respective conductive thread 208. The textile controller 204 uses the intersection point of the touched conductive threads 208 to determine the location of the touch input on the capacitive touch sensor 202. For example, the textile controller 204 can determine touch data by defining the location of each touch as X, Y coordinates within the grid of the conductive thread 208.

[0045] If implemented as a self-capacitance sensor, "ghosting" can occur when receiving multi-touch input. For example, consider a user touching the grid of the conductive thread 208 with two fingers. When this happens, the textile controller 204 determines X, Y coordinates for each of the two touches. However, it is possible that the textile controller 204 is unable to map the individual X coordinates to their corresponding Y coordinates. For example, if a first touch has the coordinates X1, Y1, and a second touch has the coordinates X4, Y4, the textile controller 204 may also detect the "ghost" coordinates X1, Y4 and X4, Y1.

[0046] In one or more versions, the textile controller 204 is configured to detect touch input "areas" that correspond to two or more touch input points on the grid of the conductive thread 208. The conductive threads 208 can be woven close together, so that when an object touches the grid of the conductive thread 208, a change in capacitance occurs for multiple horizontal conductive threads 208 and / or multiple vertical conductive threads 208. A single touch with a single finger, for example, can generate the coordinates X1, Y1 and X2, Y1. The textile controller 204 can thus be configured to detect touch input when a change in capacitance occurs for multiple horizontal conductive threads 208 and / or multiple vertical conductive threads 208.It should be noted that this eliminates the ghosting effect, as the textile control 204 does not detect touch input when touches are detected at two separate points that are separated by a distance.

[0047] Alternatively, if implemented as a projective capacitance sensor, the textile controller 204 charges a single set of conductive threads 208 (e.g., horizontal conductive threads 208) by supplying a control signal (e.g., a sine wave signal) to the single set of conductive threads 208. The textile controller 204 then detects capacitance changes in the other set of conductive threads 208 (e.g., the vertical conductive threads 208).

[0048] In this configuration, the vertical conductive threads 208 are not charged and thus serve as a virtual ground. However, when the horizontal conductive threads 208 are charged, they capacitively couple with the vertical conductive threads 208. When an object, such as the user's finger, touches the grid of conductive threads 208, a change in capacitance occurs on the vertical conductive threads (increase or decrease). The textile controller 204 uses this change in capacitance on the vertical conductive threads 208 to identify the presence of the object. To do this, the textile controller 204 detects a point of touch input by scanning the vertical conductive threads 208 to detect changes in capacitance.The textile control unit 204 determines the location of the touch input as the interface point between the vertical conductive thread 208 with varying capacitance and the horizontal conductive thread 208 on which the control signal was transmitted. The textile control unit 204 can, for example, determine touch data by identifying the location of each touch as X, Y coordinates on the grid of the conductive thread 208.

[0049] In both the case of implementation as an intrinsic capacitance sensor and in the case of implementation as a projective capacitance sensor, the capacitive sensor 208 is configured to transmit touch data to the gesture manager 218, so that the gesture manager 218 can determine touch-data-based gestures which can be used to control the object 104, the computer device 106, or the applications 216 on the computer device 106.

[0050] The Gesture Manager 218 can be run to recognize a variety of different types of gestures performed on the Interactive Textile 102, such as touches, taps, swipes, holds, and covers. To recognize these diverse gestures, the Gesture Manager 218 is configured to determine the duration of a touch, swipe, or hold (e.g., one second or two seconds), the number of touches, swipes, or holds (e.g., a single tap, a double tap, or a triple tap), the number of fingers used in the touch, swipe, or hold (e.g., one-finger touch or swipe, two-finger touch or swipe, three-finger touch or swipe), the frequency of the touch, and the direction of a touch or swipe (e.g., up, down, left, right).Regarding holding, the gesture manager 218 can also determine which area of ​​the capacitive touch sensor 202 of the interactive textile 102 is being held (e.g., top, bottom, left, right, or top and bottom). The gesture manager 218 can thus recognize a variety of different holding actions, such as covering, covering and holding, five-finger holding, covering and holding with five fingers, pinching and holding with three fingers, and the like. Connecting an electronic component to an interactive textile

[0051] To enable the detection of multitouch input, conductive threads 208 are connected to the electronic components 203, for example a flexible printed circuit board (PCB), during the manufacturing process. Several embodiments employ a connection method to connect an electronic component 203 to loose conductive threads 208 of an interactive textile 102. For example, Fig. 4 to be noted, which illustrates an exemplary connection system 400 that can be used to connect an electronic component to an interactive textile according to one or more embodiments.

[0052] The connection system 400 is configured to accommodate an interactive textile 102, which includes conductive threads 208 arranged in a grid or a series. As previously discussed, each conductive thread 208 includes a conductive wire (e.g., a copper wire) that is twisted, braided, or entangled with one or more flexible threads (e.g., polyester or cotton threads). The interactive textile 102 is configured such that some conductive threads 208 are loose and protrude from the fabric of the interactive textile 102. In general, the connection system 400 can be configured to connect an electronic component 203 to loose conductive threads 208 of the interactive textile 102. In the illustration, the connection system 400 includes a banding component 402, a tissue scraping component 404, a bonding component 406, a sealing component 408 and an encapsulation component 410.

[0053] The tape-forming component 402 represents tools or functions for arranging conductive threads 208 of an interactive textile 102 in tape form, with a grid spacing corresponding to the grid spacing of the connection points 412 (e.g., plates or pads) of the electronic component 203. The stripping component picks up the tape formed by the conductive threads and strips non-conductive material (e.g., silk or polyester) from the conductive threads 208 of the tape to expose the conductive wires. The bonding component 406 then bonds the connection points 412 of the electronic component 203 to the conductive wires of the tape.

[0054] After connecting the terminals 412 of the electronic component 203 to the conductive threads 208 of the interactive textile 102, the sealing component 408 seals the conductive threads 208 located near the tape to protect them from water ingress and corrosion. The encapsulation component 410 then applies a waterproof material (e.g., coating, plastic, or polymer) to the electronic component 203, which firmly attaches the electronic component 203 to the interactive textile and simultaneously prevents water from causing corrosion of the electronic component 203.

[0055] In one or more embodiments, the connection system 400 further includes a controller 414, which can be executed by computer-executable commands and is configured to control the connection system 400 for the purpose of connecting the electronic component 203 to the interactive textile 102. For example, the controller 414 is configured to control the functions of the connection system 400 in order to automate at least some of the processes carried out by components 402 to 410.

[0056] Now, a more detailed discussion of the banding component 402, stripping component 404, bonding component 406, sealing component 408 and encapsulation component 410 must be considered.

[0057] Fig. Figure 5 illustrates a System 500 in which the banding component of the Fig. 4 is used to arrange loose conductive threads 208 of an interactive textile 102 in a ribbon form. In this example, the ribbon forming component 402 receives an interactive textile 102 with loose conductive threads 208, as previously described. A comb tool 502 of the ribbon forming component is used to collect loose conductive threads 208 that break out from the fabric surface of the interactive textile 102 and arrange them at a grid spacing that corresponds to the grid spacing of the connection points 412 of the electronic component 203. In one or more embodiments, the grid spacing of the comb tool can be mechanically adjustable (e.g., using a dial) to allow the manufacturer to set the comb tool 502 according to the grid spacing of the connection point of the specific electronic component 203.

[0058] For example, the comb tool 502 includes several openings configured to receive the loose conductive threads 208 of the interactive textile 102. The distance between the individual openings, also referred to as the grid spacing, can be mechanically adjusted to match the spacing between the openings of the comb tool 502 to the grid spacing of the connection points 412 of the electronic component 203. All loose conductive threads 208 can thus be collected and guided into one of the openings of the comb tool 502, while simultaneously arranging the loose conductive threads 208 according to the grid spacing of the electronic component 203.

[0059] The aligned conductive threads 208 are then coated with a layer 504 within the comb tool 502. The layer 504 can be in a variety of different forms, such as Scotch tape, molded silicone polymer, or hot melt adhesive, to name just a few. After the aligned conductive threads 208 have been coated with the layer 504, a heating element 506 is applied to the layer 504 to create the cured layer 508. It should be noted that the layer 508 secures the conductive threads 208 of the interactive textile 102, ensuring that the conductive threads 208 are permanently aligned with the connection points of the electrical component 203.

[0060] In particular, the band-forming component 402, the comb tool 502, and the heating element 506 can be designed in a variety of different shapes. However, the following illustrate Fig. 6A- Fig. 6C Examples of a banding component according to one or more embodiments.

[0061] Fig. Figure 6A illustrates an example 600 of a comb tool of a band-forming component according to various embodiments. In this example, the loose conductive threads 208 of the interactive textile 102 are collected and guided into each individual opening of the comb tool 502. In some cases, a user guides the loose conductive threads 208 into each individual opening of the comb tool 502. Alternatively, this procedure can be at least partially automatic, such that the controller 414 controls the functions of the connection system 400 to cause the loose conductive threads 208 to be guided into the openings of the comb tool 502.

[0062] Fig. Figure 6B illustrates an additional example of a comb tool of the band-forming component according to various embodiments. In Figure 602, the comb tool 502 is instructed to open in order to tension the conductive threads 208 aligned within the comb tool 502. In Figure 604, the aligned conductive threads 208 within the comb tool 502 are coated with a layer 504.

[0063] Fig. Figure 6C illustrates an example of a heating element of the tape-forming component according to various embodiments. In this example, the heating element 506 is positioned over the coating 504 and pressed down to heat the coating 504, thereby producing the cured tape 508 in which the aligned conductive threads 208 are secured to correspond to the grid spacing of the connection points 412.

[0064] Fig. Figure 7 illustrates a system 700 in which the wiping component 404 of the Fig. 4 for the removal of non-conductive material from the conductive threads 208 of the tape 508 is carried out according to one or more embodiments. In this example, the stripping component 404 picks up the tape 508 produced by the tape-forming component 402, as described previously. As described throughout, each conductive thread of the tape 508 contains non-conductive material that must be removed to allow the conductive threads of the tape 508 to connect to the terminals of the electronic component 203.

[0065] A heated blade 702 of the stripping component 404 is used to strip or remove the non-conductive material (e.g., flexible threads 308 in the form of silk, polyester, or cotton threads) from the conductive threads 208 of the tape 508. This exposes the conductive wires 306 of the conductive threads 208, as illustrated in Figure 704.

[0066] The heated blade 702 is configured to melt or burn the non-conductive material of the conductive threads 208 without melting or burning the conductive wire 306 of the conductive thread 208. For this purpose, the temperature of the heated blades 702 can be regulated such that the temperature is high enough to burn or melt the non-conductive material without burning or melting the conductive wire 306.

[0067] The use of the heated blade 702 particularly increases the efficiency of the stripping process, as the heated blade can strip the non-conductive material from the conductive threads 208 of the tape 508 in a single step, thereby increasing the efficiency of the process. Alternatively, heating elements other than the heated blade 702 can be used. In one or more embodiments, for example, a laser beam can be used to remove the non-conductive material. In this case, the absorption of the laser beam is low, so that the laser beam removes the non-conductive material without removing the conductive wire.

[0068] In particular, the wiper component 404 can be designed in a variety of different shapes. However, the following illustrates Fig. Figure 8A shows an example of a stripping component according to one or more embodiments. In this example, the stripping component 404 is designed as a "hand-operated tool" which can be operated at least partially by a user. The stripping component 404 includes a heated blade 702, which in this example comprises an upper blade 802 and a lower blade 804.

[0069] Fig. Figure 8B illustrates an additional example of the stripping component according to one or more embodiments. In this example, the strip 508 is placed and aligned on the stripping component 404 by positioning the strip 508 on tension pins of the stripping component, which are aligned with the outermost corners of the strip 508, thus enabling precise centering of the strip. By pushing back the upper blade, the conductive threads of the strip can then be tensioned.

[0070] Fig. Figure 8C illustrates an additional example of the stripping component according to one or more embodiments. In this example, a handle 806 is pulled toward the user to cause the upper blade 802 to come into contact with the lower blade 804. The blades are then heated to a temperature high enough to burn or melt the non-conductive threads without burning or melting the conductive wire (e.g., a temperature of approximately 260 degrees Celsius). The upper blade 802 remains in contact with the lower blade 804 for a predetermined duration, causing the non-conductive threads to burn or melt (e.g., 12 seconds). The blades are then pushed away from the user to strip the non-conductive material from the conductive threads 208 of the tape 508 and expose the conductive wires 306.

[0071] Fig. Figure 9 illustrates a System 900 in which the bonding component of the Fig. 4 to page 12 Bonding of an electronic component to the conductive threads of the tape is implemented.

[0072] In this example, the bonding component 406 picks up the tape 508 with exposed conductive wires 306. The bonding component 406 aligns the terminals 412 of the electronic component 203 with the stripped conductive wires 306 of the tape 508. The bonding component 406 then processes a heated rod 902 with solder 904 and presses the heated rod 902 with the solder 904 against the exposed conductive wires 306 and the terminals 412 to cause each exposed conductive wire to be bonded to a corresponding terminal of the electronic component, as illustrated by Figure 906. Since the collected conductive strands of the tape 508 and the terminals 412 of the electronic component 203 have, in particular, the same grid spacing, this method is equivalent to a method for joining standard cables. The bonding component 406 can be manufactured in a variety of different shapes.However, the bonding component 406 is designed in one or more versions as a "hand-operated tool" which can be operated at least partially by a user.

[0073] Fig. Figure 10 illustrates a System 1000 in which the sealing component 408 of the Fig. 4 is used to seal the conductive threads according to one or more configurations. In this example, the sealing component 408 accommodates the electronic component 203 with bonded conductive threads 208. An epoxy tool 1002 is used to apply epoxy 1004 to each individual conductive thread 208.

[0074] In one or more versions, the epoxy tool is equipped with a multi-nozzle spray head, enabling the simultaneous application of epoxy to each individual conductive filament 208. The multi-nozzle spray head can, for example, have 12 nozzles to allow the simultaneous application of epoxy to 12 conductive filaments 208. Alternatively, the epoxy tool 1002 can be equipped with a single nozzle; in this case, the epoxy must be applied separately to each individual conductive filament.

[0075] For example, Fig. Figure 11 illustrates an example 1100 of epoxy tools according to one or more embodiments. Figure 1102 illustrates a single-head nozzle, and Figure 1104 illustrates a multi-head nozzle. In particular, the epoxy 1004 is applied to the conductive threads 208 located at the base of the tape 508, such that the tape is positioned between the applied epoxy and the electronic component 203. After application of the epoxy 1004, the epoxy and the conductive threads are cured with UV light or heat by placing the electronic component and the connected conductive threads in a curing box 1006. This causes the epoxy to penetrate the fiber of the conductive thread 208, thus preventing fluid from passing through the conductive threads 208 to the electronic component 203.

[0076] Fig. Figure 12 illustrates a system 1200 in which the encapsulation component 410 of the Fig. Step 4 is performed to encapsulate an electronic component 203 bonded to the interactive textile 102. In this example, the encapsulation component 410 accommodates the electronic component 203 with bonded conductive threads, which have been sealed with epoxy as described previously.

[0077] In the encapsulation process, the electronic component 203, bonded to the conductive wires 306, is firmly attached to the interactive textile 102. To protect the electronic component 203, a waterproof housing (e.g., plastic or polymer) is bonded to the fabric of the interactive textile 102, so that the electronic component 203 is enclosed within the encapsulation.

[0096] For this purpose, the electronic component 203 and the tape 508 are placed in a mold 1202. Then, a waterproof material 1204, or another waterproof material, is applied to the mold 1202 (e.g., using an extrusion gun) so that the waterproof material hardens around the electronic component 203 and the tape 508. Then the electronic component 203 and the ribbon 508 are removed from the mold 1302, and the polymer hardens around the electronic component and the ribbon to form an encapsulation 1206.In particular, the electronic component 203, the tape 508, and the conductive threads adjacent to the tape 508 are completely encapsulated. Furthermore, since the conductive threads are sealed at the base of the tape 508, water is prevented from entering the encapsulation 1206. Example procedure

[0078] Fig. Figure 13 illustrates an exemplary procedure 1300 for connecting an electronic component to an interactive textile. This procedure is presented using block statements that specify the operations to be performed, but are not necessarily limited to the sequence or combinations shown in order to perform the operations by the corresponding blocks. The techniques are not limited to being performed by a single unit or by multiple units operating on the same device.

[0079] In component 1302, loose conductive threads of the interactive textile are collected and arranged in a band form with a grid spacing that corresponds to the grid spacing of the connection points of an electronic component. For example, the band-forming component 402 collects loose conductive threads 208 of the interactive textile 102 and arranges them in the form of a band 508 with a grid spacing that corresponds to the grid spacing of the connection points 412 of the electronic component 203.

[0080] At 1304, non-conductive material is stripped from the conductive threads of the tape to expose the conductive wires of the conductive threads. For example, the stripping component 404 strips non-conductive material from the conductive threads 208 of the tape 508 to expose the conductive wires 306.

[0081] At 1306, the connection points of the electronic component are bonded to the exposed conductive wires of the tape. For example, the bonding component 406 bonds the connection points 412 of the electronic component 203 to the exposed conductive wires 306 of the tape 508.

[0082] In component 1308, the conductive threads at the base of the tape are sealed with an epoxy. For example, the sealing component 408 seals the conductive threads 208 at the base of the tape 508 with an epoxy 1004.

[0083] In component 1310, the electronic component and the tape are encapsulated with a waterproof material. For example, the encapsulation component 410 encapsulates the electronic component 203 and the tape 508 with a waterproof material, such as plastic or polymer. Example computer system

[0084] Fig. Figure 14 illustrates various components of an exemplary Computer System 1400, which can be accessed by any client, server, and / or computer device, referring to the Fig. 1- Fig. The configuration described in section 13 above can be used to connect an electronic component to an interactive textile. In embodiments, the computer system 1400 can be implemented as a wired and / or wireless portable device, a system-on-a-chip (SoC), and / or another type of device or part thereof, as well as a combination thereof. The computer system 1400 can be connected to a user (e.g., a person) and / or an entity that operates the device, such that a device refers to logical devices that include users, software, firmware, and / or combinations of devices.

[0085] The 1400 computer system includes communication devices 1402 that enable wired or wireless transmission of device data 1404 (e.g., received data, data in transit, data intended for transmission, data packets, etc.). Device data 1404 or other device content may include device configuration settings, media content stored on the device, and / or information associated with the device user. Media content stored on the 1400 computer system may include any type of audio, video, and / or image data.The computer system 1400 includes one or more data inputs 1406 through which any form of data, media content and / or input can be received, for example, human utterances, touch data generated by an interactive textile 102, user-selectable input (explicit or implicit), messages, music, TV media content, recorded video content and any other form of audio, video and / or image data that can be received from any other content and / or data sources.

[0086] The Computer System 1400 also includes communication interfaces 1408, which can be implemented in any form of single or multiple serial and / or parallel interfaces, wireless interfaces, any form of network interface, a modem, and any other communication interfaces. The communication interfaces 1408 provide a connection and / or other communication links between the Computer System 1400 and a communication network, through which other electronic, computer, and communication devices transmit data to the Computer System 1400.

[0087] The Computer System 1400 includes one or more processors 1410 (e.g., any type of microprocessor, controller, and the like) that process computer-executable instructions to control the operation of the Computer System 1400 and enable techniques for interactive textiles, or their embodiments. Alternatively or additionally, the Computer System 1400 can be implemented with any hardware, firmware, or logic circuits, or combinations thereof, that are executed in conjunction with processing and controlling circuits, generally identified at 1412. Although not shown, the Computer System 1400 may include a system bus or data transmission system that couples the various components within the device.

[0088] A system bus can include any bus structures, as well as combinations thereof, for example a memory bus or memory controller, a peripheral bus, a universal serial bus and / or a processor or local bus that uses any form of bus architecture.

[0089] The Computer System 1400 also includes a computer-readable medium 1414, for example, one or more storage devices that enable persistent or non-temporary data storage (i.e., as opposed to mere signal transmission), which include, for example, random-access memory (RAM), non-volatile memory (e.g., single or multiple read-only memory (ROM), flash memory, EPROM, EEPROM, etc.), and a disk storage device. A disk storage device can be any form of magnetic or optical storage device, for example, a hard disk drive, recordable or rewritable compact discs (CDs), any form of digital versatile discs (DVDs), and the like. The Computer System 1400 can also include a mass storage device 1416.

[0090] The computer-readable medium 1414 provides data storage mechanisms for storing device data 1404, as well as various device applications 1418 and any other types of information and / or data relating to the operational aspects of the computer system 1400. For example, an operating system 1420 can be maintained as a computer application using the computer-readable medium 1414 and executed on processors 1410. The device applications 1418 can include a device manager, for example, any form of control application, software applications, signal processing and control modules, specific device code, a hardware abstraction layer for a specific device, and the like. This text was taken from original sources by the DPMA. It contains no drawings. The presentation of tables and formulas may be unsatisfactory.

[0091] The device applications 1418 also include any system components, generators, or manager devices for connecting an electronic component to an interactive textile. In this example, the device applications 1418 include a gesture manager 218 and a controller 414.

Claims

[1] Method for connecting an electronic component to an interactive textile, the method comprising: the collection of loose conductive threads of the interactive textile and the arrangement of these threads in band form with a grid spacing corresponding to a grid spacing of the connection points of the electronic component, wherein the collection and arrangement comprises the collection and arrangement of loose conductive threads with a comb tool which includes openings whose spacing corresponds to the grid spacing of the connection points; the stripping of non-conductive material from the conductive threads of the tape to expose the conductive wires of the conductive threads; bonding the connection points of the electronic component to the exposed conductive wires of the tape; sealing the conductive threads at the base of the tape with an epoxy; and encapsulating the electronic component and the tape with a waterproof material. [2] Method according to claim 1, further comprising forming the band: the arrangement of the loose conductive threads within the openings of the comb tool; the coating of the aligned conductive threads within the comb tool; and Heating the coating to secure the aligned conductive threads. [3] Method according to claim 2, wherein the grid spacing of the comb tool is mechanically adjustable. [4] Method according to any one of claims 1 to 3, wherein the stripping of non-conductive material from the conductive threads of the tape comprises the application of a heated blade to the conductive threads of the tape in order to melt or burn the non-conductive material from the conductive threads of the tape. [5] Method according to any one of claims 1 to 4, wherein the stripping of non-conductive material from the conductive threads of the tape comprises applying a laser beam to the conductive threads of the tape to remove the non-conductive material from the conductive threads of the tape. [6] Method according to any one of claims 1 to 5, wherein the bonding of the connection points of the electronic component to the exposed conductive wires of the tape further comprises: aligning the exposed conductive wires of the tape to the connection points of the electronic component; and Pressing a heated rod with solder against the exposed conductive wires and connection points, so that each exposed conductive wire is bonded to a corresponding connection point of the electrical component. [7] Method according to any one of claims 1 to 6, wherein the sealing of the conductive threads at the base of the tape with an epoxy comprises: the application of the epoxy to each of the conductive threads at the base of the tape; and hardening the epoxy with UV light or heat. [8] Method according to claim 7, wherein the epoxy is applied individually to each individual conductive thread at the base of the tape using a single-headed nozzle. [9] Method according to any one of claims 1 to 8, comprising encapsulating the electronic component and the tape with a waterproof material: the insertion of the electronic component and the tape into a mold; Applying the waterproof material to the mold so that the waterproof material hardens around the electronic component and the tape. [10] Method according to claim 9, wherein the electronic component comprises a flexible printed circuit board, and / or wherein the conductive wires comprise copper wires. [11] System for connecting an electronic component to an interactive textile, the system comprising: a tape-forming component comprising a comb tool and a heating element, the tape-forming component configured to gather and arrange loose conductive threads of the interactive textile using a comb tool, and to press the heating element over a coating applied over the conductive threads arranged in the comb tool to form a tape; a configured stripping component comprising a heated blade, the stripping component configured to apply the heated blade to the conductive threads arranged in the comb tool to strip non-conductive material from the conductive threads and expose the conductive wires of the conductive threads; and a bonding component comprising a heated rod, the bonding component configured to press the solder-treated heated rod against the exposed conductive wires and the connection points, so that each exposed conductive wire is bonded to a corresponding connection point of the electrical component. [12] System according to claim 11, wherein the comb tool includes openings whose spacing corresponds to the grid spacing of the connection points, and / or further comprising a sealing component configured to apply epoxy to each individual conductive thread at the base of the tape and to cure the epoxy with UV light or heat to seal the conductive threads at the base of the tape, and / or further comprising an encapsulation component configured to place the electronic component and the tape into a mold and to apply a waterproof material to the mold such that the waterproof material cures and forms an encapsulation around the electronic component and the tape.