Combined machining process and combined machining program

Abstract

Combined processing method performed by a device (100) comprising: a laser processing device (190) and a mechanical processing device (154), wherein the method comprises: a first step of such execution of a mechanical processing on a target area (11) for laser processing, which is a target of a laser processing of a processing target (10), such that the target area (11) for laser processing has a surface shape with a predetermined absorption capacity for a laser beam; a second step of emitting a laser beam (20) onto the target area (11) for laser processing to heat the processing target (10) after completion of the first step; and a third step of such execution of a mechanical processing on the target area for laser processing (11) that the processing target (10) has a desired shape and / or a desired surface, after completion of the second step.

Description

BACKGROUND OF THE INVENTION Area of ​​the invention

[0001] The present invention relates to a combined machining method and a combined machining program for machining a machining target. Related technology

[0002] Traditionally, mechanical processing, in which operations such as ablation, grinding, and polishing are performed on a workpiece (hereinafter referred to as a workpiece), is generally carried out using a machine tool with tools and the like. Laser processing is also generally performed, in which a workpiece is processed by irradiating it with a laser beam. Patents 1 and 2, for example, disclose a technology for performing both mechanical processing and laser processing on a workpiece.

[0003] More precisely, the technology disclosed in patents 1 and 2 involves mechanical processing by grinding and polishing a wafer, which is such that the wafer has a greater thickness than the final processing thickness. Subsequently, laser processing is performed on the wafer using a laser cutting device. Furthermore, mechanical processing is carried out again after the wafer has undergone specified subsequent steps, which are performed after the laser processing, in such a way that the wafer has a final processing thickness. In this way, by performing the mechanical processing in two stages, the wafer is prevented from being split during the specified subsequent steps. Patent specification 1: Unexamined Japanese patent application, Publication No. JP 2007 - 235 068 A Patent specification 2: Unexamined Japanese patent application, Publication No. JP 2007 - 235 069 A

[0004] JP S60-133991A describes a process for laser welding steel strips. The steel strips are cut to size with shears and then butted together using clamps. The surfaces of the joined butt joints are ground with a grinding wheel to a surface roughness of at least 10 micrometers and at most 10% of the thickness of the steel strips. A processing head of a laser welding machine then moves across the butt joints. As the head moves, the laser beam generated by the laser beam oscillator is guided through a conveyor channel and directed by the head onto the sections of the steel strips, thus welding the strips together.

[0005] JP H11-123583A describes a device for laser processing of reflective workpieces. The device is designed such that an auxiliary gas is injected coaxially with a laser beam exiting the center of a gas nozzle tip. Additionally, a cylindrical powder nozzle is arranged concentrically around the outer circumference of the gas nozzle tip. A liquid is sprayed from the outside of the gas nozzle onto the workpiece through the powder nozzle, thus mattening the workpiece surface before laser irradiation. Splashes and molten material generated on the front and back of the workpiece during laser processing are removed by the liquid spray. SUMMARY OF THE INVENTION

[0006] Laser processing can be broadly divided into three types: conversion processing (e.g., surface hardening), in which the surface temperature of a processing target is raised to a temperature lower than the melting point of the processing target; melt processing (e.g., welding or thermal ablation), in which the surface temperature of a processing target is raised to a temperature higher than the melting point but lower than the boiling point; and processing in which a workpiece is vaporized and removed by heating it to a temperature higher than its boiling point.

[0007] In the case of evaporation processing, it is necessary to heat the workpiece to a temperature higher than its boiling point. Therefore, it is required to adjust the power or spot size of a laser beam to maximize the energy density of the emitted laser beam on the workpiece surface.

[0008] In contrast, conversion and melting processes require heating the workpiece surface to a low temperature. Therefore, it is necessary to adjust the power or spot size of a laser beam so that the energy density of the emitted laser beam on the workpiece surface is kept appropriately low.

[0009] During heating processes using a laser beam, the phenomenon occurs that the absorbance of the laser beam increases abruptly as the workpiece surface heats up to a certain high temperature, and the heating continues. One reason for this is that the absorbance of a laser beam tends to depend on the surface temperature of the workpiece. The other reason is related to a change in the surface condition, such as melting, oxidation, or carbonization, and a change in the surface shape, such as the formation of a through-hole. However, if the energy density of the emitted laser beam on the workpiece surface is low, the temperature increase on the workpiece surface is slow, and therefore the change in the reflectance of the laser beam on the surface is small.If the absorption capacity for the laser beam on the workpiece surface is low, the amount of heat absorbed by the workpiece remains low, and the problem arises that it is not possible to heat the workpiece adequately.

[0010] Although heating can be carried out more efficiently in this respect, as long as the absorption capacity for a laser beam on the workpiece surface can be increased, it is difficult to change the absorption capacity because the absorption capacity for light on the surface of a material depends on the surface properties or condition, or on the angle of incidence. Therefore, in a general technology such as that disclosed in patents 1 and 2, the absorption capacity of a workpiece is not specifically taken into account.

[0011] Furthermore, conventional blackening processes, for example, involve applying a dark absorbent to the surface of a workpiece to increase its absorption capacity for a laser beam. However, this method presents a problem: the absorbent must be removed after laser processing, making the process complex and incurring additional costs.

[0012] Therefore, it is an object of the present invention to provide a combined machining method and a combined machining program suitable for easily adjusting the absorption capacity of a workpiece before performing laser machining.

[0013] This problem is solved by the subject matter of the independent claims. Preferred embodiments are the subject matter of the dependent claims.

[0014] According to the present invention, it is easily possible to adjust the absorption capacity of a workpiece before laser processing is carried out. BRIEF DESCRIPTION OF THE DRAWINGS Fig. Figure 1 is a diagram that represents a basic configuration of a combined machining device according to an embodiment of the present invention. Fig. Figure 2 is a diagram illustrating a first embodiment of the present invention. Fig. Figure 3 is a flowchart that illustrates a basic workflow of an embodiment of the present invention. Fig. Figure 4 is a diagram describing an angle of impact. Fig. Figure 5 is a diagram that shows an example of the proportion of a surface's reflectance in relation to its absorptivity. Fig. Figure 6 is a diagram illustrating a second embodiment of the present invention. Fig. Figure 7 is a diagram illustrating a third embodiment of the present invention. Fig. Figure 8 is a diagram illustrating a fourth embodiment of the present invention. Fig. Figure 9 is a diagram illustrating a fifth embodiment of the present invention. Fig. Figure 10 is a diagram illustrating a sixth embodiment of the present invention. Fig. 11A is a diagram (1 / 2) that represents a seventh embodiment of the present invention. Fig. Figure 11B is a diagram (2 / 2) that illustrates the seventh embodiment of the present invention. Fig. Figure 12A is a diagram (1 / 2) that represents an eighth embodiment of the present invention. Fig. Figure 12B is a diagram (2 / 2) that represents the eighth embodiment of the present invention. Fig. Figure 13 is a diagram illustrating a ninth embodiment of the present invention. Fig. Figure 14 is a diagram illustrating a tenth embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0015] First, an overview of one embodiment of the present invention is described. One embodiment of the present invention relates to a combined processing method involving both mechanical processing and laser processing. In the present embodiment, prior to laser processing, mechanical processing is performed on a target area for laser processing on a workpiece (hereinafter referred to as the "target area for laser processing") such that the absorption capacity is suitable for a laser beam. After the mechanical processing is completed, laser processing is carried out by emitting a laser beam onto the target area for laser processing.

[0016] In this way, it is possible to ensure that the workpiece absorbs an adequate amount of heat and to heat it to a desired temperature. This means that it is possible to solve the problem mentioned in the "SUMMARY OF THE INVENTION" of "providing a combined machining process and a combined machining program suitable for easily adjusting the absorption capacity of a workpiece before laser processing." Furthermore, in the present embodiment, it is also possible to give the workpiece a desired shape by performing a mechanical machining operation after laser processing, as required. An overview of the embodiment of the present invention has been described above.

[0017] Next, embodiments one through ten of the present invention are described. These embodiments share a common configuration of a combined machining device 100 for carrying out the processes described in each of these embodiments. Therefore, the configuration of the combined machining device 100 is described first, followed by a detailed description of each embodiment. <Konfiguration der den jeweiligen Ausführungsformen gemeinsamen kombinierten Bearbeitungsvorrichtung 100 >

[0018] The configuration of the combined machining device 100 is described with reference to a functional block diagram according to Fig. 1 described. According to Fig. 1 The combined processing device 100 comprises a CPU 111, a ROM 112, a RAM 113, a CMOS memory 114, several interfaces (I / Fs 115, 118 and 119), a PLC 116, an input / output unit 117, a data communication bus 120, several shaft control circuits (shaft control circuits 130 to 134), several servo amplifiers (servo amplifiers 140 to 144), several servo motors (servo motors 150 to 154), a spindle control circuit 160, a spindle amplifier 161, a spindle motor 162, a pulse encoder 163, a display / MDI unit 170, a control console 171, an external device 172, a laser control unit 180 and a laser processing unit 181.

[0019] The CPU 111 is a processor that controls the entire combined machining device 100. The CPU 111 reads a system program stored in the ROM 112 via the bus 120 and controls the entire combined machining device 100 according to the system program. Volatile calculation data, display data, and various data elements entered by an operator via the display / MDI unit 170 are stored in the RAM 113.

[0020] The CMOS memory 114 is configured as non-volatile memory, supported by a battery (not shown), and its memory state is retained even when the power source of the combined processing unit 100 is switched off. A processing program read via the interface 115, a processing program entered via the display / MDI unit 170, and the like are stored in the CMOS memory 114. In the present embodiment, the CPU 111 controls the laser processing unit 190 based on the processing program, and the corresponding motors for moving a workpiece and driving tools, thereby enabling laser processing and mechanical processing to be carried out in separate steps to be described later.

[0021] Various system programs for performing processing in an editing mode required for creating and editing an editing program and for performing processing for automated workflows are written in advance to ROM 112.

[0022] Various main components, such as an editing program for executing the control according to the present embodiment, can be entered via the interface 115 and the display / MDI unit 170 and stored in the CMOS memory 114.

[0023] Interface 115 is configured to allow a connection between the combined machining device 100 and the external device 172, acting as a data server. The machining program and various parameters are read from the external device 172. Furthermore, the machining program edited in the combined machining device 100 can be saved to an external storage device via the external device 172.

[0024] The PLC (programmable logic controller) 116 outputs signals via the input / output unit 117 to an auxiliary device (for example, an actuator referred to as a robot hand for tool exchange) of a machine tool, according to a sequence program contained in the combined machining device 100, and controls the auxiliary device. In addition, the PLC 116 receives signals from various switches of the control console 171 located on the main body of a machine tool, performs necessary processing on the signals, and sends the processed signals to the CPU 111.

[0025] The display / MDI unit 170 is a device for manual data input, comprising a display, a keyboard, and the like. Interface 118 receives commands and data from the keyboard of the display / MDI unit 170 and sends the commands and data to the CPU 111. Interface 119 is connected to the control console 171, which includes a manual pulse generator and the like. The shaft control circuits 130 to 134 of the respective shafts receive motion parameter commands for the respective shafts from the CPU 111 and output the commands for the respective shafts to the servo amplifiers 140 to 144.

[0026] The servo amplifiers 140 to 144 receive the commands to control the servomotors 150 to 154 of the respective shafts. Each servomotor 150 to 154 of the respective shafts includes a position and speed detector and sends a position and speed feedback signal from the position and speed detector back to the shaft control circuits 130 to 134 to perform feedback control of position and speed. The position and speed feedback is not shown in the block diagram.

[0027] The spindle control circuit 160 receives a main shaft rotation command for a main shaft to which a tool for performing a machining operation is attached, and outputs a spindle speed signal to the spindle amplifier 161. Upon receiving the spindle speed signal, the spindle amplifier 161 causes the spindle motor 162 to rotate at the commanded speed to drive a tool attached to the main shaft.

[0028] The pulse encoder 163 is coupled to the spindle motor 162 via a gearbox, belt, or similar device, and the pulse encoder 163 outputs a feedback pulse synchronously with the rotation of the main shaft. This feedback pulse is read by the CPU 111 via the bus 120. Based on this feedback pulse, the CPU 111 controls a main shaft rotation command for a machine tool.

[0029] Based on the processing program, the laser control unit 180 receives a laser power command for laser processing from the CPU 111. This laser power command includes instructions such as peak power, frequency, duty cycle, and the like for emitting a laser beam at a specified power. The laser control unit 180 then outputs a control signal based on this laser power command to the laser processing unit 190.

[0030] The laser processing unit 190 is a unit comprising a laser oscillator, which vibrates and emits a laser beam, a processing head, and a nozzle that condenses the laser beam emitted by the laser oscillator for projection onto a workpiece using an optical system. Based on the control signal from the laser control unit 180, the laser processing unit 190 projects a laser beam at a predetermined power onto a workpiece.

[0031] A general method for moving a workpiece or tool using respective shafts, a general mechanical machining method using a tool attached to a main shaft, and a general laser machining method using the Laser Machining Unit 190 are generally known to people skilled in the art. Therefore, a detailed description and illustration of these methods are omitted.

[0032] Moreover, the configuration example of the combined machining device 100 is merely an example. In the present embodiment, various mechanical machining operations, such as turning (including thread cutting), milling, transfer machining (including knurling), rolling, pressing, forming, and sandblasting, can be performed using tools. Furthermore, laser machining can be employed in the present embodiment, utilizing various lasers such as a carbon dioxide laser (CO2 laser), a YAG laser, a fiber laser, and a diode laser. To implement these various machining processes, the combined machining device 100 can be modified as desired.

[0033] In the configuration example described above, five shaft control circuits 30 to 34 and five servo motors 50 to 54 are used. However, the combined machining device 100 can include any number of shaft control circuits and servo motors without limitation. Although the combined machining device 100 can be implemented as a single device, it can also be implemented as a combination of a numerical control and a machine tool.

[0034] Next, the respective embodiments are described in detail. In connection with the following embodiments, a case is described in which hardening is carried out on a workpiece 10 made of a metallic material (for example, unalloyed steel S45C) by means of laser processing using a laser beam 20.

[0035] In this case, the laser beam 20 is a high-power laser such as a carbon dioxide laser (CO2 laser), a YAG laser, a fiber laser, or a diode laser. Furthermore, the output power of the laser beam 20 is, for example, 10 W to 20 kW. In addition, the wavelength of the laser beam 20 lies, for example, in the range from ultraviolet to infrared light.

[0036] These assumptions, however, are merely examples to describe the respective embodiments and do not limit the applications of those embodiments. For example, a material other than metal can be used as workpiece 10. <Erste Ausführungsform>

[0037] Next, a first embodiment will be described. Fig. Figure 2 shows mechanical processing and laser processing by the combined processing device 100 on the workpiece 10. Furthermore, it shows Fig. 3. A flowchart of the respective steps according to the present embodiment. The respective steps to be described later are performed by the combined machining device 100 described above.

[0038] First, the workpiece 10 exhibits [unclear] before the processing carried out in the respective steps, as described in [unclear]. Fig. 2 “(a) Before processing (raw material)”, a cylindrical shape is shown. The workpiece 10 is positioned on one of the axes of the combined machining device 100 such that it rotates about an axis (in the drawing, the axis of rotation is represented by a dot-dash line) extending in a longitudinal direction along a side face of the cylindrical shape. The following processes are carried out while the workpiece 10 is rotated, and the rotational speed is, for example, 1000 rpm.

[0039] Subsequently, in this state, the combined processing device 100 performs mechanical processing on a target area 11 for laser processing on the workpiece 10 prior to the laser processing, such that the absorption capacity for a laser beam becomes adequate. This means that as a first step (according to Fig. Step 3 (S1) involves a preparatory laser irradiation process.

[0040] Here, with reference to the Fig. 4 and Fig. 5 The concept of mechanical processing in the first step according to the present embodiment is described. First, as in Fig. Figure 4 shows the angle at which the laser beam 20 strikes the surface of the workpiece 10 perpendicularly, an angle of incidence of 0°. In this case, the absorption coefficient for the laser beam 20 tends to be, as shown in Fig. 5 shows that the laser beam decreases when it hits the target perpendicularly (angle of incidence = 0°), and increases when the angle of incidence increases (for example, when it becomes greater than 60°).

[0041] Therefore, in the present embodiment, the mechanical processing is carried out in the first step taking this circumstance into account. For example, if it is desired to increase the absorption capacity for the laser beam 20, a surface shape is mechanically machined such that the angle of incidence of the laser beam on the target area for laser processing increases. Conversely, if it is desired to decrease the absorption capacity for the laser beam 20, a surface shape is mechanically machined such that the angle of incidence of the laser beam on the target area for laser processing decreases.

[0042] Specific machining processes include turning (including thread cutting), milling, transferring (including knurling), rolling, pressing, pushing and sandblasting on the surface of the workpiece 10.

[0043] In the present embodiment, the surface shape is mechanically machined to increase the absorption capacity for the laser beam 20, thereby increasing the angle of incidence of the laser beam 20 on the target area for laser processing. Therefore, a turning operation is performed such that an area other than the target area 11 for laser processing on the surface of the workpiece 10 has a desired final shape. The workpiece 10, for example, has a desired final diameter. As shown in Fig. As shown in Figure 2 under “(b) First step (before laser irradiation)”, a V-groove with a flat section at a crest and a trough is repeatedly created in the target area 11 for laser processing. The V-grooves are, for example, spaced 0.5 mm apart and parallel to the axis of rotation. Furthermore, the height of the flat section at the crest of a V-groove is, for example, 0.5 mm above the desired final diameter.

[0044] In this state, the combined processing device 100 performs laser processing on the target area 11 for laser processing. More precisely, the laser beam 20 is directed onto the target area 11 for laser processing to heat it. This means that as a second step (according to Fig. 3 Step S2) a laser irradiation process is carried out.

[0045] Since a preliminary mechanical processing step is performed to ensure adequate absorption for the laser beam 20, the workpiece 10 efficiently absorbs the laser beam 20. This means that the laser processing can be carried out efficiently. Because the peaks and troughs of the respective V-grooves are flat sections in this example, the laser beam 20 strikes them perpendicularly, and a large portion of the laser beam 20 is reflected. However, because the laser beam 20 strikes the other sections of the respective V-grooves at an angle, it is efficiently absorbed, and these sections are heated significantly. In the drawings described later, the heated sections are represented by diagonal hatching.

[0046] Furthermore, the heat generated by the heating process is transferred from the low points of the respective V-grooves into the interior of the target area 11 for laser processing. When the laser emission ceases, the heat from the heated sections is rapidly transferred to the surrounding, lower-temperature sections, and the heated sections are rapidly cooled. Alternatively, the heated sections are rapidly cooled by a cooling oil or water. In this way, hardening to a predetermined depth can be performed in the target area 11 for laser processing.

[0047] As in Fig. As shown in Figure 2 under “(c) Second step (Laser emission)”, the laser beam 20 is emitted from the center of the workpiece 10 to a side surface of the workpiece 10 in order to adjust the angle of incidence so that the laser beam 20 is absorbed more efficiently by the workpiece 10.

[0048] The combined processing device 100 then performs a final processing step by means of mechanical processing, thereby obtaining a desired finished shape and surface in addition to the desired heat treatment. This means that as a third step (according to Fig. Step 3 (S3) performs the final processing. As in Fig. As shown in section 2 under “(d) Third step (finishing)”, for example, a turning operation is carried out on the target area 11 for laser processing, and the V-grooves formed in the target area 11 for laser processing are removed so that the target area 11 for laser processing has a desired final diameter.

[0049] Since hardening in the target area 11 for laser processing can be carried out to a predetermined depth, as described above, if the surface has undergone such a finishing process, it is possible to obtain a partially heat-treated component. In the first step, V-grooves are created, and the mechanical processing must not be carried out in areas other than the target area 11 for laser processing. In the third step, both the target area 11 for laser processing and areas other than the target area 11 for laser processing can be machined to achieve the desired final diameter.

[0050] Since, in the embodiment described above, the laser processing is carried out as a second step after the mechanical processing to increase the absorption capacity for the laser beam 20 at the target area 11, it is possible to efficiently heat the workpiece 10. Subsequently, by carrying out the third step, it is possible to obtain a desired finished shape and surface in addition to the desired heat processing. <Zweite Ausführungsform>

[0051] Next, with reference to Fig. 6. A second embodiment is described. In the description of each embodiment following the second embodiment, sections that overlap with those of the first embodiment are omitted, and differences from the first embodiment are described in detail.

[0052] According to the first embodiment, the first step involves a mechanical processing operation to increase the absorption capacity of the laser beam 20. In contrast, in the present embodiment, the first step involves a mechanical processing operation to decrease the absorption capacity.

[0053] The reason for this is that, depending on the surface texture and condition (surface roughness) of workpiece 10, it is preferable to perform mechanical processing as a first step to reduce its absorption capacity. For example, if the raw material of workpiece 10 is a cast blank, a forged material, or black-dyed leather, a fine, uneven section will be present on its surface. Workpiece 10 with this fine, uneven surface section is in Fig. 6 under “(a) Before processing (raw material)”.

[0054] When the laser beam 20 is emitted onto the workpiece 10 in such a state, the surface, although the absorption capacity is increased to be higher than that of a flat surface, is generally heated unevenly, which is not desirable.

[0055] Therefore, in the present embodiment, as in Fig. 6 under “(b) First step (before laser irradiation)”, as mechanical processing in the first step is such that polishing or the like is carried out on the target area 11 for laser processing, such that the target area 11 for laser processing is converted into a flat metal surface.

[0056] After the first step has been carried out, the laser beam 20 is emitted onto the target area 11 for laser processing in the second step, thereby enabling uniform heating. In this way, in the present embodiment, as in Fig. 6 under “(c) Second step (laser emission)”, it is possible to perform heat treatment uniformly on the entire target area 11 for laser processing.

[0057] In this case, furthermore, “(d) Third step (finishing)” may be carried out, and “(d) Third step (finishing)” may be omitted if it is acceptable for areas other than the target area 11 for laser processing on the surface of the workpiece 10 to be black-dyed leather or the like. <Dritte Ausführungsform>

[0058] Next, with reference to Fig. 7 describes a third embodiment. In the present embodiment, light reflected from the laser beam 20 onto the workpiece 10 is taken into account.

[0059] When a laser beam 20a (an incident light beam), which is incident light that strikes perpendicularly or at a small angle, passes through an aperture of a laser oscillator that emitted the laser beam 20 and returns to the laser oscillator. When the laser beam 20 returns to the laser oscillator, the laser oscillator may be damaged.

[0060] Therefore, the present embodiment prevents such a situation from occurring. More precisely, as described in Fig. 7 shown under “(b) First step (before laser irradiation)”, the mechanical processing in the first step repeatedly creates a mountain shape on the surface of the target area 11 for laser processing.

[0061] In this way, as in Fig. Figure 7, “(c) Second Step (Laser Emission)”, shows an angle of incidence represented by an angle of half the width of the laser beam 20a (an incident light beam), which is light incident on the mountain shape, which is equal to or greater than a convergence angle represented by an angle of half the width. As a result, the reflected light (the reflected light beam) does not return to the laser oscillator.

[0062] As described in connection with the first embodiment, the laser beam 20 is, as in Fig. Figure 7, under “(c) Second step (laser emission)”, shows that the laser beam is emitted from the center of the workpiece 10 to the side surfaces of the workpiece 10. Since in this way the angle of incidence represented by the angle of half the width of the laser beam 20a (the incident light beam), which is incident light, becomes equal to or greater than the angle of convergence represented by the angle of half the width, the laser beam 20b (the reflected light beam), which is reflected light, does not return to the laser oscillator.

[0063] Since, in the embodiment described above, the angle of incidence represented by the angle of half the width of the laser beam 20a (the incident light beam), which is incident light, is equal to or greater than the angle of convergence represented by the angle of half the width, it is possible to prevent the laser beam 20b (the reflected light beam), which is reflected light, from returning to the laser oscillator. Moreover, since the laser beam 20b (the reflected light beam), which is reflected light, is absorbed by the surrounding exterior of the aperture in this case, no particular problem arises. <Vierte Ausführungsform>

[0064] Next, with reference to Fig. 8 A fourth embodiment is described. The present embodiment shows an unusual effect during heating by the laser beam 20 during the mechanical processing in the first step.

[0065] In the present embodiment, if the laser beam 20 is emitted from randomly or circularly polarized light to heat a material, at an angle of incidence of 0° only the (according to the absorption coefficient y) is emitted. Fig. 8 corresponding) absorption coefficient for a P-wave component greater than (twice the absorption coefficient x according to Fig. 8 corresponding) absorption coefficients for the laser beam 20 from the sum of the S- and P-wave components. This means that in the example according to Fig. 8. The angle of impact is controlled so that it is equal to a(°) or greater. At an angle of impact of a(°), the absorption coefficient y, as shown in the diagram, is twice the absorption coefficient x.

[0066] In this way, the heating effect of the laser beam 20 is remarkably efficient when the surface shape of the workpiece 10 is modified during the first mechanical processing step such that the angle of incidence a(°) is equal to or greater than α(°). Furthermore, if the surface shape of the workpiece 10 is modified so that the angle of incidence b(°), at which the absorption of the P-wave component is highest, is equal to or greater, an even more significant heating effect can be achieved. The present embodiment is particularly suitable when the laser beam 20 is used that comprises only the P-wave, but not the S-wave. <Fünfte Ausführungsform>

[0067] Next, with reference to Fig. 9 a fifth embodiment is described. As in Fig. As shown in Figure 9 under “(a) Before processing (raw material)”, the mechanical processing in the first step of the present embodiment is carried out on the surface shape of the target area 11 for laser processing, which is horizontal to the P-polarization plane, such that V-grooves are produced close together at a distance of 0.3 mm, as shown, for example, under “(b) First step (before laser irradiation)”. Although the distance according to the drawing is 0.3 mm, the V-grooves can be produced even closer together. The distance can be selected as desired, for example, in the range of 0.05 mm to 3 mm. The V-grooves can easily be produced by thread cutting or the like.

[0068] As in Fig. As shown in Figure 9 under “(C-1) Second Step (Laser Emission)”, the laser beam 20 is subsequently emitted as a second step. In this respect, the angle of incidence of the laser beam 20 increases with respect to the respective inclined surfaces of the V-groove. Therefore, the respective inclined surfaces of the V-groove are efficiently heated by absorption of the laser beam 20.

[0069] If, in this respect, a macroscopic focus is placed on the multiple V-grooves instead of the individual V-grooves, it becomes apparent that the evident absorption capacity of the entire target area 11 for laser processing, which is a flat surface on which the multiple V-grooves are formed, can be increased. As in Fig. As shown in Figure 9 under “(C-2) Second Step (Laser Emission)”, the heat applied by emitting the laser beam onto the multiple V-grooves spreads from the respective V-grooves through the interior of the target area 11 for laser processing. In this way, heat processing can be carried out in the target area 11 for laser processing to a predetermined depth.

[0070] According to the embodiment described above, by creating the V-grooves at a fine distance, it is possible to increase the apparent absorption capacity of the entire target area 11 for laser processing, which macroscopically is a flat surface. <Sechste Ausführungsform>

[0071] Next, with reference to Fig. 10 describes a sixth embodiment. The present embodiment is particularly suitable if a desired final shape obtained by the third step is a shape that does not readily absorb the laser beam 20.

[0072] In the present embodiment, the mechanical processing in the first step produces grooves with a width of 0.5 mm and a depth of 0.8 mm in the target area 11 for laser processing such that the side surfaces have an angle of 85°, as shown in Fig. 10 under “(b) First step (before laser irradiation)” under<Fall der vorliegenden Ausführungsform> depicted.

[0073] In the second step, the laser beam 20 is directed onto the target area 11 for laser processing in such a way that the laser beam 20 is absorbed by the side surfaces of the grooves to heat the side surfaces, as shown in Fig. 10 under “(c) Second step (laser emission)” under<Fall der vorliegenden Ausführungsform> illustrated. In this way, heat treatment (hardening in this example) can be carried out up to a predetermined thickness.

[0074] Through mechanical processing in the third step, the side surfaces are finished in a rectangular shape, as shown in Fig. 10 under “(d) Third step (finishing)” under<Fall der vorliegenden Ausführungsform> As shown. Since hardening up to a predetermined thickness can be carried out in this case, the side surfaces are in a hardened state after the final processing. A case in which the processing according to the present embodiment was not carried out is shown in Fig. 10 with reference to<Fall, in dem die Verarbeitung gemäß der Ausführungsform nicht ausgeführt wurde> described.

[0075] It is assumed that the mechanical processing in the first step was carried out in such a way that grooves with a width of 0.5 mm and a depth of 0.8 mm and a rectangular shape were produced in the target area 11 for laser processing such that the side surfaces had an angle of 90°, as shown in Fig. 10 under “(b) First step (before laser irradiation)” under<Fall, in dem die Verarbeitung gemäß der Ausführungsform nicht ausgeführt wurde> depicted.

[0076] It is also assumed that in the second step, laser beam 20 was emitted. As in Fig. 10 under “(c) Second step (laser emission)” under<Fall, in dem die Verarbeitung gemäß der Ausführungsform nicht ausgeführt wurde> As shown, in this case the side surfaces of the grooves are hardly heated, since the laser beam 20 is barely directed onto the side surfaces of the grooves. Furthermore, because the laser beam 20 strikes the flat sections at the lowest points of the grooves perpendicularly, these flat sections are not heated sufficiently. Since the entire rectangular shape forming the groove is therefore not heated, no hardening occurs.

[0077] Since, as described above, the hardening of the side surfaces to a predetermined depth can be carried out according to the present embodiment, the side surfaces are in a hardened state after the final processing. This means that, according to the present embodiment, only the side surfaces can be heat-treated. <Siebte Ausführungsform>

[0078] Next, with reference to Fig. 11A and Fig. A seventh embodiment is described in Section 11B. The present embodiment, as a result of the mechanical processing in the first step, prevents excessive heating of a section of the target area 11 for laser processing.

[0079] First, with reference to Fig. Figure 11 describes a case in which V-grooves are repeatedly created in the target area 11 for laser processing, but no flat section is formed. In this case, the absorption capacity in the V-groove is improved. Furthermore, the laser beam 20 is repeatedly reflected so that it reaches the low points of the V-grooves. Therefore, as in Fig. As shown in Figure 11A under “(c) Second Step (Laser Emission)”, the edges of the repeating V-grooves on both side faces are excessively heated, and there is a probability that the low points will be excessively heated due to the concentration of the laser beam. Although in this case it depends on the type of laser beam 20 used for laser processing and the material or the like of the workpiece 10, the workpiece 10 may be heated to a temperature exceeding its melting point, even if hardening is to be carried out by heating the workpiece 10 to a temperature lower than its melting point.

[0080] As in Fig. As shown in Figure 11B under “(c) Second step (laser emission)”, a flat section is therefore created at the apex and at the troughs of the repeating V-grooves. Since the absorption coefficient at the flat section is low, it is therefore, unlike according to Fig. 11A, it is possible to prevent excessive heating of a section of the peak and troughs. Therefore, it is possible to heat the entire target area for laser processing uniformly. In the case of Fig. For example, in 11B, the spacing of the repeating V-grooves is 1 mm. Furthermore, the height of the flat section at the apex of the V-groove is, for example, 0.5 mm. <Achte Ausführungsform>

[0081] Next, with reference to Fig. 12A and Fig. Section 12B describes an eighth embodiment. In the present embodiment, a method for mechanical processing is taken into account in the first step.

[0082] As in Fig. As shown in Figure 12A under “(b) First step (before laser irradiation)”, a knurling process is carried out on the target area 11 for laser processing such that a series of concave or convex cones or truncated cones are produced on the surface of the target area 11 for laser processing. In this way, it is possible to increase the absorption capacity for the laser beam 20.

[0083] Knurling can be achieved, for example, by removing material in such a way that the V-grooves intersect, forming a pattern on the surface. Alternatively, knurling can be achieved, for example, by rolling. In particular, it can be achieved by pressing a knurling die against the workpiece 10 to imprint the die's shape onto the workpiece, thereby plastically deforming the workpiece 10.

[0084] As in Fig. As shown in Figure 12b under “(b) First step (before laser irradiation)”, the absorption capacity for the laser beam 20 can be increased by forming circular conical depressions in the target area 11 for laser processing. In this case, the circular conical depressions can be produced by ablation or rolling. According to the embodiment described above, the mechanical processing in the first step can be carried out by various methods. <Neunte Ausführungsform>

[0085] Next, with reference to Fig. 13 describes a ninth embodiment. Although hardening was described as an example of laser processing in the second step in the respective embodiments described above, welding is described as an example of laser processing in the second step in connection with the present embodiment and the following tenth embodiment.

[0086] First, the case of the present embodiment is described. The workpiece 10 according to Fig. 13 has a cylindrical shape, similar to those shown in connection with the respective embodiments described above, and Fig. Figure 13 shows a sectional view of workpiece 10. As described in Fig. 13 “(a) Before processing (raw material)” under<Fall der vorliegenden Ausführungsform> As shown, the end surfaces of two cylindrical workpieces 10 are brought into contact with each other.

[0087] Furthermore, the mechanical processing in the first step is carried out in such a way that a shape is created in the target area 11 for laser processing using the end sections of the two cylindrical workpieces 10 as the target area 11 for laser processing, which increases the absorption capacity for the laser beam 20, as shown in Fig. 13 under “(c) Second step (laser emission)” under<Fall der vorliegenden Ausführungsform> This is illustrated. For example, repeating V-grooves are created.

[0088] In the second step, the laser beam 20 is directed onto the target area 11 for laser processing. Since the absorption capacity in the target area 11 for laser processing is increased by the first step, the end sections of the two cylindrical workpieces 10 are sufficiently heated in this respect, and the temperature exceeds the melting point of the workpiece 10, as shown in Fig. 13 under “(c) Second step (laser emission)” under<Fall der vorliegenden Ausführungsform> The process is illustrated. In this way, the end sections of the two cylindrical workpieces 10 are melted, and the two cylindrical workpieces 10 are welded together. Since, in the embodiment described above, the absorption capacity in the target area 11 for laser processing is increased in the first step, it is possible to carry out the welding efficiently.

[0089] Although the task of performing a weld can be accomplished in this state, a third step can also be carried out as required. As in Fig. As shown in Figure 13 under “(d) Third step (finishing)”, for example, turning operations can be performed on the target area 11 for laser processing to remove the V-grooves repeatedly formed in the target area 11 for laser processing and to bulge sections produced during welding so that the target area 11 for laser processing has a desired final diameter. A case in which the processing according to the present embodiment was not carried out is described with reference to<Fall, in dem die Verarbeitung gemäß der Ausführungsform nicht ausgeführt wurde> according to Fig. 13 described.

[0090] As in Fig. 13 under “(a) Before processing (raw material)”<Fall, in dem die Verarbeitung gemäß der Ausführungsform nicht ausgeführt wurde> As shown, the end faces of the two cylindrical workpieces 10 are brought into contact with each other, similar to the present embodiment. If the processing according to the present embodiment was not carried out, the first step was not performed.

[0091] It is assumed that the laser beam 20 was subsequently emitted in the second step. Since, in this case, the mechanical processing to improve the absorption capacity was not carried out on the target area 11 for laser processing, the end sections of the two cylindrical workpieces 10 are treated as shown in Fig. 13 under “(c) Second step (laser emission)” under<Fall, in dem die Verarbeitung gemäß der Ausführungsform nicht ausgeführt wurde> depicted, not sufficiently heated, and the temperature does not exceed the melting point of the workpiece 10, or a time to be taken into account is required until the temperature exceeds the melting point.

[0092] In contrast, in the present embodiment, as described above, the absorption capacity in the target area 11 for laser processing is increased in the first step, making it possible to carry out the welding efficiently. <Zehnte Ausführungsform>

[0093] A tenth embodiment is described with reference to Fig. 14. In the present embodiment, welding is described as an example of laser processing in the second step. Although according to the ninth embodiment the end sections of the two cylindrical workpieces 10 are welded together, in the present embodiment the end sections of two plate-shaped workpieces 10 are welded together.

[0094] First, the case of the present embodiment is described. As in Fig. 14 under “(a) Before processing (raw material)”<Fall der vorliegenden Ausführungsform> As shown, the end surfaces of two plate-shaped workpieces 10 are brought into contact with each other. Furthermore, the mechanical processing in the first step is carried out such that a shape is created in the target area 11 for laser processing using the end sections of the two plate-shaped workpieces 10 as the target area 11 for laser processing, which increases the absorption capacity for the laser beam 20, as shown in Fig. 14 under “(c) Second step (laser emission)” under<Fall der vorliegenden Ausführungsform> This is illustrated. For example, repeating V-grooves are created. In this case, the repeating V-grooves are produced by performing a mechanical operation in which, for example, a mold is pressed against the workpiece to transfer a shape onto it, similar to knurling.

[0095] In the second step, the laser beam 20 is directed onto the target area 11 for laser processing. Since the absorption capacity in the target area 11 for laser processing is increased by the first step, the end sections of the two plate-shaped workpieces 10 are sufficiently heated, and the temperature exceeds the melting point of the workpiece 10, as shown in Fig. 14 under “(c) Second step (laser emission)” under<Fall der vorliegenden Ausführungsform> As shown, the end sections of the two plate-shaped workpieces 10 are melted, and the two plate-shaped workpieces 10 are welded together. Since, in the embodiment described above, the absorption capacity in the target area 11 for laser processing is increased in the first step, it is possible to carry out the welding efficiently.

[0096] Although the task of performing a weld can be accomplished in this state, a third step can also be carried out as required. For example, in Fig. As shown in section 14 under “(d) Third step (finishing)”, such mechanical processing using a drive roller or pressing can be carried out on the target area 11 for laser processing to finish the target area 11 for laser processing to a flat surface.

[0097] A case in which the processing according to the present embodiment was not carried out is described with reference to<Fall, in dem die Verarbeitung gemäß der Ausführungsform nicht ausgeführt wurde> according to Fig. 14 described. As in Fig. 14 under “(a) Before processing (raw material)”<Fall, in dem die Verarbeitung gemäß der Ausführungsform nicht ausgeführt wurde> As shown, the end surfaces of two plate-shaped workpieces 10 are brought into contact with each other, similar to the present embodiment. If the processing according to the present embodiment was not carried out, the first step was not carried out.

[0098] It is assumed that in the second step, the laser beam 20 was emitted. Since in this case, as in Fig.14 under “(c) Second step (laser emission)” under<Fall, in dem die Verarbeitung gemäß der Ausführungsform nicht ausgeführt wurde> As shown, if the mechanical processing to improve the absorption capacity was not carried out on the target area 11 for laser processing, the end sections of the two plate-shaped workpieces 10 are not heated sufficiently, and the temperature does not exceed the melting point of the workpiece 10, or a certain amount of time is required until the temperature exceeds the melting point.

[0099] In contrast, in the present embodiment, as described above, the absorption capacity in the target area 11 for laser processing is increased in the first step, making it possible to carry out the welding efficiently.

[0100] The combined machining device described above can be implemented by hardware, software, or a combination of both. Furthermore, the combined machining process performed by the combined machining device described above can be implemented by hardware, software, or a combination of both. In this context, implementation by software means that a computer reads and executes a program.

[0101] The programs can be stored on and made available to a computer on any of different types of non-volatile, computer-readable media. Non-volatile, computer-readable media include various types of physical storage media. Examples of non-volatile, computer-readable media include magnetic recording media (such as a floppy disk, magnetic tape, and hard disk drive), magneto-optical recording media (such as a magneto-optical disk), CD-ROM (a solid-state memory), CD-R, CD-R / W, semiconductor memory (such as a mask ROM, a PROM (a programmable ROM), an EPROM (a erasable PROM), a flash ROM, and RAM (random-access memory)). The programs can be made available to a computer using one of these various types of non-volatile, computer-readable media.Examples of volatile, computer-readable media include electrical signals, optical signals, and electromagnetic waves. A volatile, computer-readable medium can provide programs to a computer via a wired communication path such as an electrical cable, optical fiber, or the like, or via a wireless communication path.

[0102] Although the respective embodiments are preferred embodiments of the present invention, the scope of the present invention must not be limited to the respective embodiments described above, and the present invention can be modified in various ways without departing from the core concept of the present invention. The respective embodiments can, for example, be combined with one another without departing from the core concept of the present invention. EXPLANATION OF THE REFERENCE SYMBOLS 10 workpieces 11 Target area for laser processing 20 laser beam 100 Combined machining device 111 CPU 112 ROM 113 RAM 114 CMOS memory slots 115, 118, 119 interface 116 PLC 117 Input / Output Unit 120 data communication bus 130 to 134 shaft control circuit 140 to 144 servo amplifiers 150 to 154 servo motor 160 spindle control circuit 161 Spindle amplifiers 162 Spindle motor 163 pulse encoders 170 Display / MDI unit 171 Control console 172 External Device 180 Laser control unit 181 Laser processing unit

Claims

[1] Combined processing method performed by a device (100) comprising: a laser processing device (190) and a mechanical processing device (154), wherein the method comprises: a first step of such execution of a mechanical processing on a target area (11) for laser processing, which is a target of a laser processing of a processing target (10), such that the target area (11) for laser processing has a surface shape with a predetermined absorption capacity for a laser beam; a second step of emitting a laser beam (20) onto the target area (11) for laser processing to heat the processing target (10) after completion of the first step; and a third step of such execution of a mechanical processing on the target area for laser processing (11) that the processing target (10) has a desired shape and / or a desired surface, after completion of the second step. [2] Combined processing method according to claim 1, wherein the mechanical processing in the first step includes shaping the target area (11) for laser processing in such a way that it has a surface shape which increases the absorption capacity for the laser beam (20). [3] Combined processing method according to claim 2, wherein the surface shape by which the absorption capacity for the laser beam (20) is increased is a surface shape by which an angle of incidence represented by an angle of half the width of the laser beam (20) with respect to the surface shape is equal to or greater than an angle of convergence represented by an angle of half the width of the laser beam (20). [4] Combined processing method according to claim 2 or 3, wherein the surface shape by which the absorption capacity for the laser beam (20) is increased is a surface shape by which an absorption capacity for a P-wave component at an angle of incidence of the laser beam (20) with respect to the surface shape is equal to or greater than an absorption capacity for the sum of a P-wave component and an S-wave component when the laser beam is perpendicular to the surface shape. [5] Combined processing method according to one of claims 2 to 4, wherein the surface shape by which the absorption capacity for the laser beam (20) is increased is a surface shape comprising the shape of a V-groove. [6] Combined processing method according to any one of claims 2 to 5, wherein the surface shape by which the absorption capacity for the laser beam (20) is increased is a surface shape comprising a repetition of the shape of a V-groove. [7] Combined machining method according to claim 6, wherein each of the V-grooves of the surface shape comprising a repetition of the shape of a V-groove has a flat section on a crown and / or at a low point of the V-groove. [8] Combined processing method according to any one of claims 2 to 7, wherein the surface shape by which the absorption capacity for the laser beam (20) is increased is a surface shape comprising a concave or convex cone or truncated cone. [9] Combined processing method according to claim 1, wherein the mechanical processing in the first step includes shaping the target area (11) for laser processing in such a way that it has a surface shape which reduces the absorption capacity for the laser beam (20). [10] Combined processing method according to one of claims 1 to 9, wherein the mechanical processing in the first step includes shaping the target area (11) for laser processing in such a way that it has a surface shape by which the absorption capacity for the laser beam (20) is uniform in the entire target area (11) for laser processing. [11] Combined machining program for causing a device (100) comprising a laser machining unit (190) and a mechanical machining unit (154) to function as a device (100) performing a combined machining process comprising: a first step of such execution of a mechanical processing on a target area (11) for laser processing, which is a target of a laser processing of a processing target (10), such that the target area (11) for laser processing has a surface shape with a predetermined absorption capacity for a laser beam, a second step of emitting a laser beam (20) onto the target area (11) for laser processing to heat the processing target (10) after completion of the first step: and a third step of such execution of a mechanical processing on the target area for laser processing (11) that the processing target (10) has a desired shape and / or a desired surface, after completion of the second step.

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