METHOD FOR DEVELOPING A POWER ELECTRONICS SYSTEM
Patent Information
- Application Number
- DE102016114324
- Authority / Receiving Office
- DE · DE
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2015-08-19
- Filing Date
- 2016-08-03
- Publication Date
- 2026-08-27
- Estimated Expiration
- 2036-08-03
AI Technical Summary
Existing power electronics systems in electric vehicles face challenges in efficiently converting direct current from traction batteries to alternating current for electric machines while ensuring effective cooling and structural integrity.
A monolithic power module is formed by bonding transistor-based switching arrangements with a resin, incorporating coolant chambers and a manifold, and encapsulating them in a housing to create a unified power electronics assembly that efficiently converts DC to AC and manages cooling.
The solution provides a robust, efficient, and compact power conversion system with integrated cooling, enhancing the performance and durability of electric vehicle powertrain components.
Smart Images

Figure 00000000_0000_ABST
Abstract
Description
AREA OF TECHNOLOGY
[0001] The present disclosure relates to power electronics systems for an electric powertrain of a motor vehicle. BACKGROUND
[0002] Vehicles such as battery electric vehicles (BEVs), plug-in hybrid electric vehicles (PHEVs), and fully hybrid electric vehicles (FHEVs) contain a traction battery assembly whose purpose is to serve as an energy source for one or more electric motors. The traction battery includes components and systems designed to support the vehicle's power and operational management. A power inverter is electrically connected between the battery and the electric motors to convert the direct current (DC) coming from the battery into alternating current (AC) compatible with the electric motors. The power inverter can also act as a rectifier to convert AC from the electric motors into DC compatible with the battery. SUMMARY
[0003] According to one embodiment, a power electronics assembly comprises a housing and an array of power stages arranged within the housing. Each power stage includes a transistor-based switching arrangement designed to convert direct current from a traction battery into alternating current for an electric motor. The power stages are bonded together with a resin to form a monolithic power module that is bonded to a wall of the housing.
[0004] According to another embodiment, a power electronics assembly comprises a housing and an array of power stages arranged within the housing. Each power stage includes a transistor-based switching arrangement designed to convert direct current from a traction battery into alternating current for an electric motor. A distributor is arranged opposite the array. The power stages are bonded to each other and to the distributor via a resin, forming a monolithic power module bonded to a wall of the housing.
[0005] According to yet another embodiment, a method for forming a power module assembly includes arranging power stages and coolant chamber cores in a linear stack such that the cores are nested between the power stages, and attaching a distributor core to the stack to form a subassembly. The distributor extends along the length of the stack. The method also includes placing the subassembly into a mold cavity of an injection molding machine and injecting resin into the mold cavity to encapsulate the subassembly, thereby forming a power module. The method further includes circulating a solvent through the power module to dissolve the coolant chamber and distributor cores.
[0006] According to a further embodiment, a method for forming an inverter system controller includes providing an L-shaped section of a housing having a bottom and a side wall, and connecting a mold—comprising a pair of side plates extending from the side wall and a transverse plate extending between the side plates—to the L-shaped section, such that the side plates, the transverse plate, the side wall, and the bottom are joined together to form a mold cavity. The method further includes placing a manifold into the mold cavity and arranging power stages and coolant chamber cores in a linear stack such that the cores are arranged in layers between the power stages.The process also involves inserting the linear stack into the mold cavity and pouring resin into the cavity to encapsulate the linear stack and manifold, forming a power module. The process further involves circulating a solvent through the power module to dissolve the coolant chamber cores. BRIEF DESCRIPTION OF THE DRAWINGS
[0007] Fig. Figure 1 is a schematic representation of an example hybrid vehicle.
[0008] Fig. Figure 2 is a circuit diagram of a variable voltage converter and a power inverter.
[0009] Fig. 3 is a perspective view of a performance level.
[0010] Fig. 4 is a side view, in cross-section, of the performance level of Fig. 3 along the intersection line 4-4.
[0011] Fig. Figure 5 is a perspective view of a subassembly, showing the performance levels of Fig. 3 and soluble cores.
[0012] Fig. Figure 6 is a schematic front view of an injection molding device.
[0013] Fig. Figure 7 is a perspective view of the injection molding device of Fig. 3.
[0014] Fig. 8 is a perspective view of a mold made with the injection molding device of Fig. 3 manufactured power module assemblies.
[0015] Fig. 9 is a side view, in cross-section, of the power module assembly of Fig. 8 along the intersection line 9-9.
[0016] Fig. Figure 10 is a resolved perspective view of an inverter system control.
[0017] Fig. Figure 11 is a perspective view of another power module assembly.
[0018] Fig. Figure 12 is a perspective view of a section of another inverter system controller without a built-in power module.
[0019] Fig. Figure 13 is a perspective view of a section of the inverter system control of Fig. 11 with built-in power module.
[0020] Fig. Figure 14 is a flowchart for the manufacture of a power module assembly according to one embodiment. DETAILED DESCRIPTION
[0021] Embodiments of the present disclosure are described here. It is understood, however, that the disclosed embodiments are merely examples, and that other embodiments may take diverse and alternative forms. The figures are not necessarily to scale; some features may be exaggerated or minimized to show details of certain components. Therefore, the specific structural and functional details disclosed here are not to be interpreted as limiting, but merely as a representative basis for teaching the person skilled in the art how to use the present invention in a variety of ways.It is obvious to the person skilled in the art that various features illustrated and described with reference to any of the figures can be combined with other features illustrated in one or more of the other figures to produce embodiments not expressly illustrated or described. The combinations of illustrated features provide representative embodiments for typical applications. However, for certain applications or implementations, various combinations and modifications of the features, corresponding to the teachings of this disclosure, may be desirable.
[0022] An exemplary PHEV is in Fig. 1 shown and is generally referred to as a vehicle 16 designated. The vehicle 16 includes a gearbox 12 and is powered by at least one electric motor 18 with support from an internal combustion engine 20powered. The electric machine 18 can one in Fig. 1. The alternating current electric motor depicted as a "motor". The electric machine 18 It absorbs electrical power and provides torque for vehicle propulsion. The electric motor 18 It also acts as a generator to convert mechanical power from regenerative braking into electrical power.
[0023] The gearbox 12 It can be a power-split design. The gearbox 12 The first electric machine includes 18 and a second electric machine 24 The second electric machine 24 can one in Fig. The first is an alternating current electric motor depicted as a "generator". The second electric machine 24 It takes on the form of the first electric machine 18 The second electric machine generates electrical power and provides an output torque. 24It also acts as a generator to convert mechanical power into electrical power and optimize the power flow through the gearbox. 12 In other embodiments, the transmission does not have a power-split design.
[0024] The gearbox 12 can a planetary gear unit 26 include a sun wheel 28 , a planetary carrier 30 and a ring gear 32 includes the sun wheel. 28 is connected to an output wave of the second electric machine 24 connected to absorb a generator torque. The planetary carrier 30 is connected to an output shaft of the power machine 20 connected to absorb a power machine torque. The planetary gear unit 26 combines the generator torque with the engine torque and adjusts around the ring gear 32 A combined output torque is ready. The planetary gear unit 26It functions as a continuously variable transmission without fixed or "step" gear ratios.
[0025] The gearbox 12 It can also include a freewheel clutch and a generator brake. 33 include the freewheel clutch connected to the output shaft of the power unit. 20 The freewheel clutch prevents the gearbox from rotating in only one direction. It is coupled so that the output shaft can only rotate in one direction. 12 the power machine 20 reverse drive. The generator brake 33 is with the output wave of the second electric machine 24 coupled. The generator brake 33 can be activated to control the rotation of the output shaft of the second electric machine 24 and the ring gear 28 to "brake" or prevent. Alternatively, the freewheel clutch and the generator brake can be used. 33 eliminated and replaced by control strategies for the power engine 20 and the second electric machine24 be replaced.
[0026] The gearbox 12 may also include a countershaft, intermediate gears, including a first gear 34 , a second gear 36 and a third gear 38 Includes a planetary output gear. 40 is with the hollow gear 32 connected. The planetary output gear 40 combs with the first gear 34 , to generate a torque between the planetary gear unit 26 and to transmit the power to the countershaft. An output gear 42 is with an output wave of the first electric machine 18 coupled. The output gear 42 combs with the second gear 36 , to generate a torque between the first electric machine 18 and to transmit the power to the countershaft. A transmission output gear. 44 is equipped with a drive shaft 46 connected. The drive shaft 46is through a differential 50 with a pair of driven wheels 48 coupled. The transmission output gear 44 combs with the third gear 38 , to create a torque between the gearbox 12 and the driven wheels 48 to transfer.
[0027] The vehicle 16 includes an energy storage device, such as a traction battery 52 , for storing electrical energy. The battery 52 is a high-voltage battery capable of delivering electrical power to power the first electric machine 18 and the second electric machine 24 to operate the battery 52 It also draws electrical power from the first electric machine. 18 and the second electric machine 24 on, when they operate as generators. The battery 52is a battery pack composed of several battery modules (not shown), each battery module containing several battery cells (not shown). In other embodiments of the vehicle 16 Other types of energy storage devices, such as capacitors and fuel cells (not shown), are provided for, which replace the battery. 52 supplement or replace. A high-voltage bus connects the battery. 52 electrically with the first electric machine 18 and the second electric machine 24 .
[0028] The vehicle includes a battery energy control module (BECM). 54 to control the battery 52 The BECM 54 It receives an input that displays vehicle and battery states, such as battery temperature, voltage, and current. The BECM 54The BECM calculates and estimates battery parameters, such as battery charge level and battery performance. 54 provides an output to other vehicle systems and controls (BSOC, P cap ), ready to provide a battery state of charge (BSOC) and battery power capability (P). cap ) displays.
[0029] The vehicle 16 includes a DC / DC converter or variable voltage converter (VVC) 10 and an inverter 56 The VVC 10 and the inverter 56 are electrically connected between the traction battery 52 and the first electric machine 18 and between the battery 52 and the second electric machine 24 switched. By the VVC 10 The voltage potential of the battery is 52The electrical power provided was "raised" or increased. (VVC) 10 According to one or more embodiments, the voltage potential of the battery is also 52 The supplied electrical power is "lowered" or reduced. The inverter 56 It is used to operate the electric machines 18 , 24 , which are the main battery 52 (by the VVC) 10 The inverter converts the supplied direct current power into alternating current power. 56 converts to charge the traction battery 52 also from the electric machines 18 , 24 The supplied alternating current power is converted into direct current power. Other embodiments of the gearbox. 12 include several inverters (not shown), such as one for each electric machine 18 , 24 assigned inverter. The VVC 10 includes an inductive assembly 14 .
[0030] The gearbox 12 includes a transmission control module (TCM) 58 to control the electric machines 18 , 24 of the VVC 10 and the inverter 56 Traditional Chinese Medicine (TCM) 58 is designed to control, among other things, the position, speed and energy consumption of the electric machines 18 , 24 to monitor. The TCM 58 It also monitors electrical parameters (for example, voltage and current) at various points within the VVC. 10 and the inverter 56 Traditional Chinese Medicine (TCM) 58 provides other vehicle systems with corresponding output signals based on this information.
[0031] The vehicle 16 includes a vehicle system controller (VSC) 60 , which communicates with other vehicle systems and controls to coordinate their function. Although the VSC 60While shown as a single controller, it can include multiple controllers that can be used to control multiple vehicle systems according to an overall vehicle control logic or software.
[0032] The vehicle control systems, including the VSC 60 and of TCM 58 VSCs generally contain any number of microprocessors, application-specific integrated circuits (ASICs), integrated circuits (ICs), memory (e.g., FLASH, ROM, RAM, EPROM, and / or EEPROM), and software code to work together to perform a series of operations. The controllers also include predefined data, or "lookup tables," based on calculations and test data, which are stored within memory. 60 communicates with other vehicle systems and controls (for example, the BECM) 54 and TCM 58) via one or more wired or wireless vehicle connections using common bus protocols (for example, CAN and LIN). The VSC 60 receives an input (PRND) indicating the current position of the gearbox. 12 (for example, park, reverse, neutral, or "drive"). The VSC 60 It also receives an input (APP) representing an accelerator pedal position (APP). The VSC 60 represents TCM 58 an output is provided that represents a target wheel torque, a target engine speed, and a generator braking command; and the BECM 54 a contactor control.
[0033] The vehicle 16 includes an engine control module (ECM) 64 to control the power engine 20 The VSC 60 presents the ECM 64An output (engine target torque) is provided, based on a number of input signals including APP, and corresponds to a vehicle propulsion request from the driver.
[0034] If the vehicle 16 a PHEV can 52 via a charging port 66 The vehicle periodically receives alternating current energy from an external power supply or network. 16 also includes an on-board charger 68 , which draws the alternating current energy from the charging port 66 records. The charger 68 is an AC / DC converter that converts the absorbed AC energy into energy for charging the battery. 52 converts suitable direct current energy. The charger 68 The direct current energy is then used during the battery recharging process. 52 To. It goes without saying that the inverter 56 , although in the context of a PHEV 16It is shown and described, but can be implemented in other types of electric vehicles, such as a HEV or a BEV.
[0035] In Fig. 2 is now a circuit diagram of the VVC 10 and the inverter 56 shown. The VVC 10 It can include one or more power stages, each featuring a transistor-based switching arrangement, such as a half-bridge. Each power stage includes a first switching unit. 70 and a second switching unit 72 to increase the input voltage (V bat ), to generate an output voltage (V dc ) to provide. The first switching unit 70 can a first transistor 74 include, which leads to a first diode 76 The two components are connected in parallel, but their polarities are reversed (antiparallel). The second switching unit 72 can use a second transistor 78 include, which leads to a second diode80 The transistors are connected in antiparallel. 74 , 78 Each transistor can be any type of controllable switch (e.g., an insulated bipolar transistor (IGBT) or a field-effect transistor (FET)). Furthermore, the transistors can be... 74 , 78 each individually through TCM 58 can be controlled. The inductive assembly 14 is depicted as an inductive input element that is connected between the traction battery 52 and the switching units 70 , 72 It is connected in series. The inductive component 14 A magnetic flux is generated when a current is applied. When the current passes through the inductive component... 14 When the flowing current changes, a time-varying magnetic field is generated and a voltage is induced. Other embodiments of the VVC 10 include alternative circuit designs.
[0036] The inverter 56 It can include multiple power stages stacked in a module, which feature a transistor-based switching arrangement, such as a half-bridge. Each half-bridge can have a positive DC supply line. 84 They feature a positive DC input coupled to a positive DC input from the battery and a negative DC input coupled to a negative DC input from the battery. The half-bridges 82 can also each be a first switching unit 88 and a second switching unit 90 include the first switching unit 88 can a first transistor 92 include, which leads to a first diode 94 is connected in parallel. The second switching unit 90 can use a second transistor 96 include, which leads to a second diode 98 is connected in parallel. The first and second transistors 88 , 96They can be IGBTs or FETs. The first and second switching units 88 , 90 each of the half-bridges 82 converts the battery's direct current into a single-phase alternating current output at the AC power supply line. 100 um. The AC power supply lines 100 are each electrically connected to the motor 18 or generator 24 tied together.
[0037] In the illustrated embodiment, the VVC includes 10 two power levels and the inverter includes 9 Power levels (three for the generator) 24 and six for the engine 18 In other embodiments, the VVC includes 10 one power level and the inverter includes six power levels (three for the generator). 24 and three for the engine 18 The VVC power levels and the inverter power levels can be identical components and are generally referred to as power levels.82 These can be referred to as such. Both the VVC power stages and the inverter power stages can be arranged in a common stack.
[0038] As in Fig. 3 and Fig. As shown in section 4, each performance level can be used. 82 opposite main pages 110 , opposite side pages 112 , a top 138 and a floor 140 include the performance level 82 It also includes a positive DC power connection. 114 , a negative DC power connection 116 , an AC power connection 118 and signal connection pins 120 , which are electrically connected to the semiconductor components of the power stage 82 are connected. The position of the terminals and signal pins can vary depending on the embodiment and is not limited to the configuration shown. For example, the signal pins can be located 120on the upper part 138 and the AC power connection is located on the left side.
[0039] A first record 122 is on one of the main pages 110 and a second record 124 on the other main page of the performance level 82 arranged. The plates 122 , 124 They can be made of metal, plastic, composite material, or a combination thereof. The semiconductor components of the power stage 82 can be done with an epoxy resin 127 or filled with other filler material to electrically insulate the semiconductor devices from the plates and other components. Note: For clarity, the epoxy resin is not hatched.
[0040] A multiple performance levels 82They are arranged in a stack and combined with other components to form a power module. The power module can be further enhanced by overmolding or injection molding a subassembly that defines the power levels. 82 and other components, are produced with a resin to form a monolithic power module.
[0041] In Fig. 5 begins an exemplary process of developing a monolithic performance module by assembling the performance levels. 82 and other components to a subassembly 150 The sub-assembly includes a number of performance levels. 82 , which are arranged in a linear stack such that their main sides 110 are facing each other. A plurality of soluble nuclei 152 are nested between the performance levels 82 arranged so that a core 152 between immediately adjacent performance levels82 This arrangement of power stages and cores can be described as a stack. 154 The cores are placeholders used to create internal cavities within the completed power modules after the cores have been removed. In the illustrated embodiment, the cores are 152 Placeholders for internal coolant chambers. The cores 152 can be made from any soluble material such as extruded polystyrene foam (e.g. Styrofoam) ® ), sugar, salt, sand or wax.
[0042] The subassembly 150 also includes a distribution core 156 , which can be made of any soluble material. The distributor core 156 is a placeholder used to create an internal cavity in the completed power module, which serves as a distributor for the coolant chambers. The distributor core 156is against the stack 154 The distributor is arranged so that it extends along one length of the stack. In the example shown, the distributor core is located on the bottom of the stack; however, in other embodiments, the distributor can be placed on a different side. The distributor core 156 includes a pair of protrusions 158 , which consist of an end 160 of the distributor core 156 extend outwards. The projections 158 are located where the distributor's inlet and outlet channels will be. In other embodiments, the stack 154 Instead of a distributor core, an actual distributor is attached.
[0043] After assembly, the sub-assembly 150 Ready for shaping. Fig. 6 and Fig. Figure 7 shows a schematic representation of an injection molding device for the sub-assembly. 150 The injection molding device162 includes a first forming tool 164 and a second forming tool 166 The first forming tool 164 includes a molding fixture surface 168 , which have a cavity embedded in the first mold 170 forms. The second forming tool 166 includes a molding fixture surface 172 , which have a cavity embedded in the second mold 174 forms the first and second forming tools 164 , 166 They are movable relative to each other between an open position (shown) and a closed position (not shown). In the closed position, the cavities act 170 , 174 together and form a partial cavity 178 , which the sub-assembly 150 surrounds. The mold surfaces 168 , 172 Additional exceptions may apply in each case. 176 for the inclusion of sections of the subassembly 150form. For example, some of the cutouts serve to 176 to accommodate the connections of the power stages 82 The exceptions 176 The cutouts are shown schematically and may differ in practice. Alternatively, the cutouts can be omitted entirely and a different structural element used for the signal connection pins and terminals.
[0044] The subassembly 150 can be combined with a planar component 180 – such as a plastic, composite or metal disc – injection molded, which are also located within the partial recess 178 is recorded. To capture the planar component 180 to include, each of the cavities 170 , 174 an enlarged section (or a secondary cavity) 182 , which extends further into the mold than the main section of the cavity. The enlarged section 182is shaped in such a way that it corresponds to the planar component 180 corresponds to and incorporates a section of the planar component when the mold tools are closed.
[0045] Before closing the molds, the subassembly 150 against a main page 184 the planar component 180 arranged. The planar component 180 forms a pair of channels 186 for connection to the cooling system (not shown). One of the channels is an inlet channel and the other is an outlet channel, connecting to respective lines of the cooling system. Each channel can have a stub section. 188 include, which consists of the planar component 180 extends to assist in attaching the channels to the cooling system. The subassembly 150 and the planar component 180 are so aligned that the projections 158 in the canals 186be recorded.
[0046] As soon as the sub-assembly 150 and the planar component 180 correctly aligned with each other and within the molding device 162 are held, the forming tools can 164 , 166 must be closed. At least one of the molds includes an injection nozzle channel. 190 , which provides access to the cavity 178 provides. An injector nozzle 192 A resin material is injected into the injection nozzle channel. 190 one and then into the partial cavity 178 via partial cutouts (not shown). The resin material fills the gap between the mold surfaces and the subassembly and planar component to form the subassembly. 150 to encapsulate in resin. The resin connects each of the performance levels. 82 , the kernels 152 and the distributor core 152(or the distributor) are bonded together, forming a monolithic power module. A monolithic power module is a single unit and is cast as one piece (in the sense that a monolithic integrated circuit is a set of electronic circuits formed on a single chip).
[0047] The resin also bonds the subassembly and the planar component together. After the resin has set or cured (depending on the type of resin used), the first and second molds open, and the injection-molded power module is removed. The resin can be an epoxy resin or another polymer. The power module can be connected to a line for circulating a solvent to dissolve the cores, exposing the manifold and coolant chambers. The solvent can be water, acetone, or another chemical. The choice of solvent depends on the core material. Alternatively, assembly proceeds, and the cores are dissolved later.
[0048] As now in Fig. As shown in section 8, the power module assembly includes (with 200 (designated) the monolithic power module 202 and the planar component 180 The performance module 202includes the majority of performance levels 82 , which are enclosed in a housing made of hardened resin 204 are encapsulated. The partial cavity 178 is designed so that the remote ends of the connections 114 , 116 and 118 and signal connection pins 120 They are not encapsulated in resin. Sections of the connectors and signal pins therefore extend from the housing. 204 outwards, allowing them to be electrically and mechanically coupled to other electrical components.
[0049] Fig. Figure 9 shows a cross-sectional view of the power module assembly. 200 along section line 9-9. In this figure, the cores were separated to form a distributor. 206 and coolant chambers 208 to expose the coolant chambers. These are located between immediately adjacent power stages. 82 arranged and enclosed 204and the outer panels 122 formed. The coolant chambers each contain at least two openings. 210 , which are in fluidically communicating connection with the distributor 206 stand. The distributor 206 It can have an inlet chamber (not shown) and an outlet chamber. 212 include, which are separated by a partition (not shown) that forms a section of the housing 204 is. The outlet chamber 212 is in fluid communication with one of the channels 186 about an implementation 214 inside the enclosure 204 The canal 186 and the implementation 214 are axially aligned with each other. The inlet chamber can be separated from the outlet chamber. 212 same.
[0050] Fig. Figure 10 is a exploded view of an inverter system controller (ISC). 220, which can also be referred to as a power electronics assembly. The ISC 220 The power module assembly includes 200 , which the power module 202 and the planar component 180 includes the ISC 220 also includes a case 222 The planar component 180 forms one side of the casing 222 for example, the planar component 180 the front wall of the housing 222 out. The casing 222 also includes a top 224 , a floor 226 , a left side 228 , a right side 230 and a reverse side 231 The individual walls of the housing are connected to form a rectangular structure that provides an interior for the electronic components housed within. Some walls of the housing 222 can be formed in one piece. A capacitor bank 232is inside the power module 202 arranged immediately adjacent to each other. Busbars 233 do the DC connections couple 114 , 116 of the power module 202 mechanical and electrical connections 236 the capacitor battery 232 A gate driver board 234 is electrically connected to the signal connection pins 120 connected. The AC connections 118 of the power module 202 The electric motors can be connected via an AC busbar assembly (not shown). Another busbar can electrically connect the VVC power stages to the inductive component located outside the enclosure. 222 It may also be located inside the housing. Other components, such as current sensors, a power supply board, and a control board, can also be found there. 222 be arranged.
[0051] In Fig. 11 is a power module assembly 336 shown according to another embodiment. The power module assembly 336 similar to the power module assembly 200 , but instead of injection molding a subassembly and a planar component, the power module assembly is 336 by injection molding a sub-assembly (similar to the sub-assembly) 150 ) with a box construction 338 trained. The performance module assembly 336 includes a monolithic power module 340 , which is bonded to one side of the box construction 338 is attached. The box construction 338 forms a section of the ISC package. For example, the box construction 338 form the front, back and side walls of the ISC housing.
[0052] Fig. 12 and Fig. 13 represent a different ISC 300This is also known as a power electronics assembly. The ISC 300 includes a housing 302 The housing may have a hinged design, which includes a first section 304 and a second section 310 exhibits what is schematically represented by dotted lines. The first section 304 includes a front panel joined along one edge, forming an L-shaped section 306 and base plate 308 The second section includes the cover plate. 312 , a first side panel 314 , a second side panel 316 and a backplate 318 The first and second sections 304 , 310 They work together in their composite state to form an interior.
[0053] The ISC 300 also includes one with the case 302 connected form 320 The form 320can one with the front 306 and the ground 308 linked first and second page 322 , 324 and one with the first and second page 322 , 324 and the ground 308 connected back 326 include the walls of the mold. 320 form a mold cavity 320 for forming a power module. In some embodiments, the shape 320 one piece with the first section 203 of the case 302 be trained. Alternatively, the form can be 320 , as shown, a separate component that attaches to the housing 302 is attached with fasteners, adhesive or other means.
[0054] The power module can be created by overmolding a multiple power stages and a distributor in the mold cavity. 328They are formed with a resin or potting compound such as epoxy resin. In a first step, the performance levels are determined. 332 and soluble nuclei 334 arranged in a stack to form a subassembly 330 to train. The performance levels 332 are arranged so that the main pages of each performance level face a main page of an immediately adjacent performance level. The cores 334 are nested between the main pages of the performance levels 332 arranged.
[0055] Next, a distributor will be installed. 341 (or a distributor core) is placed into the mold cavity. The distributor 341 includes an inlet channel 342 and outlet channel 344 , which are integrated into the front panel 306 formed inlet and outlet channels 346 , 348 are aligned. The channels of the front panel 306are arranged in such a way that they align with the channels of the distributor 341 are offset to bring the channels into a fluidly communicating connection. The channels 346 , 348 are designed to be connected to the supply and return lines of a coolant circulation system.
[0056] The distributor can include an inlet chamber and an outlet chamber arranged side by side and separated by a partition. Each chamber contains a top section with a plurality of openings arranged to align with the cores. 334 the sub-assembly 330 The alignments are as follows. As explained previously, the cores form placeholders for the coolant chambers. Once the power module is formed and the cores are dissolved, the holes within the distributor connect the coolant chambers fluidically to the inlet and outlet chambers of the distributor. 341 .
[0057] After the distributor 341 into the hollow 328 The sub-assembly is installed 330 into the hollow 328 be placed. The subassembly 330 can be on the distributor 341 lie and within the cavity 328 be recorded so that there is a gap between the performance levels 332 and the interior of the cave 328 is formed to provide space for the resin or potting compound.
[0058] The mold cavity 132 may include slots or holes that allow the connectors and signal pins to protrude from the shape 320 to extend outwards. For example, the pages can 322 , 324 Slots 350 form those that accommodate the connections. The slots and holes can serve as alignment elements to align the subassembly. 330 inside the cavity 328to position correctly. Additional components can be attached to the mold to seal the slots and prevent resin or potting compound from leaking.
[0059] As soon as the sub-assembly 330 and the distributor 341 correctly within the form 320 are positioned, a resin will be applied. 349 (or a potting compound) into the cavity 328 poured. The resin fills the air pores between the subassemblies. 330 , the distributor 341 and the inner walls of the cavity 328 The resin encapsulates the subassembly and the distributor, and after it has cured (or set), it forms a power module consisting of the inlet and outlet channels. 346 , 348 of the case 302can be connected to lines for circulating a solvent through the power module assembly to dissolve the cores and expose the coolant chambers located between immediately adjacent power stages.
[0060] After the resin has cured, the remaining components of the ISC can be added. 300 They are assembled. For example, a capacitor bank is located inside the casing. 302 next to the power module assembly on the base plate 302 arranged. Busbars 233The DC connections of the power module assembly are mechanically and electrically coupled to the capacitor bank. A gate driver board can be installed on the power module and electrically connected to the signal pins. The AC connections of the power module can be connected to the electric motors via an AC busbar assembly. Another busbar can electrically connect the VVC power stages to the inductive component located outside the enclosure. 302 It may also be located inside the housing. Other components, such as current sensors, a power supply board, and a control board, can also be found there. 302 be arranged. After all internal components are completely inside the housing 302 Once assembled, the first and second hinged shell sections can be connected to close the case.
[0061] In an alternative embodiment, the distributor is replaced by the distributor core. The distributor core can be the distributor core described above. 156 The distributor core is a temporary placeholder to create a void within the power module. Once the resin has cured, the distributor core dissolves, and the resulting inner cavity, formed by the cured resin, creates a distributor within the power module.
[0062] Fig. 14 is a flowchart 351 for the production of a power module assembly 200 . At step 352 The power stages and coolant chamber cores are arranged in a linear stack, so that the cores are nested between the power stages. A distributor core is added at step 354 attached to the stack, thereby forming a sub-assembly. At step 356A planar component is positioned against one end of the subassembly. The planar component and the subassembly are then... 358 placed in a mold cavity of an injection molding device. At step 360 Resin is injected into the mold cavity to form a power module assembly. The resin bonds each of the power stages together, bonds the distributor and the power stages together, and adheres the subassembly to the planar component. In step 362 A solvent is circulated through the power module to dissolve the cores and expose coolant chambers and a distributor.
[0063] Although embodiments have been described above, it is not intended that these embodiments describe all possible forms encompassed by the claims. The words used in the description are descriptive, not limiting, and it is understood that various modifications may be made without deviating from the essence and scope of the disclosure. As previously described, the features of different embodiments can be combined to form further embodiments of the invention that may not be explicitly described or illustrated.It is apparent to those skilled in the art that, although various embodiments may be described in such a way as to offer advantages or be preferred over other embodiments or implementations from the prior art with respect to one or more desired features, compromises may be made with regard to one or more features or characteristics in order to achieve desired overall system attributes that depend on the specific application and implementation. These attributes may include, but are not limited to, cost, strength, durability, lifetime costs, marketability, appearance, packaging, size, utility, weight, manufacturability, ease of manufacture, etc.Therefore, embodiments that are described as less desirable than other embodiments or realizations of the prior art with respect to one or more properties do not fall outside the scope of protection of the disclosure and may be desirable for certain applications.
[0064] It is further described as follows: A. Power electronics assembly, comprising: a case; and an array of power stages arranged within the housing, each incorporating a transistor-based switching arrangement designed to convert direct current from a traction battery into alternating current for an electric machine, and bonded together via a resin to form a monolithic power module bonded to a wall of the housing. B. Assembly according to A, further comprising a capacitor bank arranged within the housing and mechanically and electrically coupled to the power module. C. Assembly according to A, wherein the monolithic power module forms coolant chambers nested between the power stages and designed to circulate coolant to cool the power stages during operation. D. Assembly according to C, wherein the wall further includes a channel in fluidically communicating connection with the coolant chambers, and wherein the channel is aligned with a feedthrough formed in the monolithic power module. E. Assembly according to B, wherein the transistor-based switching arrangement is a half-bridge arrangement. F. Power electronics assembly, comprising: a case; an array of power stages arranged within the housing, each incorporating a transistor-based switching arrangement designed to convert direct current from a traction battery into alternating current for an electric motor; and a distributor arranged against the array, wherein the power stages are each connected to each other and to the distributor via a resin in a material-bonded manner, thereby forming a monolithic power module bonded to a wall of the housing. G. Assembly according to F, wherein the monolithic power module forms coolant chambers which are nested between the power stages and are designed to circulate coolant to cool the power stages during operation, and wherein the coolant chambers are each in fluidically communicating connection with the distributor. H. Assembly according to G, wherein the wall further includes a channel in fluidically communicating connection with the distributor. I. Assembly according to H, wherein the distributor forms an axially aligned opening arranged against the channel. J. Assembly according to I, wherein the channel includes a stub extending outwards from the wall. K. Assembly according to J, wherein the stub and the wall are formed in one piece. L. Assembly according to F, further comprising a capacitor bank arranged within the housing and mechanically and electrically coupled to the power module via a busbar. M. assembly according to F, wherein the monolithic power module further includes solvable cores nested between the power stages. N. assembly according to M, wherein the soluble cores consist of salt. O. Method for forming a power module assembly, comprising the following steps: to arrange the power stages and coolant chamber cores in a linear stack such that the cores are nested between the power stages; to attach a distributor core to the stack in order to form a subassembly, the distributor extends along one length of the stack; to place the subassembly into a mold cavity of an injection molding machine; to inject resin into the mold cavity to encapsulate the subassembly, forming a power module; and to circulate a solvent through the power module to dissolve the coolant chamber and distributor cores. P. Method according to O, which further comprises placing a planar component in the mold cavity such that a main face of the planar component is arranged towards one end of the subarrangement. Q. Method according to P, which further includes bonding the planar component to the subassembly with the resin. R. Method according to Q, further comprising attaching a cover to the planar component to form an enclosure around the power module, wherein the planar component forms one side of the enclosure. S. Method according to Q, wherein the planar component includes a bore in the main face and the distributor core includes a projection, and further comprising inserting the projection into the bore. T. Method for training an inverter system controller, which includes: to provide an L-shaped section of a housing that includes a bottom and a side wall; to connect a mold comprising a pair of side plates extending from the side wall and a transverse plate running between the side plates with the L-shaped section, so that the side plates, the transverse plate, the side wall and the bottom are connected to form a mold cavity; to insert a distributor into the mold cavity; to arrange power stages and coolant chamber cores in a linear stack, so that the cores are nested between the power stages; to insert the linear stack into the mold cavity; to pour resin into the mold cavity to encapsulate the linear stack and distributor in resin, forming a power module; and to circulate a solvent through the power module to dissolve the coolant chamber cores.
Claims
[1] Power electronics assembly comprising: a case; and an array of power stages arranged within the housing, each incorporating a transistor-based switching arrangement designed to convert direct current from a traction battery into alternating current for an electric machine, and bonded together via a resin to form a monolithic power module bonded to a wall of the housing. [2] Assembly according to claim 1, further comprising a capacitor bank arranged inside the housing and mechanically and electrically coupled to the power module. [3] Assembly according to claim 1, wherein the monolithic power module forms coolant chambers which are nested between the power stages and are designed to circulate coolant to cool the power stages during operation. [4] Assembly according to claim 3, wherein the wall further includes a channel in fluidically communicating connection with the coolant chambers, and wherein the channel is aligned with a feedthrough formed in the monolithic power module. [5] Assembly according to claim 1, wherein the transistor-based switching arrangement is a half-bridge arrangement.
Citation Information
Patent Citations
Semiconductor device, and method of manufacturing semiconductor device
JP2010219137A
JP002010219137A