Organic electronic component

Abstract

Organic electronic component (100), comprising - a substrate (1) with an active area (11), a connection area (13) and a mechanical decoupling area (12) connecting the active area (11) and connection area (13), - an active element (10) on the substrate (1) in the active area (11), - at least one contact layer (30) on the substrate (1) in the connection area (13) and - at least one conductor track (22) on the substrate (1) in the decoupling area (12), wherein the at least one conductor track (22) electrically connects the at least one contact layer (30) to the active element (10), wherein the decoupling area (12) has a mechanical relief structure (20) which has greater flexibility than the active area (11), wherein the active area (11), the decoupling area (12) and the connection area (13) of the substrate (1) are formed in a continuous and single-piece manner, wherein the relief structure (20) has at least two webs (21) that connect the active area (11) with the connection area (13), wherein the at least two webs (21) run uniformly side by side from the active area (11) to the connection area (13) in an unloaded state, and wherein the at least two webs (21) exhibit at least one change of direction in an unloaded state in the course from the active area (11) to the connection area (13).

Description

[0001] An organic electronic component is specified.

[0002] The following publications concern organic electronic components: DE 10 2013 107 116 A1, DE 10 2015 121 133 A1, DE 10 2006 052 029 A1, DE 10 2011 003 641 A1.

[0003] Organic electronic devices typically consist of a substrate onto which organic layers and electrodes are deposited. Regarding the electrical connection of such a device, efforts are underway to provide a robust, simple, cost-effective, and user-friendly contact solution. One advantageous contact option, for example via a connector, would be to connect the connector as directly as possible to the substrate or to design the substrate itself as the connector. However, since the connector area is mechanically strongly connected to the active area of ​​the device, handling the connector area, such as during installation or connection of the device, can lead to damage to the active area.For example, if the connector area is twisted during insertion, this torsion is transferred to the active area and can lead to damage such as microscopic or macroscopic cracks in layers or layer boundaries. Mechanical stress can also occur during the manufacturing of the connector area. For instance, when attaching connector components, the necessary process forces can be transferred from the connector area to the sensitive active area.

[0004] To avoid these problems, flexible printed circuit boards, so-called FlexPCBs, are attached to the component substrate by bonding them with an anisotropically conductive adhesive and fitted with a connector at the end furthest from the component. However, this approach is complex and expensive.

[0005] At least one function of certain embodiments is to specify an organic electronic component.

[0006] This problem is solved by an object according to the independent patent claim. Advantageous embodiments and further developments of the object are characterized in the dependent claims and are further described in the following description and drawings.

[0007] The organic electronic device comprises a substrate. An active element, which includes at least one organic material, is deposited on the substrate. The substrate can, for example, consist of one or more materials selected from glass, plastic, ceramic, metal, and semiconductor materials. In particular, the substrate can also be designed and configured for the fabrication of multiple components in an assembly. For each component of such an assembly, a corresponding area on the substrate can be provided. In other words, organic and other materials are deposited in adjacent areas on the substrate to create multiple active elements on the substrate assembly and thus multiple organic electronic devices in the assembly.It is also possible that one or more materials are applied over a large area and then structured according to the intended areas. The individual components can be separated from the composite by separating them. Although the following description refers to a single organic electronic component, the described features and embodiments also apply to multiple components produced together as a composite on the substrate.

[0008] The substrate has an active region on which the active element is formed. The active region of the substrate is thus characterized by the presence of the active element on this part of the substrate. According to a preferred embodiment, the substrate can be flexible. In particular, the active region of the substrate can be flexible. This can especially mean that the substrate or the active region of the substrate, relative to its size in the finished organic electronic device, can be bent and / or creased under little or essentially no force up to a certain finite minimum bending or kinking radius without damaging the substrate and the device as a whole.The substrate can be, for example, a thin glass film, a plastic film, a metal film, or a multi-layered laminate made of one or more of these materials. The thickness of the substrate, and especially the active area, depends on the material, the size, and the desired flexibility. For example, in the case of a laminate, the substrate can be a glass-plastic laminate or a metal-plastic laminate. Alternatively, the active area of ​​the substrate can be inflexible relative to its size in the finished product, meaning it is rigid or only slightly flexible. This can also mean that the active area of ​​the substrate is not designed to be bent or folded. Depending on the flexibility of the substrate, and especially the active area, the active element on the active area of ​​the substrate can also be flexible or inflexible.

[0009] The substrate features a connection area designed and configured for the electrical connection of the organic electronic component, and in particular the active element, to an external power source. The term "power source" includes a simple current and / or voltage supply as well as integrated control electronics, for example, with passive or active regulation. Furthermore, the connection area can also be designed and configured for the electrical or electronic connection of the organic electronic component without a power supply, for example, in the case of an organic electronic component configured as a photodetector, a solar cell, or an RFID component (RFID: "radio-frequency identification," "identification using electromagnetic waves"). In particular, the organic electronic component has at least one contact layer on the connection area.The at least one contact layer can be designed and configured to be electrically contactable via an external contact element. The connection area can also be part of a connector for the organic electronic component, allowing the component to be plugged into a corresponding counterpart. Additional connector components, such as one or more housing parts and / or parts for mechanical locking to the substrate, can be attached to the connection area. The connector can be either a male or female part of a connector system. Furthermore, the connection area can also be designed and configured for soldering. In this case, the at least one contact layer can be designed and configured to be soldered to an electrical input from an external power source.Depending on the design of the active element, the component can also have multiple contact layers in the substrate connection area. The features and embodiments described for at least one contact layer also apply equally to multiple contact layers.

[0010] The substrate features a mechanical decoupling zone between the active area and the connection area, which connects the active area and the connection area of ​​the substrate. The active area, the decoupling zone, and the connection area are, in particular, contiguous and formed as a single piece. In other words, the active area, the decoupling zone, and the connection area of ​​the substrate are formed from the same material or materials as a single, cohesive component. The substrate thus comprises a first part in the form of the active area, a second part in the form of the decoupling zone, and a third part in the form of the connection area, all of which are manufactured from the same workpiece and form integral components of the substrate.In other words, preferably none of the three substrate parts is manufactured independently of the other parts and then joined to them, so that no connecting material is present between the three substrate parts for fastening them. For example, a plate or film can be provided for substrate production, in which the three substrate parts are formed by structuring processes such as mechanical or laser-assisted cutting, sawing, and / or etching. The structuring of the individual parts can also be carried out in different structuring steps, particularly if a plurality of substrates are to be provided in a composite for the fabrication of a plurality of organic electronic devices as described above. Furthermore, it is possible for all parts of the substrate to have the same thickness.

[0011] The mechanical decoupling area features a mechanical relief structure that exhibits greater flexibility than the active area of ​​the substrate. This relief structure allows the substrate to be more flexible in the decoupling area than in the active area. Furthermore, the relief structure can also exhibit greater flexibility than the connection area. The decoupling area, and in particular the relief structure within it, is specifically designed to mechanically decouple the active area and the connection area of ​​the substrate, at least partially. This means that forces acting on the connection area, such as torsional, tensile, and / or compressive forces, do not affect the active area, or only to a reduced extent.Simply put, the connection area is movable relative to the active area within certain limits due to the decoupling zone, without any movement of the connection area having a detrimental effect on the active area. Since the substrate, including the active area, the mechanical decoupling zone, and the connection area, is formed as a single piece as described above, all areas of the substrate are made of the same material. However, the active area and the connection area are mechanically decoupled from each other. This means, in particular, that the transmission of forces from one of these areas to the other is prevented or at least reduced and thus dampened by the decoupling structure. Therefore, the decoupling zone can allow the connection area a considerable degree of movement without subjecting the active area to any damaging mechanical stress.

[0012] According to another embodiment, the active element comprises an organic functional layer sequence with at least one or a plurality of organic functional layers. The organic electronic component can, for example, be an organic optoelectronic component. In other words, the active element can be an organic optoelectronic component such as an organic light-emitting diode or an organic photodiode. In this case, the active element can comprise an organic functional layer sequence that includes at least one organic optoelectronic layer, i.e., an organic light-emitting layer or an organic light-detecting layer.Furthermore, the organic functional layer sequence can comprise at least one or more organic electronic layers, which may be selected from charge carrier injection layers, charge carrier transport layers, and charge carrier blocking layers. Particularly preferably, the organic functional layer sequence described here and below comprises all organic electronic and optoelectronic layers of the organic electronic device on the active region of the substrate. Alternatively, instead of an optoelectronic device, the organic electronic device can also be configured without optoelectronic functionality, i.e., with purely electronic functionality. In this case, the organic electronic device can include an active element, which, for example, comprises or is an organic transistor.

[0013] The organic functional layers of the active element can consist of or comprise an organic material with or from organic polymers, organic oligomers, organic monomers, small organic non-polymeric molecules, or combinations thereof. The application of the organic material to the active region of the substrate can therefore be achieved, for example, by physical vapor deposition, such as evaporation, or by liquid phase deposition.

[0014] For electrical contacting the organic functional layer sequence, the active element can further comprise one or more electrode materials, which can form one or more electrode layers or parts thereof. Depending on the design of the organic electronic device, electrode materials can be applied to one side or to different sides of the organic functional layer sequence, and in different regions there. For example, electrode materials can be arranged between the substrate and the organic functional layer sequence and / or on the organic functional layer sequence from the substrate's perspective. Furthermore, the substrate itself can also form an electrode material for the active element and thus be configured as an electrode layer for electrical contacting the organic functional layer sequence. In this case, the substrate can preferably be a metal layer or be composed of one.Furthermore, in this case the substrate can be electrically contactable in the connection area, as described above in connection with at least one contact layer.

[0015] According to a further embodiment, the organic electronic component has at least one conductive trace on the substrate in the decoupling region, which electrically connects the at least one contact layer in the connection region to the active element in the active region. The at least one conductive trace can thus also extend into the active region and / or the connection region of the substrate. Furthermore, several conductive traces can be present on the substrate in the decoupling region, which can electrically connect different parts of the active element to different contact layers in the connection region. The features and embodiments described below for at least one conductive trace also apply equally to a plurality of conductive traces.

[0016] The at least one conductive track and / or the at least one contact layer and / or at least one or more electrode layers of the active element can comprise or be composed of a contact material. The contact material can, for example, comprise or be a metal, which may particularly preferably be selected from aluminum, barium, indium, silver, gold, chromium, titanium, molybdenum, magnesium, calcium, copper, and lithium, as well as compounds, combinations, and alloys with one or more of the aforementioned materials. The contact material can also comprise a stack of layers with several materials, for example, Mo / Al / Mo or Cr / Al / Cr. Furthermore, the electrode material can additionally or alternatively comprise a transparent conductive oxide (TCO), for example, zinc oxide, tin oxide, cadmium oxide, titanium oxide, indium oxide, indium tin oxide (ITO), Zn₂SnO₄, CdSnO₃, ZnSnO₃, MgIn₂O₄, GaInO₃, Zn₂In₂O₅, or In₄Sn₃O₄. 12, as well as mixtures of different transparent conductive oxides.

[0017] For example, the at least one conductor and the at least one contact layer and / or the at least one conductor and at least one electrode layer of the active element can be made of one or more identical materials. Accordingly, the at least one conductor and the at least one contact layer and / or the at least one conductor and at least one electrode layer of the active element can form a continuous, electrically conductive structure. If the substrate is electrically conductive and, for example, made of or containing a metal, the contact material can be electrically insulated from the substrate, for example, by means of an electrically insulating layer between the substrate and the contact material. Accordingly, the at least one conductor and / or the at least one contact layer can be electrically insulated from the substrate.

[0018] According to a further embodiment, the decoupling structure has at least one web that connects the active area to the connection area. Here and in the following, a "web" is defined as an area of ​​the substrate that has a narrower width than adjacent areas. In particular, the at least one web of the decoupling structure has a narrower width than both the active area and the connection area. Due to this narrower width, the at least one web, and thus the decoupling structure, can exhibit greater flexibility than the active area. Specifically, the narrower the web, the greater the flexibility. Therefore, due to the at least one web, and thus the decoupling structure, the decoupling area can exhibit greater deformability than the active area and / or the connection area.The previously described at least one conductor track on the substrate in the decoupling area can be arranged, in particular, on at least one web. Furthermore, multiple conductor tracks can also run on at least one web.

[0019] The at least one ridge can run at least partially straight and / or at least partially curved and / or at least partially angled from the active area to the connection area. In particular, the at least one ridge can have such a shape in an unloaded state. Regardless of the actual path of the at least one ridge, all areas of the substrate can lie in the same plane in an unloaded state. For example, the at least one ridge can run in a straight line from the active area to the connection area in an unloaded state. Furthermore, the at least one ridge, in an unloaded state, lies in the plane of the active area along its path from the active area to the connection area and has at least one change of direction. This change of direction can be curved or angled, so that the at least one ridge can have at least partially an arc shape and / or partially an angular shape.For example, in an unloaded state, at least one web can extend from the active area to the connection area in a wave-like, meandering, zigzag, or combination thereof shape. Such curved and / or kinked profiles of the at least one web can increase the flexibility of the stress-relief structure and, compared to a straight web, allow for deformation along the direction of arrangement from the active area to the connection area, i.e., compression or stretching.

[0020] The decoupling structure has at least two ribs that connect the active area to the connection area. In an unloaded state, these two ribs run uniformly, for example, parallel, side by side from the active area to the connection area. The decoupling structure may also have more than two ribs. The description above for the single rib applies equally to the two or more ribs. If the organic electronic component has more than one conductor track on the substrate in the decoupling area, multiple conductor tracks can be arranged on each rib. Furthermore, one or more conductor tracks can be arranged on each of several ribs.

[0021] According to a further embodiment, the stress-relief structure can have at least one opening arranged between the at least two webs. "Opening" here can particularly mean that it extends through the substrate, i.e., that substrate material between the at least two webs has been completely removed in a region within the mechanical decoupling area. Furthermore, the stress-relief structure can have a plurality of openings and a plurality of webs, wherein immediately adjacent openings are each separated from one another by a web of the plurality of webs. The plurality of webs can, for example, form a comb-like structure. Furthermore, several first webs can extend along the arrangement direction from the active area to the connection area, and several second webs can extend perpendicular to the arrangement direction. Since the first and second webs intersect, they can form a net-like structure.

[0022] According to a further embodiment, the organic optoelectronic device has an encapsulation arrangement over the active element, which can protect the active element from damaging external influences such as moisture or harmful gases from the environment, such as oxygen and hydrogen sulfide. The encapsulation arrangement can also be flexible or inflexible, depending on the flexibility of the substrate described above, and in particular the flexibility of the active region of the substrate.

[0023] According to a further embodiment, the encapsulation arrangement is designed as a thin-film encapsulation. In this context, a thin-film encapsulation arrangement is understood to be a device designed to form a barrier against atmospheric substances, in particular against moisture and oxygen, and / or against other harmful substances such as corrosive gases, for example, hydrogen sulfide. In other words, the thin-film encapsulation is designed so that it cannot be penetrated by atmospheric substances at all, or only to a very limited extent. This barrier effect in the thin-film encapsulation is essentially created by encapsulation layers designed as one or more thin layers, which are part of the encapsulation arrangement or which constitute the encapsulation arrangement.The encapsulation layers of the encapsulation arrangement typically have a thickness of less than or equal to a few hundred nm. Preferably, the encapsulation arrangement comprises a sequence of layers with a plurality of thin encapsulation layers, each of which can have a thickness greater than or equal to one atomic layer, or greater than or equal to 1 nm, or greater than or equal to 5 nm and less than or equal to 100 nm, or less than or equal to 70 nm, or less than or equal to 50 nm, or less than or equal to 20 nm, or less than or equal to 10 nm.

[0024] The encapsulation layers can be applied, for example, using an atomic layer deposition (ALD) or a molecular layer deposition (MLD) process. Suitable encapsulation materials for the encapsulation layers of the encapsulation assembly are oxides, nitrides, or oxynitrides, such as aluminum oxide, zinc oxide, zirconium oxide, titanium oxide, hafnium oxide, lanthanum oxide, and tantalum oxide.

[0025] Alternatively or additionally to encapsulation layers produced by ALD or MLD, the encapsulation arrangement can comprise at least one or more further layers, in particular barrier layers and / or passivation layers and / or planarization layers, which are deposited by thermal evaporation, by means of a plasma-enhanced process such as sputtering or plasma-enhanced chemical vapor deposition (PECVD), or by means of plasmaless vapor deposition such as chemical vapor deposition (CVD). Suitable materials for this purpose can be those mentioned above in connection with ALD and MLD, as well as silicon nitride, silicon oxide, silicon oxynitride, indium tin oxide, indium zinc oxide, aluminum-doped zinc oxide, and mixtures and alloys of the aforementioned materials.Carbides such as SiC or compounds containing carbides are also possible. The one or more additional layers can each have a thickness between 1 nm and 5 µm, preferably between 1 nm and 1 µm, including the boundary values.

[0026] Furthermore, the encapsulation arrangement can also be formed by a vapor-deposited metal layer. In particular, the encapsulation arrangement can thus consist of a purely vapor-deposited metal layer, for example made of aluminum, with a sufficient thickness of, for example, 10 µm or more. In addition, the encapsulation arrangement can also additionally or alternatively include a lid.

[0027] The encapsulation arrangement can be located exclusively on the active area of ​​the substrate. The at least one conductor running across the decoupling area from the active area to the connection area can protrude from beneath the encapsulation arrangement and, uncovered by the encapsulation arrangement, extend across the decoupling area. In this case, at least a portion of the at least one conductor in the decoupling area can be covered with a protective layer, for example, a plastic material such as an acrylate.

[0028] Furthermore, it is also possible that the encapsulation arrangement extends from the active area into the decoupling area, so that at least one conductor track is covered by the encapsulation arrangement in the decoupling area. In addition, the encapsulation arrangement can extend into the connection area and thus cover the active element in the active area, the stress relief structure, at least one conductor track, and at least part of the connection area (for example, at least part of at least one contact layer in the connection area) in the decoupling area.

[0029] Furthermore, if the substrate material does not provide sufficient impermeability to moisture and / or damaging ambient gases, the organic electronic device can have an additional encapsulation arrangement on the substrate, at least in the active region between the substrate and the active element. This additional encapsulation arrangement can have features similar to those previously described for the encapsulation arrangement on the active element.

[0030] In the organic electronic component described here, the connection area and the active area of ​​the substrate, and thus the electrical connection and the active element of the component, are largely mechanically decoupled from each other. Damage, for example to the encapsulation arrangement, in the active area can therefore be avoided, even if torsion occurs in the connection area. This makes it possible to use cost-effective concepts for integrating a contact option or connector directly into the preferably flexible component without having to fear any impairment of the component's robustness due to mechanical stress during the contacting or plugging process.The increased freedom of movement of the connection area due to the mechanical relief structure in the decoupling area simplifies the installation and connection of the component, even by a customer, and opens up more variable installation options, since the counterpart to a plug integrated into the component in the connection area does not have to be aligned exactly with the desired position of the active element, in the case of an organic light-emitting component, thus with the position of the luminous surface.

[0031] Further advantages, advantageous embodiments and further developments result from the exemplary embodiments described below in conjunction with the figures.

[0032] They show: Fig. 1A and Fig. 1B Schematic representations of an organic electronic component according to an example, Fig. 2A and Fig. 2B Schematic representations of an organic electronic component according to another example, Fig. 3 a schematic representation of an active element of an organic electronic device according to an exemplary embodiment, Fig. 4 to 6 schematic representations of organic electronic components according to further examples and Fig. 7A to 7G schematic representations of substrates for organic electronic components according to further embodiments and examples.

[0033] In the exemplary embodiments, examples, and figures, identical, similar, or similarly functioning elements may be designated with the same reference numerals. The depicted elements and their relative sizes are not to be considered to scale; rather, individual elements, such as layers, components, building elements, and areas, may be exaggerated for clarity and / or better understanding.

[0034] In the Fig. 1A and Fig. Figure 1B shows an example of an organic electronic device 100, which has a substrate 1 and an active element 10 on it. The in Fig. Figure 1A shows a section through component 100, while the Fig. Figure 1B shows a top view of the active element 10 on the substrate 1. The active element 10 can, in particular, be an active element of an organic optoelectronic device, for example, an organic light-emitting or light-detecting device. Furthermore, it is also possible that the active element 10 is part of a non-optoelectronic organic device.

[0035] The substrate 1 is preferably flexible and comprises, for example, glass, plastic, metal, or a combination thereof in the form of a laminate. The active element 10 is arranged on a first sub-region of the substrate 1, which forms an active region 11 of the substrate 1. Adjacent to the active region 11, the substrate 1 has a further sub-region that forms a mechanical decoupling region 12. Adjacent to this, the substrate 1 has a further sub-region that forms a connection region 13. The active region 11 and the connection region 13 are thus connected to each other by the decoupling region 12. The active region 11, the decoupling region 12, and the connection region 13 of the substrate 1 are interconnected and formed as a single unit, thus constituting integral components of the substrate 1.

[0036] The mechanical decoupling area 12 features a mechanical relief structure 20 that exhibits greater flexibility than the active area 11 of the substrate 1. This relief structure 20 allows the substrate 1 to be more flexible in the decoupling area 12 than in the active area 11. Furthermore, the relief structure 20 can also exhibit greater flexibility than the connection area 13. Due to these flexibility properties, the relief structure 20 is suitable for at least partially mechanically decoupling the active area 11 and the connection area 13 of the substrate 1, so that forces acting on the connection area 13 do not affect the active area 11 and thus the active element 10, or only to a reduced extent.If the connection area 13 is subjected to torsional, stretching, and / or compression forces, which can occur, for example, during the manufacturing, connection, and / or installation of the organic electronic component 100, these forces are attenuated or not transmitted to the active area 11 at all, since the stress-relieving structure 20 is primarily deformed. This effectively prevents force transmission from the connection area 13 to the active area 11, thus preventing the active area 11 from being subjected to excessive mechanical stress and potentially damaged. In the example shown, the stress-relieving structure 20 is formed by a web 21 that connects the active area 11 and the connection area 13. In the example shown, the web 21 is straight when the substrate 1 is unloaded and thus runs in a straight line along the arrangement direction from the active area 11 to the connection area 13.The web 21 has a narrower width than the active area 11 and the connection area 13, and therefore exhibits the described greater flexibility. Since areas 11, 12, and 13 are formed from the same material and can be created, for example, by suitable structuring of a corresponding foil or plate-shaped raw material, the described mechanical decoupling of the active area 11 and the connection area 13 is possible without the use of additional materials and components.

[0037] The connection area 13 is designed and configured for the electrical connection of the organic electronic component 100 to an external power source, so that the active element 10 in the active area 11 can be supplied with power via the connection area 13. For this purpose, the substrate 1 has at least one contact layer 30 on the connection area 13. The contact layer 30 can, for example, be used to create a soldered connection. Furthermore, the contact layer 30 can also be part of a connector for the organic electronic component 100, with which the organic electronic component 100 can be plugged into a corresponding counterpart. For the sake of clarity, additional connector components attached to the substrate 1 in the connection area 13, such as one or more housing parts and / or parts for mechanical locking, are not shown.Furthermore, the connection area 13 can have a shape that differs from the one shown and may, for example, be bent or angled. The previously described mechanical decoupling of the active area 11 and the connection area 13 significantly simplifies the handling of the connection area 13 when connecting it to an external power source. If the contact layer 30 is soldered, the ridge shape of the relief structure 20 can additionally reduce heat conduction from the connection area 13 to the active area 11 and thus to the active element 10, thereby also reducing the risk of thermal damage to the active element 10.

[0038] For the electrical connection of the contact layer 30 with the active element 10, the organic electronic component 100 has at least one conductor 22 in the decoupling area 12. This conductor 22 forms, in particular, an electrically conductive layer on the bridge 21 of the relief structure 20 to conduct an electric current from the connection area 13 to the active area 11 and thus to the active element 10 for its operation. Instead of the single contact layer 30 and the single conductor 22 that are present in the Fig. 1A and Fig. As shown in Figure 1B, the component 100 can also have several contact layers 30 and / or several conductor tracks 22, by means of which several different areas of the active element 10, for example different electrode layers or electrode layer areas, can be electrically contacted independently of each other.

[0039] In the Fig. 2A and Fig. 2B is another example of an organic electronic component 100 shown, wherein in Fig. 2A a section through the active area 11 and thus through the active element 10 along the in Fig. Section line AA is shown in 2B. Fig. Figure 2B shows a top view of component 100, which corresponds to the representation of the Fig. 1B corresponds. By way of example, the organic electronic component 100 with the active element 10 is configured in this example as an organic light-emitting component in the form of an organic light-emitting diode (OLED). Alternatively, the active element 10 can also be configured with a different functionality as described above, so that the organic electronic component 100 with the active element 10 can, for example, also be configured as an organic light-detecting component or as an organic electronic component without optoelectronic functionality, for example in the form of an organic transistor, or can have a combination of such elements.

[0040] In the example shown, the active element 10 has a first electrode layer 2 and a second electrode layer 3 on the substrate 1, between which an organic functional layer stack 4 with at least one organic light-emitting layer is arranged. At least one of the electrode layers 2, 3 is transparent, so that light generated in the active element 10 and thus in the organic functional layer stack 4 during operation of the organic electronic device 100 can be emitted outwards. For example, the electrode layer 2 of the active element 10, arranged between the organic functional layer stack 4 and the substrate 1, can be transparent.Similarly, the substrate 1 can also be transparent, allowing the organic electronic device 100 to emit light generated in the organic functional layer stack 4 through the first electrode layer 2 and the substrate 1 during operation. Such a configuration is also referred to as a "bottom emitter." Alternatively or additionally, the upper second electrode layer 3 can also be transparent. Such a configuration is also referred to as a "top emitter." If the organic electronic device 100 is configured simultaneously as a bottom emitter and a top emitter, the device 100 can, in particular, form a transparent organic light-emitting device.

[0041] If light is to be emitted through the substrate 1, it preferably comprises a transparent material and is, for example, in the form of a glass plate or glass layer. Alternatively, the substrate 1 can also, for example, comprise a glass-plastic laminate. If the light emission is to occur only in the direction away from the substrate 1, the substrate 1 can, for example, also comprise or be made of a metal layer in the form of a metal plate or metal foil. To protect the active element 10 from damaging environmental influences on the substrate side, the substrate 1 is preferably hermetically sealed.

[0042] A transparent electrode layer can, in particular, comprise a transparent contact material, for example, a transparent conductive oxide (TCO) as described above in the general section. Furthermore, metallic mesh structures, conductive networks, and metallic meshes, for example, with or made of silver and / or graphene, as well as carbon-containing layers, are also possible materials for a transparent electrode layer. In addition, a transparent electrode layer can also comprise or be composed of a metal as a contact material, which may be selected from aluminum, barium, indium, silver, gold, magnesium, calcium, and lithium, as well as compounds, combinations, and alloys thereof.The thickness of the metal is to be chosen to be so small, for example in the range of less than or equal to 20 nm, preferably less than or equal to 15 nm, that at least some of the light generated in the organic functional layer stack 4 during operation of the device 100 can penetrate the metal. A transparent electrode layer can also comprise combinations of the described contact materials, for example in the form of a layer stack. A non-transparent electrode layer can preferably be reflective, so that light generated during operation in the organic functional layer stack 4 and emitted towards the non-transparent electrode layer can be reflected towards the transparent electrode layer in order to exit the electronic device 100 through it.For this purpose, one or more of the aforementioned metals are particularly suitable as contact material, which in this case have a sufficiently large thickness to have a reflective effect.

[0043] In the example shown, the lower electrode layer 2 is configured as the anode, while the upper electrode layer 3 is configured as the cathode. However, with appropriate material selection or a suitable design of the organic functional layer stack 4, a polarity-inverted configuration is also possible.

[0044] The electrode layers 2, 3 can be large-area and continuous, so that the organic electronic component 100 can be configured as a light source, in particular as a surface light source. "Large-area" can mean that the organic electronic component 100, and in particular the active element 10, has an area greater than or equal to a few square millimeters, preferably greater than or equal to one square centimeter, and particularly preferably greater than or equal to one square decimeter. Alternatively, at least one of the electrode layers 2, 3 of the active element 10 of the organic electronic component 100 can be structured, thereby enabling a spatially and / or temporally structured and / or variable light display, for example, for structured and / or multicolored illumination or for a display device.Such a structured electrode layer can then have independently controllable areas.

[0045] For electrical contacting of the electrode layers 2, 3, as described in the Fig. 2A and Fig. As can be seen in Figure 2B, electrode connection pieces in the form of conductor tracks 22 are provided, extending outwards from the electrode layers 2, 3. The conductor tracks 22 can be transparent or opaque and, for example, comprise one or more of the contact materials mentioned for the electrode layers or be made of them. Particularly preferably, the conductor tracks 22 can also comprise a layer stack of several materials as contact material, for example, Mo / Al / Mo or Cr / Al / Cr. Furthermore, the conductor tracks 22 and one or both electrode layers 2, 3 can also be identical, so that one or both electrode layers 2, 3 can each transition into a conductor track 22. The two conductor tracks 22 shown are purely examples for contacting large-area electrode layers 2, 3.If the organic electronic component 100 has an active element 10 with at least one electrode layer structured into several regions, a correspondingly larger number of conductor tracks 22 can be present to enable independent contact between the electrode layer regions. Each of the conductor tracks 22 extends, as described in the previous example, from the active element 10 on the active region 11, across the decoupling region 12, to the connection region 13, where it contacts a contact layer 30. This contact layer allows the electrode layers 2 and 3 to be electrically connected externally. The contact layers 30 can comprise one or more of the contact materials previously described for the electrode layers 2 and 3 and the conductor tracks 22. Furthermore, the conductor tracks 22 and the contact layers 30 can also be made of the same material and be formed as a single unit, i.e., seamlessly integrated.

[0046] The organic functional layer stack 4 can comprise layers with organic polymers, organic oligomers, organic monomers, organic small non-polymeric molecules, or combinations thereof. In particular, it can be advantageous for the organic functional layer stack to include, in addition to the organic light-emitting layer, a functional layer designed as a hole transport layer to enable effective hole injection into the light-emitting layer. Suitable materials for a hole transport layer include, for example, tertiary amines, carbazole derivatives, conductive polyaniline, or polyethylene dioxythiophene.Suitable materials for the light-emitting layer include those exhibiting radiation emission due to fluorescence or phosphorescence, such as polyfluorene, polythiophene, or polyphenylene, or derivatives, compounds, mixtures, or copolymers thereof. Furthermore, the organic functional layer stack 4 can include a functional layer configured as an electron transport layer. Additionally, the organic functional layer stack 4 can also include electron and / or hole blocking layers. The organic functional layer stack 4 can also comprise multiple organic light-emitting layers arranged between the electrode layers 2 and 3.

[0047] Furthermore, as in Fig. As shown in Figure 2A, insulating layers 5 may be present, for example made of polyimide, which can electrically insulate the electrode layers 2 and 3 from each other. Depending on the design of the individual layers of the active element 10, insulating layers 5 may not be necessary and may be omitted, for example, in the case of corresponding masking processes for applying the layers.

[0048] An encapsulation arrangement 40 is applied to the active element 10 to protect the organic materials from damaging environmental influences such as moisture, oxygen, and hydrogen sulfide. The encapsulation arrangement 40 is designed as a thin-film encapsulation comprising at least one or more encapsulation layers made of one or more encapsulation materials. The encapsulation layers can be applied, for example, by ALD, CVD, or MLD processes. Suitable materials for the encapsulation layers, with a preferred thickness of greater than or equal to one atomic layer and less than or equal to 100 nm, include, for example, aluminum oxide, zinc oxide, zirconium oxide, titanium oxide, hafnium oxide, lanthanum oxide, and tantalum oxide.Alternatively or in addition to encapsulation layers produced by means of ALD or MLD, the encapsulation arrangement 40 can have at least one or a plurality of further layers, in particular barrier layers and / or passivation layers, which can be applied by other methods described above in the general part.

[0049] The encapsulation arrangement 40 can, alternatively or additionally to thin-film encapsulation, have or be made of a lid, for example, a rigid lid. Suitable lid materials can be, for example, glass and / or metal. The lid can also have a getter material on a side facing the active element 10, for example, for moisture absorption. Furthermore, the lid can be bonded to the substrate 1 by adhesive bonding, at least along the edge of the active area 11 or even over the entire surface of the active area 11. For example, a lid made of or containing aluminum can be applied over the entire surface of an organic electronic device configured as a bottom emitter with a substrate 1 made of or containing plastic.Furthermore, a cover made of glass, particularly ultra-thin glass, can be applied over a surface area to an organic electronic device configured as a top emitter or a transparent OLED. Alternatively, a cavity-forming cover made of glass is also possible for such devices. In the case of a top emitter, the substrate 1 can preferably be, for example, a metal. The cover can reduce the flexibility of the active area. This can even result in complete mechanical stiffening, for example, in the case of a cavity glass. Regardless, the decoupling area 12 can remain flexible.This makes it possible, when using flexible substrates that are also suitable for so-called roll-to-roll processes, to reduce the flexibility in the active area 11 if desired, so that when using a flexible substrate 1 an essentially rigid component with an integrated extremely flexible connection is possible.

[0050] The encapsulation arrangement can be configured as in the Fig. 2A and Fig. 2B shown, are arranged exclusively on the active area of ​​the substrate 1. The conductor tracks 22, which run from the active area 11 to the connection area 13 via the decoupling area 12, can protrude below the encapsulation arrangement 40 and, uncovered by the encapsulation arrangement 40, run over the decoupling area 12.

[0051] As an alternative to just one active element 10, a plurality of active elements 10 can also be applied to the substrate 1. Furthermore, it is also possible that instead of one connection area 13, several connection areas are present, on each of which at least one contact layer 30 is arranged, wherein each of the connection areas is connected to the active area 11 by at least one web 21 of the stress-relieving structure 20 in the decoupling area 12.

[0052] In Fig. Figure 3 shows an embodiment of an organic electronic component 100 which, in contrast to the previous example, has a substrate 1 made of a material that is not impervious to damaging environmental influences. For example, the substrate 1 in this case can be formed by a plastic film. Therefore, at least in the active region 11 between the substrate 1 and the active element 10, a further encapsulation arrangement 41 is arranged on the substrate 1, which can have features as described for the encapsulation arrangement 40 on the active element 10. The further encapsulation arrangement 41 can also be applied to the entire substrate 1, i.e., also in the decoupling region 12 and in the connection region 13.

[0053] In Fig. Figure 4 shows another example of an organic electronic component in which the substrate 1 is formed by an electrically conductive material. For example, in this case, the substrate 1 can be formed by a metal foil. In addition to the contact layer 30 and the conductor track 22, the substrate 1 can also serve as an electrical lead for the active element 10. Therefore, an electrically insulating layer 50 is arranged between the substrate 1 and the conductor track 22, as well as between the substrate 1 and the contact layer 30. This insulating layer 50 electrically isolates the substrate 1 from the conductor track 22 and the contact layer 30. The electrically insulating layer 50 can be formed, for example, by a plastic material or by one or more layers as described in connection with the encapsulation arrangements 40 and 41.Accordingly, the further encapsulation arrangement described above can also serve as an electrically insulating layer 50, wherein at least a part of the substrate 1 in the active area 11 is free of the electrically insulating layer 50 in order to be in electrical contact with the active element 10.

[0054] In Fig. Figure 5 shows an example of an organic electronic component, where, in comparison to the example of the Fig. 2A and Fig. 2B the conductor tracks 21 in the decoupling area 12 are covered with a protective layer 60. The protective layer 60, which is different from the encapsulation arrangement 40, can, for example, comprise or be made of a plastic material such as an acrylate and provide at least mechanical protection for the conductor tracks 21.

[0055] In the example of the Fig. 6 The organic electronic component 100 has an encapsulation arrangement 40 which differs from the examples of the Fig. 2A, Fig. 2B, Fig. 3 and Fig. 6 extends over the decoupling area 12 and thus over the webs 21 of the relief structure 20. This allows the conductor tracks 21 in the decoupling area 12 to also be protected by the encapsulation arrangement 40. In the example shown, the encapsulation arrangement 40 also extends over part of the connection area 13, so that part of this area, and in particular the contact layers 30, can also be protected by the encapsulation arrangement 40. The organic electronic component 100 can therefore have the same encapsulation materials in the active area 11, as well as in the decoupling area 12 and / or in the connection area 13.

[0056] In the Fig. Figures 7A to 7G show sections of substrates 1 for organic electronic components according to further embodiments and examples, which exhibit variations of the previously shown relief structures 20 in the decoupling region 12. As shown in the Fig. 7A and Fig. As shown in Figure 7B, the relief structure 20 can have more than one or two webs 21 extending in comb-like structures from the active area 11 to the connection area 13, the number of webs 21 shown being purely exemplary. As shown, adjacent webs 21 are separated from each other by an opening 23, so that a plurality of openings 23 can be present. The webs 21 can be evenly spaced from each other, as shown, so that the openings 23 can all have the same size, in particular the same width. Alternatively, it is also possible that openings 23 of different sizes, in particular different widths, are present, so that the webs 21 can have different distances from each other.The flexibility and stability of the relief structure 20 can be adjusted as desired by the number and width of the webs 21 and by the sizes of the openings 23 between the webs 21. In contrast to the examples of . Fig. 2A, Fig. 2B, Fig. 5, Fig. 6 and Fig. 7A, where the decoupling area 12 has a smaller width than the active area 11 and the connection area 13, the decoupling area 12 can also have the same width as the other two areas 11, 13, as in Fig. 7B is shown.

[0057] As in Fig. As shown in Figure 7C, several first webs 21 can extend along the arrangement direction from the active area 11 to the connection area 13, and several second webs 21' can extend perpendicular to the arrangement direction. The intersecting first and second webs 21, 21' can form a net-like structure with openings 23 enclosed by the webs 21, 21', as shown. Instead of square or rectangular openings 23, these can also be, for example, diamond-shaped. The webs 21, 21' can therefore also extend obliquely from the active area 11 to the connection area 13.

[0058] The in the Fig. The relief structures 20 shown in Figures 7A to 7C, like the previous examples, have webs 21, 21' that run in a straight line when unloaded. As in the Fig. As shown in Figures 7D to 7G, the webs 21, in the unloaded state, can also lie in the plane of the active area 11 along the route from the active area 11 to the connection area 13 and exhibit at least one change of direction. Again, the number of webs 21 shown is purely exemplary. In particular, the number of webs 21 shown in the Fig. The relief structures 20 shown in Figures 7D to 7G may each have more or fewer webs 21, or only one web 21. At least one change of direction can be indicated by an arc or a kink, so that the webs 21 may have at least a partial arc shape and / or a partial angular shape. For example, the webs 21, as shown in Fig. As shown in Figure 7D, the webs exhibit a meandering shape in an unloaded state. Furthermore, the webs 21, as shown in the Fig. As shown in 7E to 7G, the shape can be wavy, and when combined with the bridge profiles shown with angular changes in direction, zigzag shapes can also result. As in Fig. As indicated by 7G, the decoupling area 12 can also have a relief structure 20 in which the webs 21 extend beyond the width of the active area 11 and the connection area 13.

[0059] The bridge shapes shown can also be combined with each other. On one, several or all bridges 21 of the in the Fig.In the relief structures 20 shown in Figures 7A to 7G, one or more conductive traces can each be arranged, which electrically connect contact layers on the connection area 13 to the active element on the active area 11. Furthermore, the active area 11 and the connection area 13 can also have different widths than in the illustrated embodiments and examples. For example, the connection area 13 can be narrower than the active area 11. Alternatively, several active elements 10, which can be identical or different, can also be arranged in the active area 11 and electrically connected to contact layers in the connection area 13 in the manner described.

[0060] The embodiments and features described in connection with the figures can be combined with one another according to further embodiments, even if not all possible combinations are explicitly described. Furthermore, the embodiments described in connection with the figures may have additional or alternative features as described in the general section. Reference symbol list 1 substrate 2, 3 electrode layer 4 organic functional layer stacks 5 Insulator layer 10 active element 11 active area 12 Connection area 13 mechanical decoupling area 20 mechanical relief structure 21, 21' Bridge 22 conductor track 23 Opening 30 Contact layer 40, 41 Encapsulation arrangement 50 electrically insulating layer 60 protective layer 100 organic electronic components

Claims

Organic electronic component (100) comprising: a substrate (1) with an active region (11), a connection region (13) and a mechanical decoupling region (12) connecting the active region (11) and the connection region (13); an active element (10) on the substrate (1) in the active region (11); at least one contact layer (30) on the substrate (1) in the connection region (13); and at least one conductive trace (22) on the substrate (1) in the decoupling region (12), wherein the at least one conductive trace (22) electrically connects the at least one contact layer (30) to the active element (10), wherein the decoupling region (12) has a mechanical relief structure (20) that has greater flexibility than the active region (11), wherein the active region (11), the decoupling region (12), and the connection region (13) of the substrate (1) are formed integrally and in one piece.wherein the relief structure (20) has at least two webs (21) that connect the active area (11) with the connection area (13), wherein the at least two webs (21) run uniformly side by side from the active area (11) to the connection area (13) in an unloaded state, and wherein the at least two webs (21) have at least one change of direction in an unloaded state in the course from the active area (11) to the connection area (13). Component (100) according to the previous claim, wherein the relief structure (20) has at least one opening (23) arranged between the at least two webs (21). Component (100) according to one of the preceding claims, wherein the at least two webs (21) extend in a wave-like manner from the active area (11) to the connection area (13) in an unloaded state. Component (100) according to one of the preceding claims, wherein the relief structure (20) has a plurality of openings (23), wherein openings (23) immediately adjacent to each other are each separated from each other by a web (21) of a plurality of webs (21). Component (100) according to the preceding claim, wherein the majority of the webs (21) form a comb-like structure. Component (100) according to claim 4, wherein the majority of the webs (21, 21') form a net-like structure. Component (100) according to one of the preceding claims, further comprising an encapsulation arrangement (40) over the active element (10), wherein the encapsulation arrangement (40) extends from the active area (11) into the decoupling area (12). Component (100) according to the previous claim, wherein the encapsulation arrangement (40) extends into the connection area (13). Component (100) according to one of claims 1 to 6, further comprising an encapsulation arrangement (40) over the active element (10), wherein the encapsulation arrangement (40) is arranged exclusively on the active area (11) of the substrate (1). Component (100) according to one of claims 7 to 9, wherein the encapsulation arrangement (40) comprises a thin-film encapsulation. Component (100) according to one of the preceding claims, wherein the at least one conductor track (22) in the decoupling area (12) is covered with a protective layer (60) made of a plastic material. Component (100) according to one of the preceding claims, wherein the substrate (1) is flexible. Component (100) according to one of the preceding claims, wherein the substrate (1) is electrically conductive and the at least one conductor track (22) is arranged in an electrically insulated manner from the substrate (1). Component (100) according to one of the preceding claims, wherein the active element (10) comprises an organic functional layer stack (4). Component (100) according to one of the preceding claims, wherein the active element (10) is an organic optoelectronic element.

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