METHOD FOR PRODUCING A FLAT LADDER ARRANGEMENT

Abstract

Method for producing a flat conductor arrangement (10), comprising the steps: - Providing an electrically conductive flat conductor rail (1); - Specifying at least one contact area (13) on a flat conductor surface (2) of the flat conductor rail (1); - Application of an adhesion promoter (3) to the flat conductor surface (2) leaving out at least one contact area (13), wherein the adhesion promoter (3) promotes a material-bonded connection between the flat conductor rail (1) and a predetermined insulating material; - Forming an insulating layer (11) comprising the insulating material on the flat conductor rail (1) after it has been provided with the adhesion promoter (3), wherein the at least one contact area (13) arranged below the insulating layer (11) is subsequently marked on the insulating layer (11); - Removal of a section (12) of the insulating layer (11) produced at at least one contact area (13) of the flat conductor rail (1).

Description

[0001] The invention relates to a method for manufacturing a flat conductor arrangement.

[0002] The increasing use of different material combinations in vehicle bodies, up to and including complete CFRP bodies (for example, in monocoques), will significantly impair or even render the electrical grounding in motor vehicles in the future. This would necessitate, in some cases, the use of more stranded conductors for grounding, and would likely lead to an increase in the weight of the vehicle's electrical system and wiring harness.

[0003] The electrical return current introduced via so-called ground bolts typically always follows the path of least resistance. Due to the use of different body materials and joining techniques, such as gluing, riveting, welding, and the like, an undefined or undirected electrical return current from electrical components to the vehicle battery is generated. This undirected return current creates an electromagnetic field that can negatively affect vehicle occupants and the vehicle's electronics.

[0004] By using so-called flat conductor rails, especially those made of aluminum, the installation space and conductor weight for electrical grounding can be significantly reduced. These flat conductor rails are often routed along the underbody contour from the rear to the front of a vehicle. In particular, a multi-layer flat conductor structure used for central electrical supply and grounding eliminates the formation of an electromagnetic field, regardless of the body materials used. Such flat conductor arrangements in vehicles also result in improved electrical system stability.

[0005] To enable effective mutual cancellation of electromagnetic fields between two adjacent flat conductor rails, the two rails must be positioned as close to each other and with as much surface area as possible. Unlike flat conductor supply lines, which are mainly used in the underbody area and sometimes also in the interior without a second, ground-return rail, and usually with relatively thick PVC insulation exceeding 2.5 mm, these multi-layer flat conductor rails require relatively thin insulation walls.

[0006] To enable particularly easy and cost-effective stripping of aluminum flat conductor cores, i.e., aluminum flat conductor busbars, non-adherent insulating materials are frequently used. However, due to their processing, geometric arrangement, and temperature fluctuations, these insulating materials often exhibit relatively high internal mechanical stresses, which can result in material shrinkage of over 20 mm over a length of 3,000 mm. Mechanical stresses can also occur in the transverse direction, causing the insulating materials to tear during temperature cycling or thermal shock tests. Relative movement between the flat conductor busbars and the insulating plastics used for insulation, especially due to changes in length caused by temperature cycling, can lead to shearing effects and thus to insulation material failure.

[0007] A metallurgical bond between the insulating plastic and the flat conductor rail would eliminate material shrinkage and ensure optimal thermal shock resistance for the entire component, i.e., the flat conductor rail coated with the insulating plastic. However, this would necessitate a significantly more complex and expensive stripping process to remove the optimally bonded insulation from the flat conductor core, i.e., the flat conductor rail. For example, milling the insulating layer from the flat conductor core could cause chip formation. To prevent a short circuit caused by a remaining metal chip, a complex cleaning process would be required. Furthermore, laser-blasting the insulation across a large area can lead to thermal changes in the metal surface, and undefined degradation residues from the insulation can cause undesirable interactions.

[0008] US 3,159,555 A discloses a method for manufacturing busbars. DE 10 2014 004 431 A1 discloses a sheathing for profiles with lateral exits. US 3,547,718 A discloses a method for manufacturing a flat and flexible cable. DE 10 2014 119,720 A1 discloses an insulated flat conductor and a flat conductor assembly. DE 100 57 479 A1 discloses a method for manufacturing an electrical flat ribbon cable.

[0009] It is therefore the object of the present invention to provide a method for manufacturing a flat conductor arrangement which has at least one electrically conductive flat conductor rail and an insulating layer which at least partially encloses it, by means of which at the same time a particularly stable connection between the insulating layer and the flat conductor rail as well as a particularly simple local stripping of the insulating layer is made possible.

[0010] This problem is solved by a method for manufacturing a flat conductor arrangement with the features of claim 1. Advantageous embodiments with expedient and non-trivial further developments of the invention are specified in the dependent claims.

[0011] In the inventive method for manufacturing a flat conductor assembly, an electrically conductive flat conductor rail is provided. The provided flat conductor rail serves as a kind of flat conductor core in the flat conductor assembly to be manufactured. The flat conductor rail is a strip-shaped rail made of a current-conducting material. The dimensions of the flat conductor rail in the width and length directions are large in relation to its thickness, i.e., its height. These flat sides extend in the longitudinal and transverse directions of the flat conductor rail and have a significantly larger surface area than the respective side surfaces of the flat conductor rail that extend in the longitudinal and vertical directions of the flat conductor. Furthermore, the flat sides also have a significantly larger surface area than the respective end faces of the flat conductor rail that extend in the transverse and vertical directions of the flat conductor rail.

[0012] Furthermore, at least one contact area is specified on a flat conductor surface of the flat conductor rail. This contact area serves to connect a contact element, such as a screw tab, a plug-in tongue, a screw bolt, a cable lug, or the like. Alternatively, an electrical conductor can also be directly connected to the flat conductor rail at this contact area.

[0013] An adhesion promoter is then applied to the flat conductor surface, leaving the at least one contact area untouched. The adhesion promoter facilitates a metallurgical bond between the flat conductor rail and a predetermined insulating material. Subsequently, an insulating layer comprising the insulating material is formed on the flat conductor rail after it has been coated with the adhesion promoter. The insulating layer is preferably formed on the flat conductor rail in such a way that a connection, particularly preferably a metallurgical bond, is established between the insulating layer and the flat conductor surface. Finally, a section of the insulating layer formed at the contact area of ​​the flat conductor rail is removed.

[0014] A key aspect of the solution according to the invention is that the flat conductor rail is coated with an adhesion promoter, i.e., a so-called primer. This promotes a strong, bonded connection between the insulating material and the flat conductor rail. However, the areas where the insulating layer is to be removed after application are left uncoated, allowing for subsequent conventional and simplified stripping. This selective application of the adhesion promotes the best possible bond between the insulating material and the flat conductor rail. As a result, a long-lasting and temperature-resistant insulating layer is formed on the flat conductor surface.In contrast, where the adhesion promoter has been omitted, the processing of the flat conductor rail is simplified, particularly to remove respective sections of the insulating layer in order to connect an electrical contact element to the specified contact area or several specified contact areas in a particularly reliable manner.

[0015] The invention is based on the understanding that insulating materials, which mostly consist of plastics, bond very poorly or not at all with metallic surfaces. An optimal, material-bonded bond between plastics and, for example, aluminum materials requires the use of an adhesion promoter that first establishes a material-bonded connection with the metal surface and subsequently, for example in an extrusion process to produce the insulating layer, forms a physical or chemical bond with the insulating material.

[0016] For example, a regular and recurring application of the adhesion promoter to the flat conductor surface can be carried out. As a result, a uniform or standardized semi-finished product can be manufactured, from which the stripping of the subsequently applied insulating layer can be carried out individually as required.

[0017] For particularly thin flat conductor rails, it may be sufficient to apply the adhesion promoter only to the flat sides that make up the largest area of ​​the rail. However, if the flat conductor rail is somewhat thicker, it may also be advantageous to apply the adhesion promoter to the narrow longitudinal sides as well.

[0018] In principle, all thermoplastics or thermoplastic elastomers with sufficient electrical insulation properties and flexibility can be used as insulating material. In particular, polyolefins (PP copolymers, PE, etc.), polyamides (PA 12, etc.), PVC, TPE, or crosslinking PE are suitable. Depending on the type of plastic and the processing technique, insulating layer thicknesses of 0.15 to 3.5 mm, preferably 0.3 to 1.5 mm, are sufficient. If the adhesion promoter is also to be applied to the narrow longitudinal sides, layer thicknesses of 0.5 to 2.0 mm are preferred for the insulating layer in these areas.

[0019] Our own measurements on 60 x 1 mm aluminum strips with 0.3 mm thick PP insulation and overhangs on the narrow longitudinal sides of the flat conductor rail yielded an electrical breakdown strength of 16 kV. Therefore, the flat conductor arrangements manufactured according to the invention can be used not only in the 12-volt and 48-volt ranges but also in the high-voltage range.

[0020] For weight reduction reasons, the flat conductor rail is preferably made of aluminum. All common extruded aluminum alloys or rolled strips with a purity of at least 99.5% or higher can be used. This ensures sufficient electrical conductivity with adjustable material hardness. For aluminum flat conductor rails, material thicknesses of 0.5 to 5.0 mm, and particularly 1.0 to 3 mm, are advantageous. The widths of the flat conductor rails are preferably in the range of 5 to 60 mm, and particularly preferably in the range of 15 to 60 mm.

[0021] The insulating layer can also serve to compensate for any warping or burr formation of the flat conductor rail perpendicular to the main alignment axis caused by a strip-cutting process and to ensure sufficient dielectric strength. Furthermore, an off-center position of the flat conductor rail serving as the core during the manufacturing of the insulating layer can be compensated for by appropriately selected insulating layer thickness or geometry.

[0022] As mentioned, due to its lightweight design, aluminum is the preferred core material for the flat busbar. However, other common electrically conductive materials or alloys, such as copper or brass, can also be used instead of aluminum. The flat busbar can have a wide variety of cross-sectional geometries and profile shapes, with varying width and height ratios. When aluminum is used as the material for the flat busbar, it can be in the form of rolled sheets, strips, extruded profiles, wrought or cast materials, or even foils.

[0023] The inventive method thus provides a flat conductor arrangement that exhibits particularly stable long-term properties due to the metallurgical bond between the insulating material and the flat conductor rail. This prevents, in particular, undesirable shrinkage of the insulating layer. Furthermore, the entire flat conductor arrangement exhibits particularly good thermal shock resistance and deformability. In addition, the selective application of the adhesion promoter ensures that the applied insulating layer can be stripped very easily and cost-effectively in the respective contact areas. The easily strippable contact areas allow, for example, electrical contact elements to be attached to the flat conductor rail in a metallurgically bonded and media-tight manner, for instance, by welding.

[0024] The flat conductor arrangements manufactured according to the invention can be used for targeted electrical grounding in vehicles with poorly or non-conductive bodywork, for example, made of CFRP. Using such flat conductor arrangements allows for improved electromagnetic compatibility in the vehicle without additional shielding. Conventional wiring harness installation with flexible supply lines is also possible, particularly without external B+ leads requiring body penetrations and sealing systems. The flat conductor arrangement, serving as an electrical supply and / or ground strap, can be contacted at any point, thus being multi-drop capable. Especially when aluminum is used as the material for the flat conductor rail, a particularly high degree of lightweight construction can be achieved in the manufactured flat conductor arrangement.Such flat conductor arrangements also have a reduced installation height compared to conventional, round supply or ground conductors. Furthermore, flat conductor arrangements manufactured in this way exhibit a higher current-carrying capacity than stranded conductors with the same cross-sectional area. Using such flat conductor arrangements in a multilayer flat conductor structure also results in increased vehicle electrical system stability and the elimination of electromagnetic fields. In addition, a starter-generator battery bus and a vehicle interior power supply bus (also terminal 30) can be decoupled from each other. The flat conductor arrangements manufactured in this way can be used in 12 V, 48 V, and high-voltage electrical systems. The use of the flat conductor arrangements manufactured using the method according to the invention is not limited to the automotive sector.

[0025] An advantageous embodiment of the invention provides that, prior to the application of the adhesion promoter, the flat conductor surface is treated in such a way as to promote a metallurgical bond between the adhesion promoter and the flat conductor rail. Preferably, the flat conductor surface is treated electrochemically, chemically, or physically for this purpose. For an optimal metallurgical bond between the adhesion promoter and the flat conductor rail material, the flat conductor surface is therefore preferably treated electrochemically, for example. An electrochemical treatment can be carried out, for example, by anodic oxidation, such as by means of an anodizing process. Particularly when heat is introduced during the production of the adhesion promoter layer, this can promote a chemical reaction of the adhesion promoter material on the flat conductor surface of the flat conductor rail.Other chemical or physical surface treatments, or a favorable combination of materials with regard to the adhesion promoter used and the flat conductor rail material, can also promote a material-bonded connection between the insulating material and the adhesion promoter and between the adhesion promoter and the flat conductor rail.

[0026] In a further advantageous embodiment of the invention, the adhesion promoter is thermally treated after application to the flat conductor surface. This means that the introduction of activation energy through heat input optimally achieves a chemical reaction with the flat conductor surface. For example, the adhesion promoter can be "baked" into the flat conductor surface by applying a corresponding temperature. The thermal treatment of the applied adhesion promoter can take place either before or during the production of the insulating layer. Depending on how the insulating layer is produced on the flat conductor rail, the process may already generate a temperature input that necessitates the thermal treatment, preferably baking, of the adhesion promoter.Thermal treatment of the adhesion promoter ensures that it adheres to the flat conductor surface and fully develops its adhesion-promoting effect. This thermal treatment thus promotes a strong chemical and / or physical bond between the insulating layer and the flat conductor surface.

[0027] Another advantageous embodiment provides that the adhesion promoter comprises a thermosetting or thermoplastic polymer material, at least in some areas. Polymer materials with thermosetting or thermoplastic components can therefore be used as adhesion promoters, i.e., as primers. These exhibit particularly good adhesion-promoting properties.

[0028] In a further advantageous embodiment of the invention, the adhesion promoter comprises a first side with a polar, chemically reactive group and a second side with material components that are also present in the insulating material, the first side facing the flat conductor surface and the second side facing the insulating layer. The polar, chemically reactive group can, for example, be maleic anhydride or polyurethane groups. The second side can, for example, comprise polymer components that are also contained in the insulating material, thereby promoting a chemical or physical bond between the adhesion promoter and the insulating layer.

[0029] According to a further advantageous embodiment of the invention, the adhesion promoter is applied by at least one of the following methods: spray application, wherein a region of the flat conductor surface surrounding the partial area is masked or only locally wetted; pad printing; roller application; screen printing; or inkjet printing. Spray application to the flat conductor surface can also be carried out without masking. In principle, the adhesion promoter can be applied sequentially, regularly, irregularly, continuously, or selectively. For example, the adhesion promoter can be applied in stripes extending longitudinally along the flat conductor rail by roller or spray application, wherein at least one further strip-shaped area on the flat conductor surface is not provided with the adhesion promoter.This continuous, partial application of the adhesion promoter allows for the production of a standardized semi-finished product. A highly flexible, selective application of the adhesion promoter, on the other hand, can be achieved, for example, using inkjet technology. Here, non-adherent areas can be created by switching printheads on and off, allowing the adhesion promoter to be easily omitted from the flat conductor surface in these areas. Depending on the areas on the flat conductor where the adhesion promoter is to be applied, one of the aforementioned methods can be selected, or several of the above-mentioned methods can be combined.

[0030] Another advantageous embodiment of the invention provides that, before applying the adhesion promoter, at least one contact area on the flat conductor surface is covered. For example, adhesive tapes or adhesive strips can be applied to the flat conductor surface, ensuring that no adhesion promoter is applied to these areas. Alternatively, flexible masks or clamps can be used to cover the designated contact areas of the flat conductor surface, thus ensuring that no adhesion promoter is applied to these areas. In principle, any means can be used to mask or cover the designated contact areas before applying the adhesion promoter to the flat conductor surface.This ensures that the areas to be excluded are not actually affected by the bond intermediary.

[0031] In a further advantageous embodiment of the invention, the insulating material is at least partially transparent, and the adhesion promoter has a different color than the insulating material and the flat conductor rail. After the insulating layer has been applied, it is particularly easy to identify where the adhesion promoter has been applied and where it has been left out on the flat conductor surface. This facilitates the targeted removal of the insulating layer from the areas that will later serve as contact points when the flat conductor assembly is in use.

[0032] According to the invention, the at least one contact area arranged below the insulating layer is marked on the insulating layer. For the arranged contact area, i.e., the area where the adhesion promoter has been omitted, lasers or printers, for example, can be used. This marking is preferably synchronized with the respective application process of the adhesion promoter in order to ensure that, during targeted removal of the insulating layer, the areas of the flat conductor surface where the adhesion promoter has been omitted are also reliably targeted.

[0033] According to a further advantageous embodiment of the invention, the insulating layer is produced by conveying the flat conductor rail, coated with the adhesion promoter, through an extrusion die, by means of which the insulating layer is extruded onto the outside of the flat conductor rail. During the extrusion process, a physical bond or even a chemical reaction occurs between the insulating material and the flat conductor rail due to the application of temperature and pressure, specifically where the adhesion promoter has been applied. The adhesion promoter is applied to the flat conductor rail prior to the extrusion process in such a way that it withstands the shear forces occurring during extrusion, i.e., without the applied adhesion promoter being smeared or otherwise removed from its original position on the flat conductor surface during extrusion.Extrusion allows the insulation layer to be attached to the flat conductor rail particularly easily and quickly, especially if the entire flat conductor rail is to be encased by the insulation layer.

[0034] According to an alternative advantageous embodiment of the invention, the insulating layer is produced by placing the flat conductor rail, coated with the adhesion promoter, into an injection mold and then overmolding the insulating layer onto the outside of the flat conductor rail. Injection molding also makes it possible to completely encase the flat conductor rail with the insulating layer, if necessary. Like extrusion, injection molding is particularly well-suited for producing the insulating layer on the flat conductor rail cost-effectively and reliably, especially in high-volume production. Other alternatives for applying the insulating layer include spray application or dipping.

[0035] Another advantageous embodiment of the invention provides that the application of the adhesion promoter is integrated into a manufacturing process of the flat conductor rail or into a manufacturing process of the insulating layer. This integration of the application of the adhesion promoter, either into the manufacturing process of the flat conductor rail itself or into the manufacturing process of the insulating layer, results in a relatively small to negligible increase in costs, but subsequently significantly simplifies the local stripping of the insulating layer.

[0036] Further advantages, features and details of the invention will become apparent from the following description of preferred embodiments and from the drawings.

[0037] The drawing shows in: Fig. 1 a first variant for applying an adhesion promoter to a first embodiment of a flat conductor rail, wherein the adhesion promoter is applied to the respective upper and lower flat sides of the flat conductor rail, leaving certain areas untreated; Fig. 2 a second variant for applying the adhesion promoter to a second embodiment of the flat conductor rail, which is thicker than the first embodiment of the flat conductor rail, wherein not only the upper and lower flat sides but also the respective narrow longitudinal sides of the flat conductor rail are coated with the adhesion promoter; Fig. 3 a third variant for applying the adhesion promoter to the first embodiment of the flat conductor rail, wherein the adhesion promoter is applied by means of a spray application and certain areas of the flat conductor rail are masked by means of a clamp; Fig. 4 an enlarged perspective view of the in Fig. 3 inserted clamps; Fig. 5 a fourth variant for applying the adhesion promoter to the second embodiment of the flat conductor rail, wherein the adhesion promoter is again applied by means of a spray application and certain areas of the flat conductor rail are masked by means of a clamp; Fig. 6 an enlarged perspective view in Fig. 5 inserted clamps; Fig. 7 a fifth variant for applying the adhesion promoter to the first embodiment of the flat conductor rail, wherein the adhesion promoter is applied in a band-like manner to the respective upper and lower flat sides of the flat conductor rail by means of respective rollers; Fig. 8 a sixth variant of an embodiment of the method for applying the adhesion promoter to the second embodiment of the flat conductor rail, wherein the adhesion promoter is applied by means of several rollers to both the upper and lower flat sides as well as to a narrow longitudinal side; and in Fig. 9 a perspective view of a flat conductor arrangement, which as in Fig. 8 has been treated with the adhesion promoter, followed by the application of an insulating layer to the flat conductor rail and subsequently the insulating layer being stripped again in the areas where the adhesion promoter has been omitted.

[0038] In the figures, identical or functionally equivalent elements are given the same reference symbols.

[0039] A first embodiment of a flat conductor rail 1 is shown in a schematic perspective view in Fig. Figure 1 shows this first embodiment. It is characterized by the fact that the flat conductor rail 1 is particularly flat. The flat conductor rail 1 can, for example, be made of aluminum. The flat conductor rail 1 serves as a so-called flat conductor core for electrical supply or grounding in motor vehicles. It is common practice for such flat conductor rails 1 to be further encased with an insulating layer made of plastic, which is not shown here. Contact areas, not shown here, are typically provided at various locations on a flat conductor surface 2 of the flat conductor rail 1. These contact areas serve as points where, for example, cables or other electrical conductors or contact elements are attached to or connected to the flat conductor rail 1.Therefore, it is important that only the bare, electrically conductive metallic material of the flat conductor rail 1 is present at these contact points. After applying the insulating layer, it must therefore be removed from these contact points as completely as possible.

[0040] At the same time, it is also important that this insulating layer, apart from the contact areas, adheres firmly, preferably by a material bond, to the flat conductor rail 1. To enable particularly easy stripping of the insulating layer (not shown here) and to ensure that the insulating layer otherwise remains firmly bonded to the flat conductor rail 1, an adhesion promoter 3 is applied to the flat conductor rail 1. As shown schematically here, the adhesion promoter 3 can, for example, be applied to the respective upper and lower flat surfaces of the flat conductor rail 1 using rollers 4.To facilitate particularly easy removal of the insulating layer at the aforementioned contact areas, masks 5 or adhesive tapes 6 can be used, for example, which are applied to selected positions on the flat conductor surface 2 before the adhesion promoter 3 is applied. This reliably ensures that no adhesion promoter is applied to the areas on the flat conductor surface 2 that will later serve as contact points.

[0041] If the contact area of ​​the flat conductor surface 2 is located transversely across the flat side of the flat conductor rail, the corresponding rollers 4 can be lifted from the flat conductor rail 1, so that no wetting with the adhesion promoter 3 occurs in this area. This would eliminate the need for the use of masks 5 or adhesive tapes 6.

[0042] In Fig. Figure 2 shows a second embodiment of the flat conductor rail 1 in a perspective view. The flat conductor rail 1 shown here is somewhat more robust than the one in Figure 2. Fig. 1 embodiment of the flat conductor rail 1 shown. In other words, the embodiment shown in Fig. The flat conductor rail shown in Figure 2 has a larger rail height-to-width ratio than the one shown in Figure 2. Fig. 1. In this case, it is advantageous to also apply the adhesion promoter 3 to the respective narrow longitudinal sides 7 of the flat conductor rail 1. Because the flat conductor rail shown here is somewhat thicker, the narrow longitudinal sides 7 are also somewhat thicker than in the embodiment shown in Figure 1. Fig. 1. Flat conductor rail shown. To ensure reliable adhesion of the insulating layer yet to be applied to the narrow longitudinal sides 7 of the flat conductor rail 1 shown here, the adhesion promoter 3 is also applied to these areas using rollers 4. To avoid applying the adhesion promoter 3 at specific points that are to serve as contact areas, an adhesive tape 6 is again applied to the flat conductor surface 2 before the adhesion promoter 3 is applied.

[0043] In Fig. Figure 3 shows the first embodiment of the flat conductor rail 1 in a perspective view, wherein, in the present case, the adhesion promoter 3 is applied to the flat conductor surface 2 by means of a spray head 8. Alternatively, it is also possible, for example, that the adhesion promoter 3 is applied by inkjet printing instead of by spraying.

[0044] In the present case, a detachable terminal 9 is used to locally mask or cover the flat conductor rail 1. The terminal 9 is attached to those areas of the flat conductor rail 1 that will later serve as contact points and where the insulating layer must be locally removed before it is applied.

[0045] By using a movable masking 5 (not shown here) the application of an adhesion promoter to a defined sub-area of ​​the flat conductor surface 2 can also be prevented.

[0046] In Fig. 4 is the one in Fig. The clamping terminal 9 is shown in a perspective view. As can be seen, the clamping terminal 9 has a more or less U-shaped cross-section. The clamping terminal 9 can, for example, be attached laterally to the flat conductor rail 1 and then moved along it to mask selected areas so that no adhesion promoter 3 is applied in these areas.

[0047] In Fig. Figure 5 shows the second embodiment of the flat conductor rail 1 in a perspective view. As in Fig. Here too, a spray head 8 is used to apply the adhesion promoter 3 by spraying. Alternatively, it is also possible to apply the adhesion promoter by inkjet printing. A terminal 9 is again used to locally mask the flat conductor rail 1, ensuring that the adhesion promoter 3 is not applied to the flat conductor surface 2 where the terminal 9 is attached. In the case shown, the terminal 9 is shaped such that it also masks or covers the respective narrow longitudinal sides 7 of the flat conductor rail 1 on the left and right. Here too, it is possible to create selective adhesion promoter-free flat conductor surface areas 2 without additional masking by selectively controlling the spray bar or, alternatively, by inkjet printing.

[0048] In Fig. 6 is the one in Fig. Figure 5 shows the inserted terminal 9 in a perspective view. As can be seen, the terminal 9 has an almost completely closed cross-section. The terminal 9 can, for example, be slipped over an end face of the flat conductor rail 1 in order to then position it as desired at corresponding positions on the flat conductor rail 1 for masking purposes.

[0049] In Fig. Figure 7 again shows the first embodiment of the flat conductor rail 1. In the present case, the adhesion promoter 3 is applied in strips to the top and bottom surfaces of the flat conductor rail 1 exclusively on the flat sides by means of respective rollers 4. As can be seen, the rollers 4 leave areas of the flat conductor surface 2 untouched on the left and right sides, i.e., these areas are not coated with the adhesion promoter 3. A subsequently applied insulating layer can therefore be removed particularly easily from these areas where the adhesion promoter 3 has been applied, whereas the insulating layer is bonded particularly firmly, especially metallurgically, to the flat conductor rail 1 in the areas where the adhesion promoter 3 has been applied.

[0050] Alternatively, it is also possible for the adhesion promoter 3 to be applied continuously or discontinuously by means of a laterally limited spray application instead of by roller application.

[0051] In Fig. Figure 8 shows the second embodiment of the flat conductor rail 1 in a perspective view. In this case, the adhesion promoter 3 is also applied in strips to the flat conductor rail 1 by means of several rollers 4. Since this second embodiment of the flat conductor rail 1 is somewhat thicker than the first embodiment, at least one of the two narrow sides 7 is also coated with the adhesion promoter 3 by means of one of the rollers 4. Again, certain areas, which are also coated in strips, are not coated with the adhesion promoter 3. These areas can be relatively easily cleaned of the insulating layer (not shown here) after its application. Where the adhesion promoter 3 has been applied, the insulating layer forms a particularly strong bond with the flat conductor rail 1, preferably by forming a metallurgical bond.

[0052] In Fig. 9 shows a flat conductor arrangement 10, which is shown in Fig. Figure 8 shows a flat conductor rail 1 (not specified here) and an insulating layer 11 encasing it. After the flat conductor rail 1 has been coated with the adhesion promoter 3, the insulating layer 11 is produced on the flat conductor rail 1. The insulating layer 11 can be produced, for example, by passing the flat conductor rail 1 coated with the adhesion promoter 3 through an extrusion die (not shown here), by means of which the insulating layer 11 is extruded onto the outer circumference of the flat conductor rail 1. Alternatively, it is also possible, for example, to place the flat conductor rail 1 coated with the adhesion promoter 3 into an injection mold (also not shown here), by means of which the insulating layer 11 is subsequently injection-molded.

[0053] After the insulating layer 11 has been produced on the outer circumference of the flat conductor rail 1, specific sections 12 of the produced insulating layer 11 are selectively removed. This exposes, i.e., strips, the previously mentioned contact areas 13.

[0054] To facilitate the targeted removal of sections 12 of the insulating layer 11, markings 14 are applied to the insulating layer 11 after its production. These markings indicate where the adhesion promoter 3 has been applied and where it has not. These markings 14 can, for example, be laser-etched or printed onto the insulating layer 11.

[0055] Alternatively or additionally, it is also possible to choose a material for the insulating layer 11 that is at least partially transparent, in which case the adhesion promoter 3 has a different color than the flat conductor rail 1 and the insulating layer 11. This allows the applied adhesion promoter 3 to show through the insulating layer 11. Consequently, it is easy to see which areas of the flat conductor surface 2 have not been coated with the adhesion promoter 3 and where the sections 12 can be removed particularly easily to expose the contact areas 13.

[0056] The production of the insulating layer 11 and the local removal of sections 12 of the applied insulating layer 11 can also be carried out in the same way in connection with the Fig. The variants described in points 1 to 7 can be carried out.

[0057] By applying the adhesion promoter 3 and by locally omitting the adhesion promoter 3 at selected locations on the flat conductor rail 1, it can be ensured that the insulating layer 11 forms a firm bond with the flat conductor rail 1 where the adhesion promoter 3 has been applied. Furthermore, it can be ensured that the contact areas 13 can be easily cleaned of the insulating layer 11 after its application. In the areas of the flat conductor surface 2 where the adhesion promoter 3 has been applied, the insulating layer 11 can form a metallurgical bond with the flat conductor rail 1. Preferably, the insulating material of the insulating layer 11 consists of thermoplastics or thermoplastic elastomers with sufficient electrical insulation properties and flexibility. For example, the insulating layer 11 can be made of polyolefins (PP copolymers, PE, etc.), polyamides (PA 12, etc.).), PVC, TPE or cross-linking PE.

[0058] It is particularly advantageous if the flat conductor rail 1 is made of aluminum, for example from rolled sheet, rolled strip, an extruded profile, wrought or cast material, or foil. Besides aluminum, other common electrically conductive materials or alloys, such as copper or brass, can also be used as the current-conducting core material for the flat conductor arrangement 10.

[0059] In addition to the flat conductor rail variants 1 shown, a wide variety of other cross-sectional geometries and profile shapes can also be provided with the adhesion promoter 3 in the manner described and subsequently coated with the insulating layer 11. Finally, in the areas where the adhesion promoter 3 has been omitted, the sections 12 of the insulating layer 11 are removed to expose the contact areas 13. The adhesion promoter 3 can, of course, also be applied to the flat conductor rail 1 in completely different configurations than described, such as continuously in certain areas, regularly or irregularly sequentially, in a grid pattern, or selectively. REFERENCE MARK LIST 1 flat conductor rail 2 Flat conductor surface 3 liability mediators 4 rolls 5. Masking 6 adhesive tape 7 Narrow long side 8 spray heads 9 terminal 10 Flat conductor arrangement 11 Insulation layer Section 12 13 Contact area 14 Marking

Claims

Method for producing a flat conductor assembly (10), comprising the steps of: - providing an electrically conductive flat conductor rail (1); - specifying at least one contact area (13) on a flat conductor surface (2) of the flat conductor rail (1); - applying an adhesion promoter (3) to the flat conductor surface (2) leaving the at least one contact area (13) uncovered, wherein the adhesion promoter (3) facilitates a metallurgical bond between the flat conductor rail (1) and a specified insulating material; - producing an insulating layer (11) comprising the insulating material on the flat conductor rail (1) after it has been provided with the adhesion promoter (3), wherein the at least one contact area (13) arranged below the insulating layer (11) is subsequently marked on the insulating layer (11);- Removal of a section (12) of the insulating layer (11) produced at at least one contact area (13) of the flat conductor rail (1).; Method according to claim 1, characterized in that, prior to the application of the adhesion promoter (3), the flat conductor surface (2) is treated in such a way as to promote a material-bonded connection between the adhesion promoter (3) and the flat conductor rail (1). Method according to claim 2, characterized in that the flat conductor surface (2) is treated electrochemically, chemically or physically. Method according to one of the preceding claims, characterized in that the adhesion promoter (3) is thermally treated after being applied to the flat conductor surface (2). Method according to one of the preceding claims, characterized in that the adhesion promoter (3) comprises a thermosetting or thermoplastic polymer material at least in some areas. Method according to claim 5, characterized in that the adhesion promoter (3) has a first side with a polar, chemically reactive group and a second side with material components which are also located in the insulating material, wherein the first side is facing the flat conductor surface (2) and the second side is facing the insulating layer (11). Method according to one of the preceding claims, characterized in that the adhesion promoter (3) is applied by means of at least one of the following methods: - spray application, wherein an area surrounding the partial area of ​​the flat conductor surface (2) is masked; - spray application on partial areas of the flat conductor surface (2) without masking (5); - pad printing; - roller application; - screen printing; - inkjet printing. Method according to one of the preceding claims, characterized in that, prior to the application of the adhesion promoter (3), the at least one contacting area (13) on the flat conductor surface (2) is covered. Method according to one of the preceding claims, characterized in that the insulating material is at least partially transparent and the adhesion promoter (3) has a different color than the insulating material and the flat conductor rail (1). Method according to one of the preceding claims, characterized in that the insulating layer (11) is produced by conveying the flat conductor rail (1) provided with the adhesion promoter (3) through an extrusion tool by means of which the insulating layer (11) is extruded onto the outside of the flat conductor rail (1). Method according to one of claims 1 to 9, characterized in that the insulating layer (11) is produced by placing the flat conductor rail (1) provided with the adhesion promoter (3) into an injection molding tool and then injection molding the insulating layer (11) onto the outside of the flat conductor rail (1). Method according to one of the preceding claims, characterized in that the application of the adhesion promoter (3) is integrated into a manufacturing process of the flat conductor rail (1) or into a manufacturing process of the insulating layer (11). Method according to one of the preceding claims, characterized in that a contacting element in the form of a screw tab, a plug-in tongue, a screw bolt or a stranded conductor is attached to at least one contacting area (13) of the flat conductor rail (1) after removal of the section (12) of the insulating layer (11).

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