Substrate holding structure, electronic component module and electrical junction box

The substrate holding structure with deformable protrusions addresses the issue of rattle and displacement in electronic components by securely engaging the substrate, enhancing stability and reducing vibration impacts.

DE102016223931B4Active Publication Date: 2025-08-14YAZAKI CORP
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Patent Information

Application Number
DE102016223931
Authority / Receiving Office
DE · DE
Patent Type
Patents
Current Assignee / Owner
Priority Date
2015-12-02
Filing Date
2016-12-01
Publication Date
2025-08-14
Estimated Expiration
2036-12-01

AI Technical Summary

Technical Problem

Existing substrate holding structures fail to adequately prevent rattle and relative displacement of substrates due to vibrations, particularly in electronic component modules and electric connection boxes, which can affect the stability and integrity of connected electronic components.

Method used

A substrate holding structure featuring a housing with protrusions that plastically deform upon contact with the substrate, and a holding member with complementary protrusions, to securely hold the substrate in place and suppress rattling by restricting relative movement between the substrate and the housing.

Benefits of technology

The proposed structure effectively reduces substrate rattle and relative displacement, ensuring the stability of electronic components and soldering units by maintaining secure engagement and minimizing vibration-induced disturbances.

✦ Generated by Eureka AI based on patent content.

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Abstract

Substrate holding structure (100) comprising: a holding unit (43a, 44a) provided with a housing (4) including a receiving unit (7) receiving an inserted substrate (6) therein, and holding an end part of the substrate (6) received in the receiving unit (7) on an insertion direction access side of the substrate (6); projections (49) projecting from side wall surfaces (41a, 42a), which are wall surfaces (41, 42) of the housing (4) along an insertion direction of the substrate (6) and opposite side surfaces (6e, 6f) of the substrate (6), and a holding element (5) connected to an end part of the substrate (6) on the insertion direction access side of the substrate (6) and held by the holding unit (43a, 44a), wherein the projections (49) are plastically deformed due to contact with the substrate (6) to be inserted into the receiving unit (7), and the holding member (5) includes projections (55) on the side of the holding member (5) which come into contact with an inner wall surface (41, 42) of the housing (4) in a state in which the holding member (5) is held by the holding unit (43a, 44a).
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Description

Background of the invention 1. Field of the invention

[0001] The present invention relates to a substrate holding structure, an electronic component module and an electrical connection box. 2. Description of related technology

[0002] Conventionally, there is a technique for mounting a substrate in a package. For example, Japanese Patent Application Laid-Open No. JP H08-145018 A discloses a technique for mounting a planar object in a package, wherein left and right side edges of the planar object are fitted and inserted between left and right inner side surfaces of the package so that the planar object is mounted and housed in the package. In the structure for mounting a planar object in a package according to Japanese Patent Application Laid-Open No. JP H08-145018 A, at least one of the side edges of a planar object and the inner side surfaces of a package is provided with projections that serve to sandwich and press the side edges of the planar object together with an increasing deformation of the side surfaces of the package.

[0003] There is further potential for improvement in reducing substrate rattle. Even if a side edge of a substrate is interposed and pressed against one part of an insertion direction, rattle may occur in other parts.

[0004] Document JP H09-17265 A relates to a printed circuit board mounting structure. The structure comprises a box-shaped housing with an opening on one side, a cover covering the housing from the side of the opening, and a printed circuit board held between opposing abutment surfaces, wherein the abutment surfaces are each part of intermediate elements formed in both the housing and the cover. At least one of the intermediate elements has a step formed by the abutment surface and a wall surface forming a corner region at the boundary with the abutment surface. A projection extending toward the printed circuit board and being compressible and deformable is formed in at least one of the housings or the abutment surfaces of the cover.

[0005] Document JP 2007-227824 A relates to a substrate housing with guides for guiding the movement of a substrate on two opposing inner side surfaces. A pair of holding elements for holding the substrate is arranged on one end face in the direction of insertion of the substrate. The distance between the facing portions of the pair of holding elements is smaller than the thickness of the substrate. One of the facing portions is flat, the other has a protruding shape.

[0006] None of the documents includes a further holding element according to the substrate holding structure of claim 1. Overview of the invention

[0007] An object of the present invention is to provide a substrate holding structure, an electronic component module, and an electrical connection box capable of reducing rattling of a substrate.

[0008] According to one aspect of the present invention, a substrate holding structure includes a holding unit equipped with a housing including a receiving unit that receives an inserted substrate therein and that holds an end part of the substrate received in the receiving unit on an insertion direction access side of the substrate; and projections that project from side wall surfaces that are wall surfaces of the housing along a substrate insertion direction and oppose side surfaces of the substrate, and that are plastically deformed due to contact with the substrate to be inserted into the receiving unit.The substrate holding structure further includes a holding member connected to an end part of the substrate on the insertion direction access side of the substrate and held by the holding unit, the holding member including projections on the side of the holding member that come into contact with an inner wall surface of the housing in a state where the holding member is held by the holding unit.

[0009] According to another aspect of the present invention, in a substrate holding structure, preferably both of the pair of side wall surfaces which are opposite to each other and between which the substrate is sandwiched are provided with the projections.

[0010] According to yet another aspect of the present invention, in a substrate holding structure, the projections are preferably arranged in a deep part on the side wall surfaces in the insertion direction of the substrate.

[0011] According to yet another aspect of the present invention, an electronic component module includes a substrate to which an electronic component is connected; a housing including a receiving unit that receives therein the substrate to be inserted; a holding unit that is provided to the housing and that holds an end part of the substrate received in the receiving unit at an insertion direction access side of the substrate; and projections that project from side wall surfaces that are wall surfaces of the housing along a substrate insertion direction and that oppose side surfaces of the substrate, and that are plastically deformed due to contact with the substrate to be inserted into the receiving unit.

[0012] According to yet another aspect of the present invention, an electrical connection box includes a substrate to which an electronic component is connected; a casing including a receiving unit for receiving therein the substrate to be inserted; a holding unit provided to the casing and holding an end part of the substrate received in the receiving unit on an insertion direction access side of the substrate; projections projecting from side wall surfaces that are wall surfaces of the casing along a substrate insertion direction and opposite side surfaces of the substrate, and that are plastically deformed due to contact with the substrate to be inserted into the receiving unit; and a frame that holds the casing therein.

[0013] The above and other objects, features, advantages and technical and industrial significance of this invention will be better understood by reading the following detailed description of presently preferred embodiments of the invention in conjunction with the accompanying drawings. Short description of the drawings Fig. 1 is a perspective view illustrating an electrical junction box according to an embodiment; Fig. 2 is a bottom view illustrating the electrical connection box according to the embodiment; Fig. 3 is a perspective view illustrating a substrate and a connector block according to the embodiment; Fig. 4 is a perspective cross-sectional view illustrating a housing according to the embodiment; Fig. 5 is a cross-sectional view illustrating an electronic component module according to the embodiment; Fig. 6 is a cross-sectional view illustrating frame-side projections according to the embodiment; and Fig. 7 is another cross-sectional view illustrating the frame-side projection according to the embodiment. Detailed description of the preferred embodiments

[0014] A substrate support structure, an electronic component module, and an electrical connection box according to an embodiment of the present invention will be described below with reference to the accompanying drawings. It should be noted that the following embodiment is not intended to limit the invention. Components in the embodiment include components that are easily conceived by those skilled in the art or substantially the same components. Embodiment

[0015] An embodiment is described with reference to Fig. 1 to 7. The embodiment relates to a substrate support structure, an electronic component module, and an electrical junction box. Fig. 1 is a perspective view illustrating an electrical connection box according to the embodiment of the present invention, Fig. 2 is a bottom view illustrating the electrical connection box according to the embodiment, Fig. 3 is a perspective view illustrating a substrate and a connector block according to the embodiment, Fig. 4 is a perspective cross-sectional view illustrating a housing according to the embodiment, Fig. 5 is a cross-sectional view illustrating an electronic component module according to the embodiment, Fig. Fig. 6 is a bottom view illustrating frame-side projections according to the embodiment, and Fig. 7 is a cross-sectional view illustrating the frame-side projection according to the embodiment. Fig. 4 is a perspective view along IV-IV of Fig. 1, Fig. 5 is a cross-sectional view along VV of Fig. 1, Fig. 6 is a cross-sectional view along VI-VI of Fig. 1, and Fig. 7 is a cross-sectional view along VII-VII of Fig. 6.

[0016] As in Fig. 1, an electrical junction box 1 according to the embodiment includes a frame 2 and an electronic component module 3. In the embodiment, the electrical junction box 1 will be described by taking as an example a case where the electrical junction box 1 is mounted on a vehicle. The electrical junction box 1 forms a wire harness WH together with electric wires W. The wire harness WH is mounted on a vehicle such as an automobile and connects respective devices mounted on the vehicle. The wire harness WH includes a plurality of electric wires W used for power supply and signal transmission. Ends of the electric wires W are connected to the electronic component module 3 housed in the electrical junction box 1.The other ends of the electric wires W are connected to corresponding devices (external devices) such as a battery or an electric component through a connector and the like.

[0017] The electronic component module 3 of the embodiment includes a substrate holding structure 100, which will be described below, and can prevent rattling of a substrate 6 (see Fig. 3 and Fig. 5) on a housing 4. The substrate holding structure 100 includes engagement openings 43a as holding units that hold the substrate 6, and projections 49 (see Fig. 4 and Fig. 5), which are plastically deformed due to contact with the substrate 6. The projections 49 hold the substrate 6, which is inserted into the housing 4, and prevent the substrate 6 from rattling against the housing 4.

[0018] The Fig. 1 and Fig. The frame 2 illustrated in FIG. 2 holds the housing 4 of the electronic component module 3 therein. The frame 2 is integrally formed of, for example, a synthetic resin. The frame 2 is a cylindrical member, and a planar shape thereof is a polygon, for example, a rectangle. The electronic component module 3 is inserted into or extracted from the frame 2 from an opening of the frame 2. The electrical connection box 1 includes an upper cover and a lower cover, not illustrated, for closing the opening of the frame 2. The frame 2, together with the upper cover and the lower cover, forms a closed receiving space that receives the electronic component module 3.

[0019] The electronic component module 3 includes the housing 4 and a connector block 5. The housing 4 is a receiving element formed as an approximately rectangular parallelepiped. The housing 4 is integrally formed from a synthetic resin or the like. The housing 4 includes a receiving unit 7 (see Fig. 4), which the substrate 6 (see Fig. 3), which will be described below. The housing 4 includes a first side wall 41, a second side wall 42, a third side wall 43, a fourth side wall 44, and a depth wall 45. The first side wall 41, the second side wall 42, the third side wall 43, and the fourth side wall 44 form a cylindrical unit having substantially rectangular cross sections. The depth wall 45 closes one end of the cylindrical unit formed by each of the side walls 41, 42, 43, and 44. The other end of this cylindrical unit is open. In other words, the side walls 41, 42, 43, and 44 and the depth wall 45 form a quadrangular cylinder with one end open.

[0020] The electronic component module 3 according to the embodiment has a cylindrical unit axis formed by the side walls 41, 42, 43, and 44 extending in a vertical direction, and is mounted on a vehicle with the opening of the casing 4 facing downward. Hereinafter, the "vertical direction" is referred to as the vertical direction of a vehicle when the electrical connection box 1 incorporating the electronic component module 3 is mounted on a vehicle. A long direction of a cross-sectional shape of the casing 4 on a surface orthogonal to the vertical direction is referred to as a "transverse direction," and a short direction of the cross-sectional shape is referred to as a "longitudinal direction." The transverse direction and the longitudinal direction are orthogonal to each other.

[0021] The first side wall 41 and the second side wall 42 oppose each other in the transverse direction. The third side wall 43 and the fourth side wall 44 oppose each other in the longitudinal direction. Ends of the third side wall 43 and the fourth side wall 44 in the transverse direction are connected to the first side wall 41, and the other ends are connected to the second side wall 42. Engaging units 46 are provided on outer surfaces of the first side wall 41 and the second side wall 42. The engaging units 46 are projections having a substantially U-shaped planar shape. The frame 2 has engaging projections corresponding to the engaging units 46. The engaging units 46 engage with the engaging projections of the frame 2 to connect the housing 4 and the frame 2.

[0022] A plurality of engagement holes 43a are provided near a lower end of the third side wall 43. The engagement holes 43a are arranged at intervals along the lower side of the third side wall 43. The third side wall 43 is provided with three engagement holes 43a in the embodiment, and one of the engagement holes 43a and the other two engagement holes 43a are arranged in the center in the transverse direction, or on one end side and on the other end side in the transverse direction. The fourth side wall 44 is provided with engagement holes 44a (see Fig. 4) which are identical to the engagement openings 43a.

[0023] As in Fig. As illustrated in Figure 2, the frame 2 includes module receiving units 2a that receive the electronic component module 3. The frame 2 of the embodiment includes a plurality of module receiving units 2a. The electronic component module 3, which includes the housing 4, is inserted into the module receiving units 2a and is held by the frame 2.

[0024] The connector block 5 is a block-shaped member that closes the opening of the housing 4. The connector block 5 is integrally formed from a synthetic resin or the like. An end surface 51 of the connector block 5 is provided with a plurality of connector engagement units 52. The connector engagement units 52 are frame-shaped components that protrude from the end surface 51. Each of the connector engagement units 52 includes a recess 52a with which a mating connector is engaged. A plurality of terminals 53 protrude from the bottom of the recess 52a. The terminals 53 are electrically connected to terminals of the mating connector.

[0025] As in Fig. As illustrated in Fig. 3, the connector block 5 holds the substrate 6. The substrate 6 is, for example, a printed circuit board, and wiring of electric circuits is formed on the surface thereof. A planar shape of the substrate 6 in the embodiment is a rectangle, and corners are chamfered in an arc shape. One end side of the substrate 6 is fixed to fixing means 56 of the connector block 5 by a fixing member such as screws. The fixing means 56 sandwiches the terminals 53 and is provided at both end portions in the transverse direction. Hereinafter, a side of the substrate 6 fixed to the connector block 5 is referred to as a "base end side," and a free end side opposite to the side fixed to the connector block 5 is referred to as a "tip side." The substrate 6 and the connector block 5 are inserted into the housing 4 from a tip surface 6d.

[0026] The substrate 6 includes a plurality of through-holes 6a on the base end side. The through-holes 6a extend through the substrate 6 in a substrate thickness direction. Terminals 53 having conductivity are inserted through the respective through-holes 6a. The terminals 53 are a rod-shaped or plate-shaped member bent at a right angle, and ends thereof are inserted through the through-holes 6a from one surface side of the substrate 6. The other ends of the terminals 53 project into the recesses 52a of the connector block 5 as described above. Each of the terminals 53 is electrically connected to an electrical circuit of the substrate 6 by soldering.Electronic components such as a resistor 6b and a relay 6c are electrically connected to the electrical circuit of the substrate 6, and the electronic components and the electrical circuit of the substrate 6 as a whole form an electrical circuit.

[0027] The connector block 5 includes engagement projections 54. The engagement projections 54 are projections that correspond to the engagement openings 43a and 44a (see Fig. 1 and Fig. 4) of the housing 4. A third side surface 5c and a fourth side surface 5d of the connector block 5 are provided with the engaging projections 54. The third side surface 5c and the fourth side surface 5d are side surfaces along the long direction of the connector block 5, in other words, side surfaces that extend in the transverse direction of the connector block 5 and are each directed in the longitudinal direction. The third side surface 5c is a wall surface opposite to the third side wall 43 of the housing 4. The fourth side surface 5d is a wall surface opposite to the fourth side wall 44 of the housing 4. The engaging projections 54 protrude in the longitudinal direction from the third side surface 5c and the fourth side surface 5d. The engaging projections 54 engage with the engaging holes 43a and 44a of the housing 4 and connect the housing 4 to the connector block 5.

[0028] A first side surface 5a and a second side surface 5b of the connector block 5 are provided with block-side protrusions 55. The block-side protrusions 55 are provided as retainer-side protrusions. The block-side protrusions 55 come into contact with an inner wall surface of the housing 4 and restrict relative displacement (rattling) of the connector block 5 to the housing 4. The first side surface 5a and the second side surface 5b are side surfaces along the short direction of the connector block 5, in other words, side surfaces that extend in the longitudinal direction of the connector block 5 and each face in the transverse direction. The first side surface 5a is a wall surface opposite to the first side wall 41 of the housing 4. The second side surface 5b is a wall surface opposite to the second side wall 42 of the housing 4.The block-side protrusions 55 project in the transverse direction from the first side surface 5a and the second side surface 5b. The block-side protrusions 55 are linear or ridge-shaped protrusions that extend along the vertical direction, in other words, along the insertion direction of the substrate 6. In the connector block 5 of the embodiment, the block-side protrusions 55 are sequentially arranged at one end part and the other end part of the first side surface 5a and the second side surface 5b. A lower end side of the connector block 5 is provided with the block-side protrusions 55. More specifically, the block-side protrusions 55 extend in a certain range from flanges 57 to the upper side. The flanges 57 are flange-shaped protrusions that project from the lower end of the third side surface 5c and the fourth side surface 5d in a direction orthogonal to the vertical direction.The flanges 57 serve as stops that come into contact with the edge of the housing 4 on the opening side.

[0029] As in Fig. 4, the housing 4 includes a receiving unit 7. The receiving unit 7 is a space defined by the first side wall 41, the second side wall 42, the third side wall 43 (see Fig. 1), the fourth side wall 44, and the depth wall 45. In other words, the receiving unit 7 is an inner space of the cylindrical housing 4 having a bottom. The first side wall 41 and the second side wall 42 each include a first guide 47, a second guide 48, and the projection 49. An inner wall surface of the first side wall 41 and the second side wall 42 is provided with each of the guides 47 and 48 and the projection 49. The first guide 47 and the second guide 48 extend along the vertical direction, in other words, along the depth direction of the receiving unit 7. The first guide 47 and the second guide 48 are opposite to each other in the longitudinal direction. The second guide 48 is arranged closer to a position on the fourth side wall 44 than the first guide 47 and at a certain distance from the first guide 47.The first guide 47 and the second guide 48 are projections that project from the inner wall surfaces of the side walls 41 and 42 and are formed integrally with the side walls 41 and 42.

[0030] Grooves 8 are provided between the first guides 47 and the second guides 48. The grooves 8 are grooves surrounded by the first guides 47, the second guides 48, and inner wall surfaces 41a and 42a of the side walls 41 and 42. The first guides 47 and the second guides 48 guide the substrate 6, which is inserted into the receiving unit 7, to the grooves 8. The first guides 47 and the second guides 48 guide an end part of the substrate 6 in a width direction from both sides in the longitudinal direction so as to restrict positional displacement of the substrate 6. In this way, the first guides 47 and the second guides 48 can prevent contact between electronic components connected to the substrate 6 and the inner wall surfaces of the housing 4. A groove width of the grooves 8 extends to an access side such that the substrate 6 is easily guided to the grooves 8 at the access part.

[0031] The projections 49 are projections that protrude from the inner wall surfaces 41a and 42a of the first side wall 41 and the second side wall 42 and are formed integrally with the side walls 41 and 42. Hereinafter, the inner wall surfaces 41a and 42a are also referred to as “side wall surfaces 41a and 42a.” The side wall surfaces 41a and 42a are wall surfaces along the insertion direction of the substrate 6 in the receiving unit 7. In addition, the side wall surfaces 41a and 42a are wall surfaces, the side surfaces 6e and 6f (see Fig. 3) of the substrate 6 inserted into the receiving unit 7. The projection 49 of the first side wall 41 and the projection 49 of the second side wall 42 are opposite each other in the transverse direction. In other words, the longitudinal and vertical positions of the projection 49 of the first side wall 41 and the projection 49 of the second side wall 42 are identical.

[0032] A shape of each of the projections 49 is a tapered shape in which a width in the vertical direction narrows toward the tip side in the projection direction.

[0033] The shape of the projections 49 in the embodiment is a triangular pyramid shape and extends in the longitudinal direction. In other words, the cross section of the projections 49 orthogonal to the longitudinal direction is a triangle. Both ends of each projection 49 are connected to the first guide 47 and the second guide 48, respectively. A distance between the tip of the projection 49 on the first side wall 41 and the tip of the projection 49 on the second side wall 42 is narrower than a width W1 (see Fig. 3) of the substrate 6. The distance between the tips of the projections 49 is defined so that at least one of the side surfaces 6e and 6f of the substrate 6 comes into contact with the projections 49 at the time of inserting the substrate 6 into the receiving unit 7. In the embodiment, the distance between the pair of opposing projections 49 is defined so that the side surfaces 6e and 6f each come into contact with the projections 49 even if warping and twisting occur on the substrate 6 within a range assumed in the design. The projections 49 are crush ribs that are plastically deformed due to contact with the substrate 6 inserted into the receiving unit 7.

[0034] The substrate 6 is inserted from an opening 4a to the depth wall 45 of the housing 4. More specifically, the connector block 5 and the substrate 6 are inserted from the opening 4a to the depth wall 45 with the tip surface 6d first into the receiving unit 7. The receiving unit 7 of the housing 4 receives the inserted substrate 6 therein and accommodates at least a part of the connector block 5. The connector block 5 inserted into the receiving unit 7 closes the opening 4a of the housing 4 and forms a closed space for accommodating the substrate 6 in the housing 4.

[0035] When the connector block 5 is inserted into the receiving unit 7, the engaging projections 54 of the connector block 5 penetrate into the engaging holes 43a and 44a from the inside of the housing 4 and engage with the engaging holes 43a and 44a, as shown in Fig. 1. The engaging projections 54, which engage with the engaging openings 43a and 44a, restrict the connector block 5 from being pulled out of the receiving unit 7.

[0036] When the substrate 6 to be inserted into the receiving unit 7 comes into contact with the protrusions 49, parts of the protrusions 49 that come into contact with the substrate 6 are plastically deformed. The substrate 6 deforms the protrusions 49 and is inserted into a deep part of the receiving unit 7 while sliding on the protrusions 49. While a part of the protrusions 49 on the tip side is plastically deformed, the protrusions 49 as a whole are elastically deformed depending on the pressing force received from the substrate 6. A material (strength), a shape, a size, and the like of the protrusions 49 are defined so that at least a part of the protrusions 49 on the tip side is plastically deformed and squeezed due to contact with the substrate 6.A material (elastic modulus), a shape, a size, and the like of the protrusions 49 are preferably defined so that at least a part of the protrusions 49 on the base end side is plastically deformed so as to maintain a contact state between the protrusions 49 and the substrate 6. When the insertion of the substrate 6 into the receiving unit 7 is completed, grooves for interposing the substrate 6 from both sides in the longitudinal direction are formed on the protrusions 49 by plastic deformation. The grooves of the protrusions 49 preferably come into contact with and hold the substrate 6, but a gap may be present between the grooves and the substrate 6.

[0037] The projections 49 prevent a relative displacement of the substrate 6 to the housing 4. As in Fig. As illustrated in Figure 5, the pair of protrusions 49, which oppose each other in the transverse direction, restricts the relative displacement of the substrate 6 to the housing 4 in the transverse direction. The protrusion 49 on the first side wall 41 narrows a movement range of the substrate 6 toward the inner wall surface 41a. Conversely, the protrusion 49 on the second side wall 42 narrows a movement range of the substrate 6 toward the inner wall surface 42a. In this way, the pair of protrusions 49 restricts the relative displacement of the substrate 6 to the housing 4 in the transverse direction.

[0038] The grooves formed on the protrusions 49 due to plastic deformation sandwich the substrate 6 from both sides in the longitudinal direction and restrict the relative displacement of the substrate 6 to the housing 4 in the longitudinal direction. Thus, in the embodiment, the protrusions 49 prevent the housing 4 and the substrate 6 from moving differently from each other during vibration of a vehicle; in other words, they prevent vibrations from occurring independently and differently from each other in the housing 4 and the substrate 6. It is believed that if the housing 4 is not provided with the protrusions 49, the housing 4 and the substrate 6 will vibrate differently from each other, and electronic components and a soldering unit of the substrate 6 will be easily affected by the vibrations.In contrast, in the electronic component module 3 of the embodiment, the protrusions 49 suppress differential vibrations of the housing 4 and the substrate 6. The housing 4 not only holds the end part of the substrate 6 on the insertion direction access side by the connector block 5, but also holds a part of the substrate 6 located further on the tip side than the connector block 5 with the protrusions 49. In this way, rattling of the housing 4 and the substrate 6 is suppressed, and the electronic components and the soldering unit of the substrate 6 are suitably protected.

[0039] The projections 49 of the embodiment are arranged in a deep part of the side wall surfaces 41a and 42a in the insertion direction of the substrate 6. As in Fig. 4 and Fig. 5, the protrusions 49 are arranged at the end part of the grooves 8 on the upper side. More specifically, the protrusions 49 are arranged on the slightly lower sides (the base end sides) as chamfered portions 6g and 6h of the substrate 6 accommodated in the accommodation unit 7. The chamfered portion 6g is an angularly chamfered portion formed by the intersection of the tip surface 6d and the side surface 6e on the first side wall 41 side. The chamfered portion 6h is an angularly chamfered portion formed by the intersection of the tip surface 6d and the side surface 6f on the second side wall 42 side.The protrusions 49 are provided such that the tips of the protrusions 49 are positioned slightly lower than the tapered portions 6g and 6h when the housing 4 and the connector block 5 are engaged with each other. The protrusions 49, located at a deep part in the insertion direction, hold the tip part of the substrate 6. As described above, the end part of the substrate 6 on the access side (the base end side) in the insertion direction is held by the housing 4 through the connector block 5. In this way, in the electronic component module 3 of the embodiment, both end parts of the substrate 6 are held in the insertion direction by the housing 4. In this way, the electronic component module 3 of the embodiment appropriately prevents rattling of the substrate 6 against the housing 4.

[0040] When the connector block 5 is inserted into the receiving unit 7 as shown in Fig. 5, the block-side protrusions 55 of the connector block 5 come into contact with the inner wall surfaces of the housing 4. The block-side protrusion 55 on the first side surface 5a comes into contact with the inner wall surface 41a on the first side wall 41 of the housing 4, and the block-side protrusion 55 on the second side surface 5b comes into contact with the inner wall surface 42a on the second side wall 42 of the housing 4. The connector block 5 is inserted toward a depth side of the receiving unit 7, whereas the block-side protrusion 55 on the first side surface 5a slides on the first side wall 41, and the block-side protrusion 55 on the second side surface 5b slides on the second side wall 42.The engaging projections 54 of the connector block 5 engage the engaging openings 43a and 44a when the block-side projection 55 on the first side surface 5a presses against the first side wall 41 and the block-side projection 55 on the second side surface 5b presses against the second side wall 42. In this way, the block-side projections 55 restrict the connector block 5 from moving relatively in the transverse and longitudinal directions against the housing 4 and prevent rattling of the housing 4 and the connector block 5.

[0041] As mentioned with reference to Fig. 6 and Fig. As described in Fig. 7, the frame 2 of the embodiment includes frame-side protrusions 21 that prevent relative displacement of the housing 4 to the frame 2. The wall surfaces of the frame 2 that face the housing 4 are provided with the frame-side protrusions 21. The wall surfaces of the frame 2 that face the first side wall 41 and the second side wall 42 of the housing 4 are provided with the frame-side protrusions 21 of the embodiment. In other words, the opposing wall surfaces that sandwich the housing 4 in the transverse direction are provided with the frame-side protrusions 21. Fig. 6 and Fig. 7 illustrates a wall surface 22 of the frame 2 opposite the second side wall 42 and the frame-side projections 21 with which the wall surface 22 is provided. The frame-side projections 21 with which the wall surface opposite the first side wall 41 is provided are the same as the frame-side projections 21 with which the wall surface 22 is provided.

[0042] The frame-side projections 21 project from the wall surface 22 to the interior of the module receiving unit 2a. In the frame 2 of the embodiment, as shown in Fig. 6, a pair of ribs 23 protrude from the wall surface 22. The ribs 23 are projections that have a rectangular cross-section and extend in the vertical direction. Engaging projections or the like that are connected to the engaging units 46 (see Fig. 1) of the housing 4 are provided between the pair of ribs 23. The tip surfaces of the ribs 23 are provided with the frame-side projections 21. As shown in Fig. As illustrated in Figure 7, the frame-side protrusion 21 is provided in a certain range from the lower end portion of the module receiving unit 2a upward. A cross section of the protrusions 21 is a tapered shape in which a width in the longitudinal direction narrows toward the tip side in the protrusion direction.

[0043] The frame-side protrusions 21 are crush ribs that come into contact with the housing 4 inserted into the module receiving unit 2a so as to be plastically deformed. When the housing 4 inserted into the module receiving unit 2a comes into contact with the frame-side protrusions 21, parts of the frame-side protrusions 21 that come into contact with the housing 4 are plastically deformed. For example, the housing 4 is inserted into the module receiving unit 2a from below with the depth wall 45 facing upward. In the outer wall surfaces of the first side wall 41 and the second side wall 42 of the housing 4, a part of the rear end side (the opening 4a side) protrudes further in the insertion direction than a part of the tip side (the depth wall 45 side).In other words, on the outer wall surfaces of the housing 4, at a part opposite to the frame-side projection 21, at the time of inserting the housing 4 into the module receiving unit 2a, the rear end side extends further in the transverse direction than the tip side in the insertion direction. The tip part of the housing 4 can be inserted into the module receiving unit 2a without coming into contact with the frame-side projections 21. On the other hand, the rear end part of the housing 4 comes into contact with the frame-side projections 21 and plastically deforms them. The housing 4 plastically deforms the frame-side projections 21 and is inserted into the module receiving unit 2a until the engaging projections of the frame 2 engage with the engaging units 46. When received in the module receiving unit 2a, the housing 4 is held by the frame-side projections 21.The frame-side projections 21 restrict relative displacement of the housing 4 to the frame 2 in the transverse direction. Furthermore, the frame-side projections 21 can restrict relative displacement of the housing 4 to the frame 2 in the longitudinal direction.

[0044] In this way, in the electrical connection box 1 of the embodiment, the first side wall 41 and the second side wall 42 of the housing 4 are held from both surface sides by the block-side projections 55 and the frame-side projections 21. In this way, rattling of the housing 4 and the substrate 6 against the frame 2 and rattling of the substrate 6 against the housing 4 are prevented. Thus, the electrical connection box 1 of the embodiment can reduce the influences of vibrations of the substrate 6 on the electronic components and the soldering unit. In the embodiment, as shown in Fig. As illustrated in Figure 6, the block-side projections 55 and the frame-side projections 21 oppose each other in the transverse direction, sandwiching the side walls 41 and 42 therebetween to appropriately prevent rattling of the housing 4. The longitudinal positions of the block-side projections 55 and the frame-side projections 21 preferably coincide with each other, but the longitudinal positions may be slightly shifted in the embodiment.

[0045] As described above, the electronic component module 3 according to the embodiment includes the substrate holding structure 100 that holds the substrate 6. The substrate holding structure 100 includes the engaging holes 43a and 44a and the protrusions 49. The housing 4 is provided with the engaging holes 43a and 44a, and these serve as holding units that hold the end part of the substrate 6 accommodated in the accommodation unit 7 on the insertion direction access side. The engaging holes 43a and 44a engage with the engaging protrusions 54 to restrict relative displacement of the connector block 5 to the housing 4 in the transverse direction and the longitudinal direction. In other words, the engaging holes 43a and 44a hold the end part of the substrate 6 on the access side through the connector block 5. It can be considered that the holding units include the connector block 5 in addition to the engaging holes 43a and 44a.The connector block 5 can serve as a holding unit together with the housing 4 because the connector block 5 is connected or joined to the housing 4 and holds the end part of the substrate 6 on the insertion direction access side.

[0046] The projections 49 protrude from the side wall surfaces 41a and 42a. The side wall surfaces 41a and 42a are wall surfaces along the insertion direction of the substrate 6 into the receiving unit 7, and they are wall surfaces opposite the side surfaces 6e and 6f of the substrate 6. The projections 49 are plastically deformed due to contact with the substrate 6 inserted into the receiving unit 7. The end part of the substrate 6 on the access side in the insertion direction is held not only by the engaging holes 43a and 44a by the connector block 5, but also by the projections 49 at a position further on the tip side than the connector block 5. The projections 49 can suppress rattling of the substrate 6 on the housing 4 compared to a housing in which the substrate 6 is held by the connector block 5 in a cantilevered state.

[0047] Even if deformation such as bending and twisting occurs on the substrate 6, the projections 49 can deform the substrate 6 and hold the deformed substrate 6 without correcting the deformation. The projections 49 are plastically deformed due to contact with the substrate 6, but do not exert a large force on the substrate 6 in a direction in which the deformation is returned. In this way, the projections 49 can hold the substrate 6 while preventing a new stress from being applied to a soldered part. The projections 49 are plastically deformed due to contact with the substrate 6 so as to hold the substrate 6 without generating excessive stress on the package 4 and the substrate 6.

[0048] Both of the pair of side wall surfaces 41a and 42a, which oppose each other to sandwich the substrate 6, are provided with the protrusions 49. The pair of protrusions 49 can hold the substrate 6 from both sides in the width direction and appropriately prevent rattling of the substrate 6 against the housing 4.

[0049] The projections 49 are arranged in the deep part of the side wall surfaces 41a and 42a in the insertion direction of the substrate 6. In this way, both end portions of the substrate 6 are held in the insertion direction by the housing 4. In this way, rattling of the substrate 6 on the housing 4 is suitably prevented.

[0050] The substrate holding structure 100 of the embodiment includes the block-side protrusions 55 provided on the connector block 5. The connector block 5 is connected to the end portion of the substrate 6 on the insertion direction access side and is a holding member held by the engaging holes 43a and 44a as holding units. The block-side protrusions 55 contact the inner wall surfaces of the housing 4 and press against the housing 4, thereby preventing relative displacement of the connector block 5 and the substrate 6 with respect to the housing 4. In this way, rattling of the substrate 6 against the housing 4 is suitably prevented.

[0051] The electronic component module 3 according to the embodiment includes the substrate 6 to which the electronic components are connected, the housing 4 including the receiving unit 7, the engaging holes 43a and 44a as holding units, the substrate 6 inserted into the receiving unit 7, and the projections 49. The electronic component module 3 of the embodiment can suitably prevent rattling of the substrate 6 on the housing 4.

[0052] The electrical connection box 1 according to the embodiment includes the substrate 6 to which the electronic components are connected, the housing 4 containing the receiving unit 7, the engaging holes 43a and 44a as holding units, the projections 49, and the frame 2 that holds the housing 4 therein. The electrical connection box 1 of the embodiment can suitably prevent rattling of the substrate 6 against the housing 4. modification

[0053] Positions and shapes of the projections 49, the block-side projections 55, and the frame-side projections 21 are not limited to those exemplified. For example, the position of the projections 49 is not limited to that illustrated. The position of the projections 49 is preferably the deep part on the inner wall surfaces 41a and 42a in the insertion direction of the substrate 6, but this deep part is not limited to the illustrated position, which is slightly further on the base end side than the tapered portions 6g and 6h of the substrate 6. The “deep part” may be, for example, a region R1 (see Fig. 5) further on the tip side as an intermediate position of the insertion direction of the substrate 6. The “deep part” may be an area R2 (see Fig.5) that is one-third the length of the tip surface 6d of the substrate 6. The "deep part" may be a region that is one-quarter, one-fifth, one-tenth, or the like, the length of the tip surface 6d of the substrate 6. The position of the protrusions 49 is preferably defined such that the vibration frequency of primary vibrations occurring in a vehicle and the natural vibration frequency of the substrate 6 supported by the protrusions 49 do not coincide with each other.

[0054] Corners of the substrate 6 are not necessarily chamfered. In this case, the protrusions 49 are preferably arranged slightly farther on the base end side than the corners of the substrate 6 at the tip in the insertion direction. The side wall surfaces 41a and 42a are not necessarily provided with the grooves 8. In this case, an installation area (a region in the longitudinal direction) of the protrusions 49 on the inner wall surfaces 41a and 42a is, for example, an area assumed to be a passage area of ​​the substrate 6.

[0055] A plurality of protrusions 49 may be arranged along the insertion direction on the side wall surfaces 41a and 42a. For example, another protrusion 49 may be provided between the position of the illustrated protrusions 49 and the connector block 5. Only one of the side wall surfaces 41a and 42a may be provided with the protrusions 49. In other words, the protrusions 49 may be provided at a position where one of the side surfaces 6e and 6f of the substrate 6 is held. For example, in the housing 4, when the inner wall surface 41a opposite one side surface 6e is located near the side surface 6e, and the inner wall surface 42a opposite the other side surface 6f is located at a position away from the side surface 6f, only the inner wall surface 41a may be provided with the protrusions 49.

[0056] Not only the first side wall 41 and the second side wall 42, but also the depth wall 45 can be provided with the protrusions 49. In this case, the protrusions 49 are protrusions that protrude from the inner wall surface of the depth wall 45 toward the access side of the receiving unit 7. The protrusion amount of the protrusions 49 on the depth wall 45 is defined such that the protrusions 49 come into contact with the tip surface 6d of the substrate 6 that is inserted into the receiving unit 7.

[0057] The connector block 5 can be pressed into the housing 4 and held by the housing 4 at the engaging part with the housing 4. In this case, the engaging unit of the housing 4 with the connector block 5 functions as a holding unit. In the housing 4, the depth side of the receiving unit 7 is not necessarily closed. The housing 4 can be a cylindrical housing in which the depth wall 45 is absent and both ends are open.

[0058] Contents disclosed in the embodiment and the modification may be combined for implementation as necessary.

[0059] A substrate holding structure, an electronic component module, and an electrical connection box according to the embodiment include holding units provided with a housing and holding an end portion of a substrate accommodated in a receiving unit on an insertion-direction access side of the substrate; and projections projecting from side wall surfaces, which are wall surfaces of the housing along the substrate insertion direction and wall surfaces opposite side surfaces of the substrate, and which are plastically deformed due to contact with the substrate to be inserted into the receiving unit. The substrate holding structure, the electronic component module, and the electrical connection box according to the present invention can suppress relative displacement of the substrate to the housing with projections and suppress rattling of the substrate.

[0060] While the invention has been described with respect to particular embodiments for the purpose of complete and clear disclosure, the appended claims are not to be so limited, but are to be construed to embody all modifications and alternative constructions that may occur to one skilled in the art which reasonably fall within the basic teachings presented herein.

Claims

[1] Substrate holding structure (100) comprising: a holding unit (43a, 44a) provided with a housing (4) including a receiving unit (7) receiving an inserted substrate (6) therein, and holding an end part of the substrate (6) received in the receiving unit (7) on an insertion direction access side of the substrate (6); projections (49) projecting from side wall surfaces (41a, 42a), which are wall surfaces (41, 42) of the housing (4) along an insertion direction of the substrate (6) and opposite side surfaces (6e, 6f) of the substrate (6), and a holding element (5) connected to an end part of the substrate (6) on the insertion direction access side of the substrate (6) and held by the holding unit (43a, 44a), wherein the projections (49) are plastically deformed due to contact with the substrate (6) to be inserted into the receiving unit (7), and the holding member (5) includes projections (55) on the side of the holding member (5) which come into contact with an inner wall surface (41, 42) of the housing (4) in a state in which the holding member (5) is held by the holding unit (43a, 44a). [2] The substrate holding structure (100) according to claim 1, wherein both of the pair of side wall surfaces (41a, 42a) which are opposed to each other and sandwich the substrate (6) therebetween are provided with the projections. [3] The substrate holding structure (100) according to claim 1 or 2, wherein the projections are arranged in a deep part of the side wall surfaces (41a, 42a) in the insertion direction of the substrate (6). [4] Electronic component module (3) comprising: a substrate (6) to which an electronic component is connected; a housing (4) including a receiving unit (7) that receives the substrate (6) to be inserted therein; a holding unit (43a, 44a) with which the housing (4) is equipped and which holds an end part of the substrate (6) accommodated in the accommodating unit (7) on an insertion direction access side of the substrate (6); projections (49) projecting from side wall surfaces (41a, 42a), which are wall surfaces (41, 42) of the housing (4) along an insertion direction of the substrate (6) and opposite side surfaces (6e, 6f) of the substrate (6), and a holding element (5) connected to an end part of the substrate (6) on the insertion direction access side of the substrate (6) and held by the holding unit (43a, 44a), where the projections (49) are plastically deformed due to contact with the substrate (6) to be inserted into the receiving unit (7), and the holding member (5) includes projections (55) on the side of the holding member (5) which come into contact with an inner wall surface (41, 42) of the housing (4) in a state in which the holding member (5) is held by the holding unit (43a, 44a). [5] Electrical connection box which has: a substrate (6) to which an electronic component is connected; a housing (4) including a receiving unit (7) that receives the substrate (6) to be inserted therein; a holding unit (43a, 44a) with which the housing (4) is equipped and which holds an end part of the substrate (6) accommodated in the accommodating unit (7) on an insertion direction access side of the substrate (6); projections (49) projecting from side wall surfaces (41a, 42a), which are wall surfaces (41, 42) of the housing (4) along an insertion direction of the substrate (6) and opposite side surfaces (6e, 6f) of the substrate (6), a holding member (5) connected to an end part of the substrate (6) on the insertion direction access side of the substrate (6) and held by the holding unit (43a, 44a), and a frame holding the housing (4) therein, wherein the projections (49) are plastically deformed due to contact with the substrate (6) to be inserted into the receiving unit (7), and the holding member (5) includes projections (55) on the side of the holding member (5) which come into contact with an inner wall surface (41, 42) of the housing (4) in a state in which the holding member (5) is held by the holding unit (43a, 44a).

Citation Information

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